CN105325067B - Conductive radiating fins and electric component and electronic product including conductive radiating fins - Google Patents

Conductive radiating fins and electric component and electronic product including conductive radiating fins Download PDF

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Publication number
CN105325067B
CN105325067B CN201480034531.0A CN201480034531A CN105325067B CN 105325067 B CN105325067 B CN 105325067B CN 201480034531 A CN201480034531 A CN 201480034531A CN 105325067 B CN105325067 B CN 105325067B
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CN
China
Prior art keywords
radiating fins
conductive radiating
layer
heat conduction
thermal diffusion
Prior art date
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CN201480034531.0A
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Chinese (zh)
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CN105325067A (en
Inventor
梁点植
范元辰
宋基德
宋真守
韩仁奎
柳钟虎
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日进材料股份有限公司
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Priority to KR10-2013-0070497 priority Critical
Priority to KR20130070497 priority
Priority to KR10-2014-0073692 priority
Priority to KR1020140073692A priority patent/KR101707042B1/en
Application filed by 日进材料股份有限公司 filed Critical 日进材料股份有限公司
Priority to PCT/KR2014/005363 priority patent/WO2014204204A1/en
Publication of CN105325067A publication Critical patent/CN105325067A/en
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Publication of CN105325067B publication Critical patent/CN105325067B/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472Sheet interfaces
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472Sheet interfaces
    • H05K7/20481Sheet interfaces characterised by the material composition exhibiting specific thermal properties

Abstract

Disclosed herein is a kind of conductive radiating fins and electric component and electronic product including conductive radiating fins, the conductive radiating fins include:The thermal diffusion layer formed using metal material;It is arranged on a surface of thermal diffusion layer or two surfaces and using the heat conduction layer for including the inorganic material formation selected from least one of metal oxide and alloy material;And it is arranged on the adhesive phase on a surface of heat conduction layer or two surfaces.

Description

Conductive radiating fins and electric component and electronic product including conductive radiating fins

Technical field

The present invention relates to conductive radiating fins and electric component and electronic product including the conductive radiating fins, and more Body, it is related to the conductive radiating fins for the heat conduction layer for also including being formed by inorganic material, thus provides except electromagnetic wave shielding performance The heat dissipation characteristics of raising outside energy and electric conductivity.

Background technology

Recently, according to the slimming and simplification of electronic equipment, electronic unit and electric component become miniaturization, according to electricity The high-performance of sub- equipment, electronic unit and electric component generate substantial amounts of heat.Substantial amounts of thermally-induced electronic unit and electrically Faulty operation, lost of life of part etc..

Therefore, effective absorb by electronic unit and the heat of electric component generation and by the heat transfer absorbed outside has been used The conductive radiating fins in portion.

Conductive radiating fins include the thermal diffusion layer that will be discharged to the outside by the heat of electronic unit and electric component generation, and Thermal diffusion layer is attached to the adhesive layer of electronic unit and electric component.Metal such as copper is mainly used as the material of thermal diffusion layer.

Organic polymer is mainly used as the material of adhesive phase.Organic polymer generally has low thermal conductivity.Therefore, wrap Include the thermal diffusion performance degradation of the conductive radiating fins of adhesive phase.

In order to improve the low heat conductivity of adhesive phase, thermal conductive particles are with the addition of, but are made by adding thermal conductive particles Obtain elastic increase, the cohesive reduction of adhesion layer.

Therefore, it has been necessary to provide the conductive radiating fins that excellent heat diffusivity can be with both cohesives.

The content of the invention

Technical problem

In one aspect of the invention, the invention provides a kind of conductive radiating fins/heat loss through conduction with new structure Piece.

In another aspect of this invention, the invention provides a kind of electric component including conductive radiating fins.

In still another aspect of the invention, the invention provides a kind of electronic product including conductive radiating fins.

Technical solution

The exemplary of the present invention provides a kind of conductive radiating fins, and the conductive radiating fins include:

The thermal diffusion layer formed by metal material;

And be arranged on a surface of thermal diffusion layer or two surfaces and by comprising selected from inorganic metal, metal oxygen The heat conduction layer of one or more of inorganic material formation in compound and alloy.

The another exemplary embodiment of the present invention provides a kind of electronic unit, and the electronic unit includes:

Heater;And

It is arranged on the conductive radiating fins on a surface of heater or two surfaces.

The another exemplary of the present invention provides a kind of electronic product including conductive radiating fins.

Beneficial effect

According to an aspect of the present invention, including the heat conduction layer with new composition, enabling do not reducing bonding The conductive radiating fins with both excellent heat diffusivity energy and electromagnetic wave shielding performance are obtained in the case of the cohesive of oxidant layer.

Brief description of the drawings

Fig. 1 is the schematic diagram for showing the conductive radiating fins according to an exemplary.

Fig. 2 is the schematic diagram for showing the conductive radiating fins according to another exemplary embodiment.

Fig. 3 is the schematic diagram for showing the conductive radiating fins according to another exemplary embodiment.

Fig. 4 is the schematic diagram for showing the conductive radiating fins according to another exemplary embodiment.

Fig. 5 is the schematic diagram for showing the conductive radiating fins according to another exemplary embodiment.

Fig. 6 is the schematic diagram for showing the conductive radiating fins according to another exemplary embodiment.

<The description of reference>

(100):Fin (001):Adhesive phase

(002):Heat conduction layer (003):Thermal diffusion layer

(004):Inorganic metal layer (005):Release layer

Embodiment

Hereinafter, by the conductive radiating fins according to exemplary, and the electricity of the conductive radiating fins is included Gas part and electronic product are explained in more detail.

Included according to the conductive radiating fins of an exemplary:The thermal diffusion layer formed by metal material;And It is arranged on a surface of thermal diffusion layer or two surfaces and by including in inorganic metal, metal oxide and alloy One or more of inorganic material formation heat conduction layer.Metal material is not limited specifically, but can be such as copper And aluminium.Inorganic metal is the metals different from forming the metal material of thermal diffusion layer.For example, inorganic metal can be iron, zinc and Nickel.

Conductive radiating fins can also include the protective layer being arranged on a surface of heat conduction layer or two surfaces.Protection Layer can include polymer.Protective layer includes polymer so that protective layer can be melted by heating, and be attached to substrate material Material etc., or polymer have cohesive in itself so that protective layer can be attached to base material etc..What is used in protective layer is poly- Compound has no particular limits, and can be that the thermoplastic polymer by heating melting or the adhesive with cohesive gather Compound.

For example, protective layer can be the adhesive phase for including binder polymer.

