CN105448855A - Package structure capable of changing circuit configuration - Google Patents
Package structure capable of changing circuit configuration Download PDFInfo
- Publication number
- CN105448855A CN105448855A CN201410438986.0A CN201410438986A CN105448855A CN 105448855 A CN105448855 A CN 105448855A CN 201410438986 A CN201410438986 A CN 201410438986A CN 105448855 A CN105448855 A CN 105448855A
- Authority
- CN
- China
- Prior art keywords
- packaging body
- encapsulating structure
- circnit layout
- chip
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Semiconductor Integrated Circuits (AREA)
Abstract
The invention relates to the field of electronic technology, particularly to a package structure. A package structure capable of changing circuit configuration includes a package for packaging a chip. A circuit is disposed on the chip. The circuit is connected with pins of the chip correspondingly through connecting ends. At least two of the connecting ends are led out to the upper surface of the package to serve as lead-out ends. According to the invention, the connecting ends expected to be in need of change of line connection relation in the circuit are led out to the upper surface of the package, a metal lead can be disposed between the lead-out ends or a space can be reserved for welding a metal lead, so that the connection between the two connecting ends in the circuit can be changed as required without opening the chip package structure, and the invention is especially suitable for the research and development stage and facilitates the change of circuit configuration.
Description
Technical field
The present invention relates to electronic technology field, be specifically related to a kind of encapsulating structure.
Background technology
Microelectronics Packaging utilizes membrane technology and fine interconnection technique, semiconductor components and devices and other inscapes are arranged on framework or substrate, fix and connect, draw splicing ear, and fixed by the embedding of plasticity dielectric, form the technology of overall package structure, encapsulating structure does not still link up the bridge of chip internal and external circuit, also for chip and miscellaneous part provide reliable mechanical support, protection is not by external environmental interference, the encapsulating structure of prior art is once fixing, Circnit Layout is not easy to change, when needs are changed Circnit Layout, the technique of needs complexity is changed, waste time and energy and be not easy to implement, and when being used for development, because needs are changed repeatedly, more considerably increase the workload of research staff.
Summary of the invention
The object of the invention is to, a kind of encapsulating structure changing Circnit Layout is provided, solves above technical problem.
Technical problem solved by the invention can realize by the following technical solutions:
The encapsulating structure of Circnit Layout can be changed, comprise packaging body, for chip package, described chip is provided with circuit, described circuit connects by link is corresponding with the pin of described chip, it is characterized in that, at least two described links are drawn to the upper surface of described packaging body as exit.
The encapsulating structure changing Circnit Layout of the present invention, two described exits at least one precalculated position are connected in the upper surface of described packaging body by metal lead wire.
The encapsulating structure of the of the present invention Circnit Layout changed, described exit forms pad in the upper surface of described packaging body.
The encapsulating structure changing Circnit Layout of the present invention, the lower surface of described packaging body arranges described pin in order to be connected with external print circuit board.
The encapsulating structure changing Circnit Layout of the present invention, described packaging body adopts the encapsulating structure of BGA Package form.
The encapsulating structure changing Circnit Layout of the present invention, the inside of described packaging body comprises substrate, and described chip is arranged on described substrate.
The encapsulating structure changing Circnit Layout of the present invention, described packaging body adopts ceramic material or plastic material to make.
Beneficial effect: owing to adopting above technical scheme, line connecting relation in circuit is estimated to need the link changed to lead to the upper surface of packaging body by the present invention, metal lead wire can will be set or reserved exit goes between in order to weld metal between exit, be convenient to need not to open when needed chip-packaging structure and can change connection in circuit between two links, be specially adapted to development, conveniently change Circnit Layout.
Accompanying drawing explanation
Fig. 1 is the schematic internal view of packaging body of the present invention;
Fig. 2 is the front view of packaging body of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of protection of the invention.
It should be noted that, when not conflicting, the embodiment in the present invention and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
With reference to Fig. 1, Fig. 2, the encapsulating structure of Circnit Layout can be changed, comprise packaging body 1, encapsulate for chip 3, chip 3 is provided with circuit, and circuit connects by link 2 is corresponding with the pin 4 of chip 3, and at least two links 2 are drawn to the upper surface of packaging body 1 as exit.
Line connecting relation in circuit is estimated to need the link 2 changed to lead to the upper surface of packaging body 1 by the present invention, metal lead wire can will be set or reserved exit goes between in order to weld metal between exit, be convenient to need not to open when needed chip-packaging structure and can change connection in circuit between two links 2, be specially adapted to development, conveniently change Circnit Layout.
The encapsulating structure changing Circnit Layout of the present invention, two exits at least one precalculated position are connected in the upper surface of packaging body 1 by metal lead wire 5.
Metal lead wire 5 of the present invention can along the transverse direction of packaging body 1 or longitudinal arrangement.With reference to shown in Fig. 2, comprise four desired locations, wherein, two transversely arranged, two other longitudinal arrangement.In off-state between the exit of the position, central area of packaging body, reserve and go between in order to connection metal; The exit of all the other two desired locations is connected by metal lead wire.
