CN105276854A - Liquid semiconductor refrigeration heat exchange module and high-power liquid semiconductor refrigeration heat exchanger - Google Patents
Liquid semiconductor refrigeration heat exchange module and high-power liquid semiconductor refrigeration heat exchanger Download PDFInfo
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- CN105276854A CN105276854A CN201410352929.0A CN201410352929A CN105276854A CN 105276854 A CN105276854 A CN 105276854A CN 201410352929 A CN201410352929 A CN 201410352929A CN 105276854 A CN105276854 A CN 105276854A
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Abstract
The invention relates to the field of semiconductor refrigeration heat exchange, in particular to a liquid semiconductor refrigeration heat exchange module and a first metal spiral pipe. The liquid semiconductor refrigeration heat exchange module comprises a pair of metal plates. A plurality of semiconductor refrigeration slices are fixed to each metal plate. Through holes are formed in the middles of the metal plates respectively. The first metal spiral pipe is fixed in a first containing space formed by the pair of the metal plates. One end of the first metal spiral pipe stretches out from the side portion of the first containing space to be connected to a first liquid delivery pipe. The other end of the first meal spiral pipe stretches out from the side portion of the first containing space or the through hole of any metal plate to be connected to a second liquid delivery pipe. A connecting wire of each semiconductor refrigeration slice is guided out to reach a junction box. The invention further provides a high-power liquid semiconductor refrigeration heat exchanger based on the liquid semiconductor refrigeration heat exchange module. According to the liquid semiconductor refrigeration heat exchange module and the high-power liquid semiconductor refrigeration heat exchanger based on the liquid semiconductor refrigeration heat exchange module, the difficult problem that a single refrigeration element pair is low in power and cannot be used in a high-power mode is solved through a modular structural form.
Description
Technical field
The present invention relates to semiconductor refrigerating field of heat exchange, particularly relate to a kind of liquid semiconductor cooling heat exchange module and high-power liquid semiconductor refrigerated heat exchanger.
Background technology
The operation principle of semiconductor refrigerating is based on Peltier principle, and the size of completed semiconductor refrigeration device is little lightweight, mechanical running part, noiselessness in work, aneroid, gas working media, thus free from environmental pollution, cooling parameters is not by direction in space and gravity effect; By regulating the size of operating current, conveniently adjusted cooling rate; By switch current direction, refrigerator can be made to change into from refrigerating state and to heat duty; Speed of action is fast, long service life, and is easy to control.
Semiconductor refrigerating has more advantage, but also has fatal weakness, and freeze exactly affected by environment comparatively large, when cold and hot end reaches a fixed difference difference, will reach an equalization point, now the temperature of cold and hot end would not continue to change.In order to reach lower temperature, the temperature that the modes such as forced heat radiation must be taked to reduce hot junction realizes.
The power that the single cooling module of semiconductor chilling plate is right is very little, but is combined into pile mode, and become refrigeration system with the Combination of Methods of pile series and parallel of the same type, refrigeration work consumption just can accomplish very large scope.
Found by the literature search of prior art, hot-side heat dissipation generally adopts the form of force ventilation, and air cooling way heat dissipation capacity is limited, and radiator is not modular construction, be unfavorable for that dilatation overlaps, these all drawbacks all constrain the high-power applications of semiconductor refrigerating technology.
Summary of the invention
For current high power semi-conductor Refrigeration Technique Problems existing, the invention provides a kind of modularization, the liquid semiconductor cooling heat exchange module of easy dilatation overlap joint and high-power liquid semiconductor refrigerated heat exchanger.
Technical scheme provided by the invention is:
A kind of liquid semiconductor cooling heat exchange module, comprising:
Pair of metal plate body, each metal plate is all fixed with multiple semiconductor chilling plate, and all offers through hole in the middle of each metal plate;
First metallic coil, it is fixed in the first accommodation space of pair of metal plate body formation, and one end of described first metallic coil is stretched out from the sidepiece of described first accommodation space and is connected to first liquid carrier pipe, the other end of described first metallic coil stretches out from the sidepiece of described first accommodation space or the through hole of arbitrary metal plate and is connected to second liquid carrier pipe;
Wherein, the connecting line of each semiconductor chilling plate all leads to terminal box place.