At the same time, in general conductive radiating fins in the related art, adhesive layer includes thermal conductive particles so that viscous The thermal conductivity for closing layer is improved, but cohesive is deteriorated.By contrast, in the conductive radiating fins of the present invention, thermal conductive particles are formed In single heat conduction layer, enabling prevent the thermal diffusion performance degradation of conductive radiating fins and adhesive layer can be improved Cohesive.

Adhesive layer in conductive radiating fins does not include thermal conductive particles or including than the conductive radiating fins in correlation technique Thermal conductive particles poor thermal conductive particles, enabling provide with correlation technique in conductive radiating fins thermal diffusion The similar heat diffusivity energy of performance.

In conductive radiating fins, metal oxide can be black oxide.Metal oxide can pass through black oxidation Thing effectively suppresses deterioration according to the temperature change of conductive radiating fins.In addition, the cohesive between heat conduction layer and adhesive layer can More to improve.In addition, heat conduction layer substantially has black, excellent outward appearance is thus provided, and more effectively shields electricity Magnetic wave, thus reduces the interference of electromagnetic wave in electronic equipment.For example, black oxide can be one or more transition metal Oxide.For example, black oxide can include the oxide of copper, nickel and cobalt.At the same time, metal oxide can be copper Oxide.

In conductive radiating fins, inorganic material can comprise additionally in the one or more in alloy and carbon-based material Kind.

Inorganic material also includes alloy, thus with metal phase than thermal conductivity of the alloy there is provided raising so that heat conduction layer There can be the thermal conductivity more improved.That is, heat conduction layer can act essentially as new thermal diffusion layer.

In addition, inorganic material also includes carbon-based material so that the thermal conductivity of heat conduction layer can be significantly improved.Cause This, heat conduction layer can act essentially as new thermal diffusion layer.In addition, compared with the thermal diffusion layer formed by metal material, also Heat conduction layer including carbon-based material can substantially provide the heat diffusivity energy more improved.E.g., including carbon-based material Heat conduction layer can form the metal oxide-carbon composite bed with following structure, and carbon-based material is dispersed in gold in the structure shown here Belong in oxide matrix.

Compared with the carbon-based fin formed by graphite in correlation technique, point of the composite bed without such as carbon-based material The problem of dissipating property, crackle and crush (crushing), and need not be coated using single polymer film etc., it is thus real Now simple and firm structure.Therefore, composite bed can provide excellent heat diffusivity energy and durability simultaneously.

For example, carbon-based material can include carbon-based nano structure.Carbon-based nano structure is the knot with nano-scale structure Structure.For example, there is one-dimensional nano structure, the size only one dimension of wherein carbon-based nano structure is unrestricted and remaining The size of two dimensions is limited to 1000nm or smaller;And two-dimensional nanostructure, the wherein size of carbon-based nano structure only two Dimension is unrestricted, and the size of an only remaining dimension is limited to 1000nm or smaller.

One-dimensional nano structure is the unrestricted nanostructured of length, and including such as CNT and carbon Nanowire Dimension.CNT has no particular limits, if such as metal carbon nanotube, semiconductor carbon nanometer tube, single-walled carbon nanotube, double The CNT of wall carbon nano tube and multi-walled carbon nanotube is workable in the art, then the CNT can For use as the CNT of the present invention.Carbon nano-fiber is that diameter is less than 1000nm and had compared with general carbon fiber non- The carbon fiber of often high thermal conductivity.For example, the thermal conductivity of the carbon nano-fiber of vapor phase growth can be 500W/mK or higher. Two-dimensional nanostructure is the unrestricted nanostructured of area, and including graphene etc..If the area of graphene does not have The limitation of body, then available any kind of graphene may be used as two-dimensional nanostructure in the art.

In addition, carbon-based material can also include the one or more in graphite, expanded graphite and carbon fiber.Graphite It is the carbon-based material with high crystalline, its thermal conductivity is high and is 350W/mK to 400W/mK.Expanded graphite is to pass through Using strong acid etc. reason stone ink and then the handled graphite crossed of dry and/or sintering, and make the increased stone in the distance between surface Ink.Carbon fiber is fibrous carbon of the diameter in micron level.

Formed heat conduction layer on thermal diffusion layer can be integrally formed on thermal diffusion layer and without using such as gluing The organic binder bond of mixture or adhesive.For example, heat conduction layer can be formed directly on thermal diffusion layer by plating.Therefore, The thermal conductivity in interface between thermal diffusion layer and heat conduction layer can not be reduced by adhesive or adhesive.

The content of alloy in heat conduction layer can be the gross weight of heat conduction layer by weight 10% to by weight 90%, but be basically not limited in the scope, and can change as suitably desired.

The content of carbon-based material in heat conduction layer can be up to by weight the 10% of the gross weight of heat conduction layer.Example Such as, the content of the carbon-based material in heat conduction layer can be the gross weight of heat conduction layer by weight 0.01% to by weight 10%.For example, the content of the carbon-based material in heat conduction layer can be the gross weight of heat conduction layer by weight 0.1% to by Weight meter 10%.For example, the content of the carbon-based material in heat conduction layer can be the gross weight of heat conduction layer by weight 0.5% to by weight 10%.For example, the content of the carbon-based material in heat conduction layer can be the gross weight of heat conduction layer by Weight meter 1% is to by weight 10%.When the too high levels of the carbon-based material in heat conduction layer, include the heat of metal oxide Conducting shell may have crackle.

Heat conduction layer can not substantially include organic material.That is, heat conduction layer can be without using such as polymerizeing The organic material of thing binding agent and only by metal oxide, alloy and carbon-based material one or more formed.Cause Do not include organic binder bond for heat conduction layer, significantly improved so can be provided compared with the heat conduction layer comprising organic binder bond Thermal conductivity.For example, heat conduction layer can be formed by plating, chemical plating etc..In addition, for example high not implementing stringent condition Heat conduction layer can be formed in the case of temperature and/or high pressure.Manufacture the conduction including heat conduction layer with therefore, it can simple economy Fin.

Alloy in conductive radiating fins can be comprising in Cu, Ni, Co, Fe, Zn, Cr, Mo, W, V, Mn, Ti and Sn Two or more elements alloy.For example, alloy can be one or more of conjunctions in Cu and above-mentioned residual metallic Gold.

Metal oxide in conductive radiating fins can include Cu.For example, metal oxide can be Cu oxide.Example Such as, Cu oxide can be CuO, Cu2O etc..

