CN105388166A - Chip carrier rack mechanism for chip visual inspection - Google Patents

Chip carrier rack mechanism for chip visual inspection Download PDF

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Publication number
CN105388166A
CN105388166A CN201510927105.6A CN201510927105A CN105388166A CN 105388166 A CN105388166 A CN 105388166A CN 201510927105 A CN201510927105 A CN 201510927105A CN 105388166 A CN105388166 A CN 105388166A
Authority
CN
China
Prior art keywords
chip
chi frame
detection
installation
guide groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510927105.6A
Other languages
Chinese (zh)
Inventor
李志远
耿世慧
李熙春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Fivision Technology Co Ltd
Original Assignee
Chongqing Fivision Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Fivision Technology Co Ltd filed Critical Chongqing Fivision Technology Co Ltd
Priority to CN201510927105.6A priority Critical patent/CN105388166A/en
Publication of CN105388166A publication Critical patent/CN105388166A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Abstract

The invention provides a chip carrier rack mechanism for chip visual inspection. The chip carrier rack mechanism comprises a track and a chip frame moving on the track, the track comprises two steel rails arranged in parallel, the facing surfaces of the two steel rails are respectively provided with a guide slot, two side edges of the chip frame are respectively embedded in the guide slots of the two steel rails and can move on the track, two side edges of the chip frame are respectively a plurality of first pulleys, the pulley surfaces of the first pulleys are in contact with the guide slots, the bottoms of the two side edges of the chip frame embedded in the guide slots are also provided with a plurality of second pulleys, the pulley surfaces of the second pulleys are in contact with the guide slots, and the end surface of the chip frame in installation positions is also provided with a plurality of through holes. An image acquisition device can be arranged above the track rightly facing the installation positions to acquire an image, and image treatment is carried out to judge qualification detection of a chip, so the efficiency in the invention is higher than that of present technologies adopting artificial detection modes.

