CN105185764B - Spring pins POP structures and process - Google Patents
Spring pins POP structures and process Download PDFInfo
- Publication number
- CN105185764B CN105185764B CN201510642903.4A CN201510642903A CN105185764B CN 105185764 B CN105185764 B CN 105185764B CN 201510642903 A CN201510642903 A CN 201510642903A CN 105185764 B CN105185764 B CN 105185764B
- Authority
- CN
- China
- Prior art keywords
- spring pins
- substructure
- superstructure
- encapsulating structure
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention relates to a kind of Spring pins POP structures and process, the structure includes upper strata encapsulating structure and lower floor's encapsulating structure, and lower floor's encapsulating structure includes substrate（1）And chip（2）, the chip（2）It is mounted on substrate（1）On, the chip（2）Surrounding is provided with Spring pins module（4）, the Spring pins module（4）Including superstructure（4a）And substructure（4b）Two parts, the substructure（4b）Top offers at least twice gap along longitudinal direction（4c）, the Spring pins module（4）Upper surface is exposed to plastic packaging material（6）Surface, the upper strata encapsulating structure is stacked and is arranged on lower floor's encapsulating structure.A kind of Spring pins POP structures of the present invention and process, it can expose connection pin, simplify technological process, improve production efficiency, save cost without laser drilling or reduction process after encapsulating.
Description
Technical field
The present invention relates to a kind of Spring pins POP structures and process, belong to technical field of semiconductor encapsulation.
Background technology
With the development of microelectric technique, integrated circuit interconnection density is improved constantly.Two dimension interconnection is increasingly becoming limitation half
The bottleneck that conductor chip performance is improved, microelectronics Packaging is increasingly prone to 3D encapsulation.Chip-stacked is that raising Electronic Packaging is highly dense
One of main path of change, as encapsulating highly dense integrated major way, POP at present（Stacked package）More and more weighed
Depending on.Stacked package is a kind of integrated antenna package technology, in vertical direction to the ball bar of discrete logical sum storage
Array（BGA）Encapsulation is combined, and two or more encapsulation are connected, that is, stacked.
Traditional POP encapsulating structures have two kinds：One kind is that ball is planted in the side of substrate four front, and technique is planted by substrate front side
Ball, encapsulating and then progress laser drilling exposed front surface tin ball（As shown in Figure 1）.POP schemes after improvement are electroplated on substrate
Pin is exposed by reduction process after conducting metal pillar, plastic packaging（As shown in Figure 2）.There is following lack in traditional POP encapsulating structures
Point：
1st, tradition POP encapsulating structures are required for progress laser drilling or reduction process that mutual connection pin up and down is exposed plastic packaging
Material, process costs are high；
2nd, tradition POP structure tops can not be mounted directly the plugging type package structures such as common SOP.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of Spring pins POP structures and work for above-mentioned prior art
Process, it can expose connection pin, simplify technological process, improve without laser drilling or reduction process after encapsulating
Production efficiency, has saved cost.
The present invention the used technical scheme that solves the above problems is：A kind of Spring pins POP structures, it is sealed including upper strata
Assembling structure and lower floor's encapsulating structure, lower floor's encapsulating structure include substrate and chip, and the chip is by mounting solder ball in base
On plate, the chip circumference is provided with Spring pins module, chip and Spring pins the modular peripheral bag by conductive material
Envelope has plastic packaging material, and the Spring pins module includes superstructure and substructure two parts, and the substructure is that two ends are wide
Offer at least twice gap along longitudinal direction at the top of middle narrow dolioform and hollow column, the substructure, it is described on
Portion's structure is solid column structure or open-topped open column shape body structure, and the superstructure is put in substructure
Portion, the superstructure realizes electrical interconnection with substructure by the design of gap, and the Spring pins module upper table is showed
For plastic packaging material surface, the upper strata encapsulating structure is arranged on lower floor's encapsulating structure by Spring pins module stack.
Described gap etc. point substructure side wall, the gap depth is no more than a half height of substructure.
The largest outer diameter scope of the superstructure is between the minimum interior diameter of substructure and maximum inner diameter.