Metal oxide in conductive radiating fins, which can also be included, is selected from Ni, Co, Fe, Zn, Cr, Mo, W, V, Mn, Ti and Sn In one or more of elements.For example, metal oxide can include being selected from nickel oxide, cobalt/cobalt oxide, ferriferous oxide, zinc One in oxide, chromated oxide, molybdenum oxide, tungsten oxide, barium oxide, Mn oxide, titanium oxide and tin-oxide Kind or more is planted.For example, metal oxide can include oxide and/or hydroxide.Such as Co3O4、CoO(OH)、CoO、 NiO、Ni2O3、Ni(OH)2

The thickness of heat conduction layer in conductive radiating fins can be 10 μm or smaller.For example, the heat biography in conductive radiating fins The thickness of conducting shell can be 5 μm or smaller.For example, the thickness of the heat conduction layer in conductive radiating fins can be 0.1 μm to 4 μm. For example, the thickness of the heat conduction layer in conductive radiating fins can be 0.1 μm to 3 μm.For example, the heat conduction layer in conductive radiating fins Thickness can be 0.1 μm to 2 μm.For example, the thickness of the heat conduction layer in conductive radiating fins can be 0.1 μm to 1 μm.Work as heat When the thickness of conducting shell is more than 10 μm, the thermal resistance of heat conduction layer may increase.

Heat conduction layer in conductive radiating fins can have flexibility.Compared with the general heat conduction layer in correlation technique, Heat conduction layer can have flexibility.Specifically, even if heat conduction layer is to include the composite bed of carbon-based material, unlike in correlation technique Heat conduction layer (it is easy to rupture) including carbon-based material, the heat conduction layer can also have flexibility so that heat conduction layer With at a relatively high durability and it can be used for various purposes.

The metal material of thermal diffusion layer in conductive radiating fins can be copper or aluminium.The thermal conductivity of copper and aluminium is 200W/mK Or it is higher.Therefore, the metal material can be effective by heat while reception from heater through adhesive phase and heat conduction layer Ground diffuses to outside.For example, thermal diffusion layer can be copper foil.

The thickness of thermal diffusion layer in conductive radiating fins can be 4 μm to 100 μm.Thermal diffusion layer thickness for 4 μm or In the case of smaller, when the heat sent by heater is big, the thermal capacity of thermal diffusion layer may saturation.In the thickness of thermal diffusion layer In the case that degree is more than 100 μm, the heat diffusion properties of thermal diffusion layer cannot may be improved.For example, the thickness of thermal diffusion layer can To be 10 μm to 60 μm.For example, the thickness of thermal diffusion layer can be 20 μm to 50 μm.For example, the thickness of thermal diffusion layer can be 30 μm to 45 μm.

Conductive radiating fins can also include metal level, be arranged on described on a surface of thermal diffusion layer or two surfaces Metal level includes the metal in iron, zinc and nickel.Ferrous metal layer, zinc metal level and/or nickel metal layer are also included in thermal expansion Dissipate on a surface or two surfaces for layer, thus prevent thermal diffusion layer from deteriorating.

The thickness of adhesive phase in conductive radiating fins can be 50 μm or smaller.For example, the heat biography in conductive radiating fins The thickness of conducting shell can be 1 μm to 40 μm.For example, the thickness of the heat conduction layer in conductive radiating fins can be 5 μm to 30 μm.Example Such as, the thickness of the heat conduction layer in conductive radiating fins can be 10 μm to 20 μm.For example, heat conduction layer in conductive radiating fins Thickness can be 15 μm to 20 μm.

Adhesive phase in conductive radiating fins can include organic based polymer.If organic based polymer provides bonding Property, then organic based polymer has no particular limits, and can include, for example, acrylic acid based polymer, styryl are poly- Compound, polyurethane based-polymer and based polymer.

In addition, the adhesive phase in conductive radiating fins can not include heat conducting material.However, being led to further improve The thermal conductivity of electric fin, can also include the heat conducting material of particle form.

Inorganic nitride particle, metal hydroxide particle, metal oxide particle, metallic particles, carbon can be used Grain etc. is used as heat conducting material.It is, for example, possible to use boron nitride particle, aluminum nitride particle, silicon nitride particle and gallium nitride particle It is used as inorganic nitride particle.Wherein, because the more excellent thermal conductivity of boron nitride particle and excellent electrical insulation capability can make Use boron nitride particle.That is, at least boron nitride particle may be used as inorganic nitride particle.It is, for example, possible to use hydrogen-oxygen Each particle changed in aluminium and magnesium hydroxide is used as metal hydroxide particle.Wherein, because aluminum hydroxide particles are more excellent Thermal conductivity and excellent electrical insulation capability can use aluminum hydroxide particles as metal hydroxide particle.Aluminium can be used Oxide, titanium oxide, zinc oxide, tin-oxide, Cu oxide, the tin-oxide of nickel oxide and antimony dopant are used as metal Oxide particle.Wherein, because the more excellent thermal conductivity of al oxide granule and excellent electrical insulation capability can use alumina Compound particle is used as metal oxide particle.

Carborundum, silica, calcium carbonate, barium titanate, copper, silver, gold, nickel, aluminium, platinum, carbon black, carbon pipe (carbon can be used Nanotube), each particle in carbon fiber and diamond be used as heat conducting material.

It can be used alone one kind in various particles, or can combine and using two kinds in various particles or more It is a variety of to be used as heat conducting material.The shape of thermal conductive particles is not limited specifically, and for example can be spherical, aciculiform or plate Shape.

When thermal conductive particles have it is spherical when, the primary average particle sizes of thermal conductive particles can be 0.1 μm to 1000 μm, excellent Elect 1 μm to 100 μm, more preferably 2 μm to 20 μm as.When primary average particle size is 1000 μm or smaller, thermal conductive particles The ratio of the thickness of size and heat transfer adhesive phase can reduce so that be not easy in terms of the thickness of heat transfer adhesive phase Produce deviation.

In addition, when thermal conductive particles have aciculiform or plate shape, the maximum length of thermal conductive particles can be for 0.1 μm extremely 1000 μm, it is preferable that 1 μm to 100 μm, it is highly preferred that 2 μm to 20 μm.When maximum length is 1000 μm or smaller, Ke Nengre Conductive particles are difficult to condense so that be easily processed thermal conductive particles.

In addition, when thermal conductive particles have aciculiform by indulging that long axis length/minor axis length or long axis length/thickness are represented Horizontal ratio, or the aspect ratio represented when thermal conductive particles have plate shape by catercorner length/thickness or long edge lengths/thickness, can 1 to 10000 is thought, it is highly preferred that 10 to 1000.