The encapsulating structure changing Circnit Layout of the present invention, exit forms pad in the upper surface of packaging body 1, is convenient to weld metal lead-in wire.
The encapsulating structure changing Circnit Layout of the present invention, the lower surface of packaging body 1 arranges pin 4 in order to be connected with external print circuit board.Because exit is arranged at the upper surface of packaging body 1, pin 4 is arranged at the lower surface of packaging body 1, and after making packaging body 1 be installed on printed circuit board, the annexation between being convenient to exit is changed.
The encapsulating structure changing Circnit Layout of the present invention, packaging body 1 adopts the encapsulating structure of BGA Package form.The pin of the encapsulating structure of BGA Package form can be very short, shortens the transmission path of signal, reduce lead-in inductance, resistance, thus can improve the performance of circuit.
The encapsulating structure changing Circnit Layout of the present invention, the inside of packaging body 1 comprises substrate, and chip 3 is arranged on substrate.The lower surface of substrate arranges pad, and ball bond forms pin 2 on pad.
The encapsulating structure changing Circnit Layout of the present invention, packaging body 1 can adopt ceramic material or plastic material to make.The packaging body 1 adopting ceramic material to make has greater flexibility in external form and function aspects, has better heat dispersion simultaneously.
The foregoing is only preferred embodiment of the present invention; not thereby embodiments of the present invention and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilizations specification of the present invention and diagramatic content and apparent change obtain in protection scope of the present invention.
Claims (7)
1. can change the encapsulating structure of Circnit Layout, comprise packaging body, for chip package, described chip is provided with circuit, described circuit connects by link is corresponding with the pin of described chip, it is characterized in that, at least two described links are drawn to the upper surface of described packaging body as exit.
2. the encapsulating structure changing Circnit Layout according to claim 1, is characterized in that, two described exits at least one precalculated position are connected in the upper surface of described packaging body by metal lead wire.
3. the encapsulating structure changing Circnit Layout according to claim 1, is characterized in that, described exit forms pad in the upper surface of described packaging body.
4. the encapsulating structure changing Circnit Layout according to claim 1, is characterized in that, the lower surface of described packaging body arranges described pin in order to be connected with external print circuit board.
5. the encapsulating structure changing Circnit Layout according to claim 1, is characterized in that, described packaging body adopts the encapsulating structure of BGA Package form.
6. the encapsulating structure changing Circnit Layout according to claim 1, is characterized in that, the inside of described packaging body comprises substrate, and described chip is arranged on described substrate.
7. the encapsulating structure changing Circnit Layout according to claim 1, is characterized in that, described packaging body adopts ceramic material or plastic material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410438986.0A CN105448855A (en) | 2014-08-29 | 2014-08-29 | Package structure capable of changing circuit configuration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410438986.0A CN105448855A (en) | 2014-08-29 | 2014-08-29 | Package structure capable of changing circuit configuration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105448855A true CN105448855A (en) | 2016-03-30 |
Family
ID=55558892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410438986.0A Pending CN105448855A (en) | 2014-08-29 | 2014-08-29 | Package structure capable of changing circuit configuration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105448855A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101859752A (en) * | 2009-04-06 | 2010-10-13 | 杨文焜 | Stack package structure and manufacture method thereof with chip embedded and silicon through hole crystal grain |
| CN101930956A (en) * | 2009-06-22 | 2010-12-29 | 日月光半导体制造股份有限公司 | Chip packaging structure and manufacturing method thereof |
| CN201725790U (en) * | 2010-05-12 | 2011-01-26 | 谢国华 | Chip with double-layer lead pin |
| CN102088013A (en) * | 2009-12-02 | 2011-06-08 | 杨文焜 | Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same |
| CN102376678A (en) * | 2010-08-23 | 2012-03-14 | 矽品精密工业股份有限公司 | Chip scale package and manufacturing method thereof |
-
2014
- 2014-08-29 CN CN201410438986.0A patent/CN105448855A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101859752A (en) * | 2009-04-06 | 2010-10-13 | 杨文焜 | Stack package structure and manufacture method thereof with chip embedded and silicon through hole crystal grain |
| CN101930956A (en) * | 2009-06-22 | 2010-12-29 | 日月光半导体制造股份有限公司 | Chip packaging structure and manufacturing method thereof |
| CN102088013A (en) * | 2009-12-02 | 2011-06-08 | 杨文焜 | Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same |
| CN201725790U (en) * | 2010-05-12 | 2011-01-26 | 谢国华 | Chip with double-layer lead pin |
| CN102376678A (en) * | 2010-08-23 | 2012-03-14 | 矽品精密工业股份有限公司 | Chip scale package and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160330 |
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| RJ01 | Rejection of invention patent application after publication |