The conductive material uses conducting resinl or tin cream.
When the superstructure of Spring pins module uses solid column structure, the upper strata encapsulating structure is common
Flat pin, L-type pin, J-type pin, the encapsulating structure of ball grid array type pin, now the upper strata encapsulating structure by SMT print solder pastes or
Soldered ball and lower floor's encapsulating structure interconnection；
When the superstructure of Spring pins module uses open-topped open column shape body structure, the upper strata encapsulation knot
Structure is common SOP, PGA, wire inserting slot or the modular structure with stitch, and the upper strata encapsulating structure is plugged in lower floor's encapsulation
In structure.
Multiple tracks annular convex rib is provided with the outer wall of the superstructure.
A kind of process of Spring pins POP structures, the described method comprises the following steps：
Step 1: in the enterprising luggage piece operation of substrate；
Step 2: Spring pins module is adhered on substrate by conductive materials such as conducting resinls or tin cream, the elasticity
Leaded molded elemental height is higher than plastic package die thickness；
Step 3: Spring pins module carries out baking fixation after installing；
Step 4: carrying out encapsulating operation forms elastic leaded molded upper surface and modeling in lower floor's encapsulating structure, packaging operation
Upper mould contact is sealed, Spring pins module upper surface after plastic packaging is exposed to plastic packaging material surface formation pin；
Upper strata encapsulating structure is installed Step 5: being stacked on lower floor's encapsulating structure.
Compared with prior art, the advantage of the invention is that：
1st, using connector of the Spring pins as Rotating fields up and down, without laser drilling or reduction process, work is simplified
Skill flow, improves production efficiency, has saved cost；
2nd, common SOP can be installed using the Spring pins of upper opening structure（Small outline packages）、PGA（Contact pin net
Lattice array package）, wire inserting slot or the module with stitch.
Brief description of the drawings
Fig. 1 is a kind of traditional structural representation of embodiment of POP encapsulating structures；
Fig. 2 is the structural representation of traditional another embodiment of POP encapsulating structures；
Fig. 3 is the leaded molded a kind of structural representation of embodiment of elasticity in a kind of Spring pins POP structures of the invention；
Fig. 4 shows for the structure before the leaded molded another embodiment encapsulating of elasticity in a kind of Spring pins POP structures of the invention
It is intended to；
Fig. 5 is elastic leaded molded superstructure schematic diagram in Fig. 3, Fig. 4.
Fig. 6, Fig. 7 are elastic two kinds of leaded molded substructure schematic diagrames in Fig. 3, Fig. 4；
Fig. 8 ~ Figure 11 is a kind of process flow diagram of Spring pins POP structures of the invention；
Figure 12 is a kind of a kind of structural representation of embodiment of Spring pins POP structures of the invention；
Figure 13 is a kind of structural representation of another embodiment of Spring pins POP structures of the invention.
Wherein：
Substrate 1
Chip 2
Soldered ball 3
Spring pins module 4
Superstructure 4a
Substructure 4b
Gap 4c
Conductive material 5
Plastic packaging material 6.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing embodiment.
Referring to Fig. 4, Figure 12 and Figure 13, a kind of Spring pins POP structures in the present embodiment, it includes upper strata encapsulating structure
With lower floor's encapsulating structure, lower floor's encapsulating structure includes substrate 1 and chip 2, and the chip 2 is mounted on substrate 1 by soldered ball 3
On, Spring pins module 4, the chip 2 and the periphery of Spring pins module 4 are provided with by conductive material 5 around the chip 2
Plastic packaging material 6 is encapsulated with, the Spring pins module 4 includes superstructure 4a and substructure 4b two parts, the substructure
4b is to offer at least twice along longitudinal direction at the top of the narrow dolioform and hollow column in the wide centre in two ends, the substructure 4b
Gap 4c, the superstructure 4a are solid column structures or open-topped open column shape body structure, the top knot
Structure 4a is put in inside substructure 4b, and the superstructure 4a and substructure 4b is realized electrically mutual by gap 4c design
Connection, the upper surface of Spring pins module 4 is exposed to the surface of plastic packaging material 6, and the upper strata encapsulating structure passes through Spring pins module 4
Stacking is arranged on lower floor's encapsulating structure.