The general merchandise of in the market can be used as thermal conductive particles.Entitled " HP-40 " (Mi Zshima Kokintez companies) product, the product of entitled " PT620 " (Momentive companies) etc. may be used as the particle of boron nitride, Entitled " Heidi light H-32 " and " Heidi light H-42 " (Showa Denko companies) product etc. may be used as Aluminum hydroxide particles, entitled " KISUMA 5A " (Kowa Kakagu Kogyo companies) product etc. may be used as magnesium hydroxide Particle, entitled " SN-100S ", " SN-100P " and " SN-100D (aqueous dispersion product) " (Ishihara Sangyo companies) Product etc. may be used as the silicon oxide particles of antimony dopant, the production of entitled " TTO series " (Ishihara Sangyo companies) Product etc. may be used as the particle of titanium oxide, and entitled " SnO-310 ", " SnO-350 " and " SnO-410 " (Sumimoto Osaka cement companies) product etc. may be used as zinc oxide particle.

Relative to the organic polymer compositions of 100 parts by weight, the thermal conductive particles that can be used are 10 parts by weight to 1000 Parts by weight, for example, 50 parts by weight to 500 parts by weight, or 100 parts by weight to 400 parts by weight.Relative to the polymerization of 100 parts by weight Thing component, used thermal conductive particles are 10 parts by weight or more parts by weight so that further improving heat transfer adhesive layer Thermal conductivity in terms of there is advantage, and used thermal conductive particles are 1000 parts by weight or less parts by weight so that entered There is advantage in the flexible aspect that one step improves heat transfer adhesive phase, and the bonding force of heat transfer adhesive layer becomes excellent.

Adhesive phase in conductive radiating fins can also include fire proofing.Magnesium hydroxide and aluminium hydroxide can be used to make For fire proofing, but the substantial not limited to this of fire proofing, and if certain fire proofing is to make in the art , then any kind of fire proofing can be used.The particle diameter of magnesium hydroxide can be 0.5 μm to 5 μm, but be due to The particle diameter of magnesium hydroxide is small, so the performance of fire proofing can be improved.

The content of magnesium hydroxide can be the 10 volume % to 40 volume % of the cumulative volume of adhesive layer.When containing for magnesium hydroxide When amount is less than 10 volume %, adhesive phase is likely difficult to show the performance of anti-flammability, and when the content of magnesium hydroxide exceedes During 40 volume %, thermal conductivity reduction and elasticity increase so that the cohesive of adhesive phase may be reduced.

Adhesive phase can be coated on heat conduction layer by various methods.For example, coating adhesive layer on heat conduction layer Method can be selected from gravure (Gravure) rubbing method, fine gravure (Micro Gravure) rubbing method, kiss formula gravure (Kiss Gravure) rubbing method, comma scraper (Comma Knife) rubbing method, roller (Roll) coating, spray (spray) coating, Meyer rod (Meyer Bar) rubbing method, slit (Slot Die) rubbing method, reversely (Reverser) rubbing method, flexible board (printing) method, And offset printing (offset) method, but substantially not limited to this, and if a kind of method can form the adhesive in this area Layer, then can be using method of the methods described as the coated with adhesive layers on heat conduction layer.

Conductive radiating fins can also include setting release layer over the binder layer.Release layer protects conductive radiating fins, and And paper, polymer film etc. can be used, and if a kind of release layer is workable in the art, then the release layer It may be used as the release layer of the present invention.For example, polymer film can be PET film, acrylic film etc..

Insulating barrier can also be provided with a surface or two surfaces for thermal diffusion layer.Insulating barrier covers thermal diffusion layer Surface thus prevent the thermal diffusion layer conductive due to metallic property.So and conductive radiating fins from being produced with other electronics Component contact in product, and the electric insulation for conductive radiating fins is provided.

If a kind of electrically insulating material is workable in the art, then the electrically insulating material may be used as insulation Material used in layer.It is, for example, possible to use polyethylene terephthalate (PET), poly- naphthalenedicarboxylic acid ethylene glycol (PEN), polyphenylene sulfide (PPS), polyethylene (PE), polypropylene (PP), polyimides (PI), makrolon (PC), silicones and Polyurethane resin is used as electrically insulating material.

It is preferred that the insulating barrier of lower thermal conductivity.And specifically, it is preferable to ground, thermal conductivity is 0.5W/mK, and it is highly preferred that heat Conductance is 0.2W/mK.PET and PI thermal conductivity is about 0.15W/mK, and PP thermal conductivity is about 0.12W/mK, PC heat Conductance is about 0.19W/mK, and PE thermal conductivity is about 0.50W/mK, and PPS thermal conductivity is about 0.29W/mK.Cause This, in the above-described example, preferably PET, PP, PI and PC.

The thickness of insulating barrier is preferably from 10 μm to 100 μm.When the thickness of insulating barrier is less than 10 μm, thermal diffusion layer is along thickness The heat transfer in direction is not obstructed fully, therefore, and thermal conductivity of the thermal diffusion layer along surface direction can not fully increase.When thermal insulation layer When thickness is more than 100 μm, thermal accumlation between thermal diffusion layer and insulating barrier, and there is heat can not be from conductive radiating fins The risk that diffusion into the surface is gone out.

Thermal diffusion layer in conductive radiating fins can include multiple metal levels and the engagement being arranged between the metal level Layer.That is, thermal diffusion layer can also be formed by multiple metal levels for being connected by bonding layer by a metal level.Heat The number for the metal level that diffusion layer includes is not limited specifically, and can be selected as suitably desired.

For example, thermal diffusion layer can include two metal levels and the bonding layer being arranged between metal level.Described two gold Belonging to the summation of the thickness of layer can be, for example, 10 μm to 60 μm.The summation of the thickness of described two metal levels can be, for example, 20 μm to 50 μm.The summation of the thickness of described two metal levels can be, for example, 30 μm to 45 μm.

For example, thermal diffusion layer can be 15 μm to 20 μm of the first metal layer by thickness and thickness is 13 μm to 17 μm Two metal levels are formed.

It can be fluoropolymer resin to be arranged on the bonding layer between metal level.It is, for example, possible to use polyurethane-based resin, third Olefin(e) acid resin (acyl group resin), epoxy and Lauxite are used as fluoropolymer resin.The method for forming bonding layer can be with The method for forming adhesive phase is identical.

Differently, conductive radiating fins include the thermal diffusion layer formed by the first metal material, and are arranged on thermal diffusion layer A surface or two surfaces on and include the heat conduction layer of the second metal material, and the second metal material is to be selected from One or more of metals in iron, zinc and nickel.

