CN105466260B - Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig - Google Patents
Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig Download PDFInfo
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- CN105466260B CN105466260B CN201510988851.6A CN201510988851A CN105466260B CN 105466260 B CN105466260 B CN 105466260B CN 201510988851 A CN201510988851 A CN 201510988851A CN 105466260 B CN105466260 B CN 105466260B
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- heat
- fins
- air
- exchanging part
- exchanger rig
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention relates to heat-exchanger rig and with the semiconductor freezer of the heat-exchanger rig.Specifically, the present invention provides a kind of heat-exchanger rigs comprising the first heat exchanging part, the first heat exchanging part tool is there are two fins set, and each fins set has the fin of multiple parallel intervals setting, and two fins sets are arranged along the length direction of fin or width direction interval；And air supply device, it is set between two fins sets, is configured to the direction suction airflow from the orientation perpendicular to two fins sets, and blow air-flow to two fins sets, to allow airflow into each fins set between every two adjacent fins.In addition, the present invention also provides a kind of semiconductor freezers with the heat-exchanger rig.Since air supply device is set between two fins sets in heat-exchanger rig of the invention, the thickness of heat-exchanger rig can be reduced, the heat dissipation especially suitable for semiconductor freezer.
Description
Technical field
The present invention relates to refrigerating equipments, more particularly to a kind of heat-exchanger rig and with the semiconductor of the heat-exchanger rig
Refrigerator.
Background technique
Semiconductor freezer, also referred to as thermoelectric refrigerator.It passes through heat pipe heat radiation and conduction using semiconductor chilling plate
Technology and automatic pressure-transforming Variable flow control technology realize refrigeration, are not necessarily to refrigeration working medium and mechanical moving element, solve medium pollution
With the application problem of the tradition machineries refrigerator such as mechanical oscillation.However, the cold end of semiconductor chilling plate refrigeration while, meeting
Generate a large amount of heat in its hot end, to guarantee that semiconductor chilling plate is reliably continued for work, need in time to hot end into
Row heat dissipation, however in the prior art for semiconductor chilling plate hot-side heat dissipation generally using by setting blower to cooling fin into
The scheme of row forced convertion heat dissipation, to improve heat exchange efficiency, but radiating fin volume itself is larger；In addition, in radiating fin
Axial flow blower is arranged in the side of group, with to the gap blow flow between every two adjacent fin, or from every two adjacent
Gap suction airflow between fin.The problems such as volume of this heat exchanger is bigger, needs installation space big, is not suitable for
It is installed in lesser space.In addition, hot-side heat dissipation is usually to achieve the purpose that heat dissipation by the revolving speed and power of increase blower,
Radiating efficiency difference and the big energy consumption height of noise.
Summary of the invention
One object of the present invention is intended to overcome at least one defect of existing heat-exchanger rig, provides a kind of structure novel
Heat-exchanger rig, the heat dissipation with lesser thickness, especially suitable for semiconductor freezer.
One of first aspect present invention is further objective is that the heat exchange efficiency of heat-exchanger rig will be improved.
Another of first aspect present invention is further objective is that the noise of heat-exchanger rig will be reduced as far as possible.
One purpose of second aspect of the present invention is to provide for a kind of semiconductor freezer with above-mentioned heat-exchanger rig.
According to an aspect of the present invention, the present invention provides a kind of heat-exchanger rigs for semiconductor freezer.It should
Heat-exchanger rig includes the first heat exchanging part, and first heat exchanging part has：
Two fins sets, each fins set have the fin of multiple parallel intervals setting, and described two fins sets
It is arranged along the length direction of the fin or width direction interval；With
Air supply device is set between two fins sets, is configured to from the arrangement perpendicular to described two fins sets
The direction suction airflow in direction, and blow air-flow to two fins sets, to allow airflow into each fins set
Between every two adjacent fins.
