CN105244163A - Novel ceramic capacitor - Google Patents

Novel ceramic capacitor Download PDF

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Publication number
CN105244163A
CN105244163A CN201510543410.5A CN201510543410A CN105244163A CN 105244163 A CN105244163 A CN 105244163A CN 201510543410 A CN201510543410 A CN 201510543410A CN 105244163 A CN105244163 A CN 105244163A
Authority
CN
China
Prior art keywords
pin
chip
tin electrode
ceramic matrix
bending
Prior art date
Application number
CN201510543410.5A
Other languages
Chinese (zh)
Inventor
乔金彪
Original Assignee
苏州斯尔特微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州斯尔特微电子有限公司 filed Critical 苏州斯尔特微电子有限公司
Priority to CN201510543410.5A priority Critical patent/CN105244163A/en
Publication of CN105244163A publication Critical patent/CN105244163A/en

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Abstract

The invention discloses a novel ceramic capacitor. The capacitor comprises a ceramic matrix, a chip, tin electrodes and a pin. The tin electrodes are fixed to two sides of the chip respectively. Two sides of each tin electrode are provided with embossments. The chip is clamped between the two embossments. A bottom of each tin electrode is provided with bifurcation. The pin is connected between the bifurcation through a welding mode. The pin is provided with a bending portion. A radial size of the bending portion is greater than radial sizes of other portions on the pin. A layer of ceramic matrix wraps external portions of the chip, the tin electrodes and the pin. The ceramic matrix wraps the bending portion on the pin. Through the above mode, the novel ceramic capacitor is provided, stable performance is good and connection of internal structures is tight; during external force collision or extrusion, separation and shedding between the structures are not easy to generate; especially, the structure of the pin changes an original welding connection structure and the bending portion with a good external force resistance capability is additionally installed so that a durable degree of an integral body is increased and a structure life is prolonged.

Description

A kind of new ceramics capacitor

Technical field

The present invention relates to electric fittings field, particularly relate to a kind of new ceramics capacitor.

Background technology

Ceramic capacitor is using pottery as dielectric capacitor, and existing ceramic capacitor generally comprises ceramic chip, pin and epoxy resin enclosed layer, and the cross section of existing pin is circular.The ceramic capacitor of this kind of structure is when producing, and because cross section is that circular height of pin differs, cannot carry out mold pressing, therefore can only singlely carry out welding and encapsulating, production efficiency be lower.Such as Chinese invention patent " new ceramics capacitor ", application number is 201410087271.X, disclose that to comprise described ceramic chip be cuboid, two sides that ceramic chip is relative are fixedly connected with tin electrode respectively, ceramic chip and tin electrode are outside equipped with epoxy resin enclosed layer, two tin electrodes are respectively arranged with pin, the cross section of described pin is rectangle, pin wherein one end is fixedly connected with tin electrode, the other end stretches out outside epoxy resin enclosed layer, is provided with skin of paint between ceramic chip, tin electrode and pin and epoxy resin enclosed layer.Although the ceramic capacitor structure of this structure is small and exquisite, good stability, reliability is strong.But, its structure is easy to damage and come off; Especially, when being subject to external force collision or rolling, easily make to produce between structure to come off.And its pin when being subject to larger external pull, or during bending, easily causes pin entirety to come off out from structure.

Summary of the invention

The technical problem that the present invention mainly solves is to provide a kind of new ceramics capacitor, and it is reasonable in design, and structure is simple, solve internal structure by easily loosen during external force and pin by caducous problem under External Force Acting.

For solving the problems of the technologies described above, the technical scheme that the present invention adopts is to provide a kind of new ceramics capacitor, comprises ceramic matrix, chip, tin electrode and pin; The each fixing a slice tin electrode in both sides of described chip; The both sides of described tin electrode are provided with projection; Two projections by described chip gripper therebetween; The bottom of described tin electrode is provided with bifurcated; Described pin is connected between described bifurcated by welding manner; Described pin is also provided with bend; The radial dimension of described bend is greater than the radial dimension at other positions on pin; Coated one deck ceramic matrix in the outside of described chip, tin electrode, pin; Described ceramic matrix is coated to the bend on pin, and in described bend is also coated on.

Preferably, one deck epoxy resin layer is coated with in the outside of described chip and tin electrode; The thickness of described epoxy resin layer is 20 ~ 35 μm.

Preferably, described ceramic matrix is the shell body that sintering is formed.

The invention has the beneficial effects as follows: a kind of new ceramics capacitor is provided, its structure is simple, stability is good, and internal structure connects closely, when being subject to external force collision or extruding, be not easy the separation between generation structure and come off, especially the structure of pin, not only changes the welding connection structure that it is original, and has set up the good bend of external force resistance ability, improve overall robustness, add structural life-time.