Description

A kind of chip carrier mechanism being suitable for chip vision-based detection
Technical field
The present invention relates to chip detection technical field, particularly relate to a kind of chip carrier mechanism being suitable for chip vision-based detection.
Background technology
One of restriction China's development of computer and universal gordian technique are chips, and the development bottleneck of chip is manufacturing equipment and production technology.Can Godson popularize one of key factor on China's computing machine is exactly the production technology that China's manufacture of microchips must grasp chip.The technology that production technology relates to is a lot, and it is one of important content that the outward appearance wherein in chip manufacturing proces detects.The outward appearance detection system of current chip manufacture process is standard and the technology of American I NTEL and AMD substantially.China does not also have this type of chip outward appearance detection system a set of at present.Therefore China's self-developing chip outward appearance detection system is an extremely important project and engineering to China's chip manufacturing.
In existing chip manufacture process, the chip produced needs to carry out detecting to prevent chip defective or defective from coming into the market, and this operation is at present mainly by manually carrying out detecting.This mode of being undertaken detecting by experience, has following deficiency:
The first, the 4 second time of manual detection chip normal need, efficiency is not high;
The second, due to detection chip of manually bowing for a long time, cause brains to be fainted, eye fatigue, be easy to cause quality accident;
3rd, because manual detection station is worked hard, eye fatigue, a lot of employee is not for a long time in this station working time, and station employee is exchanged frequently, causes quality not ensure.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of chip carrier mechanism being suitable for chip vision-based detection, for solving problem lower by manual detection chip effect in prior art.
For achieving the above object and other relevant objects, the invention provides following technical scheme:
A kind of chip carrier mechanism being suitable for chip vision-based detection, described chip carrier mechanism comprises track and is suitable for the chi frame of movement in orbit, track comprises two rail be set in parallel, the face that two one steel rails are just right respectively offers a guide groove, the dual-side of described chi frame is embedded the movement realized in the guide groove of two one steel rails in orbit respectively, the dual-side of chi frame is respectively arranged with some first pulleys and the wheel face of this first pulley contacts with guide groove, some second pulleys are also provided with in the bottom being embedded the chi frame dual-side in guide groove, and the wheel face of the second pulley contacts with guide groove, the chi frame end face at place, installation position is also provided with some through holes.
Preferably, chi frame is also provided with some installation positions for chip placement, and this some installation position becomes the spread configuration of array.
Preferably, chi frame comprises two row installation positions, the quantity often arranging installation position is 5-7.
Preferably, described through hole is arranged between two row installation positions, and the quantity of through hole is identical with the installation position quantity often arranged.
Preferably, with the guide groove of the first pulley contact on be also provided with adhesive tape, increase friction with this, prevent stop chi frame time inertia excessive, cause the situation that chip on installation position rocks.
Preferably, the side adjacent with the dual-side of chi frame is also provided with connector, is suitable for connecting the driving mechanism for the movement of driving chip framework.
As mentioned above, the present invention has following beneficial effect: in the application of reality, image acquiring device can be set above the track just right with installation position, chip on installation position is taken pictures, thus obtain image and judged the qualified detection of chip by image procossing, adopt the mode of artificial detection compared to existing technology, efficiency seems higher.
Accompanying drawing explanation
Fig. 1 is shown as a kind of schematic diagram being suitable for the chip carrier mechanism of chip vision-based detection.
The one that Fig. 2 is shown as chi frame implements structural representation.
Element numbers explanation
1 rail
11 guide grooves
2 chi frames
21 installation positions
22 connectors
23 through holes
3 first pulleys
4 second pulleys
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, person skilled in the art scholar the content disclosed by this instructions can understand other advantages of the present invention and effect easily.
Refer to Fig. 1.Notice, structure, ratio, size etc. that this instructions institute accompanying drawings illustrates, content all only in order to coordinate instructions to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this instructions as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Refer to Fig. 1, for a kind of schematic diagram being suitable for the chip carrier mechanism of chip vision-based detection, as shown in the figure, this chip carrier mechanism comprises track and is suitable for the chi frame 2 of movement in orbit, track comprises two rail be set in parallel 1, the face that two one steel rails 1 are just right respectively offers a guide groove 11, the dual-side of described chi frame 2 is embedded the movement realized in the guide groove 11 of two one steel rails 1 in orbit respectively, the dual-side of chi frame 2 is respectively arranged with some first pulleys 3 and the wheel face of this first pulley 3 contacts with guide groove 11, some second pulleys 4 are also provided with and the wheel face of the second pulley 4 contacts with guide groove 11 in the bottom of chi frame 2 dual-side be embedded in guide groove 11, chi frame 2 end face at place, installation position 21 is also provided with some through holes 23.
In concrete enforcement, see Fig. 2, for the one of chi frame 2 implements structural representation, chi frame 2 can also be provided with some installation positions 21 for chip placement, the spread configuration of this some 21 one-tenth, installation positions array.Usually, chi frame 2 comprises two row installation positions 21, the quantity often arranging installation position 21 is 5-7, and wherein, described through hole 23 is arranged between two row installation positions 21, and the quantity of through hole 23 is identical with installation position 21 quantity often arranged.By this structure, chi frame 2 can be allowed to keep motion, and triggered by through hole 23 and take pictures thus in motion process, complete taking pictures of chip, thus avoid and allow chi frame 2 stop the situation of taking pictures, efficiency is higher always.
In concrete enforcement, the guide groove 11 contacted also is provided with adhesive tape, increases friction with this with the first pulley 3, preventing the inertia when stopping chi frame 2 excessive, causing the situation that on installation position 21, chip rocks.
In concrete enforcement, the side adjacent with the dual-side of chi frame 2 is also provided with connector 22, is suitable for connecting the driving mechanism for the movement of driving chip framework 2.
In the application of reality, image acquiring device can be set above the track just right with installation position 21, chip on installation position 21 is taken pictures, thus obtain image and judged the qualified detection of chip by image procossing, adopt the mode of artificial detection compared to existing technology, efficiency seems higher.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.