Optionally, the air supply device includes：
Ducting assembly inside defines the gap in one fins set of connection between every two adjacent fins and another institute
State the airflow channel in the gap in fins set between every two adjacent fins；With
Centrifugal wind wheel is installed in the airflow channel, arrangement side of the rotation axis perpendicular to described two fins sets
To being configured to from its axial direction suction airflow, and flow out air-flow from radial direction, by the position by the airflow channel
Two fins sets are flowed to respectively in the part of the centrifugal wind wheel two sides.
Optionally, the airflow channel includes：
Middle part accommodating chamber, the centrifugal wind wheel are installed in the middle part accommodating chamber；
Two wind pushing cavities, each wind pushing cavity extend from the middle part accommodating chamber to a fins set flaring.
Optionally, the heat-exchanger rig further includes：Second heat exchanging part, with first heat exchanging part about a geometrical plane pair
Claim arrangement.
Optionally, the heat-exchanger rig further includes：
Two heat-transfer devices, each heat-transfer device is symmetrical about the geometrical plane, and
It is configured to absorb heat or cooling capacity from heat source or cold source in the middle part of each heat-transfer device；
One fins set of first heat exchanging part and a fins set of second heat exchanging part are set to described in one
The both ends of heat-transfer device；
Another fins set of another fins set of first heat exchanging part and second heat exchanging part is set to another described
The both ends of heat-transfer device.
Optionally, each heat-transfer device includes：
Heat-conducting substrate has and the heat source or the hot linked heat-transfer surface of cold source；With
More heat carriers, the length direction along the fin are alternatively arranged, and the every heat carrier is described including being fixed on
The middle part heat carrier section of heat-conducting substrate and positioned at the middle part heat carrier section two sides, two perpendicular to geometrical plane ends
The straight heat carrier section in two ends of the straight heat carrier section in portion, the every heat carrier extends respectively through each wing being mounted thereon
The perforation hole of piece.
Optionally, the middle part heat carrier section of the every heat carrier includes：The straight heat carrier section in middle part, and respectively from described
Two connection heat carrier sections that the both ends of the straight heat carrier section in middle part extend to two sides；And
In each heat-transfer device, multiple straight heat carrier sections in middle part are in same plane, multiple ends
The straight heat carrier section in portion is in same plane, and the distance between straight heat carrier section in every two adjacent middle part is less than every two phase
Adjacent the distance between the straight heat carrier section in end, the straight heat carrier section in middle part between the heat-transfer surface at a distance from be less than the end
The straight heat carrier section in portion between the heat-transfer surface at a distance from.
Optionally, the width of each fin is the 1/7 to 3/7 of its length；Two fins of first heat exchanging part
Group is arranged along the length direction interval of the fin.
According to the second aspect of the invention, the present invention provides a kind of semiconductor freezers, including liner, semiconductor system
Cold particularly further includes with the insulating layer being set on rear side of the liner：
Rear shell defines installation space with the rear surface of the insulating layer, and offers the first air inlet thereon, and
Two the first air outlets positioned at first air inlet two sides；With
Any of the above-described kind of heat-exchanger rig, two fins sets and air supply device of the first heat exchanging part are mounted on the installation
In space and between two first air outlets；And
Two fins sets of first heat exchanging part and the hot end of the semiconductor chilling plate are directly or indirectly thermally connected；
The air supply device of first heat exchanging part is configured to that air-flow is promoted to fill from first air inlet into the air-supply
In setting, after flow to two fins sets of first heat exchanging part, exchanged heat with the fin with each fins set, after from two
A first air outlet flows out the installation space.
Optionally, first air outlet is set to the top of another first air outlet；
The second air inlet and two the second air outlets are also provided in the rear shell, second air outlet is set to
The top of another second air outlet, second air inlet are set between two second air outlets；And
Two fins sets and air supply device of second heat exchanging part of the heat-exchanger rig are mounted in the installation space
And between two second air outlets；And
Two fins sets of second heat exchanging part and the hot end of the semiconductor chilling plate are directly or indirectly thermally connected；
The air supply device of second heat exchanging part is configured to that air-flow is promoted to fill from second air inlet into the air-supply
In setting, after flow to two fins sets of second heat exchanging part, exchanged heat with the fin with each fins set, after from two
A second air outlet flows out the installation space.
