CN105172042A - Mold for battery case of notebook computer - Google Patents
Mold for battery case of notebook computer Download PDFInfo
- Publication number
- CN105172042A CN105172042A CN201510489491.5A CN201510489491A CN105172042A CN 105172042 A CN105172042 A CN 105172042A CN 201510489491 A CN201510489491 A CN 201510489491A CN 105172042 A CN105172042 A CN 105172042A
- Authority
- CN
- China
- Prior art keywords
- template
- mold
- notebook computer
- battery case
- die plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2642—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention relates to a mold for a battery case of a notebook computer. The mold comprises a positioning base, positioning rods, an upper mold pressing plate, a lower mold pressing plate, a demolding ejector pin, an upper mold body, a lower mold body and a cooling device. The number of the positioning rods is four. The tail ends of the positioning rods are perpendicularly connected with the upper surface of the positioning base. The top ends of the positioning rods are perpendicularly connected with the lower mold pressing plate. The upper mold pressing plate is located over the lower mold pressing plate. The upper mold body and the lower mold body are located between the upper mold pressing plate and the lower mold pressing plate. The upper mold body and the lower mold body are connected through bolts. The tail end of the demolding ejector pin is hinged to the positioning base. The front end of the demolding ejector pin is embedded in the lower mold body. The cooling device comprises a semiconductor refrigeration device, a ventilator fan, a heat dissipation circulating pipe and a heat dissipation fan. According to the mold for the battery case of the notebook computer, on one hand, the working position of the mold can be flexibly adjusted according to work requirements; on the other hand, a cooling mechanism can be forcibly balanced through a demolding ejector pin mechanism; in this way, efficient cooling and demolding can be effectively conducted on a product subjected to injection molding, the utilization rate of the mold is greatly increased, and the production efficiency of the product is greatly improved.
Description
Technical field
The present invention relates to a kind of battery case mould, is exactly a kind of mould of battery case of notebook computer.
Background technology
Current notebook computer has purposes very widely, use two is very huge, therefore the battery use amount as notebook important motivity source is also very huge, in order to protect battery and improve notebook overall aesthetics, it is current in cells in notebook computer is processed, all need at battery outer cladding one deck battery privacy protection shell, because this shell mostly is plastic products, therefore when producing this housing, injection molding mode is mainly utilized to produce, and current be used for carrying out mould that Notebook Battery housing injection molding produces its structurally and although serviceability can meet the needs of current production, but in use also find, current Notebook Battery housing mould is when carrying out the demoulding, because of current mould structure reason, easily cause because product length is large on the one hand, the reasons such as thickness is little, when causing stripping operation product easily and mould scratch, higher because of material temperature during product injection molding on the other hand, after completing injection molding operation, die sinking product can be taken out after needing to wait for the long period, thus also result in product easily and mould sticks together and the drawback of production efficiency deficiency, thus had a strong impact on product quality and the production efficiency of cells in notebook computer shell product, therefore for this present situation, in the urgent need to developing a kind of this computer battery of note outer casing mold of invention, with the needs that satisfied reality uses.
Summary of the invention
For the deficiency that prior art exists, the invention provides the cold granulation improved device of a newborn compound feed for piglets, this invention structure is simple, flexible and convenient to use, die operation position can be adjusted flexibly on the one hand according to need of work, place is adaptable, possess demoulding thimble mechanism forces balanced cooling mechanism simultaneously on the other hand, thus effectively can carry out temperature with high efficiency and the demoulding to the product after injection molding, thus while guaranteeing constant product quality, separately greatly improve the production efficiency of mold use rate and product.