Preferably, in described liquid semiconductor cooling heat exchange module, form the second accommodation space between the outer wall of described first metallic coil and pair of metal plate body, the import and export of described second accommodation space are connected to first liquid carrier pipe and second liquid carrier pipe respectively.
Preferably, in described liquid semiconductor cooling heat exchange module, the import and export of described second accommodation space are separately installed with the second metallic coil, the import and export of described first metallic coil and the second metallic coil are all connected to a total tube connector, and described total tube connector is connected to liquid delivery tube.
Preferably, in described liquid semiconductor cooling heat exchange module, described total tube connector stretches out from the sidepiece of described first accommodation space or the through hole of arbitrary metal plate.
A kind of high-power liquid semiconductor refrigerated heat exchanger, comprising:
Multiple liquid semiconductor cooling heat exchange module, it is arranged in parallel that it is placed in a housing, and described housing is with heat-insulation layer; Described liquid semiconductor cooling heat exchange module includes:
Pair of metal plate body, each metal plate is all fixed with multiple semiconductor chilling plate, and all offers through hole in the middle of each metal plate;
First metallic coil, it is fixed in the first accommodation space of pair of metal plate body formation, and one end of described first metallic coil is stretched out from the sidepiece of described first accommodation space and is connected to first liquid carrier pipe, the other end of described first metallic coil stretches out from the sidepiece of described first accommodation space or the through hole of arbitrary metal plate and is connected to second liquid carrier pipe;
Wherein, the connecting line of each semiconductor chilling plate all leads to terminal box place, and the hole of two ends from the perforate or sidewall of described housing central section of described first metallic coil stretches out described housing;
Multiple liquid delivery tube, it is connected with the two ends of described first metallic coil respectively;
Wherein, cold junction liquid semiconductor cooling heat exchange module and hot junction liquid semiconductor cooling heat exchange modular spacing spread configuration, the liquid semiconductor cooling heat exchange module being positioned at two ends is fixed by connector and described housing.
Preferably, in described high-power liquid semiconductor refrigerated heat exchanger, described multiple liquid delivery tube comprises cold liquid inlet pipe, cold liquid goes out pipe, hydrothermal solution inlet pipe and hydrothermal solution and goes out pipe, the two ends of the first metallic coil of described cold junction liquid semiconductor cooling heat exchange module go out pipe with described cold liquid inlet pipe and cold liquid respectively and are connected, and the two ends of the first metallic coil of described hot junction liquid semiconductor cooling heat exchange module go out pipe with described hydrothermal solution inlet pipe and hydrothermal solution respectively and are connected.
Preferably, in described high-power liquid semiconductor refrigerated heat exchanger, described cold liquid inlet pipe, cold liquid go out pipe, hydrothermal solution inlet pipe and hydrothermal solution and go out on pipe sidewall all to offer multiple installing hole, and the two ends hole stretched out respectively in described housing sidewall of described first metallic coil is connected to described installing hole.
Preferably, in described high-power liquid semiconductor refrigerated heat exchanger, described housing is provided with terminal box, the connecting line of the semiconductor chilling plate of described liquid semiconductor refrigerated heat exchanger all leads to described terminal box place.
Preferably, in described high-power liquid semiconductor refrigerated heat exchanger, between described semiconductor chilling plate and described metal plate, heat-conducting cream is scribbled.
Preferably, in described high-power liquid semiconductor refrigerated heat exchanger, make the mixture of spent glycol and demineralized water in described cold junction liquid semiconductor cooling heat exchange module, in the liquid semiconductor cooling heat exchange module of described hot junction, the mixture of spent glycol and demineralized water or demineralized water are circulated.