Heat-exchanger rig and semiconductor freezer of the invention can drop because air supply device is set between two fins sets
The thickness of low heat-exchanger rig, the heat dissipation especially suitable for semiconductor freezer.In addition, there are two heat exchanging part and each heat exchange for tool
Portion's tool improves radiating efficiency there are two the heat dissipation area that heat-exchanger rig also can be improved in fins set.Simultaneously using an air supply device
It flows through air-flow from two fins sets, air supply device utilization rate can be improved, and can reduce the noise of heat-exchanger rig.
According to the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will be brighter
The above and other objects, advantages and features of the present invention.
Detailed description of the invention
Some specific embodiments of the present invention is described in detail by way of example and not limitation with reference to the accompanying drawings hereinafter.
Identical appended drawing reference denotes same or similar part or part in attached drawing.It should be appreciated by those skilled in the art that these
What attached drawing was not necessarily drawn to scale.In attached drawing：
Fig. 1 is the schematic elevational view of heat-exchanger rig according to an embodiment of the invention；
Fig. 2 is the schematic side elevation of heat-exchanger rig according to an embodiment of the invention；
Fig. 3 is the schematic side elevation of semiconductor freezer according to an embodiment of the invention；
Fig. 4 is the schematic rear view of semiconductor freezer according to an embodiment of the invention.
Specific embodiment
Fig. 1 and Fig. 2 is the schematic elevational view and side view of heat-exchanger rig 600 according to an embodiment of the invention respectively
Figure.It as depicted in figs. 1 and 2, can the embodiment of the invention provides a kind of heat-exchanger rig 600 for semiconductor freezer
Including the first heat exchanging part 610.First heat exchanging part 610 can have there are two fins set 611 and air supply device.Each fins set 611 has
Have the fin of multiple parallel intervals setting, and with cold end/hot end of the semiconductor chilling plate in semiconductor freezer directly or
It is thermally connected indirectly, and two fins sets 611 can be arranged along the length direction of fin or width direction interval.Air supply device can be set
It is placed between two fins sets 611, is configured to the direction suction airflow from the orientation perpendicular to two fins sets 611, and
Blow air-flow to two fins sets 611, to allow airflow into each fins set 611 between every two adjacent fins, with band
Walk cooling capacity/heat on fin.Preferably, the width of each fin is the 1/7 to 3/7 of its length.When in each fins set 611
Fin perpendicular to refrigerator liner rear wall when, two fins sets 611 of the first heat exchanging part 610 are preferably along the length direction of fin
Interval setting.When the fin in each fins set 611 is parallel to the liner rear wall of refrigerator, two wings of the first heat exchanging part 610
Piece group 611 can be arranged along the length direction of fin or width direction interval.In this way, can reduce the thickness of heat-exchanger rig.
In embodiments of the present invention, air supply device may include ducting assembly 612 and centrifugal wind wheel 613.In ducting assembly 612
Define the adjacent wing of every two in gap and another fins set 611 in one fins set 611 of connection between every two adjacent fins
The airflow channel in the gap between piece.Centrifugal wind wheel 613 is mountable in airflow channel, and rotation axis can be perpendicular to two fins
The orientation of group, is configured to from its axial direction suction airflow, and flow out air-flow from radial direction, leads to by by air-flow
The part positioned at 613 two sides of centrifugal wind wheel in road flows to two fins sets 611 respectively.Specifically, airflow channel may include middle part
Accommodating chamber and two wind pushing cavities.Centrifugal wind wheel 613 is installed in the accommodating chamber of middle part.Each wind pushing cavity is from middle part accommodating chamber to one
Fins set flaring extends.
In some embodiments of the invention, ducting assembly 612 may include two side plates.Each side plate is from a fins set
An outermost fin one end extend to another fins set a corresponding outermost fin one end, with the two wings
Piece is integrally formed；Or, the both ends of each side plate are individually fixed in one end of an outermost fin of a fins set and another
One end of the corresponding outermost fin of one of fins set.Further, using rear shell of semiconductor freezer etc. and two
Side plate limits airflow channel jointly；Ducting assembly 612 can also further comprise bottom plate and cover board, to surround airflow channel.
