CN105282979B - A kind of FPC multilayer plate producing process for reducing outer-layer circuit defect - Google Patents

A kind of FPC multilayer plate producing process for reducing outer-layer circuit defect Download PDF

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Publication number
CN105282979B
CN105282979B CN201510678639.XA CN201510678639A CN105282979B CN 105282979 B CN105282979 B CN 105282979B CN 201510678639 A CN201510678639 A CN 201510678639A CN 105282979 B CN105282979 B CN 105282979B
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CN
China
Prior art keywords
fpc
plate
processing
glue
drying
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CN201510678639.XA
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Chinese (zh)
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CN105282979A (en
Inventor
吴卫钟
王俊
邹攀
沈雷
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深圳市景旺电子股份有限公司
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Priority to CN201510678639.XA priority Critical patent/CN105282979B/en
Publication of CN105282979A publication Critical patent/CN105282979A/en
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Publication of CN105282979B publication Critical patent/CN105282979B/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Abstract

The present invention discloses a kind of FPC multilayer plate producing process for reducing outer-layer circuit defect, including step:A, FPC multi-layer boards carry out plating removing glue after punching is completed:FPC multi-layer boards are fixed in Hanging Basket, are first sent into PI adjustment cylinders, removing glue processing is carried out, then front and rear twice into water washing cylinder progress washing process, is finally sent into drying cylinder and carries out drying and processing;B, two sides nog plate processing, two sides nog plate are carried out;C, it is then sent to drilling room and carries out secondary drilling.After the present invention increases before being bored two except glue process, it can be decreased obviously outer-layer circuit defect by contrast test and the mass data proof of early period, outer-layer circuit makes total yield and gets a promotion.

Description

A kind of FPC multilayer plate producing process for reducing outer-layer circuit defect

Technical field

The present invention relates to FPC to manufacture field more particularly to a kind of FPC multi-layer boards life for reducing outer-layer circuit defect Production method.

Background technology

FPC industry competitions are more and more fierce, optimize production procedure, and it is the one long-term of enterprise development to promote product yield Important process payes attention to flow details, pursues the objective of the struggle that innovation is technical staff.Mono-/bis-panel of the prior art cannot Meets the needs of client, then, multiple-plate demand increasingly increases.In FPC multi-layer board production processes, the yield of outer-layer circuit It allows of no optimist, outer-layer circuit has the problem of the defects of opening a way, is short-circuit, notch is more, and product yield is caused to decline, is increased indirectly Cost of manufacture is added.

Therefore, the prior art has yet to be improved and developed.

Invention content

In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of outer-layer circuit defects of reducing FPC multilayer plate producing process, it is intended to solve the problems, such as the defects of existing FPC multi-layer boards are susceptible to open circuit, short circuit, notch.

Technical scheme is as follows:

A kind of FPC multilayer plate producing process for reducing outer-layer circuit defect, wherein, including step:

A, FPC multi-layer boards carry out plating removing glue after punching is completed:

FPC multi-layer boards are fixed in Hanging Basket, PI adjustment cylinders is first sent into, carries out removing glue processing, then front and rear twice into washing Cylinder carries out washing process, is finally sent into drying cylinder and carries out drying and processing;

B, two sides nog plate processing, two sides nog plate are carried out;

C, it is then sent to drilling room and carries out secondary drilling.

The FPC multilayer plate producing process, wherein, the time of removing glue processing is 5 ~ 8min.

The FPC multilayer plate producing process, wherein, the temperature of removing glue processing is 35 ~ 45 DEG C.

The FPC multilayer plate producing process, wherein, the time of each washing process is 1 ~ 2min.

The FPC multilayer plate producing process, wherein, the time of drying and processing is 8 ~ 12min.

The FPC multilayer plate producing process, wherein, the temperature of drying and processing is 85 ~ 95 DEG C.

The FPC multilayer plate producing process, wherein, two sides nog plate only opens 1200# polish-brushes, electric current 3.2A when handling.

Advantageous effect:After the present invention increases before being bored two except glue process, demonstrate,proved by the contrast test and mass data of early period Bright to be decreased obviously outer-layer circuit defect, outer-layer circuit makes total yield and gets a promotion.

Description of the drawings

Fig. 1 is a kind of flow chart of FPC multilayer plate producing process for reducing outer-layer circuit defect of the present invention.