The invention has the beneficial effects as follows, provide the liquid semiconductor cooling heat exchange module of a kind of modularization, easily dilatation overlap joint, can be as required, make the semiconductor refrigerating heat exchanger of various power, can be used as the substitute products of conventional vapor-compression compressor, extensively be useful in small-sized refrigerating aircondition, in the midget plant as air conditioning for automobiles, package AC plant, detachable air conditioner and other type.Described first metallic coil and pair of metal plate body form the flow cavity of two liquid refrigerants, liquid refrigerant is by described first liquid carrier pipe and second liquid carrier pipe turnover flow cavity, constitute liquid semiconductor refrigeration and change form, liquid refrigerant flows in semiconductor refrigerating heat exchange module, takes away the energy in semiconductor refrigerating heat exchange module cold junction or hot junction.When the larger refrigeration work consumption of needs, cold junction liquid semiconductor cooling heat exchange module and hot junction liquid semiconductor cooling heat exchange modular spacing spread configuration, become powerful liquid semiconductor refrigerated heat exchanger, the liquid refrigerant of different conditions, by described first liquid carrier pipe and second liquid carrier pipe turnover flow cavity, realizes cooling heat exchange.The modular version of the present invention, solves single cooling module little to power, cannot the difficult problem of high-power use.
Accompanying drawing explanation
Fig. 1 is the first metallic coil structural representation in the present invention.
Fig. 2 is the liquid semiconductor cooling heat exchange modular structure schematic diagram one in the present invention.
Fig. 3 is the liquid semiconductor cooling heat exchange modular structure schematic diagram two in the present invention.
Fig. 4 is the A-A sectional view of Fig. 3.
Fig. 5 is the liquid semiconductor cooling heat exchange modular structure schematic diagram three in the present invention.
Fig. 6 is the B-B sectional view of Fig. 5.
Fig. 7 is the high-power liquid semiconductor refrigerated heat exchanger structural representation one in the present invention.
Fig. 8 is the high-power liquid semiconductor refrigerated heat exchanger structural representation two in the present invention.
Fig. 9 is the high-power liquid semiconductor refrigerated heat exchanger structural representation three in the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in further detail, can implement according to this with reference to description word to make those skilled in the art.
Liquid semiconductor cooling heat exchange module of the present invention comprises, pair of metal plate body 4 as shown in Figure 2, each metal plate 4 is all fixed with multiple semiconductor chilling plate 5, as shown in Figure 7, each metal plate 4 is evenly distributed with four semiconductor chilling plates 5, and all offers through hole in the middle of each metal plate 4; First metallic coil 1, as depicted in figs. 1 and 2, it is fixed in the first accommodation space of pair of metal plate body 4 formation, as shown in Figure 3 and Figure 5, and one end of described first metallic coil 1 is stretched out from the sidepiece of described first accommodation space and is connected to first liquid carrier pipe, the other end of described first metallic coil 1 as required, can stretch out (Fig. 5) from the sidepiece (Fig. 3) of described first accommodation space or the through hole of arbitrary metal plate 4 and is connected to second liquid carrier pipe; Wherein, the material of metal plate 4 and metallic coil 1 selects lightweight, that thermal conductivity is good copper material usually, and the connecting line of each semiconductor chilling plate 5 all leads to terminal box 13 place, as shown in Figure 9.
Form the second accommodation space between the outer wall of described first metallic coil 1 and pair of metal plate body 4, the import and export of described second accommodation space are connected to first liquid carrier pipe and second liquid carrier pipe respectively.Make liquid refrigerant fluid interchange simultaneously in the first metallic coil 1 and the second accommodation space respectively like this, expand heat exchange area.
As shown in figures 2-6, the import and export of described second accommodation space are separately installed with the second metallic coil 2, and the import and export of described first metallic coil 1 and the second metallic coil 2 are all connected to a total tube connector 3, and described total tube connector 3 is connected to liquid delivery tube.
Described total tube connector 3 can as required, stretch out from the sidepiece of described first accommodation space or the through hole of arbitrary metal plate 4.