In some embodiments of the invention, as depicted in figs. 1 and 2, heat-exchanger rig 600 may also include the second heat exchanging part
610'.Second heat exchanging part 610' can also have there are two fins set 611 and air supply device, and with the first heat exchanging part 610 about more than one
What plane is arranged symmetrically, to further increase heat exchange efficiency.
In some embodiments of the embodiment, heat-exchanger rig 600 further includes two heat-transfer devices 630, each thermally conductive
Device 630 is symmetrical about above-mentioned geometrical plane, and the middle part of each heat-transfer device 630 is configured to absorb heat from heat source or cold source
Or cooling capacity.One fins set 611 of the first heat exchanging part 610 and a fins set 611 of the second heat exchanging part 610' are set to one
The both ends of heat-transfer device 630；Another fins set 611 of another fins set 611 of first heat exchanging part 610 and the second heat exchanging part 610'
It is set to the both ends of another heat-transfer device 630.That is, the heat-exchanger rig 600 can simultaneously from two heat sources absorb heats or
Cooling capacity, and the heat or cooling capacity of a corresponding heat source or cold source can be transferred to the first heat exchanging part 610 by each heat-exchanger rig 600
One fins set 611 of one fins set 611 and the second heat exchanging part 610'.
Specifically, each heat-transfer device 630 includes heat-conducting substrate 631 and Duo Gen heat carrier 632.Heat-conducting substrate 631 has
With heat source or the hot linked heat-transfer surface of cold source.More heat carriers 632 can be alternatively arranged along the length direction of fin.Moreover, every
Heat carrier 632 can be heat pipe, including being fixed on the middle part heat carrier section of heat-conducting substrate 631 and being located at middle part heat carrier section two sides
, the straight heat carrier section in two ends perpendicular to geometrical plane.The middle part heat carrier section of every heat carrier 632 includes：Middle part is straight
Heat carrier section, and the two connection heat carrier sections extended respectively from the both ends of the straight heat carrier section in middle part to two sides.Every thermally conductive
The straight heat carrier section in two ends of body 632 extends respectively through the perforation hole for each fin being mounted thereon.
Preferably, in each heat-transfer device 630, multiple straight heat carrier sections in middle part are in same plane, multiple ends
Straight heat carrier section is in same plane, and the distance between straight heat carrier section in every two adjacent middle part is adjacent less than every two
The distance between the straight heat carrier section in end, multiple straight heat carrier sections in middle part between heat-transfer surface at a distance from be less than multiple ends and directly lead
Hot body section between heat-transfer surface at a distance from.In this way, can make heat-exchanger rig 600 that there is special structure, it is convenient for heat-exchanger rig
600 are installed on semiconductor freezer.
The straight heat carrier section in middle part, which is fixedly connected with mode with heat-conducting substrate 631, to be：Heat-conducting substrate 631 only has a bottom
Plate offers multiple holding tanks in heat-transfer surface side opposite to each other；The straight heat carrier section in the middle part of more heat carriers 632 is embedding by pressing
Enter holding tank, this mode connects that reliable, thermal resistivity is low.The straight heat carrier section in middle part is fixedly connected with mode with heat-conducting substrate 631
Can be：Heat-conducting substrate 631 can have bottom plate and cover board, and the opposite of bottom plate offers multiple holding tanks in heat-transfer surface side；It is more
The straight heat carrier section in the middle part of root heat carrier 632 is embedded in holding tank by pressing；Cover board is installed on heat-conducting substrate 631 opposite to each other in heat exchange
Face side, with bottom plate that the straight heat carrier section in the middle part of more heat carriers 632 is sandwiched therebetween.