Described gap 4c etc. points of substructure 4b sides walls, half of the gap 4c depth no more than substructure 4b is high
Degree.
The maximum gauge scope of the superstructure 4a is between the minimum interior diameters of substructure 4b and maximum inner diameter.
The conductive material 5 can be using conducting resinl or tin cream etc..
Before encapsulating, Spring pins module 4 is as shown in Figure 3；After encapsulating, Spring pins module 4 is as shown in Figure 4；Mould in encapsulating
Tool is pushed down at the top of the superstructure 4a of Spring pins module 4, the superstructure 4a of Spring pins module 4 by mold pressure,
The design for being further advanced by substructure 4b gap 4c is put in inside substructure 4b, ties the top of Spring pins module 4
It is able to ensure that at the top of structure 4a on a horizontal plane；Interaction between superstructure 4a and substructure 4b due to power closely connects
Touch, realize electrically interconnection；Further superstructure 4a is due to the narrow dolioform design in the wide centre in substructure 4b two ends and slits
Mouth 4c design, can finely tune superstructure 4a longitudinal locus, enable superstructure 4a top and mold
Completely attach to, it is to avoid plastic packaging material spills over superstructure 4a top during encapsulating, superstructure 4a top is exposed plastic packaging
Body surface face, it is to avoid the shift error of generation of Spring pins structural top position excessive causes POP encapsulating structures electrically reliable
The problem of property is not good.
When the superstructure 4a of Spring pins module 4 uses solid column structure, the upper strata encapsulating structure is
Common flat pin, L-type pin, J-type pin, the encapsulating structure of ball grid array type pin, now upper strata encapsulating structure by SMT print solder pastes or
Soldered ball exposes with lower floor's encapsulating structure to be interconnected at the top of the superstructure 4a of the Spring pins module 4 on plastic-sealed body surface；
When the superstructure 4a of Spring pins module 4 uses open-topped open column shape body structure, the upper strata envelope
Assembling structure is common SOP, PGA, wire inserting slot or the modular structure with stitch, and now the upper strata encapsulating structure is plugged in described
Inside the superstructure 4a of lower floor's encapsulating structure Spring pins module 4.
A kind of process of Spring pins POP structures, the described method comprises the following steps：
Step 1: referring to Fig. 8, in the enterprising luggage piece operation of substrate；
Step 2: referring to Fig. 9, Spring pins module is adhered on substrate by conductive materials such as conducting resinls or tin cream,
The Spring pins module elemental height is higher than plastic package die thickness；
Step 3: Spring pins module carries out baking fixation after installing；
Step 4: carrying out encapsulating operation forms elastic leaded molded upper surface and modeling in lower floor's encapsulating structure, packaging operation
Upper mould contact is sealed, Spring pins module upper surface after plastic packaging is exposed to plastic packaging material surface formation pin；
Upper strata plastic package structure is installed Step 5: being stacked on lower floor's plastic package structure.
In addition to the implementation, present invention additionally comprises there is other embodiment, such as chip is just first-class loaded on substrate, all to adopt
The technical scheme formed with equivalent transformation or equivalent replacement mode, all should fall into the claims in the present invention protection domain it
It is interior.
Claims (6)
1. a kind of Spring pins POP structures, it is characterised in that：It include upper strata encapsulating structure and lower floor's encapsulating structure, it is described under
Layer encapsulating structure includes substrate（1）And chip（2）, the chip（2）Pass through soldered ball（3）It is mounted on substrate（1）On, the chip
（2）Surrounding passes through conductive material（5）It is provided with Spring pins module（4）, the chip（2）With Spring pins module（4）Periphery
It is encapsulated with plastic packaging material（6）, the Spring pins module（4）Including superstructure（4a）And substructure（4b）Two parts, it is described
Substructure（4b）For the narrow dolioform and hollow column in the wide centre in two ends, the substructure（4b）Opened along longitudinal direction at top
Provided with least twice gap（4c）, the superstructure（4a）It is solid column structure or open-topped open column shape body
Structure, the superstructure（4a）Put in substructure（4b）Inside, the superstructure（4a）With substructure（4b）Pass through
Gap（4c）Design realize electrical interconnection, the Spring pins module（4）Upper surface is exposed to plastic packaging material（6）Surface, it is described
Upper strata encapsulating structure passes through Spring pins module（4）Stacking is arranged on lower floor's encapsulating structure.
