CN105225699A - A kind of Temperature Control Type test macro for memory device - Google Patents
A kind of Temperature Control Type test macro for memory device Download PDFInfo
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Abstract
The present invention relates to a kind of Temperature Control Type test macro for memory device, comprise temperature control test cavity, at least one piece of unit of testing and controlling be placed in described temperature control test cavity, for produce in described temperature control test cavity high temperature or low temperature refrigerating/heating device, to test test cavity that cavity is disposed adjacent with described temperature control and be placed in described test cavity for controlling the test macro of described refrigerating/heating device and described unit of testing and controlling.Adopt technical scheme of the present invention, by memory device test interface is fixed in unit of testing and controlling, and make it directly be plugged on the mainboard of Test Host at the back side of memory device test interface by cable extraction storage data-interface, thus the data-signal of memory device is without the need to through test board transfer, make the transmission of memory data signal more stable, substantially increase reliability and the standard of test.
Description
Technical field
The invention belongs to control application, particularly relate to a kind of Temperature Control Type test macro for memory device.
Background technology
In recent years, along with technology is increasingly mature, memory device (solid state hard disc, USB flash disk etc.) is used widely in consumption market, and is deep into the special dimension such as industry, military affairs gradually from consumer field.Having higher requirement in the aspect such as high and low temperature environment adaptability, reliability, power on/off test (powercycle) of market to solid state hard disc of these special dimensions, also causes the attention of solid state hard disc manufacturer.Flash memory (flash) due to solid state hard disc is supplied and manufacturing technology is all controlled by a few producer external, the flash chip of specific use, wide temperature exists to be bought difficulty and limit and the problem such as to sell, hard disk manufacture producer is made not only to need to do high-low-temperature environmental testing when producing, also need the high/low temperature screening of carrying out producing in batches, substantially increase difficulty of test and the complexity of On-board test equipment.
In prior art, usually test computer is connected on to the test of memory device, in test computer, testing results program realizes knowledge dish, format, initialization, read or write speed, continuous physical read-write, the test events such as powercycle, totally erasing, thus judge whether storage device performance meets standard.But memory device manufacturer generally lacks special high and low-temperature apparatus in prior art, the high-low temperature test chamber that the high/low temperature of memory device tests usual employing standard adds the method for external test computer, be placed in high-low temperature test chamber by tested memory device, from chamber, draw data extension line be connected with test computer.There is operating difficulties in the method, it is in disorder to arrange, test panel quantity is few, inefficiency, the obviously drawback such as be not suitable for producing in enormous quantities.Although also have Special high-low temperature equipment in prior art, but be also only through high-low temperature test chamber and the simple integrator of multiple test computer, although obtain certain improvement in integrated operation performance, but deep research is not carried out to problems such as line arrangement, test panel expansions, also there are problems, thus affect precision and the efficiency of memory device test.
See Fig. 1, be depicted as the connection block diagram of memory device high/low temperature test macro in prior art, measurement circuit plate is provided with multiple storage device interface for connecting tested memory device, now for the hard disk of SATA interface, the SATA hard disc interface be connected with tested SATA hard disc is fixed on measurement circuit plate in a welding manner, SATA signaling interface and power supply signal interface are set at measurement circuit plate simultaneously, it is made to be connected with power interface with the SATA interface of computer main board by data line and power lead, on measurement circuit plate, arrange that circuit is connected with SATA hard disc Interface Electrical again.In this connected mode, be connected with tested hard disk again after the SATA signal of computer main board carries out signal transfer by measurement circuit plate, cause hard disc data signal attenuation, thus the reliability of impact test and standard.
Therefore, for the above-mentioned defect existed in currently available technology, be necessary to study in fact, to provide a kind of scheme, solve the defect existed in prior art.
Summary of the invention
The object of the invention is for the problems referred to above, provide a kind of and be applicable to various memory device, test panel quantity is many, efficiency is high, be applicable to producing in enormous quantities the Temperature Control Type test macro of test.