In some alternative embodiments, each heat-transfer device 630 can be the heat-conducting plate of strip, in one side
Portion is heat-transfer surface.Four fins sets 611 are respectively arranged at the both ends of two heat-conducting plates, and the fin of each fins set 611 is from thermally conductive
Extend the another side of plate.Heat-conducting plate can be plate-type heat-pipe.In other alternative embodiments, the first heat exchanging part 610
Two fins sets 611 be mountable on a heat-transfer device 630, two fins sets 611 of the second heat exchanging part 610' are mountable
In on another heat-transfer device 630.Specifically, each heat-transfer device 630 may include heat-conducting substrate 631 and more single u-shaped heat-conductive thermo tubes.
The middle part of each U-shaped heat-conductive thermo tube can be thermally connected by the hot end of heat-conducting substrate 631 and semiconductor chilling plate.It is each U-shaped thermally conductive
The both ends of heat pipe are equipped with a fins set 611.
Further, the embodiment of the invention also provides a kind of semiconductor freezer using above-mentioned heat-exchanger rig 600,
Fig. 3 and Fig. 4 is the schematic side elevation and rearview of semiconductor freezer according to an embodiment of the invention respectively.Such as figure
3 to shown in Fig. 4, the semiconductor freezer of the present embodiment may include semiconductor module 100, liner 200, shell, chamber door 300 with
And insulating layer 400.Storage space is defined in liner 200.Generally there are two kinds of structures for the shell of semiconductor freezer, a kind of
It is pin-connected panel, a complete cabinet is assembled by top cover, left side plate, rear shell 510, lower plate etc..Another kind is whole
Formula, i.e., by top cover and left side plate, rolling is welded at an inverted " u " font, referred to as U shell, then with rear shell 510, lower plate point as required
Cabinet.The semiconductor freezer of the embodiment of the present invention includes U shell and rear shell 510 it is preferable to use monoblock type shell, i.e. shell.
Rear shell 510 can define installation space with the rear surface for the insulating layer 400 for being located at 200 rear side of liner, and offer in rear shell 510
First air inlet, and two the first air outlets positioned at the first air inlet two sides.
In this embodiment, the semiconductor module 100 of semiconductor freezer may include semiconductor chilling plate, cold end heat exchange
Device and hot end heat-exchanger rig.Mounting hole is offered on the insulating layer 400 of 200 rear side of rear wall and liner of liner 200.Cold end is changed
Thermal may include cool guiding block, cold scattering substrate, the multiple cold scattering fins being formed on cold scattering substrate, and dissipate for forced convertion
Cold cold scattering fan.Cool guiding block and semiconductor chilling plate are installed in mounting hole, and the rear surface and semiconductor refrigerating of cool guiding block
The cold end surface of piece thermally contacts.
Hot end heat-exchanger rig can be the heat-exchanger rig 600 in any of the above-described embodiment, two wings of the first heat exchanging part 610
Piece group 611 and air supply device are mounted in installation space and between two the first air outlets.Moreover, the first heat exchanging part
610 two fins sets 611 and the hot end of semiconductor chilling plate are directly or indirectly thermally connected.The air-supply of first heat exchanging part 610
Device is configured to that air-flow is promoted to enter in air supply device from the first air inlet, after flow to two fins sets of the first heat exchanging part 610
611, exchanged heat with the fin with each fins set 611, after from two the first air outlets flow out installation spaces.
In order to improve heat exchange efficiency, heat-exchanger rig 600 further comprises the second heat exchanging part 610'.One the first air outlet is set
It is placed in the top of another first air outlet.It is also provided with the second air inlet and two the second air outlets in rear shell 510, one second
Air outlet is set to the top of another second air outlet, and the second air inlet is set between two the second air outlets.First air inlet
With the second air inlet at sustained height, the first air outlet and the second air outlet are at sustained height mouth.Heat-exchanger rig 600
The second heat exchanging part 610' two fins sets 611 and air supply device be mounted in installation space and in two the second outlet air
Between mouthful.Moreover, the direct or indirect underground heat in the hot end of two fins sets 611 of the second heat exchanging part 610' and semiconductor chilling plate connects
It connects；The air supply device of second heat exchanging part 610' is configured to that air-flow is promoted to enter in air supply device from the second air inlet, after flow to
Two fins sets of two heat exchanging part, are exchanged heat with the fin with each fins set, after from the outflow installation of two the second air outlets
Space.