First metal material can be copper, aluminium etc., but substantially not limited to this, and if a kind of material may be used as this Thermal diffusion layer in field, then the material may be used as the first metal material.Second metal material is and the first metal material The different metal of material, and the second metal material can be iron, zinc and nickel.Heat conduction layer formation comprising the second metal material exists On thermal diffusion layer so that both heat diffusivity energy and electromagnetic wave shielding performance can be improved.

Conductive radiating fins can also include the protective layer being arranged on a surface of heat conduction layer or two surfaces.Protection Layer can include polymer.Protective layer allows protective layer to be melted by heating comprising polymer, and is attached to substrate base Plate etc., or polymer in itself there is cohesive to allow protective layer to be attached to basal substrate etc..What is used in protective layer is poly- Compound has no particular limits, and can be that the thermoplastic polymer by heating melting or the adhesive with cohesive gather Compound.

Conductive radiating fins can have structure for example as described below.

For example, conductive radiating fins 100 can have following structure, the structure includes:The thermal diffusion formed by metal material Layer 003;It is arranged on the heat transfer formed on a surface of thermal diffusion layer 003 and by the inorganic material including metal oxide Layer 002;And it is arranged on the adhesive phase 001 on a surface of heat conduction layer 002.

For example, as shown in Fig. 2 conductive radiating fins 100 can have following structure, the structure includes:By metal material shape Into thermal diffusion layer 003;It is arranged on a surface of thermal diffusion layer 003 and by the inorganic material shape including metal oxide Into heat conduction layer 002;It is arranged on the adhesive phase 001 on a surface of heat conduction layer 002;And it is arranged on thermal diffusion layer Heat conduction layer 002 on 003 another surface.

For example, as shown in figure 3, conductive radiating fins 100 can have following structure, the structure includes:By metal material shape Into thermal diffusion layer 003;It is arranged on a surface of thermal diffusion layer 003 and by the inorganic material shape including metal oxide Into heat conduction layer 002;It is arranged on the adhesive phase 001 on a surface of heat conduction layer 002;It is arranged on thermal diffusion layer 003 Another surface on heat conduction layer 002;And it is arranged on the adhesive phase 001 on a surface of heat conduction layer 002.

For example, as shown in figure 4, conductive radiating fins 100 can have following structure, the structure includes:By metal material shape Into thermal diffusion layer 003;It is arranged on a surface of thermal diffusion layer 003 and by the inorganic material shape including metal oxide Into heat conduction layer 002;It is arranged on the adhesive phase 001 on a surface of heat conduction layer 002;And it is arranged on thermal diffusion layer Nickel dam 004 on 003 another surface.

For example, as shown in figure 5, conductive radiating fins 100 can have following structure, the structure includes:By metal material shape Into thermal diffusion layer 003;It is arranged on the nickel dam 004 on a surface of thermal diffusion layer 003;It is arranged on a table of nickel dam 004 Adhesive phase 001 on face;And it is arranged on the nickel dam 004 on another surface of thermal diffusion layer 003.For example, as shown in fig. 6, Conductive radiating fins 100 can have following structure, and the structure includes:The thermal diffusion layer 003 formed by metal material;It is arranged on heat The heat conduction layer 002 formed on one surface of diffusion layer 003 and by the inorganic material including metal oxide;It is arranged on heat Release layer 005 on one surface of conducting shell;It is arranged on the heat conduction layer 002 on another surface of thermal diffusion layer 003;Set Adhesive phase 001 on a surface of heat conduction layer 002;And be arranged on a surface of adhesive phase 001 from Type layer 005.

In addition, though not shown in the accompanying drawings, but technically each layer of the construction fin in feasible scope On another layer of two surfaces that construction fin can be arranged on.

Heater is included according to the electronic unit of another exemplary embodiment, and is arranged on a surface of heater Or the above-mentioned conductive radiating fins on two surfaces.Heater has no particular limits, and if heater produces heat, then The heater is suitable as the heater of the present invention.Heater and/or electronic unit for example can be battery, motor and IC chip, but not limited to this, if a kind of heater and/or electronic unit need radiating in the art, then described Heater and/or electronic unit can be used as the heater and/or electronic unit of the present invention.

Above-mentioned conductive radiating fins are used according to the electronic product of another exemplary embodiment.

Electronic product can be film flat panel display equipment, such as smart phone and the Intelligent flat electricity of such as flat panel TV Portable electric appts of brain etc., but electronic product not limited to this, if a kind of electronic product needs radiating in the art, that The electronic product may be used as the electronic product of the present invention.

For example, electronic product can be flexible display device, such as flexible electrical is regarded.Conductive radiating fins have excellent soft Property, thus it is widely used in needing in flexible electronic product.

Included according to the method for the manufacture conductive radiating fins of another exemplary embodiment:Prepare metallic film;In metal Metal oxide layer is formed on film;And adhesive phase is formed on metal oxide layer.

First, metallic film is prepared.

Metallic film can be copper foil or aluminium foil.It is, for example, possible to use copper foil.Copper foil can be electrolytic copper foil, rolling copper Paper tinsel etc..

Copper foil is can to produce the electrolytic copper foil that wide width and its thickness can be 4 μm to 100 μm.For example, copper foil Thickness can be 1 μm to 35 μm.For example, the thickness of copper foil can be 6 μm to 18 μm.Surface roughness (the Rz of copper foil:DIN) It can be 0.1 μm to 2.0 μm.For example, the surface roughness of copper foil can be 0.5 μm to 1.5 μm.When the surface roughness of copper foil During less than 0.1 μm, the cohesive of bonding layer may be reduced.Possibly it can not be obtained when the surface roughness of copper foil is all higher than 2.0 μm Metal oxide layer.

Next, forming metal oxide layer on metallic film.

Metal oxide layer be by the metal including causing black electrolysis plating bath in negative electrode at set copper foil, And on the copper foil surface of negative electrode formed by depositing metal oxide coating.It is referred to as the metal of metal for causing black Including Cu, Cr, Co and Ni.In order that black is presented in Cu, Co, Ni etc. electrodeposited coating, metal oxide layer is needed by the limit Electrolysis plating such as Co in the form of the oxide is carried out near current density3O4、CoO(OH)、CoO、NiO、Ni2O3With Ni (OH)2 Deposition is on surfaces of the copper foil.