For achieving the above object, present invention employs following technical proposal:
A kind of Temperature Control Type test macro for memory device, comprise temperature control test cavity, be placed in described temperature control test cavity at least one piece of unit of testing and controlling, for produce in described temperature control test cavity high temperature or low temperature refrigerating/heating device, to test test cavity that cavity is disposed adjacent with described temperature control and be placed in described test cavity for controlling the test macro of described refrigerating/heating device and described unit of testing and controlling, wherein
Described test macro comprises at least one Test Host, and this Test Host mainboard is provided with multiple first and stores data-interface;
Described unit of testing and controlling comprises at least one for the memory device test interface that is connected with tested memory device and control circuit board, described unit of testing and controlling is connected with described Test Host, for receiving the control signal of described Test Host, data-signal and power supply signal; Described memory device test interface is fixed in described unit of testing and controlling, its front is provided with the standard interface fastened with tested memory device, its back side is directly provided with the signal extended line be connected with described standard interface, be provided with the second storage data-interface for the part receiving data-signal in the described signal extended line other end, described first stores corresponding connection between data-interface and described second storage data-interface makes described memory device test interface directly be connected with described Test Host; Be provided with storage power interface for the part receiving power supply signal in the described signal extended line other end, described storage power interface is connected with described control circuit board and is controlled by described control circuit board.
Preferably, described first storage data-interface itself is carried by this Test Host mainboard or stores the expansion of data-interface expansion cards by the multiple PCI-E slot grafting on this mainboard and obtains.
Preferably, described refrigerating/heating device is arranged on the top of described temperature control test cavity.
Preferably, arrange about cavity is tested in described test macro and described temperature control, the multiple stage Test Host of described test macro and described temperature control are tested the polylith unit of testing and controlling one_to_one corresponding in cavity and are substantially on same level position.
Preferably, described unit of testing and controlling also comprises multiple baffle plate, and described baffle plate is used for fixing described memory device test interface and described control circuit board.
Preferably, also dividing plate is provided with between described temperature control test cavity and described test cavity.
Preferably, described temperature control test cavity is also provided with the wire hole that multiple and described test cavity is communicated with on the inwall of described test cavity side, and the size of described wire hole and the connecting line between described test macro and described unit of testing and controlling adapts.
Preferably, be also provided with adiabatic clay in described wire hole, described adiabatic clay is used for closing the space between the outconnector of described temperature control test cavity and described wire hole.
Preferably, also comprise the normal temperature test section be connected with described Test Host, described normal temperature test section is arranged on the side door of described test cavity, and is provided with the memory device test interface that multiple and described test macro is connected.
Preferably, described memory device test interface is one or several combinations in SATA interface, SAS interface, PCI-E interface or USB interface; Described first storage data-interface or described second storage data-interface are any one in SATA interface, SAS interface, PCI-E interface or USB interface; Be connected by data buss such as SATA, SAS, PCI-E, UART or USB between described control circuit board with described Test Host.
Compared with prior art, the invention has the advantages that:
1, a kind of Temperature Control Type test macro for memory device of the present invention, by memory device test interface being fixed on (but not being welded on test board by memory device test interface in prior art) in unit of testing and controlling, and make it directly be plugged on the mainboard of Test Host at the back side of memory device test interface by cable extraction storage data-interface, thus memory data signal is without the need to through test board transfer, make the transmission of memory data signal more reliable and stable, substantially increase reliability and the standard of test.
2, carry out extension storage test interface by PCI-E interface, thus separate unit Test Host can the quantity of test storage equipment be increased greatly, reduction equipment volume also simplifies internal placement.
3, control circuit board adopts to seal in and go out logic chip and realizes expansion control, thus realizes multiple power supplies control.
Accompanying drawing explanation
Fig. 1 is the wiring connection layout of prior art memory device high/low temperature test macro.
Fig. 2 is the Facad structure block diagram of the Temperature Control Type test macro for memory device provided by the invention.
Fig. 3 is the inner structure block diagram of the Temperature Control Type test macro for memory device provided by the invention.
Fig. 4 is the connection diagram of the Temperature Control Type test macro for memory device provided by the invention.
Fig. 5 is the connection diagram for unit of testing and controlling in the Temperature Control Type test macro of memory device provided by the invention.
Fig. 6 is the theory diagram for control circuit board in the Temperature Control Type test macro of memory device provided by the invention.
Fig. 7 is the connection layout of the power protection chip in control circuit board provided by the invention.
Embodiment
Be below the specific embodiment of invention and by reference to the accompanying drawings, technical scheme of the present invention is further described, but the present invention be not limited to these embodiments.
After the defect that further investigation prior art memory device high/low temperature test macro exists, the present invention finds, the storage device interface of standard is all adopted in prior art, its front is the standard interface be connected with tested memory device, the back side is row's needle interface, for storage device interface is fixed on measurement circuit plate with welding manner; Have employed this usual connected mode of prior art just, data-signal is made to need by the transfer of measurement circuit plate, thus cause the decay of data-signal, and data-signal (SATA data) is all high-frequency data signal, any faint signal attenuation all may cause error in data, causes test result inaccurate.
For the defect of prior art, see Fig. 2, Fig. 3 and Fig. 4, be depicted as the syndeton block diagram of a kind of Temperature Control Type test macro for memory device of the present invention, comprise temperature control test cavity 1, be arranged on chamber door for observing the view window 6 of temperature control test cavity 1, be placed at least one unit of testing and controlling 2 in temperature control test cavity 1, for producing the refrigerating/heating device 3 of high temperature or low temperature in temperature control test cavity 1, test test cavity 4 that cavity 1 is disposed adjacent with temperature control and be placed in and test cavity 4 for controlling the test macro 5 of refrigerating/heating device 3 and unit of testing and controlling 2, wherein,
Test macro 5 comprises at least one Test Host 51, and this Test Host 51 mainboard is provided with multiple first and stores data-interface, and this first storage data-interface is generally any one in SATA interface, SAS interface, PCI-E interface or USB interface;
Test macro 5 also comprises input peripheral 52 (keyboard, mouse etc.), display 53, testing and control panel 54 and shares the KVM switcher of a display 53 and input peripheral 52 for multiple stage Test Host 51.
See Fig. 5, be depicted as the connection diagram for unit of testing and controlling in the Temperature Control Type test macro of memory device provided by the invention, unit of testing and controlling 2 comprises at least one for the memory device test interface 21 that is connected with tested memory device and control circuit board (in Fig. 2 and Fig. 3 and not shown), and tested memory device is directly plugged on memory device test interface 21; Unit of testing and controlling 2 is connected with Test Host 51 by connection cable, and for receiving the control signal of Test Host 51, data-signal and power supply signal, accordingly, connection cable comprises control signal wire, data signal line and power signal line.The power supply that power supply signal connects Test Host 51 provides Power supply for unit of testing and controlling 2, data-signal is for transmitting the storage information of tested memory device, control signal is used for testing and control (such as power on/off test), and control circuit board receives this control signal and completes the Energy control to tested memory device.Memory device test interface 21 is fixed in unit of testing and controlling 2, its front is provided with the standard interface fastened with tested memory device, its back side is directly provided with the signal extended line be connected with standard interface, the signal extended line other end is provided with the second storage data-interface for the cable receiving data-signal, second stores data-interface and first stores that data-interface is corresponding to be connected, and is any one in SATA interface, SAS interface, PCI-E interface or USB interface; First storage data-interface and second stores after data-interface engaging is connected and memory device test interface 21 is directly connected with Test Host 51; The signal extended line other end is provided with storage power interface for the cable receiving power supply signal, and the other end of power signal line is provided with storage power interface, and storage power interface is connected with control circuit board and is controlled by control circuit board.
The present invention is by being fixed on (but not being welded on test board by memory device test interface 21 in prior art) in unit of testing and controlling 2 by memory device test interface 21, and make on its mainboard being directly plugged on Test Host 51 at the back side of memory device test interface 21 by cable extraction storage data-interface, thus memory data signal is without the need to through test board transfer, make the transmission of memory data signal more reliable and stable, substantially increase reliability and the standard of test.
The memory interface (such as SATA interface) only using test computer mainboard to carry due to prior art is as memory device test interface 21, usually the memory interface limited amount (generally within 10) carried, being forced to increase too much test computer to increase the test panel quantity of integral device, causing that equipment volume is huge, internal placement is complicated, maintenance difficult.
In order to solve the problems of the technologies described above, the present invention proposes a kind of technical scheme by PCI-E slot expansion memory interface.Usually, the mainboard of Test Host 51 has multiple PCI-E slot, store data-interface expansion card extension storage interface by the multiple PCI-E slot grafting on this mainboard.Can the multiple PCI-E-SATA adapter of grafting as by PCI-E slot expansion SATA interface, a PCI-E slot can expand to 4,8 or 16 SATA interfaces, thus makes the testable memory device of separate unit Test Host 51 reach more than 20.