Accompanying drawing explanation

Fig. 1 is the structure cutaway view of a kind of new ceramics capacitor of the present invention;

Fig. 2 is the structure cutaway view that tin electrode and pin practice level place;

In accompanying drawing, the mark of each parts is as follows: 1, ceramic matrix; 2, chip; 3, tin electrode; 4, pin; 5, protruding; 6, bifurcated; 7, bend; 8, epoxy resin layer.

Embodiment

Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.

Refer to attached Fig. 1 and 2, the embodiment of the present invention comprises:

A kind of new ceramics capacitor, comprises ceramic matrix 1, chip 2, tin electrode 3 and pin 4; The each fixing a slice tin electrode 3 in both sides of described chip 2; The both sides of described tin electrode 3 are provided with protruding 5; Described chip 2 is sandwiched in therebetween by two projections 5; Described chip 2 is sandwiched in therebetween by two projections 5; As shown in the figure, chip 2 is clipped in the middle by tin electrode 3 firmly that arrange on chip 2 both sides, and respectively there is a projection 5 both sides of tin electrode 3, are convenient to the clamping of two of chip 2 free sides, and namely single tin electrode 3 adds with the degree of fiting of 2, core.The bottom of described tin electrode 3 is provided with bifurcated 6; Described pin 4 is connected between described bifurcated 6 by welding manner; Be weld in the plane because common pin 4 connects majority, the fatigue resistance of work back plane welding in the course of time can weaken by assembly, and therefore the connection state of pin 4 will become bad.Described pin 4 is also provided with bend 7; The radial dimension of described bend 7 is greater than the radial dimension at other positions on pin 4; Bend 7 can play position-limiting action to a certain extent, and must have larger bearing capacity.At the coated one deck ceramic matrix 1 in the outside of described chip 2, tin electrode 3, pin 4; Described ceramic matrix 1 is the shell body that sintering is formed, and described ceramic matrix 1 is coated to the bend 7 on pin 4, and in described bend 7 is also coated on; The stability of structure can be ensured like this, be especially subject under larger external force pulls, can preventing structure from coming off, improving the stability of structure at pin.One deck epoxy resin layer 8 is coated with in the outside of described chip 2 and tin electrode 3; The thickness of described epoxy resin layer 8 is 20 ~ 35 μm.Epoxy resin layer 8 not only can increase the intensity between syndeton, but also can play heat-blocking action to a certain extent.

The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.

Claims (3)

1. a new ceramics capacitor, is characterized in that: comprise ceramic matrix, chip, tin electrode and pin; The each fixing a slice tin electrode in both sides of described chip; The both sides of described tin electrode are provided with projection; Two projections by described chip gripper therebetween; The bottom of described tin electrode is provided with bifurcated; Described pin is connected between described bifurcated by welding manner; Described pin is also provided with bend; The radial dimension of described bend is greater than the radial dimension at other positions on pin; Coated one deck ceramic matrix in the outside of described chip, tin electrode, pin; Described ceramic matrix is coated to the bend on pin, and in described bend is also coated on.
2. a kind of new ceramics capacitor according to claim 1, is characterized in that: be coated with one deck epoxy resin layer in the outside of described chip and tin electrode; The thickness of described epoxy resin layer is 20 ~ 35 μm.
3. a kind of new ceramics capacitor according to claim 1, is characterized in that: described ceramic matrix is the shell body that sintering is formed.
CN201510543410.5A 2015-08-31 2015-08-31 Novel ceramic capacitor CN105244163A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510543410.5A CN105244163A (en) 2015-08-31 2015-08-31 Novel ceramic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510543410.5A CN105244163A (en) 2015-08-31 2015-08-31 Novel ceramic capacitor

Publications (1)

Publication Number Publication Date
CN105244163A true CN105244163A (en) 2016-01-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510543410.5A CN105244163A (en) 2015-08-31 2015-08-31 Novel ceramic capacitor

Country Status (1)

Country Link
CN (1) CN105244163A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734819A (en) * 1985-12-20 1988-03-29 Rogers Corporation Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package
CN2353026Y (en) * 1998-11-19 1999-12-08 中国科学院上海光学精密机械研究所 Corrosion resistant electric capacitor
CN102683016A (en) * 2011-03-09 2012-09-19 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing the same
CN202549618U (en) * 2011-11-30 2012-11-21 昆山万盛电子有限公司 Ceramic capacitor
CN202977167U (en) * 2012-11-07 2013-06-05 天津市承刚科技发展有限公司 Ceramic capacitor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734819A (en) * 1985-12-20 1988-03-29 Rogers Corporation Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package
CN2353026Y (en) * 1998-11-19 1999-12-08 中国科学院上海光学精密机械研究所 Corrosion resistant electric capacitor
CN102683016A (en) * 2011-03-09 2012-09-19 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing the same
CN202549618U (en) * 2011-11-30 2012-11-21 昆山万盛电子有限公司 Ceramic capacitor
CN202977167U (en) * 2012-11-07 2013-06-05 天津市承刚科技发展有限公司 Ceramic capacitor

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Application publication date: 20160113

WD01 Invention patent application deemed withdrawn after publication