Metal oxide layer can be obtained as the metal oxide coating with uniform outer appearance by the following method:By ammonium Component is added to the electrolysis plating bath comprising Cu, Co and Ni, and by it is so-called wherein as the ammonium of ligand be bonded to The heart metal ion Cu, Co and Ni complex ion plating bath, to form complex compound, and the formation metal oxide plating on copper foil Layer.

Intermediate reaction process to generation final reacting product after the first reactant is injected is complicated, accordingly, it is difficult to Detailed reaction path is found out exactly, but when Cu, Co and Ni are plated on copper foil by complex ion plating bath, Cu, Co and Ni Plating bath become entirely different with plating bath (ammonium compounds is not involved in) in correlation technique, it is therefore contemplated that preventing correlation technique The non-homogeneous metal oxide of middle plating.

Specific electroplating process is for example to be electroplated by using Ir electrodes as positive electrode and copper foil as negative electrode Come what is carried out, and the concrete component for being electrolysed plating bath will be described below.

When each concentration in Cu, Co and Ni is less than 1g/l, coating does not have complete black, and as Cu, Co and When each concentration in Ni is more than 20g/l, this, which can be related to defile due to component, generates residue.Therefore, in electrolysis plating Each content in Cu, Co and Ni for being included in bath can be 1g/l to 20g/l.

At the same time, in order to add the physical characteristic or mechanical property of thermal diffusion needs, or adhesive phase and thermal expansion are improved Dissipate layer between cohesive, in addition to Cu, Co and Ni, can also be added into plating bath Fe, Zn, Cr, Mo, W, V, Mn, Ti and One or more of components in Sn.

Because ammonium compounds is as ligand, therefore ammonium salt, such as ammonium sulfate, ammonium chloride and ammonium acetate can be added, and And also can be used to the ammonium compounds of the form of the complex compound of ammonium.When the concentration of the ammonium compounds in plating bath is more than 50g/l, metal Oxide skin(coating) will not become complete black, therefore the concentration of ammonium compounds can be 50g/l or smaller.In addition, working as ammonium compounds Concentration be less than 1g/l when, the solution resistance of plating bath is big so that ammonium compounds is uneconomical, thus ammonium compounds concentration more preferably For 1g/l to 50g/l.

As the complexing agent for being bonded ammonium and metal ion, glycine, citric acid (salt), pyrophosphoric acid etc. are appropriate. When the concentration of complexing agent is more than 100g/l, metal oxide layer will not become complete black, and be produced on the surface of copper foil Raw stain, therefore the concentration of complexing agent can be 100g/l or smaller.In addition, in order that ammonium compounds and metal ion effectively Reaction, the concentration of complexant can be 5g/l, thus the concentration of complexant is more preferably 5g/l, to 100g/l or smaller.

Plating bath can also include carbon-based material.Carbon-based material can include being selected from CNT, carbon nano-fiber, graphite One or more in alkene, ultra-dispersed diamond (UDD), diamond-like-carbon (UDC), graphite, expanded graphite and carbon fiber.

The content of carbon-based material can be 1g/l to 100g/l in plating bath.For example, the content of carbon-based material can be with plating bath For 1g/l to 50g/l.For example, the content of carbon-based material can be 1g/l to 20g/l in plating bath.For example, carbon-based material in plating bath Content can be 1g/l to 20g/l.For example, the content of carbon-based material can be 2g/l to 15g/l in plating bath.For example, plating bath The content of middle carbon-based material can be 3g/l to 15g/l.For example, the content of carbon-based material can be 7g/l to 15g/l in plating bath.

The current density of industrial Eco-power plating bath is 0.1A/dm2To 60A/dm2, and and specifically, it is preferable to, 5A/dm2 To 45A/dm2.When current density is less than 0.1A/dm2When, then the metal oxide layer of the black needed for can not obtaining, and when electricity Current density is more than 60A/dm2When, then electroplate excessive so that produce phenomenon of defiling.The pH value of plating bath can be 2.5 to 6.0, and And specifically, it is preferable to 4.0 to 5.8.When the pH value of plating bath is less than 2.5, the blackening layer of plating is dissolved, and when the pH value of plating bath During equal to or more than 6.0, opposite surface (without black surface processing) discoloration and plating solution precipitation so that the stabilization of liquid Property decline.

In addition, electroplating time can be 1 second to 40 seconds, it is contemplated that current density, concentration of electrolyte etc., except 1 Second to other scopes outside the scope of 40 seconds are available.

At the same time, in order to reduce reflectivity, and the cohesive with transparent substrates substrate is improved, fine copper stratum granulosum can To deposit and be attached to the surface of copper foil.The copper particle deposited is as anchor so that when copper foil is layered in adhesive phase material Cohesive can be improved when upper by improving peel strength.

Fine copper stratum granulosum can be handled and formed by using the roughening carried out on copper foil.Generally, in copper sulphate It is roughened in plating bath, and the adhesion amount of copper particle can be 0.1g/m during roughening processing2To 10g/m2, More preferably 0.5g/m2To 8g/m2.As described above, through for forming all of fine copper stratum granulosum and metal oxide coating The surface roughness of surface treatment process needs Rz (DIN standards) being maintained at 0.1 μm to 2.0 μm.When in the fine copper When being surface-treated under the conditions of the formation condition and plating melanism of granulosa, surface roughness may remain in above range.

Furthermore it is possible to carry out corrosion-resistant treatments on the copper foil of the present invention, such as electrolytic chromate is handled.In addition, when by The electroplating film formation of Ni, Zn, Ni alloy or the formation of Zn alloys is on non-melanism plating (blackening plated) surface When, metal oxide layer can be prevented to be heated discoloration during heating process.

Finally, adhesive phase is formed on metal oxide layer.

Adhesive phase can by will comprising acrylic acid (class) polymer, styrene-based polymer, polyurethane based-polymer, The solution of based polymer etc. is applied on metal oxide layer, is then formed by drying.The solution can be according to need Optionally to include thermal conductive particles and fire-retardant particle.

Protection tunic and/or dielectric film can be arranged as required to over the binder layer.

Implement the pattern of the present invention

Hereinafter, the present invention will be explained in more detail by embodiment.However, embodiment is only used for describing this hair Bright purpose, and to those skilled in the art it is apparent that according to the scope of the present invention of the principle matter of the present invention It is not limited to following examples.

(manufacture conductive radiating fins)

Embodiment 1:Metal oxide heat conduction layer

(formation heat conduction layer)

Thickness is immersed in 5 seconds, pickling processes in 100g/l sulfuric acid for 35 μm of electrolytic copper foil (ILJIN materials), so Pure water is used afterwards, is then commonly known as the enterprising row metal oxide in surface of glossy surface on copper foil under the following conditions Electroplating technology.As the result of plating, it is 1 μm of the gold of the melanism comprising Cu, Co and Ni that thickness is formed on the surface of copper foil Belong to oxide skin(coating).