In technique scheme, control circuit board is for receiving the control signal of Test Host 51 and the Energy control completed tested memory device, and therefore the design of control circuit board is very crucial.See Fig. 6, be depicted as the theory diagram for control circuit board in the Temperature Control Type test macro of memory device provided by the invention, control circuit board comprises the power interface that is connected with Test Host 51 and communication interface, main control chip, ON-OFF control circuit and multiple slave voltage interface for testing and control, and power interface provides power supply for accessing power supply for control circuit board; Communication interface is used for carrying out with Test Host 51 control signal that data communication receives Test Host 51; Main control chip reception control signal also sends steering order according to this control signal, ON-OFF control circuit controls the storage power interface one_to_one corresponding on slave voltage interface and memory device test interface 21, ON-OFF control circuit controls energising and the power-off of slave voltage interface according to steering order, and then realizes automatically controlling the power on/off of tested memory device.
In a preferred embodiment, main control chip is single-chip microcomputer, is specially the technical grade single-chip microcomputer that model is PIC16F688.Communication interface is UART interface, communicates with the serial port communicating protocol of Test Host 51 according to agreement, and reception control signal (bit information).
Due to the I/O port limited amount of single-chip microcomputer, in order to control the power on/off test of the tested memory device of multichannel, ON-OFF control circuit comprises multi-disc and seals in and the logic chip gone out, and main control chip is connected with ON-OFF control circuit by internal data bus.Preferably, to seal in and the logic chip model gone out is 74HC595 technical grade chip.Bit information, with SPI serial communication mode, is issued 74HC595 chip by single-chip microcomputer, and serial control signal is converted to parallel control signal by 74HC595 chip, thus realizes the control of multichannel slave voltage, compensate for main control chip I/O port lazy weight.
In a preferred embodiment, ON-OFF control circuit also comprises power protection chip, and participate in Fig. 7, be depicted as the connection layout of the power protection chip in control circuit board provided by the invention, each slave voltage interface connects a slice power protection chip.Preferably, power protection chip model is TPS22980 technical grade chip.TPS22980 chip comprises an Enable Pin, power input and power output end, and wherein, power input is connected with storage power interface, power output end and slave voltage interface, and Enable Pin is connected with 74HC595 chip, indirectly controlled and main control chip.When Enable Pin is high level, power input and power output end electrically conducting, now, slave voltage interface out-put supply signal provides power supply for tested memory device; When Enable Pin is low level, power input and power output end are in off state, and now, slave voltage interface non-transformer signal exports, and tested memory device is off-position.
In a preferred embodiment, unit of testing and controlling 2 also comprises multiple baffle plate (in Fig. 2 and Fig. 3 and not shown) be arranged in temperature control test cavity 1, and baffle plate is used for fixed memory device test interface 21 and control circuit board.Baffle plate is provided with the groove making memory device test interface 21 expose baffle plate front and is provided with for fixing screw fixed orifice simultaneously, memory device test interface 21 is the female seat of band screw fixed bit, by tighten the screws, memory device test interface 21 is fixed on baffle plate.Equally, baffle plate is also provided with the fixed orifice for control circuit board being fixed on the baffle plate back side.
In a preferred embodiment, dividing plate 7 is also provided with between temperature control test cavity 1 and test cavity 4.Dividing plate 7 plays heat-blocking action, ensures that the high and low temperature environment of temperature control test cavity 1 can not affect the normal work of test macro 5 in test cavity 4.
In a preferred embodiment, temperature control test cavity 1 is also provided with multiple wire hole 8 be communicated with test cavity 4 on the inwall of test cavity 4 side, this wire hole 8 is for the cabling of the cable 9 of connecting test main frame 51 and unit of testing and controlling 2, in order to ensure thermal insulation and leakproofness, the size of wire hole 8 and the connecting line between test macro 5 and unit of testing and controlling 2 adapts.
In a preferred embodiment, be also provided with adiabatic clay in wire hole 8, adiabatic clay is used for closing the space between temperature control test cavity 1 and wire hole 8.Ensure that the high and low temperature environment of temperature control test cavity 1 can not affect the normal work of test macro 5 in test cavity 4.
In a preferred embodiment, also comprise normal temperature test section, normal temperature test section is arranged on the side door of test cavity 4, and is provided with multiple memory device test interface 21 be connected with test macro 5.Thus multiple different test request can be met.
The high-low temperature test chamber of prior art, refrigerating/heating device 3 arranges the below stating temperature control test cavity 1 usually, but the temperature control of the Temperature Control Type test macro for memory device provided by the invention test cavity 1 is provided with more than 100 On-board test interface, if refrigerating/heating device 3 to be arranged on below, operation inconvenience operationally during layer On-board test interface, will be caused; Memory device test interface 21 and Test Host 51 connecting line will become longer simultaneously, cause data-signal to decay, thus affect the accuracy of test result.