Specific embodiment

The present invention provides a kind of FPC multilayer plate producing process for reducing outer-layer circuit defect, for make the purpose of the present invention, Technical solution and effect are clearer, clear and definite, and the present invention is described in more detail below.It should be appreciated that described herein Specific embodiment is only used to explain the present invention, is not intended to limit the present invention.

Referring to Fig. 1, Fig. 1 is preferably real for a kind of FPC multilayer plate producing process for reducing outer-layer circuit defect of the present invention The flow chart of example is applied, as shown in the figure, it includes step:

S101, FPC multi-layer board carry out plating removing glue after punching is completed:

FPC multi-layer boards are fixed in Hanging Basket, PI adjustment cylinders is first sent into, carries out removing glue processing, then front and rear twice into washing Cylinder carries out washing process, is finally sent into drying cylinder and carries out drying and processing;

S102, two sides nog plate processing, two sides nog plate are carried out;

S103, it is then sent to drilling room progress secondary drilling.

The present invention be directed to short circuits caused by plate face residue glue to be improved, and before second drills, increases except glue process(Tool Body flow:Pi adjustment+nog plate), greatly reduce because of uncertain factor(Such as:Process under thousand layer frames/film/work top/circulation Residue glue generated in the process etc.)Caused by plate face residue glue, the defects of so as to avoid result in line short.

I.e. the present invention is increased on original process base once except glue process, the residue glue of plate face is cleaned as far as possible thorough Bottom.Idiographic flow change is as follows:" punching → bis- bore " is changed to " punching → plating removing glue(PI adjustment+nog plate)→ bis- bore ".

Specifically, FPC multi-layer boards complete punching(8 two used for positioning are bored positioning T holes)Afterwards, it send to plating removing glue Processing:

FPC multi-layer boards are fixed in Hanging Basket, PI adjustment cylinders is first sent into, carries out removing glue processing(PI is adjusted), removing glue processing Time for 5 ~ 8min, temperature is 35 ~ 45 DEG C.It is 6min that preferred condition, which is the time of removing glue processing, and temperature is 40 DEG C, in this way Residue glue is more clean by what is be eliminated.The adhesive remover in cylinder is adjusted particular by PI and carrys out removing glue, contains permanganic acid in adhesive remover Potassium and sodium hydroxide, a concentration of 60 ~ 80g/L of potassium permanganate, a concentration of the 4% ~ 5% of sodium hydroxide(W/w, mass percentage concentration). A concentration of 70 g/L of best potassium permanganate, best naoh concentration are 4.5%.Above-mentioned adhesive remover can pass through deionized water To be configured.The material of PI adjustment cylinders can use stainless steel(SS316).

It after removing glue processing, is washed, washing carries out in two times, i.e., FPC multi-layer boards successively is put into washing twice It is washed in cylinder, each washing time is 1 ~ 2min.So that residue glue and treatment fluid are fully rinsed out.

It is finally sent into drying cylinder and carries out drying and processing, drying temperature is 85 ~ 95 DEG C, drying time 10min.

It is 90 DEG C that preferred condition, which is drying temperature,.Drying time is 8 ~ 12min, so that drying is more thorough, and will not be right Plate face material impacts.

After above-mentioned plating removing glue processing, nog plate processing is carried out, and be two-sided nog plate(That is two sides nog plate)Place Reason only opens 1200# polish-brushes, electric current 3.2A when carrying out the processing of two sides nog plate.The sundries oxide on copper face is removed during nog plate, Increase the binding force of copper coin and green oil.The flow of nog plate includes successively:Pickling, washing, nog plate, inspection, washing, drying waited Journey.Pickling quality used in pickling therein a concentration of 3 ~ 5%(Such as 4%), dry up and can be used 75 ~ 85 DEG C(Such as 80 DEG C), entirely Flow transmission speed is 1.5 ~ 3.0m/min(Such as 2 m/min).

Nog plate is primary, and plate thickness variable is between 0.01mil ~ 0.02mil, such as reduces 0.015mil, and nog plate enters left during plate Right wheel, which is banished, puts, and the distance between two plates of left and right are 2 ~ 4cm(Such as 3cm).The plate of milled may be dipped in 45s in water, Ran Houqu Go out with horizontal plane into 45 degree of angles, park 15s, whether observation moisture film ruptures, such as rupture, then nog plate is ineffective, on the contrary then nog plate Effect is preferable.

In conclusion after the present invention increases before being bored two except glue process, demonstrate,proved by the contrast test and mass data of early period Bright to be decreased obviously outer-layer circuit defect, outer-layer circuit makes total yield and gets a promotion.

It should be understood that the application of the present invention is not limited to the above, it for those of ordinary skills, can To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention Protect range.

Claims (6)

1. a kind of FPC multilayer plate producing process for reducing outer-layer circuit defect, which is characterized in that including step:
A, FPC multi-layer boards carry out plating removing glue after punching is completed:
FPC multi-layer boards are fixed in Hanging Basket, first be sent into PI adjustment cylinder, carry out removing glue processing, then it is front and rear twice into water washing cylinder into Row washing process is finally sent into drying cylinder and carries out drying and processing;
B, two sides nog plate processing, two sides nog plate are carried out;
C, it is then sent to drilling room and carries out secondary drilling;
The PI adjustment cylinders carry out removing glue by adhesive remover, contain potassium permanganate and sodium hydroxide, permanganic acid in the adhesive remover Potassium concn is 60 ~ 80g/L, a concentration of 4% ~ 5% w/w of sodium hydroxide, and the adhesive remover is configured by deionized water;
The two sides nog plate only opens 1200# polish-brushes when carrying out the processing of two sides nog plate, electric current 3.2A, and when nog plate removes copper face On sundries oxide, increase the binding force of copper coin and green oil, the flow of nog plate includes successively:Pickling, washing, nog plate, inspection, Washing, drying, pickling quality used in pickling a concentration of 3 ~ 5%, using 75 ~ 85 DEG C, transmission speed is 1.5 ~ 3.0m/ for drying Min, the plate of milled impregnate 45s in water, take out with horizontal plane into 45 degree of angles, park 15s, sentenced by observing water break situation Determine nog plate effect;
The punching is to rush 8 location holes that positioning is bored for two.
2. FPC multilayers plate producing process according to claim 1, which is characterized in that the time of removing glue processing is 5 ~ 8min.
3. FPC multilayers plate producing process according to claim 1, which is characterized in that the temperature of removing glue processing is 35 ~ 45 ℃。
4. FPC multilayers plate producing process according to claim 1, which is characterized in that the time of each washing process for 1 ~ 2min。
5. FPC multilayers plate producing process according to claim 1, which is characterized in that the time of drying and processing for 8 ~ 12min。
6. FPC multilayers plate producing process according to claim 1, which is characterized in that the temperature of drying and processing is 85 ~ 95 ℃。
CN201510678639.XA 2015-10-20 2015-10-20 A kind of FPC multilayer plate producing process for reducing outer-layer circuit defect CN105282979B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510678639.XA CN105282979B (en) 2015-10-20 2015-10-20 A kind of FPC multilayer plate producing process for reducing outer-layer circuit defect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510678639.XA CN105282979B (en) 2015-10-20 2015-10-20 A kind of FPC multilayer plate producing process for reducing outer-layer circuit defect

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CN105282979A CN105282979A (en) 2016-01-27
CN105282979B true CN105282979B (en) 2018-06-08

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102781158A (en) * 2011-05-09 2012-11-14 代芳 PCB (Printed Circuit Board) technology capable of increasing heat dissipation effect
CN102933040A (en) * 2012-10-23 2013-02-13 东莞生益电子有限公司 Method for manufacturing printed circuit board (PCB) with buried inductance device
CN103222351A (en) * 2011-10-25 2013-07-24 建业(惠州)电路版有限公司 Method for metallisation of holes in printed circuit board
CN103945656A (en) * 2013-01-22 2014-07-23 深圳市万泰电路有限公司 Method of manufacturing double-sided aluminum substrate with resin plug holes and counterbore holes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102781158A (en) * 2011-05-09 2012-11-14 代芳 PCB (Printed Circuit Board) technology capable of increasing heat dissipation effect
CN103222351A (en) * 2011-10-25 2013-07-24 建业(惠州)电路版有限公司 Method for metallisation of holes in printed circuit board
CN102933040A (en) * 2012-10-23 2013-02-13 东莞生益电子有限公司 Method for manufacturing printed circuit board (PCB) with buried inductance device
CN103945656A (en) * 2013-01-22 2014-07-23 深圳市万泰电路有限公司 Method of manufacturing double-sided aluminum substrate with resin plug holes and counterbore holes

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