High-power liquid semiconductor refrigerated heat exchanger of the present invention, comprising: five liquid semiconductor cooling heat exchange modules as shown in Figure 7, and it is arranged in parallel that it is placed in a housing 14, and described housing 14 is with heat-insulation layer; As shown in Figure 9, the perforate of two ends in the middle part of described housing 14 of described first metallic coil 1 or the hole sidewall stretch out described housing 14; Liquid semiconductor cooling heat exchange module comprises, pair of metal plate body 4 as shown in Figure 2, each metal plate 4 is all fixed with multiple semiconductor chilling plate 5, as shown in Figure 7, each metal plate 4 is evenly distributed with four semiconductor chilling plates 5, and all offers through hole in the middle of each metal plate 4; First metallic coil 1, as depicted in figs. 1 and 2, it is fixed in the first accommodation space of pair of metal plate body 4 formation, as shown in Figure 3 and Figure 5, and one end of described first metallic coil 1 is stretched out from the sidepiece of described first accommodation space and is connected to first liquid carrier pipe, the other end of described first metallic coil 1 as required, can stretch out (Fig. 5) from the sidepiece (Fig. 3) of described first accommodation space or the through hole of arbitrary metal plate 4 and is connected to second liquid carrier pipe; Wherein, the material of metal plate 4 and metallic coil 1 selects lightweight, that thermal conductivity is good copper material usually, and the connecting line of each semiconductor chilling plate 5 all leads to terminal box 13 place, as shown in Figure 9; Multiple liquid delivery tube, it is connected with the two ends of described first metallic coil 1 respectively.
As shown in Figure 7, cold junction liquid semiconductor cooling heat exchange module and hot junction liquid semiconductor cooling heat exchange modular spacing spread configuration, the liquid semiconductor cooling heat exchange module being positioned at two ends is fixed with described housing 14 by connector 6, screw rod 7, nut 8.This is that the metal plate 4 making semiconductor chilling plate 5 all contact like this is only hot junction or is only cold junction, avoids the waste of energy because the cold and hot end of the semiconductor chilling plate 5 on adjacent metal plate body 4 is that rightabout is placed.Such as, five liquid semiconductor cooling heat exchange modules in Fig. 7 cold and heat succeed each other placement, and three liquid semiconductor cooling heat exchange modules that are middle and two ends are hot junction liquid semiconductor cooling heat exchange module, and all the other two is cold junction liquid semiconductor cooling heat exchange module.
As shown in Figure 8 and Figure 9, described multiple liquid delivery tube comprises cold liquid inlet pipe 9, cold liquid goes out pipe 10, hydrothermal solution inlet pipe 11 and hydrothermal solution go out pipe 12, the two ends of the first metallic coil 1 of described cold junction liquid semiconductor cooling heat exchange module go out pipe 10 with described cold liquid inlet pipe 9 and cold liquid respectively and are connected, and the two ends of the first metallic coil 1 of described hot junction liquid semiconductor cooling heat exchange module go out pipe 12 with described hydrothermal solution inlet pipe 11 and hydrothermal solution respectively and are connected.
Described cold liquid inlet pipe 9, cold liquid go out pipe 10, hydrothermal solution inlet pipe 11 and hydrothermal solution and go out on pipe 12 sidewall all to offer multiple installing hole, and the hole that the two ends of described first metallic coil 1 are stretched out on described housing 14 sidewall is respectively connected to described installing hole.
As shown in Figure 9, described housing 14 is provided with terminal box 13, the connecting line of the semiconductor chilling plate 5 of described liquid semiconductor refrigerated heat exchanger all leads to described terminal box 13 place.
Scribble heat-conducting cream between described semiconductor chilling plate 5 and described metal plate 4, make heat-conducting effect better.
Make the mixture of spent glycol and demineralized water in described cold junction liquid semiconductor cooling heat exchange module, in the liquid semiconductor cooling heat exchange module of described hot junction, the mixture of spent glycol and demineralized water or demineralized water are circulated.Ethylene glycol adds in demineralized water, can reduce the freezing point of mixture, makes working medium also can keep mobility at a lower temperature.Such as, ethylene glycol content in liquid refrigerant can be made to control between 55% ~ 60%.
During work, liquid refrigerant enters cold junction liquid semiconductor cooling heat exchange module from cold liquid inlet pipe 9 through total tube connector 3, energy from semiconductor chilling plate 5 cold junction just can pass to liquid refrigerant by the first metallic coil 1 and metal plate 4, and then liquid refrigerant goes out pipe 10 through cold liquid and transfers energy in air-conditioning and other system and use; Meanwhile, another part liquid refrigerant enters hot junction liquid semiconductor cooling heat exchange module from hydrothermal solution import 11 through total tube connector 3, energy from semiconductor chilling plate 5 hot junction just can pass to liquid refrigerant by the first metallic coil 1 and metal plate 4, and then liquid refrigerant just goes out pipe 12 through hydrothermal solution and takes energy out of heat exchanger.