Claims (6)

1. one kind is suitable for the chip carrier mechanism of chip vision-based detection, it is characterized in that: described chip carrier mechanism comprises track and is suitable for the chi frame of movement in orbit, track comprises two rail be set in parallel, the face that two one steel rails are just right respectively offers a guide groove, the dual-side of described chi frame is embedded the movement realized in the guide groove of two one steel rails in orbit respectively, the dual-side of chi frame is respectively arranged with some first pulleys and the wheel face of this first pulley contacts with guide groove, some second pulleys are also provided with in the bottom being embedded the chi frame dual-side in guide groove, and the wheel face of the second pulley contacts with guide groove, the chi frame end face at place, installation position is also provided with some through holes.
2. the chip carrier mechanism being suitable for chip vision-based detection according to claim 1, is characterized in that: on chi frame, be also provided with some installation positions for chip placement, this some installation position becomes the spread configuration of array.
3. the chip carrier mechanism being suitable for chip vision-based detection according to claim 2, is characterized in that: on chi frame, comprise two row installation positions, and the quantity often arranging installation position is 5-7.
4. the chip carrier mechanism being suitable for chip vision-based detection according to claim 3, it is characterized in that: described through hole is arranged between two row installation positions, and the quantity of through hole is identical with the installation position quantity often arranged.
5. the chip carrier mechanism being suitable for chip vision-based detection according to claim 1, it is characterized in that: with the guide groove of the first pulley contact on be also provided with adhesive tape, increase friction with this, preventing the inertia when stopping chi frame excessive, causing the situation that chip on installation position rocks.
6. the chip carrier mechanism being suitable for chip vision-based detection according to claim 1, is characterized in that: on the side adjacent with the dual-side of chi frame, be also provided with connector, is suitable for connecting the driving mechanism for the movement of driving chip framework.
CN201510927105.6A 2015-12-14 2015-12-14 Chip carrier rack mechanism for chip visual inspection Pending CN105388166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510927105.6A CN105388166A (en) 2015-12-14 2015-12-14 Chip carrier rack mechanism for chip visual inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510927105.6A CN105388166A (en) 2015-12-14 2015-12-14 Chip carrier rack mechanism for chip visual inspection

Publications (1)

Publication Number Publication Date
CN105388166A true CN105388166A (en) 2016-03-09

Family

ID=55420695

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510927105.6A Pending CN105388166A (en) 2015-12-14 2015-12-14 Chip carrier rack mechanism for chip visual inspection

Country Status (1)

Country Link
CN (1) CN105388166A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101670942A (en) * 2009-09-03 2010-03-17 东莞宏威数码机械有限公司 Substrate carrier
CN202245629U (en) * 2011-09-08 2012-05-30 幸福树电机股份有限公司 Rail type conveyer
CN103021899A (en) * 2012-12-21 2013-04-03 日月光半导体(昆山)有限公司 Semiconductor product detecting machine and detecting method thereof
CN103043511A (en) * 2012-12-28 2013-04-17 苏州新奇特清洗设备有限公司 Lifting track
CN103337470A (en) * 2013-07-02 2013-10-02 无锡中微高科电子有限公司 Transmitting boat for full-automatic loading machine
CN203345550U (en) * 2013-06-18 2013-12-18 马鞍山市盛力锁业科技有限公司 Semi-finished product conveying device of punching machine
CN203587514U (en) * 2013-12-09 2014-05-07 中国人民解放军第三军医大学第二附属医院 Assembled inspection table

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101670942A (en) * 2009-09-03 2010-03-17 东莞宏威数码机械有限公司 Substrate carrier
CN202245629U (en) * 2011-09-08 2012-05-30 幸福树电机股份有限公司 Rail type conveyer
CN103021899A (en) * 2012-12-21 2013-04-03 日月光半导体(昆山)有限公司 Semiconductor product detecting machine and detecting method thereof
CN103043511A (en) * 2012-12-28 2013-04-17 苏州新奇特清洗设备有限公司 Lifting track
CN203345550U (en) * 2013-06-18 2013-12-18 马鞍山市盛力锁业科技有限公司 Semi-finished product conveying device of punching machine
CN103337470A (en) * 2013-07-02 2013-10-02 无锡中微高科电子有限公司 Transmitting boat for full-automatic loading machine
CN203587514U (en) * 2013-12-09 2014-05-07 中国人民解放军第三军医大学第二附属医院 Assembled inspection table

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Application publication date: 20160309

RJ01 Rejection of invention patent application after publication