In this embodiment, semiconductor module 100 can be two, interval setting along the vertical direction, to improve refrigerating efficiency.
Heat-exchanger rig 600 may also include two heat-transfer devices 630.The heat-transfer surface of the heat-conducting substrate 631 of each heat-transfer device 630 and one
The hot end of semiconductor chilling plate contacts against, by the heat transfer of each semiconductor chilling plate to the first heat exchanging part 610 and
Two heat exchanging part 610'.
So far, although those skilled in the art will appreciate that present invention has been shown and described in detail herein multiple shows
Example property embodiment still without departing from the spirit and scope of the present invention, still can according to the present disclosure directly
Determine or deduce out many other variations or modifications consistent with the principles of the invention.Therefore, the scope of the present invention is understood that and recognizes
It is set to and covers all such other variations or modifications.
Claims (5)
1. a kind of heat-exchanger rig for semiconductor freezer, it is characterised in that including the first heat exchanging part, first heat exchange
Portion has：
Two fins sets, each fins set has the fin of multiple parallel intervals setting, and described two fins sets are along institute
State length direction or the setting of width direction interval of fin；With
Air supply device, including ducting assembly and centrifugal wind wheel, the air supply device are set between two fins sets, configuration
At the direction suction airflow from the orientation perpendicular to described two fins sets, and blow air-flow to two fins sets
It send, to allow airflow into each fins set between every two adjacent fins；Wherein
Gap in one fins set of connection between every two adjacent fins and another described is defined in the ducting assembly
The airflow channel in the gap in fins set between every two adjacent fins, the airflow channel include middle part accommodating chamber and two air-supplies
Chamber, and from the middle part accommodating chamber to a fins set, transversely two sides flaring extends each wind pushing cavity；
The centrifugal wind wheel is installed in the middle part accommodating chamber of the airflow channel, and rotation axis is perpendicular to described two
The orientation of fins set is configured to from its axial direction suction airflow, and flows out air-flow from radial direction, by by institute
The part positioned at the centrifugal wind wheel two sides for stating airflow channel flows to two fins sets respectively；
The heat-exchanger rig further includes：
Second heat exchanging part is arranged symmetrically with first heat exchanging part about a geometrical plane；And
Two heat-transfer devices, each heat-transfer device are symmetrical about the geometrical plane；Wherein
Each heat-transfer device includes：
Heat-conducting substrate has and heat source or the hot linked heat-transfer surface of cold source；With
More heat carriers, the middle part heat carrier section including being fixed on the heat-conducting substrate, the middle part of the every heat carrier are thermally conductive
Body section includes the straight heat carrier section in middle part；Wherein
The heat-conducting substrate has a bottom plate, offers multiple holding tanks in heat-transfer surface side opposite to each other；
The straight heat carrier section in the middle part of the more heat carriers is embedded in the holding tank by pressing；
It is configured to absorb heat or cooling capacity from the heat source or cold source in the middle part of each heat-transfer device；
One fins set of first heat exchanging part and a fins set of second heat exchanging part be set to one it is described thermally conductive
The both ends of device；
Another fins set of another fins set of first heat exchanging part and second heat exchanging part is set to another described thermally conductive
The both ends of device；And
The more heat carriers are alternatively arranged along the length direction of the fin, and the every heat carrier further includes being located in described
Portion heat carrier section two sides, the straight heat carrier section in two ends perpendicular to the geometrical plane, two of the every heat carrier
The straight heat carrier section in end extends respectively through the perforation hole for each fin being mounted thereon.