Although embodiment of the present invention are open as above, but it is not restricted to listed in description and embodiment utilization, it can be applied to various applicable the field of the invention completely, for those skilled in the art, can easily realize other amendment, therefore do not deviating under the universal that claim and equivalency range limit, the present invention is not limited to specific details and illustrates here and the legend described.
Claims (10)
1. a liquid semiconductor cooling heat exchange module, is characterized in that, comprising:
Pair of metal plate body, each metal plate is all fixed with multiple semiconductor chilling plate, and all offers through hole in the middle of each metal plate;
First metallic coil, it is fixed in the first accommodation space of pair of metal plate body formation, and one end of described first metallic coil is stretched out from the sidepiece of described first accommodation space and is connected to first liquid carrier pipe, the other end of described first metallic coil stretches out from the sidepiece of described first accommodation space or the through hole of arbitrary metal plate and is connected to second liquid carrier pipe;
Wherein, the connecting line of each semiconductor chilling plate all leads to terminal box place.
2. liquid semiconductor cooling heat exchange module as claimed in claim 1, it is characterized in that, form the second accommodation space between the outer wall of described first metallic coil and pair of metal plate body, the import and export of described second accommodation space are connected to first liquid carrier pipe and second liquid carrier pipe respectively.
3. liquid semiconductor cooling heat exchange module as claimed in claim 2, it is characterized in that, the import and export of described second accommodation space are separately installed with the second metallic coil, the import and export of described first metallic coil and the second metallic coil are all connected to a total tube connector, and described total tube connector is connected to liquid delivery tube.
4. liquid semiconductor cooling heat exchange module as claimed in claim 3, it is characterized in that, described total tube connector stretches out from the sidepiece of described first accommodation space or the through hole of arbitrary metal plate.
5. a high-power liquid semiconductor refrigerated heat exchanger, is characterized in that, comprising:
Multiple liquid semiconductor cooling heat exchange module, it is arranged in parallel that it is placed in a housing, and described housing is with heat-insulation layer; Described liquid semiconductor cooling heat exchange module includes:
Pair of metal plate body, each metal plate is all fixed with multiple semiconductor chilling plate, and all offers through hole in the middle of each metal plate;
First metallic coil, it is fixed in the first accommodation space of pair of metal plate body formation, and one end of described first metallic coil is stretched out from the sidepiece of described first accommodation space and is connected to first liquid carrier pipe, the other end of described first metallic coil stretches out from the sidepiece of described first accommodation space or the through hole of arbitrary metal plate and is connected to second liquid carrier pipe;
Wherein, the connecting line of each semiconductor chilling plate all leads to terminal box place, and the hole of two ends from the perforate or sidewall of described housing central section of described first metallic coil stretches out described housing;
Multiple liquid delivery tube, it is connected with the two ends of described first metallic coil respectively;
Wherein, cold junction liquid semiconductor cooling heat exchange module and hot junction liquid semiconductor cooling heat exchange modular spacing spread configuration, the liquid semiconductor cooling heat exchange module being positioned at two ends is fixed by connector and described housing.
6. high-power liquid semiconductor refrigerated heat exchanger as claimed in claim 5, it is characterized in that, described multiple liquid delivery tube comprises cold liquid inlet pipe, cold liquid goes out pipe, hydrothermal solution inlet pipe and hydrothermal solution and goes out pipe, the two ends of the first metallic coil of described cold junction liquid semiconductor cooling heat exchange module go out pipe with described cold liquid inlet pipe and cold liquid respectively and are connected, and the two ends of the first metallic coil of described hot junction liquid semiconductor cooling heat exchange module go out pipe with described hydrothermal solution inlet pipe and hydrothermal solution respectively and are connected.