To achieve these goals, the present invention realizes by the following technical solutions:
A kind of mould of battery case of notebook computer, comprises positioning base, backstay, top die plate, press down template, demoulding thimble, mold, bed die and heat sink, backstay at least four, its end is connected with positioning base upper surface is vertical, top with press down that template is vertical to be connected, top die plate is positioned at and presses down directly over template and distribution parallel with pressing down template, top die plate, press down between template and be bolted, mold and bed die are positioned at top die plate, press down between template, and mold is connected with top die plate lower surface, bed die with press down template upper surface and be connected, mold and bed die are bolted and form airtight cavity, demoulding thimble end and positioning base hinged, front end is embedded in bed die, and is slidably connected with bed die base plate, and heat sink comprises semiconductor cooling device, ventilation blower fan, heat radiation circulation pipe and cooling fan, wherein refrigerating plant is arranged on positioning base, and is communicated with heat radiation circulation pipe, and heat radiation circulation pipe is separately embedded in top die plate, press down template and mold, in the contact surface of bed die, and heat radiation circulation pipe and top die plate, press down template surface concordant, ventilation assembling on positioning base, and is communicated with heat radiation circulation pipe, and cooling fan at least two, is arranged on top die plate upper surface respectively and presses down template lower surface, and top die plate, the cooling fan pressed down in template is all symmetrical.
Further, shop bolt and positioning electromagnet is separately established bottom described location-plate.
Further, described backstay is at least two-stage Telescopic rod structure.
Further, gasket seal is separately established in described demoulding thimble front end, and by gasket seal and bed die contacted inner surfaces.
Further, described top die plate, uniform unloading hole in template is pressed down.
Further, described unloading hole is regular hexagon, and axis and horizontal plane.
Structure of the present invention is simple, flexible and convenient to use, die operation position can be adjusted flexibly on the one hand according to need of work, place is adaptable, possess demoulding thimble mechanism forces balanced cooling mechanism simultaneously on the other hand, thus effectively can carry out temperature with high efficiency and the demoulding to the product after injection molding, thus while guaranteeing constant product quality, separately greatly improve the production efficiency of mold use rate and product.
Accompanying drawing explanation
The present invention is described in detail below in conjunction with the drawings and specific embodiments;
Fig. 1 is structural representation of the present invention.
Detailed description of the invention
The technological means realized for making the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with detailed description of the invention, setting forth the present invention further.
A kind of mould of battery case of notebook computer as described in Figure 1, comprise positioning base 1, backstay 2, top die plate 3, press down template 4, demoulding thimble 5, mold 6, bed die 7 and heat sink, backstay 2 at least four, its end is connected with positioning base 1 upper surface is vertical, top with press down that template 4 is vertical to be connected, top die plate 3 is positioned at and presses down directly over template 4 and distribution parallel with pressing down template 4, top die plate 3, press down between template 4 and be bolted, mold 6 and bed die 7 are positioned at top die plate 3, press down between template 4, and mold 6 is connected with top die plate 3 lower surface, bed die 7 with press down template 4 upper surface and be connected, mold 6 and bed die 7 are bolted and form airtight cavity, demoulding thimble 5 end and positioning base 1 hinged, front end is embedded in bed die 7, and be slidably connected with bed die 7 base plate, heat sink comprises semiconductor cooling device 8, ventilation blower fan 9, heat radiation circulation pipe 10 and cooling fan 11, wherein refrigerating plant 8 is arranged on positioning base 1, and be communicated with heat radiation circulation pipe 10, heat radiation circulation pipe 10 is separately embedded in top die plate 3, press down template 4 and mold 6, in the contact surface of bed die 7, and heat radiation circulation pipe 10 and top die plate 3, press down template 4 surface concordant, ventilation blower fan 9 is arranged on positioning base 1, and be communicated with heat radiation circulation pipe 10, cooling fan 11 at least two, be arranged on top die plate 3 upper surface respectively and press down template 4 lower surface, and top die plate 3, the cooling fan 11 pressed down in template 4 is all symmetrical.
In the present embodiment, bottom described location-plate 1, separately establish shop bolt 12 and positioning electromagnet 13.
In the present embodiment, described backstay 2 is at least two-stage Telescopic rod structure.
In the present embodiment, gasket seal 14 is separately established in described demoulding thimble 5 front end, and by gasket seal 14 and bed die 7 contacted inner surfaces.
In the present embodiment, described top die plate, press down uniform unloading hole 15 in template.
In the present embodiment, described unloading hole 15 is in regular hexagon, and axis and horizontal plane.