In a preferred embodiment, in order to the wiring length as far as possible between reduction Test Host 51 and unit of testing and controlling 2, ensure the normal transmission of data-signal.Test macro 5 and temperature control are tested cavity about 1 and are arranged, and multiple stage Test Host 51 and the temperature control of test macro 5 are tested polylith unit of testing and controlling 2 one_to_one corresponding in cavity 1 and be substantially on same level position.
In a preferred embodiment, test macro also comprises the network switch, realizes the multiple computers networking centralized control of internal system, also can be used for being connected with remote control center simultaneously, system is networked expansion.
The explanation of above embodiment just understands method of the present invention and core concept thereof for helping.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also carry out some improvement and modification to the present invention, these improve and modify and also fall in the protection domain of the claims in the present invention.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, the General Principle defined in the present invention can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these illustrated embodiments, but will meet the widest scope consistent with principles of this disclosure and features of novelty.
Claims (10)
1. the Temperature Control Type test macro for memory device, it is characterized in that, comprise temperature control test cavity, at least one piece of unit of testing and controlling be placed in described temperature control test cavity, for produce in described temperature control test cavity high temperature or low temperature refrigerating/heating device, to test test cavity that cavity is disposed adjacent with described temperature control and be placed in described test cavity for controlling the test macro of described refrigerating/heating device and described unit of testing and controlling, wherein
Described test macro comprises at least one Test Host, and this Test Host mainboard is provided with multiple first and stores data-interface;
Described unit of testing and controlling comprises at least one for the memory device test interface that is connected with tested memory device and control circuit board, described unit of testing and controlling is connected with described Test Host, for receiving the control signal of described Test Host, data-signal and power supply signal; Described memory device test interface is fixed in described unit of testing and controlling, its front is provided with the standard interface fastened with tested memory device, its back side is directly provided with the signal extended line be connected with described standard interface, the described signal extended line other end is provided with the second storage data-interface for the part receiving data-signal, and described first stores corresponding connection between data-interface and described second storage data-interface makes described memory device test interface directly be connected with described Test Host; Be provided with storage power interface for the part receiving power supply signal in the described signal extended line other end, described storage power interface is connected with described control circuit board and is controlled by described control circuit board.
2. the Temperature Control Type test macro for memory device according to claim 1, it is characterized in that, described first stores data-interface itself is carried by this Test Host mainboard or is obtained by the multiple PCI-E slot grafting storage data-interface expansion card expansion on this mainboard.
3. the Temperature Control Type test macro for memory device according to claim 1 and 2, is characterized in that, described refrigerating/heating device is arranged on the top of described temperature control test cavity.
4. the Temperature Control Type test macro for memory device according to claim 3, it is characterized in that, arrange about cavity is tested in described test macro and described temperature control, the multiple stage Test Host of described test macro and described temperature control are tested the polylith unit of testing and controlling one_to_one corresponding in cavity and are substantially on same level position.
5. the Temperature Control Type test macro for memory device according to claim 4, it is characterized in that, described unit of testing and controlling also comprises multiple baffle plate, and described baffle plate is used for fixing described memory device test interface and described control circuit board.
6. the Temperature Control Type test macro for memory device according to claim 4, is characterized in that, is also provided with dividing plate between described temperature control test cavity and described test cavity.
7. the Temperature Control Type test macro for memory device according to claim 4, it is characterized in that, described temperature control test cavity is also provided with the wire hole that multiple and described test cavity is communicated with on the inwall of described test cavity side, and the size of described wire hole and the connecting line between described test macro and described unit of testing and controlling adapts.
8. the Temperature Control Type test macro for memory device according to claim 7, it is characterized in that, also be provided with adiabatic clay in described wire hole, described adiabatic clay is used for closing the space between the outconnector of described temperature control test cavity and described wire hole.
9. the Temperature Control Type test macro for memory device according to claim 4, it is characterized in that, also comprise the normal temperature test section be connected with described Test Host, described normal temperature test section is arranged on the side door of described test cavity, and is provided with the memory device test interface that multiple and described test macro is connected.
10. the Temperature Control Type test macro for memory device according to claim 1, is characterized in that, described memory device test interface is one or several combinations in SATA interface, SAS interface, PCI-E interface or USB interface; Described first storage data-interface or described second storage data-interface are any one in SATA interface, SAS interface, PCI-E interface or USB interface; Be connected by data buss such as SATA, SAS, PCI-E, UART or USB between described control circuit board with described Test Host.
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