2. heat-exchanger rig according to claim 1, which is characterized in that
The middle part heat carrier section of the every heat carrier further includes：Prolong respectively from the both ends of the straight heat carrier section in the middle part to two sides
The two connection heat carrier sections stretched；And in each heat-transfer device, multiple straight heat carrier sections in middle part are in same flat
In face, multiple straight heat carrier sections in end are in same plane, and between the straight heat carrier section in every two adjacent middle part
Distance is less than the distance between straight heat carrier section in every two adjacent end, between the straight heat carrier section in middle part and the heat-transfer surface
Distance be less than the straight heat carrier section in the end between the heat-transfer surface at a distance from.
3. heat-exchanger rig according to claim 1, which is characterized in that
The width of each fin is the 1/7 to 3/7 of its length；
Two fins sets of first heat exchanging part are arranged along the length direction interval of the fin.
4. a kind of semiconductor freezer, including liner, semiconductor chilling plate and the insulating layer being set on rear side of the liner,
It is characterized in that, further includes：
Rear shell defines installation space with the rear surface of the insulating layer, and offers the first air inlet thereon, and be located at
Two the first air outlets of first air inlet two sides；With
Heat-exchanger rig according to any one of claim 1 to 3, two fins sets and air supply device of the first heat exchanging part
It is mounted in the installation space and between two first air outlets；And
Two fins sets of first heat exchanging part and the hot end of the semiconductor chilling plate are directly or indirectly thermally connected；
The air supply device of first heat exchanging part is configured to that air-flow is promoted to enter in the air supply device from first air inlet,
Two fins sets for flowing to first heat exchanging part afterwards, are exchanged heat with the fin with each fins set, after from two institutes
It states the first air outlet and flows out the installation space.
5. semiconductor freezer according to claim 4, which is characterized in that
One first air outlet is set to the top of another first air outlet；
The second air inlet and two the second air outlets are also provided in the rear shell, second air outlet is set to another
The top of second air outlet, second air inlet are set between two second air outlets；And
Two fins sets and air supply device of second heat exchanging part of the heat-exchanger rig are mounted in the installation space and locate
Between two second air outlets；And
Two fins sets of second heat exchanging part and the hot end of the semiconductor chilling plate are directly or indirectly thermally connected；
The air supply device of second heat exchanging part is configured to that air-flow is promoted to enter in the air supply device from second air inlet,
Two fins sets for flowing to second heat exchanging part afterwards, are exchanged heat with the fin with each fins set, after from two institutes
It states the second air outlet and flows out the installation space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510988851.6A CN105466260B (en) | 2015-12-24 | 2015-12-24 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510988851.6A CN105466260B (en) | 2015-12-24 | 2015-12-24 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105466260A CN105466260A (en) | 2016-04-06 |
| CN105466260B true CN105466260B (en) | 2018-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510988851.6A Active CN105466260B (en) | 2015-12-24 | 2015-12-24 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104197612A (en) * | 2014-09-03 | 2014-12-10 | 四川航天系统工程研究所 | High-efficiency cooling assembly of semiconductor refrigerator |
| CN204373478U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Heat-exchange device and semiconductor refrigerating equipment |
| CN204716621U (en) * | 2015-05-29 | 2015-10-21 | 合肥美的电冰箱有限公司 | For the spiral case of refrigerator and blower fan and the refrigerator with this blower fan |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM297010U (en) * | 2006-03-06 | 2006-09-01 | Channel Well Technology Co Ltd | Double-effect thermoelectric cooling apparatus |
| CN104329850B (en) * | 2014-03-28 | 2017-03-01 | 海尔集团公司 | Semiconductor freezer and its hot junction heat-exchanger rig |
| CN204694128U (en) * | 2015-04-30 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104197612A (en) * | 2014-09-03 | 2014-12-10 | 四川航天系统工程研究所 | High-efficiency cooling assembly of semiconductor refrigerator |
| CN204373478U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Heat-exchange device and semiconductor refrigerating equipment |
| CN204716621U (en) * | 2015-05-29 | 2015-10-21 | 合肥美的电冰箱有限公司 | For the spiral case of refrigerator and blower fan and the refrigerator with this blower fan |
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| CN105466260A (en) | 2016-04-06 |
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