Electrobath is constituted and plating conditions

Cu ions (CuSO4·5H2O concentration):4g/l

Co ions (CoSO4·7H2O concentration):4g/l

Ni ions (NiSO4·6H2O concentration):5g/l

Ammonium sulfate ((NH4)2SO4) concentration:15g/l

Sodium citrate (C6H5Na3O7·2H2O concentration):25g/l

Electrolyte pH:5.4

Electrolyte temperature:25℃

Current density:20A/dm2

Electroplating time:8 seconds

(formation adhesive phase)

Pass through coating acrylic adhesives (robond PS-61, the industrial coating) formation on black metal oxide layer Thickness is about 10 μm of adhesive phase.

Embodiment 2:Metal oxide+carbon-based material (CNT) heat conduction layer

In addition to concentration is additionally added into electrobath for 10g/L CNT, pass through the method phase with embodiment 1 Same method manufacture conductive radiating fins.

Embodiment 3:Metal oxide+carbon-based material (carbon nano-fiber) heat conduction layer

In addition to concentration is additionally added into electrobath for 10g/L carbon nano-fiber, pass through the method with embodiment 1 Identical method manufactures conductive radiating fins.

Embodiment 4:Metal oxide+carbon-based material (graphene) heat conduction layer

In addition to concentration is additionally added into electrobath for 5g/L graphene, by identical with the method for embodiment 1 Method manufacture conductive radiating fins.

Embodiment 5:Metal oxide+carbon-based material (expanded graphite) heat conduction layer

In addition to concentration is added into electrobath for 5g/L expanded graphite powder in addition, pass through the side with embodiment 1 Method identical method manufactures conductive radiating fins.

Embodiment 6:Nickel plating heat conduction layer

(formation heat conduction layer)

Thickness is immersed in 5 seconds, pickling processes in 100g/l sulfuric acid for 35 μm of electrolytic copper foil (ILJIN materials), so The electroplating technology of pure water, the then enterprising row metal oxide in two surfaces under the following conditions on copper foil is used afterwards.Make For the result of plating, the Ni layers that thickness is 0.21 μm are formed on the surface of copper foil.

Electrobath is constituted or plating conditions

Ni ions (NiSO4·7H2O concentration):200g/l

Sulfuric acid (H2SO4) concentration:100g/l

Electrolyte pH:1.0

Electrolyte temperature:30℃

Current density:10A/dm2

Electroplating time:10 seconds

(formation adhesive phase)

It it is about 10 μm by coating acrylic adhesives (robond PS-61, industrial coating) formation thickness on nickel dam Adhesive phase.

Embodiment 7:Metal oxide heat conduction layer+nickel metal layer

(formation heat conduction layer)

Thickness is immersed in 5 seconds, pickling processes in 100g/l sulfuric acid for 35 μm of electrolytic copper foil (ILJIN materials), so Afterwards use pure water, then under the following conditions copper foil the enterprising row metal oxide in two surfaces electroplating technology.As The result of plating, forms the melanism metal oxide layer comprising Cu, Co and Ni that thickness is 1 μm on the surface of copper foil.

Electrobath is constituted and plating conditions

Cu ions (CuSO4·5H2O concentration):4g/l

Co ions (CoSO4·7H2O concentration):4g/l

Ni ions (NiSO4·6H2O concentration):5g/l

Ammonium sulfate ((NH4)2SO4) concentration:15g/l

Sodium citrate (C6H5Na3O7·2H2O concentration):25g/l

Electrolyte pH:5.4

Electrolyte temperature:25℃

Current density:20A/dm2

Electroplating time:8 seconds

(forming Ni metal levels)

The copper foil for being formed with black metal oxide layer thereon is immersed in 5 seconds, pickling processes in 100g/l sulfuric acid, so Afterwards use pure water, then under the following conditions black oxidation nitride layer the enterprising row metal oxide in surface electroplating technology. As the result of plating, the Ni layers that thickness is 0.2 μm are formed on the surface of black oxidation nitride layer.

Electrobath is constituted or plating conditions

Ni ions (NiSO4·7H2O concentration):200g/l

Sulfuric acid (H2SO4) concentration:100g/l

Electrolyte pH:1.0

Electrolyte temperature:30℃

Current density:10A/dm2

Electroplating time:10 seconds

(formation adhesive phase)

It it is about 10 μm by coating acrylic adhesives (robond PS-61, industrial coating) formation thickness on nickel dam Adhesive phase.

Embodiment 8:Metal oxide+carbon-based material (carbon nano-fiber) heat conduction layer

In addition to concentration is added to for 10g/L carbon nano-fiber in addition electrobath be used to form heat conduction layer, lead to The method identical method crossed with embodiment 7 manufactures conductive radiating fins.

Comparative example 1:Include the adhesive phase of carbon thermal conductive particles

Except omitting the step of forming metal oxide layer, adhesive phase is directly formed on copper foil, and to cause bag Average grain diameter is added to outside adhesive phase for 1 μm of carbon particle (it is thermal conductive particles) containing by weight 5% mode, By manufacturing conductive radiating fins with the method identical method of embodiment 1.

Comparative example 2:Include the adhesive phase of Ni metal heat conduction particles

Except omitting the step of forming metal oxide layer, the direct formation adhesive phase on copper foil, and by will be by The average grain diameter of the content of weight meter 5% for 1 μm nickel (Ni) metallic particles (it is thermal conductive particles) be added to adhesive phase it Outside, by manufacturing conductive radiating fins with the method identical method of embodiment 1.

Evaluate example 1:Evaluate thermal diffusivity

By the laser flash method under ASTM E 1461 to passing through embodiment 1 to embodiment 8, and comparative example 1 and ratio The thermal diffusivity of the conductive radiating fins manufactured compared with example 2 is evaluated.Used measuring apparatus is MEZSCH model LFA447.

In laser flash method, the short flash of light is uniformly heated to the preceding surface of sample, by using infrared (IR) sensor detects the rise of the temperature on the rear surface of sample over time, then to based on by using software by sensing The thermal diffusivity (α) for the sample that device measurement data is calculated is measured.Some in measurement result are shown in table 1 below.