7. high-power liquid semiconductor refrigerated heat exchanger as claimed in claim 6, it is characterized in that, described cold liquid inlet pipe, cold liquid go out pipe, hydrothermal solution inlet pipe and hydrothermal solution and go out on pipe sidewall all to offer multiple installing hole, and the two ends hole stretched out respectively in described housing sidewall of described first metallic coil is connected to described installing hole.
8. high-power liquid semiconductor refrigerated heat exchanger as claimed in claim 5, is characterized in that, described housing is provided with terminal box, and the connecting line of the semiconductor chilling plate of described liquid semiconductor refrigerated heat exchanger all leads to described terminal box place.
9. high-power liquid semiconductor refrigerated heat exchanger as claimed in claim 5, is characterized in that, scribble heat-conducting cream between described semiconductor chilling plate and described metal plate.
10. high-power liquid semiconductor refrigerated heat exchanger as claimed in claim 5, it is characterized in that, make the mixture of spent glycol and demineralized water in described cold junction liquid semiconductor cooling heat exchange module, in the liquid semiconductor cooling heat exchange module of described hot junction, the mixture of spent glycol and demineralized water or demineralized water are circulated.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410352929.0A CN105276854B (en) | 2014-07-23 | 2014-07-23 | Liquid semiconductor cooling heat exchange module and high-power liquid semiconductor refrigerated heat exchanger |
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| CN201410352929.0A CN105276854B (en) | 2014-07-23 | 2014-07-23 | Liquid semiconductor cooling heat exchange module and high-power liquid semiconductor refrigerated heat exchanger |
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| CN105276854A true CN105276854A (en) | 2016-01-27 |
| CN105276854B CN105276854B (en) | 2017-11-17 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998056047A1 (en) * | 1997-06-04 | 1998-12-10 | Obschestvo S Ogranichennoi Otvetstvennostyu Mak-Bet | Thermo-electric battery, thermo-electric cooling unit and device for heating and cooling a liquid |
| GB2333352B (en) * | 1997-08-22 | 2000-12-27 | Icee Ltd | A heat exchange unit |
| CN1299950A (en) * | 1999-12-16 | 2001-06-20 | 速睦喜股份有限公司 | Heat-exchange apparatus for temp.-regulating device |
| US20090249796A1 (en) * | 2008-04-08 | 2009-10-08 | Ullman Alan Z | Thermally-Balanced Solid State Cooling |
| CN102128519A (en) * | 2011-04-22 | 2011-07-20 | 王增福 | Semiconductor heating and refrigerating device |
| WO2014090641A1 (en) * | 2012-12-10 | 2014-06-19 | Behr Gmbh & Co. Kg | Heat exchanger, particularly for a motor vehicle |
| CN204115291U (en) * | 2014-07-23 | 2015-01-21 | 武汉商学院 | Liquid semiconductor cooling heat exchange module and high-power liquid semiconductor refrigerated heat exchanger |
-
2014
- 2014-07-23 CN CN201410352929.0A patent/CN105276854B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998056047A1 (en) * | 1997-06-04 | 1998-12-10 | Obschestvo S Ogranichennoi Otvetstvennostyu Mak-Bet | Thermo-electric battery, thermo-electric cooling unit and device for heating and cooling a liquid |
| GB2333352B (en) * | 1997-08-22 | 2000-12-27 | Icee Ltd | A heat exchange unit |
| CN1299950A (en) * | 1999-12-16 | 2001-06-20 | 速睦喜股份有限公司 | Heat-exchange apparatus for temp.-regulating device |
| US20090249796A1 (en) * | 2008-04-08 | 2009-10-08 | Ullman Alan Z | Thermally-Balanced Solid State Cooling |
| CN102128519A (en) * | 2011-04-22 | 2011-07-20 | 王增福 | Semiconductor heating and refrigerating device |
| WO2014090641A1 (en) * | 2012-12-10 | 2014-06-19 | Behr Gmbh & Co. Kg | Heat exchanger, particularly for a motor vehicle |
| CN204115291U (en) * | 2014-07-23 | 2015-01-21 | 武汉商学院 | Liquid semiconductor cooling heat exchange module and high-power liquid semiconductor refrigerated heat exchanger |
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| CN105276854B (en) | 2017-11-17 |
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