2. a kind of Spring pins POP structures according to claim 1, it is characterised in that：The gap（4c）Decile bottom
Structure（4b）Side wall, the gap（4c）Depth is no more than substructure（4b）A half height.
3. a kind of Spring pins POP structures according to claim 1, it is characterised in that：The superstructure（4a）Most
Big overall diameter scope is in substructure（4b）Between minimum interior diameter and maximum inner diameter.
4. a kind of Spring pins POP structures according to claim 1, it is characterised in that：The conductive material（5）Using leading
Electric glue or tin cream.
5. a kind of Spring pins POP structures according to claim 1, it is characterised in that：The superstructure（4a）It is outer
Multiple tracks annular convex rib is provided with wall.
6. a kind of process of Spring pins POP structures, it is characterised in that the described method comprises the following steps：
Step 1: in the enterprising luggage piece operation of substrate；
Step 2: Spring pins module is adhered on substrate by conductive materials such as conducting resinls or tin cream, the Spring pins
Module elemental height is higher than plastic package die thickness；
The Spring pins module includes superstructure and substructure two parts, and the substructure is that the wide centre in two ends is narrow
At least twice gap is offered along longitudinal direction at the top of dolioform and hollow column, the substructure, the superstructure is
Solid column structure or open-topped open column shape body structure, the superstructure is put in inside substructure, described
Superstructure realizes electrical interconnection with substructure by the design of gap；
Step 3: Spring pins module carries out baking fixation after installing；
Step 4: carrying out encapsulating operation forms elastic leaded molded upper surface and plastic sealed mould in lower floor's encapsulating structure, packaging operation
Mould is contacted on tool, Spring pins module upper surface after plastic packaging is exposed to plastic packaging material surface formation pin；
Upper strata encapsulating structure is installed Step 5: being stacked on lower floor's encapsulating structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510642903.4A CN105185764B (en) | 2015-10-08 | 2015-10-08 | Spring pins POP structures and process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510642903.4A CN105185764B (en) | 2015-10-08 | 2015-10-08 | Spring pins POP structures and process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105185764A CN105185764A (en) | 2015-12-23 |
| CN105185764B true CN105185764B (en) | 2017-09-12 |
Family
ID=54907753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510642903.4A Active CN105185764B (en) | 2015-10-08 | 2015-10-08 | Spring pins POP structures and process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105185764B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007188945A (en) * | 2006-01-11 | 2007-07-26 | Toshiba Corp | Semiconductor device and electronic component module using same |
| JP4517124B2 (en) * | 2005-01-21 | 2010-08-04 | 株式会社アドバンストシステムズジャパン | Stacked semiconductor device |
| CN102468190A (en) * | 2010-11-12 | 2012-05-23 | 三星半导体(中国)研究开发有限公司 | Packaging mould and semiconductor packaging process using same |
| US8274144B2 (en) * | 2010-08-31 | 2012-09-25 | Samsung Electronics Co., Ltd. | Helical springs electrical connecting a plurality of packages |
| JP5266699B2 (en) * | 2007-09-25 | 2013-08-21 | 日本電気株式会社 | Contact support and mounting structure of semiconductor device |
| CN103441078A (en) * | 2013-08-06 | 2013-12-11 | 江苏长电科技股份有限公司 | Three-dimensional system-level chip normal installation stacking packaging structure formed by sealing first and then corroding and technique method |
| CN103972191A (en) * | 2013-01-31 | 2014-08-06 | 台湾积体电路制造股份有限公司 | Die package with Openings Surrounding End-portions of Through Package Vias (TPVs) and Package on Package (PoP) Using the Die Package |