[table 1]

Thermal diffusivity (α) [W/mk] Embodiment 1 343 Embodiment 2 351 Embodiment 3 350 Embodiment 4 341 Embodiment 5 337 Embodiment 6 344 Embodiment 7 359 Comparative example 1 332 Comparative example 2 331

As the result of measurement, compared with the conductive radiating fins of comparative example 1 and comparative example 2, embodiment 1 to embodiment 7 Conductive radiating fins show the heat diffusivity energy of raising.

Even if being come during the conductive radiating fins in manufacture embodiment 1 to embodiment 7 using the rolled copper foil of same thickness When substituting electrolytic copper foil, essentially identical thermal diffusion results of property is also showed.If commercially available rolled copper foil, then rolled copper foil Do not limit specifically.

Compared with the conductive radiating fins of embodiment 7, the conductive radiating fins of embodiment 8 show the electromagnetic wave shielding spy of raising Property.

In addition, the concentration of the CNT during the conductive radiating fins of manufacture embodiment 3 in electrobath change over 1g/L, In the case of 5g/L, 20g/L, 50g/L, compared with the concentration of CNT is 1g/L and 50g/L situation, in CNT Concentration be 5g/L, 10g/L and 20g/L in the case of thermal diffusivity relative increase it is many.

Evaluate example 2:Evaluate electromagnetic wave shielding characteristic

By using network analyser (Agilent, E5701A) in embodiment 1 to embodiment 8 and comparative example 1 and ratio Electromagnetic wave shielding characteristic compared with the conductive radiating fins manufactured in example 2 is measured.The predetermined of fin is applied to by measurement The value of signal value and the electric signal reflected from fin and using described two signals measured ratio to electromagnetism wave screen The rate of covering is calculated.For example, when the signal applied is completely reflected, shielding rate is 100%.Some in measurement result are shown In table 2 below.

[table 2]

Shielding rate (%) Embodiment 1 99.9 Embodiment 2 99.8 Embodiment 3 99.8 Embodiment 4 99.8 Embodiment 5 99.8 Embodiment 6 99.9 Embodiment 7 99.9 Comparative example 1 80.3 Comparative example 2 84.1

As the result of measurement, as shown in table 2, compared with the conductive radiating fins of comparative example 1 and comparative example 2, embodiment 1 to The conductive radiating fins of embodiment 7 show the electromagnetic wave shielding characteristic of raising.

Compared with the conductive radiating fins of embodiment 7, the conductive radiating fins of embodiment 8 show the electromagnetic wave shielding spy of raising Property.

Even if being come during the conductive radiating fins in manufacture embodiment 1 to embodiment 7 using the rolled copper foil of same thickness When substituting electrolytic copper foil, essentially identical electromagnetic wave shielding characteristic is also showed.If commercially available rolled copper foil, then rolled copper foil Do not limit specifically.

Commercial Application

According to an aspect of the present invention, including the heat conduction layer with new compositions, enabling do not reducing viscous The conductive radiator with both excellent heat diffusivity energy and electromagnetic wave shielding performance is obtained in the case of the cohesive of mixture layer Piece.

Claims (19)

1. a kind of conductive radiating fins, including:
One or more thermal diffusion layers formed by metal material;And
Heat conduction layer, the heat conduction layer is arranged on a surface of the thermal diffusion layer or two surfaces and by comprising choosing Formed from one or more of inorganic material in inorganic metal, metal oxide and alloy,
Wherein described metal oxide includes Cu, Ni and Co,
Wherein described inorganic material also includes carbon-based material,
Wherein described carbon-based material is including one kind in CNT, carbon nano-fiber, graphene and expanded graphite or more It is a variety of,
The heat conduction layer is formed on the thermal diffusion layer without using organic binder bond wherein by plating,
Wherein shielding rate is 99.8% to 99.9%.
2. conductive radiating fins according to claim 1, in addition to:
It is arranged on the protective layer on a surface of the heat conduction layer or two surfaces.
3. conductive radiating fins according to claim 2, wherein the protective layer includes polymer.
4. conductive radiating fins according to claim 2, wherein the protective layer is adhesive phase.
5. conductive radiating fins according to claim 1, wherein the metal oxide is black oxide.
6. conductive radiating fins according to claim 1, are passed wherein the content of the carbon-based material accounts for the heat by weight 10% or less of the gross weight of conducting shell.
7. conductive radiating fins according to claim 1, wherein the thickness of the heat conduction layer is 10 μm or smaller.
8. conductive radiating fins according to claim 1, wherein the heat conduction layer has flexibility.
9. conductive radiating fins according to claim 1, wherein the metal material is copper or aluminium.
10. conductive radiating fins according to claim 1, wherein the thermal diffusion layer is electrolytic copper foil or rolled copper foil.
11. conductive radiating fins according to claim 1, wherein the thickness of the thermal diffusion layer is 4 μm to 100 μm.
12. conductive radiating fins according to claim 1, wherein the heat conduction layer is integrally formed in the thermal diffusion On layer.
13. conductive radiating fins according to claim 1, in addition to:
Metal level, the metal level is arranged on a surface of the thermal diffusion layer or two surfaces and by selected from iron, zinc Formed with one or more of metals in nickel.
14. conductive radiating fins according to claim 4, wherein described adhesive layer include fire proofing.
15. conductive radiating fins according to claim 14, in addition to:
It is arranged on the release layer on described adhesive layer.
16. a kind of conductive radiating fins, including:
The thermal diffusion layer formed by the first metal material;And
Heat conduction layer, the heat conduction layer is arranged on a surface of the thermal diffusion layer or two surfaces and comprising second Metal material,
Wherein described second metal material is one or more of metals in iron, zinc and nickel, and first metal Material is different from second metal material,
Wherein described second metal material includes Cu, Ni and Co, and also including carbon-based material,
Wherein described carbon-based material is including one kind in CNT, carbon nano-fiber, graphene and expanded graphite or more It is a variety of,
The heat conduction layer is integrally formed on the thermal diffusion layer without using organic binder bond wherein by plating,
Wherein shielding rate is 99.8% to 99.9%, and the thermal diffusivity α is 337W/mk to 359W/mk.
17. a kind of electronic unit, including:
Heater;And
Conductive radiating fins according to any one of claim 1 to 16, the conductive radiating fins are arranged on the heater A surface or two surfaces on.
18. a kind of electronic product, it uses the conductive radiating fins according to any one of claim 1 to 16.
19. electronic product according to claim 18, wherein the electronic product is flexible display apparatus.
CN201480034531.0A 2013-06-19 2014-06-18 Conductive radiating fins and electric component and electronic product including conductive radiating fins CN105325067B (en)

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