CN105207011A - High frequency signal processing method - Google Patents
High frequency signal processing method Download PDFInfo
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- CN105207011A CN105207011A CN201410305717.7A CN201410305717A CN105207011A CN 105207011 A CN105207011 A CN 105207011A CN 201410305717 A CN201410305717 A CN 201410305717A CN 105207011 A CN105207011 A CN 105207011A
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- high frequency
- isolation
- signal transmissions
- frequency signals
- terminal
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Abstract
The invention discloses a high frequency signal processing method. The method is characterized in that at least two isolated terminals are arranged among signal transmission conductor groups on a circuit substrate so that noise interference among the signal transmission conductor groups is isolated; a periphery of each signal transmission conductor group is provided with at least one isolated terminal; when the signal transmission conductor groups are arranged on the circuit substrate in modes of paralleling, array or stereo and the like, at least two isolated terminals are arranged among the signal transmission conductor groups so that a high frequency signal interference source emitted by each signal transmission conductor group is restrained by the two isolated terminals. More than two isolated terminals are used to carry out obstruction layer upon layer so that the noise interference of the signal transmission conductor groups on the circuit substrate or other electronic apparatuses is reduced to a minimum.
Description
Technical field
The present invention, for providing a kind of high frequency signals method, espespecially a kind ofly carries out layering isolation, segmentation restraint speckle interference and be minimized the high frequency signals method of High-frequency Interference with at least two isolation terminals to the high-frequency signal interference source that Signal transmissions conductor group produces.
Background technology
Press, along with the prosperity of science and technology, people are more and more higher for the dependency degree of electricity, happy every aspect is educated in clothing, food, lodging and transportion--basic necessities of life, no matter be manufacture or use, all cannot be completely free of the use of electricity, and well known, as long as there is electricity corresponding generation to disturb, such as electromagnetic wave etc., although this interference strength and distance are inversely proportional to, but in the modern times of electronic product precise treatment all the more, the problem of interference only can be day by day serious, but misfortune, accurate electronic product is easier because disturb and malfunction and failure, and therefore how solving interference problem is the task of top priority.
High-frequency signal is referred to as when the frequency range of signal is greater than 2.4GHz, although the ear of the mankind cannot arrive by direct feeling, but this interference can reduce the sensitivity of wireless receiving, and then reduction visits, be enough to the normal use affecting wireless device, this kind of signal cannot be filtered elimination, therefore generally all carrys out noise isolation with the masking methods of external housing, or directly at the other increase of signal terminal one earth terminal, to reach the object reducing high-frequency signal noise.
Please coordinate consults shown in Fig. 1 and Fig. 2 simultaneously, for commonly using the noise isolation structure schematic diagram () of signal terminal and commonly using the noise isolation structure schematic diagram (two) of signal terminal, can find out by figure, when substrate is three ply board, only have one deck earth terminal 5 to do to isolate between left-right signal terminal 4, and when substrate is multi-layer sheet, between upper and lower signal terminal 4, also only have one deck earth terminal 5 to do to isolate.
In time using, really there is following point and disappearance waits to improve in right above-mentioned gimmick:
(1) additional housing, causes the microminiaturization of small product size to be restricted.
(2) increase by an earth terminal 5, isolation effect is limited, still has the problem affecting wireless signal.
(3) when circuit substrate is multi-layer sheet, its isolation effect of earth terminal 5 of individual layer is then more aobvious unable.
Therefore, how to solve the above-mentioned problem commonly used and disappearance, be the present inventor be engaged in the industry person skilled desire most ardently the place, direction studied and improve.
Summary of the invention
Therefore, the present inventor is because above-mentioned disappearance, be collect related data, via in many ways assessing and considering, and to engage in the many years of experience of the industry accumulation, via constantly studying and revising, begin to design this kind and directly noise jamming action is covered to signal source by electronic product inside, reach staged isolation with minimum volume, reduce the high frequency signals method of noise.
Main purpose of the present invention is: surrounding Signal transmissions conductor group being wrapped in Signal transmissions conductor group with at least one isolation end subring, make all there are at least two isolation terminals between Signal transmissions conductor group, no matter and how Signal transmissions conductor group arranges on circuit substrate, all there are at least two isolation terminals and carry out covering of high-frequency signal interference source, reduce its noise jamming whereby.
For reaching above-mentioned purpose, primary structure of the present invention comprises: multiple Signal transmissions conductor group be located on circuit substrate, and arranges at least two isolation terminals between the plurality of Signal transmissions conductor group, make when user is by least one for ring bag around the Signal transmissions conductor group be located on circuit substrate isolation terminal, can make, between any two these Signal transmissions conductor groups, there are at least two isolation terminals, the high-frequency noise interference that Signal transmissions conductor group is produced is able to be isolated by this isolation terminal layering, segmentation suppresses, interim is down to minimum by the effect of noise jamming, and the surrounding up and down of Signal transmissions conductor group all has isolation terminal, more be applicable to the circuit substrate of multilayer, it is omnibearing noise mask, there is powerful industry applications and practical improvement, microminiaturization for future electronic industry has excellent help.
By above-mentioned technology, can for commonly use cover high-frequency signal interference source gimmick existing for additional housing cause the microminiaturization of volume limited, and unevident and when being applied to multilayer circuit board, screening effect the is more limited problem points of single isolation earth terminal effect is broken through, and reaches the practical improvement of above-mentioned advantage.
Accompanying drawing explanation
Fig. 1 is the noise isolation structure schematic diagram () commonly using signal terminal;
Fig. 2 is the noise isolation structure schematic diagram (two) commonly using signal terminal;
Fig. 3 is the circuit board three-dimensional figure of present pre-ferred embodiments;
Fig. 4 is the perspective view of present pre-ferred embodiments;
Fig. 5 is the cutaway view of the A-A line segment of Fig. 4 of the present invention;
Fig. 6 is the using state schematic diagram () of present pre-ferred embodiments;
Fig. 7 is the using state schematic diagram (two) of present pre-ferred embodiments;
Fig. 8 is the using state schematic diagram () of another embodiment of the present invention;
Fig. 9 is the using state schematic diagram (two) of another embodiment of the present invention;
Figure 10 is the using state schematic diagram (three) of another embodiment of the present invention.
Description of reference numerals: 1-circuit substrate; 11-dielectric layer; 12-via; 13-conductive pole; 2,2A-Signal transmissions conductor group; 21,21A-first Signal transmissions conductor; 22,22A-secondary signal transmission conductor; 3,3A-isolation terminal; 31A-separator; 4-signal terminal; 5-earth terminal.
Embodiment
For reaching above-mentioned purpose and effect, the technology used in the present invention means and structure, with regard to present pre-ferred embodiments, these drawing illustrate that its features and functions is as follows in detail.
Illustrate: at communication field, the energy field of interference signal transmission, is called noise, the noise mentioned in this specification, is the energy field of interference signal and/or interference signal transmission.
Refer to shown in Fig. 3, Fig. 4, Fig. 5, Fig. 6 and Fig. 7, for the cutaway view of the A-A line segment of the circuit board three-dimensional figure of present pre-ferred embodiments, perspective view, Fig. 4, using state schematic diagram () and using state schematic diagram (two), find out that method of the present invention arranges at least two isolation terminals 3 between each Signal transmissions conductor group 2 on circuit substrate 1 by knowing in figure, isolate the noise jamming respectively between this Signal transmissions conductor group 2 whereby.Wherein this Signal transmissions conductor group 2 comprises one first Signal transmissions conductor 21 and a secondary signal transmission conductor 22, and this circuit substrate 1 is made up of at least three dielectric layers (Dielectric) 11, and this isolation terminal 3 is positive electricity transmission terminal or ground connection transmission terminal, and there is the via 12 of multiple through respectively this dielectric layer 11 on this circuit substrate 1, and be provided with and be at least onely arranged in this via 12 and the conductive pole 13 be electrically connected with this isolation terminal 3, by means of said structure, conductive hole 12 is arranged in be electrically connected the isolation terminal 3 of each dielectric layer 11 with conductive pole 13, those isolation terminals 3 are connected and becomes the isolation terminal 3 of Signal transmissions conductor group 2 longitudinal direction, proving by the same methods, opposite side in Signal transmissions conductor group 2 is communicated with an isolation terminal 3, and coordinate the isolation terminal 3 on being positioned on the upside of Signal transmissions conductor group 2 dielectric layer 11, and the isolation terminal 3 on the dielectric layer 11 being positioned on the downside of Signal transmissions conductor group 2, make the upside of Signal transmissions conductor group 2, downside, left side and right side are all provided with this isolation terminal 3, whereby by this Signal transmissions conductor group 2 round and round around, and become its ground floor noise mask body, in addition, because the either side of each this Signal transmissions conductor group 2 all has isolation terminal 3, the isolation terminal 3 outside second Signal transmissions conductor group 2 is made to become the second layer noise mask body of first Signal transmissions conductor group 2, therefore, when multiple Signal transmissions conductor group 2 being surrounded with isolation terminal 3 is close to each other, originally the noise jamming produced between Signal transmissions conductor group 2, most high-frequency noise is first isolated via ground floor noise mask body, thereafter remaining high-frequency noise is isolated via second layer noise mask body again, thus, can by least two isolation terminals 3 be arranged between each Signal transmissions conductor group 2, to the noise jamming respectively between this Signal transmissions conductor group 2, or the interference to other parts on circuit substrate 1, reach layering isolation, segmentation suppresses, to reduce the interference problem of its high-frequency signal, as the problem of EMI electromagnetic interference (ElectroMAgneticInterference) or RFI radio frequency interference (RAdioFrequencyInterference).
Separately please coordinate consults shown in Fig. 8 and Figure 10 simultaneously, for the using state schematic diagram () of another embodiment of the present invention, using state schematic diagram (two) and using state schematic diagram (three), find out by knowing in figure, when circuit substrate is made up of the dielectric layer of more than four layers, in the either side of each this Signal transmissions conductor group 2A, there is an isolation terminal 3 more has each this isolation terminal 3A of at least one connection separator 31A equally in the outside of isolation terminal 3A, again strengthen the effect of the noise of isolation signals transmission conductor group 2A whereby, no matter and the arrangement mode of Signal transmissions conductor group 2A is side by side, array or three-dimensional stacking, all can reach excellent isolation effect.Illustrate with concrete instance: Signal transmissions conductor group 2A is defined as the first Signal transmissions conductor 21A and secondary signal transmission conductor 22A, when the side of this Signal transmissions conductor group 2A is provided with another Signal transmissions conductor group 2A, and when wherein a Signal transmissions conductor group 2A produces noise jamming, first isolate by the isolation terminal 3A around himself, then cannot before completely isolated noise reaches another Signal transmissions conductor 2A, just first done second time isolation by the isolation terminal 3A around it, now perhaps high-frequency noise interference 100% does not intercept outside another Signal transmissions conductor 2A, but its remaining disturbing effect also remains little, especially when having separator 31A outside isolation terminal 3A, isolation effect is more remarkable.Whereby, the noise jamming intensity between Signal transmissions conductor group 2A is made to be down to minimum.
Therefore, high frequency signals method of the present invention can be improved the key problem in technology commonly used and is:
One, need not additional housing, the evolution of electronic product volume microminiaturization can not be affected.
Two, with double-deck isolation terminal 3, the noise that isolation signals transmission conductor produces, significantly suppresses intensity and the influence power of this noise.
Three, when circuit substrate 1 is multi-layer sheet, a separator 31A is more set, again strengthens its isolation effect.
In sum, high frequency signals method of the present invention in use, for really its effect and object can be reached.
The foregoing is only preferred embodiment of the present invention, non-therefore namely arresting limits the scope of the claims of the present invention, therefore the simple and easy modification of such as using specification of the present invention and graphic content to do and equivalent structure change, all should in like manner be contained in the scope of the claims of the present invention.
Claims (10)
1. a high frequency signals method, is characterized in that, is to arrange at least two isolation terminals between each Signal transmissions conductor group on circuit substrate, isolates the noise jamming respectively between this Signal transmissions conductor group whereby.
2. high frequency signals method as claimed in claim 1, is characterized in that, respectively has at least one separator for being communicated with respectively this isolation terminal outside this isolation terminal.
3. high frequency signals method as claimed in claim 1, it is characterized in that, this circuit substrate is made up of at least three dielectric layers.
4. high frequency signals method as claimed in claim 3, is characterized in that this circuit substrate having the via of multiple through respectively this dielectric layer.
5. high frequency signals method as claimed in claim 4, is characterized in that, this circuit substrate is provided with and is at least onely arranged in this via and the conductive pole be electrically connected with each this isolation terminal.
6. high frequency signals method as claimed in claim 1, it is characterized in that, this noise jamming is EMI electromagnetic interference or RFI radio frequency interference.
7. high frequency signals method as claimed in claim 1, it is characterized in that, this isolation terminal is positive electricity transmission terminal or ground connection transmission terminal.
8. high frequency signals method as claimed in claim 1, it is characterized in that, respectively this Signal transmissions conductor group comprises one first Signal transmissions conductor and a secondary signal transmission conductor.
9. high frequency signals method as claimed in claim 1, is characterized in that, those Signal transmissions conductor groups with side by side, array or three-dimensional stacking arrangement mode be arranged on this circuit substrate.
10. high frequency signals method as claimed in claim 1, is characterized in that, respectively the upside of this Signal transmissions conductor group, downside, left side and right side are respectively arranged with this isolation terminal at least one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410305717.7A CN105207011A (en) | 2014-06-30 | 2014-06-30 | High frequency signal processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410305717.7A CN105207011A (en) | 2014-06-30 | 2014-06-30 | High frequency signal processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105207011A true CN105207011A (en) | 2015-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410305717.7A Pending CN105207011A (en) | 2014-06-30 | 2014-06-30 | High frequency signal processing method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6353189B1 (en) * | 1997-04-16 | 2002-03-05 | Kabushiki Kaisha Toshiba | Wiring board, wiring board fabrication method, and semiconductor package |
| JP2011102817A (en) * | 2009-11-10 | 2011-05-26 | Nikon Corp | Microscope device |
| TW201316895A (en) * | 2011-10-14 | 2013-04-16 | Hon Hai Prec Ind Co Ltd | Printed circuit board capable of preventing electromagnetic interface |
| US20130140070A1 (en) * | 2011-12-06 | 2013-06-06 | Tyco Electronics Corporation | System for connecting electrical cables to a printed circuit board |
| CN203520952U (en) * | 2013-09-05 | 2014-04-02 | 深圳市得润电子股份有限公司 | Shielding wire capable of shielding external interference |
-
2014
- 2014-06-30 CN CN201410305717.7A patent/CN105207011A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6353189B1 (en) * | 1997-04-16 | 2002-03-05 | Kabushiki Kaisha Toshiba | Wiring board, wiring board fabrication method, and semiconductor package |
| JP2011102817A (en) * | 2009-11-10 | 2011-05-26 | Nikon Corp | Microscope device |
| TW201316895A (en) * | 2011-10-14 | 2013-04-16 | Hon Hai Prec Ind Co Ltd | Printed circuit board capable of preventing electromagnetic interface |
| US20130140070A1 (en) * | 2011-12-06 | 2013-06-06 | Tyco Electronics Corporation | System for connecting electrical cables to a printed circuit board |
| CN203520952U (en) * | 2013-09-05 | 2014-04-02 | 深圳市得润电子股份有限公司 | Shielding wire capable of shielding external interference |
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Application publication date: 20151230 |
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