| CN205016519U (en) * | 2015-10-08 | 2016-02-03 | 江苏长电科技股份有限公司 | Solid column elasticity pin POP structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100075204A (en) * | 2008-12-24 | 2010-07-02 | 삼성전자주식회사 | Stacked semiconductor package, semiconductor package module and manufacturing method thereof |
| KR20100104373A (en) * | 2009-03-17 | 2010-09-29 | 삼성전자주식회사 | Stack type semiconductor package apparatus |
-
2015
- 2015-10-08 CN CN201510642903.4A patent/CN105185764B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4517124B2 (en) * | 2005-01-21 | 2010-08-04 | 株式会社アドバンストシステムズジャパン | Stacked semiconductor device |
| JP2007188945A (en) * | 2006-01-11 | 2007-07-26 | Toshiba Corp | Semiconductor device and electronic component module using same |
| JP5266699B2 (en) * | 2007-09-25 | 2013-08-21 | 日本電気株式会社 | Contact support and mounting structure of semiconductor device |
| US8274144B2 (en) * | 2010-08-31 | 2012-09-25 | Samsung Electronics Co., Ltd. | Helical springs electrical connecting a plurality of packages |
| CN102468190A (en) * | 2010-11-12 | 2012-05-23 | 三星半导体(中国)研究开发有限公司 | Packaging mould and semiconductor packaging process using same |
| CN103972191A (en) * | 2013-01-31 | 2014-08-06 | 台湾积体电路制造股份有限公司 | Die package with Openings Surrounding End-portions of Through Package Vias (TPVs) and Package on Package (PoP) Using the Die Package |
| CN103441078A (en) * | 2013-08-06 | 2013-12-11 | 江苏长电科技股份有限公司 | Three-dimensional system-level chip normal installation stacking packaging structure formed by sealing first and then corroding and technique method |
| CN205016519U (en) * | 2015-10-08 | 2016-02-03 | 江苏长电科技股份有限公司 | Solid column elasticity pin POP structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105185764A (en) | 2015-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101958261B (en) | Semiconductor process and stackable semiconductor device packages | |
| CN102842557B (en) | A kind of encapsulation structure and manufacture method thereof | |
| CN104505382A (en) | Wafer-level fan-out PoP encapsulation structure and making method thereof | |
| CN206179848U (en) | PoP stacked package structure | |
| CN107768363A (en) | Stackable molded package and its manufacture method | |
| CN202025746U (en) | High integrated level SiP structure | |
| CN105957854B (en) | Semiconductor package assembly and a manufacturing method thereof | |
| CN201655787U (en) | Semiconductor encapsulation structure | |
| CN105185764B (en) | Spring pins POP structures and process | |
| CN102222660B (en) | Double-lead-frame multi-chip common package body and manufacturing method thereof | |
| CN205016519U (en) | Solid column elasticity pin POP structure | |
| CN203055893U (en) | Re-wiring thermal enhanced FCQFN packaging device | |
| CN206584961U (en) | A kind of LED support, LED support array, LED component and LED display | |
| CN205016522U (en) | Hollow column elasticity pin POP structure | |
| CN107742625A (en) | A kind of vertical surface mount package structure of element and its process | |
| CN108807325A (en) | A kind of novel chip-packaging structure and preparation method thereof | |
| CN205881899U (en) | Multichannel stacked package structure | |
| CN205376518U (en) | PoP stacked package structure | |
| CN205621701U (en) | Plane array does not have pin CSP packaging part | |
| CN203085511U (en) | Re-wiring multi-chip AAQFN packaging device | |
| CN205984937U (en) | Hold diode that increases chip | |
| CN204927279U (en) | No pin CSP stacked package spare with two circles weld bump | |
| CN102738016A (en) | Framework carrier pore opening based AAQFN product secondary plastic packaging manufacturing technology | |
| CN203553131U (en) | Flat integrated circuit packaging structure with lead in appearance | |
| CN102738018A (en) | Framework carrier pore opening and solder ball film sticking based AAQFN (quad flat no-lead) product secondary plastic packaging manufacturing technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |