CN105390572A - LED dispensing process - Google Patents

LED dispensing process Download PDF

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Publication number
CN105390572A
CN105390572A CN201510917729.XA CN201510917729A CN105390572A CN 105390572 A CN105390572 A CN 105390572A CN 201510917729 A CN201510917729 A CN 201510917729A CN 105390572 A CN105390572 A CN 105390572A
Authority
CN
China
Prior art keywords
led
step
phosphor gel
minutes
gluing process
Prior art date
Application number
CN201510917729.XA
Other languages
Chinese (zh)
Inventor
胡清辉
高芬
胡建
柏云
杨明周
Original Assignee
江阴乐圩光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 江阴乐圩光电股份有限公司 filed Critical 江阴乐圩光电股份有限公司
Priority to CN201510917729.XA priority Critical patent/CN105390572A/en
Publication of CN105390572A publication Critical patent/CN105390572A/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/005Processes relating to semiconductor body packages relating to encapsulations

Abstract

The invention discloses an LED dispensing process, which comprises the following five steps: carrying out dehumidifying and dedusting treatment on an LED bracket; placing an LED chip into a bowl of the LED bracket; dispensing fluorescent powder glue to the bowl of the LED bracket by automatic dispensing equipment, so as to coat the LED chip with the fluorescent powder glue; putting the dispensed LED bracket into an oven for baking within 10 minutes; and finishing the LED dispensing process after molding the fluorescent powder glue. The LED dispensing process disclosed by the invention is simple in process sequence and convenient to operate; and the amount of the fluorescent powder glue is set, so that the LED chip is relatively uniform to shine.

Description

LED gluing process

Technical field

The invention belongs to LED technology field, be specifically related to a kind of LED gluing process.

Background technology

In LED technique, the mode generally carrying out a glue on the LED support that LED chip is housed fixes and protects LED chip.Current existing some glue mode is from just carrying out a glue to the top of LED chip, and glue, under gravity and surface tension effects, forms glue-line.

The power type LED chip of reduced size support and bed type support are adopted to the LED of the some glue mode of " box dam ", in encapsulation process, glue amount controls difficulty.When the viscosity of phosphor gel is less, phosphor gel easily flows out LED support, phosphor gel is caused to drive fluorescent material to flow out together, make chip surface fluorescent material skewness, there is yellow circle or blue circle, when the viscosity as phosphor gel is larger, because mobility is little, thus cause the skewness of phosphor gel and affect the uniformity of bright dipping, gold thread position can produce larger tractive effort to phosphor gel.

Summary of the invention

Object of the present invention provides LED gluing process, solves one or more in above-mentioned prior art problem.

LED gluing process disclosed by the invention, it comprises the following steps:

Step one. LED support is dehumidified and after dust removal process, LED chip is placed in the bowl cup of LED support;

Step 2. phosphor gel is loaded in the packing element of automatically dropping glue equipment, according to each spray volume of the bowl cup setting automatically dropping glue equipment mid point glue nozzle of LED support, and in advance air unnecessary in a glue nozzle is discharged;

Step 3. utilize the automatically dropping glue equipment in described step 2 to the bowl cyphelia phosphor gel of LED support, to make the coated LED chip of phosphor gel;

Step 4. the LED support completing a glue in described step 3 was put into baking box in 10 minutes and toasts;

Step 5. after phosphor gel is shaping, namely complete the gluing process of LED.

In some embodiments, the highest raised points of the phosphor gel in step 3 is lower than the height of LED support two solder joints.

In some embodiments, in step 4, the temperature of baking box is 90 degree to 150 degree, and baking time is 10 minutes to 60 minutes.

In some embodiments, the phosphor gel in step 2 in packing element will be changed once for 30 to 40 minutes, ensures the pliability of phosphor gel.

The beneficial effect of LED gluing process provided by the present invention is:

Process flow steps of the present invention is simple, easy to operate, and the glue amount of phosphor gel is through setting, makes the luminescence of LED chip more even.

Accompanying drawing explanation

Fig. 1 is the structural representation of LED support in the LED gluing process of one embodiment of the present invention.

Embodiment

Below in conjunction with Figure of description, the present invention is described in more detail.

As shown in Figure 1, LED gluing process provided by the invention, its its comprise the following steps:

Step one. LED support 1 is dehumidified and after dust removal process, LED chip 2 is placed in the bowl cup 11 of LED support 1;

Step 2. phosphor gel 3 is loaded in the packing element of automatically dropping glue equipment, according to each spray volume of the bowl cup setting automatically dropping glue equipment mid point glue nozzle of LED support, and in advance air unnecessary in a glue nozzle is discharged;

Step 3. utilize the automatically dropping glue equipment in described step 2 to the bowl cup 11 dot fluorescent powder glue 3 of LED support 1, to make the coated LED chip 2 of phosphor gel 3;

Step 4. the LED support 1 completing a glue in described step 3 was put into baking box in 10 minutes and toasts;

Step 5. after phosphor gel 3 is shaping, namely complete the gluing process of LED.

Phosphor gel in step 2 in packing element will be changed once for 30 to 40 minutes, ensures the pliability of phosphor gel 3.The highest raised points of the phosphor gel 3 in step 3 is lower than the height of LED support 1 two solder joints 12.In step 4, the temperature of baking box is 90 degree to 150 degree, and baking time is 10 minutes to 60 minutes.

The process flow steps of LED gluing process provided by the present invention is simple, easy to operate, and the glue amount of phosphor gel is through setting, makes the luminescence of LED chip more even.

The above is only optimal way of the present invention; it should be pointed out that to those skilled in the art, without departing from the concept of the premise of the invention; can also make some similar distortion and improvement, these also should be considered as within protection scope of the present invention.

Claims (4)

1.LED gluing process, is characterized in that, comprises the following steps:
Step one. LED support is dehumidified and after dust removal process, LED chip is placed in the bowl cup of LED support;
Step 2. phosphor gel is loaded in the packing element of automatically dropping glue equipment, according to each spray volume of the bowl cup setting automatically dropping glue equipment mid point glue nozzle of LED support, and in advance air unnecessary in a glue nozzle is discharged;
Step 3. utilize the automatically dropping glue equipment in described step 2 to the bowl cyphelia phosphor gel of LED support, to make the coated LED chip of phosphor gel;
Step 4. the LED support completing a glue in described step 3 was put into baking box in 10 minutes and toasts;
Step 5. after phosphor gel is shaping, namely complete the gluing process of LED.
2. LED gluing process according to claim 1, is characterized in that, the highest raised points of the phosphor gel in described step 3 is lower than the height of LED support two solder joints.
3. LED gluing process according to claim 1, is characterized in that, in described step 4, the temperature of baking box is 90 degree to 150 degree, and baking time is 10 minutes to 60 minutes.
4. LED gluing process according to claim 1, is characterized in that, the phosphor gel in described step 2 in packing element will be changed once for 30 to 40 minutes.
CN201510917729.XA 2015-12-11 2015-12-11 LED dispensing process CN105390572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510917729.XA CN105390572A (en) 2015-12-11 2015-12-11 LED dispensing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510917729.XA CN105390572A (en) 2015-12-11 2015-12-11 LED dispensing process

Publications (1)

Publication Number Publication Date
CN105390572A true CN105390572A (en) 2016-03-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510917729.XA CN105390572A (en) 2015-12-11 2015-12-11 LED dispensing process

Country Status (1)

Country Link
CN (1) CN105390572A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107516707A (en) * 2017-08-11 2017-12-26 安徽新瑞重工股份有限公司 A kind of gluing process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101783383A (en) * 2010-01-08 2010-07-21 广州市鸿利光电股份有限公司 Dispensing process of white light-emitting diode
CN102148298A (en) * 2010-12-28 2011-08-10 广州市鸿利光电股份有限公司 Multipoint dispensing process and LED (light emitting diode) device
CN102755947A (en) * 2012-07-19 2012-10-31 厦门多彩光电子科技有限公司 Efficient LED (Light-Emitting Diode) gluing and coating method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101783383A (en) * 2010-01-08 2010-07-21 广州市鸿利光电股份有限公司 Dispensing process of white light-emitting diode
CN102148298A (en) * 2010-12-28 2011-08-10 广州市鸿利光电股份有限公司 Multipoint dispensing process and LED (light emitting diode) device
CN102755947A (en) * 2012-07-19 2012-10-31 厦门多彩光电子科技有限公司 Efficient LED (Light-Emitting Diode) gluing and coating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107516707A (en) * 2017-08-11 2017-12-26 安徽新瑞重工股份有限公司 A kind of gluing process

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Application publication date: 20160309

WD01 Invention patent application deemed withdrawn after publication