Structure of the present invention is simple, flexible and convenient to use, die operation position can be adjusted flexibly on the one hand according to need of work, place is adaptable, possess demoulding thimble mechanism forces balanced cooling mechanism simultaneously on the other hand, thus effectively can carry out temperature with high efficiency and the demoulding to the product after injection molding, thus while guaranteeing constant product quality, separately greatly improve the production efficiency of mold use rate and product.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (6)
1. a mould of battery case of notebook computer, it is characterized in that: described mould of battery case of notebook computer comprises positioning base, backstay, top die plate, press down template, demoulding thimble, mold, bed die and heat sink, described backstay at least four, its end is connected with positioning base upper surface is vertical, top with press down that template is vertical to be connected, described top die plate is positioned at and presses down directly over template and distribution parallel with pressing down template, described top die plate, press down between template and be bolted, described mold and bed die are positioned at top die plate, press down between template, and mold is connected with top die plate lower surface, bed die with press down template upper surface and be connected, described mold and bed die are bolted and form airtight cavity, demoulding thimble end and positioning base hinged, front end is embedded in bed die, and be slidably connected with bed die base plate, described heat sink comprises semiconductor cooling device, ventilation blower fan, heat radiation circulation pipe and cooling fan, wherein said refrigerating plant is arranged on positioning base, and be communicated with heat radiation circulation pipe, described heat radiation circulation pipe is separately embedded in top die plate, press down template and mold, in the contact surface of bed die, and heat radiation circulation pipe and top die plate, press down template surface concordant, described ventilation assembling is on positioning base, and be communicated with heat radiation circulation pipe, described cooling fan at least two, be arranged on top die plate upper surface respectively and press down template lower surface, and top die plate, the cooling fan pressed down in template is all symmetrical.
2. a kind of mould of battery case of notebook computer according to claim 1, is characterized in that, separately establishes shop bolt and positioning electromagnet bottom described location-plate.
3. a kind of mould of battery case of notebook computer according to claim 1, is characterized in that, described backstay is at least two-stage Telescopic rod structure.
4. a kind of mould of battery case of notebook computer according to claim 1, is characterized in that, gasket seal is separately established in described demoulding thimble front end, and by gasket seal and bed die contacted inner surfaces.
5. a kind of mould of battery case of notebook computer according to claim 1, is characterized in that, described top die plate, presses down uniform unloading hole in template.
6. a kind of mould of battery case of notebook computer according to claim 5, is characterized in that, described unloading hole is regular hexagon, and axis and horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510489491.5A CN105172042A (en) | 2015-08-11 | 2015-08-11 | Mold for battery case of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510489491.5A CN105172042A (en) | 2015-08-11 | 2015-08-11 | Mold for battery case of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105172042A true CN105172042A (en) | 2015-12-23 |
Family
ID=54894700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510489491.5A Pending CN105172042A (en) | 2015-08-11 | 2015-08-11 | Mold for battery case of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105172042A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106239809A (en) * | 2016-08-31 | 2016-12-21 | 滁州市精英家电设备有限公司 | End mould |
| CN106313488A (en) * | 2016-08-31 | 2017-01-11 | 滁州市精英家电设备有限公司 | Vacuum forming mold for inner container of refrigerator |
| CN109530619A (en) * | 2019-01-23 | 2019-03-29 | 陈孝 | A kind of Metallic Casting Die & Mold |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63182119A (en) * | 1987-01-23 | 1988-07-27 | Matsushita Electric Ind Co Ltd | Resin molding mold |
| JPH10109319A (en) * | 1996-10-04 | 1998-04-28 | Sanyo Electric Co Ltd | Injection mold of hollow molded product and molding thereof |
| CN1778538A (en) * | 2004-11-26 | 2006-05-31 | 日立工业设备系统株式会社 | Molding method and mold |
| CN202498702U (en) * | 2012-03-15 | 2012-10-24 | 中山市朗华模具注塑有限公司 | Injection mold ejection mechanism |
| CN103341557A (en) * | 2013-06-28 | 2013-10-09 | 苏州唐氏机械制造有限公司 | Intelligent temperature-control pressurization stamping die |
| CN104149291A (en) * | 2014-08-29 | 2014-11-19 | 苏州正豪塑胶电子有限公司 | Bottom injection mould |
-
2015
- 2015-08-11 CN CN201510489491.5A patent/CN105172042A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63182119A (en) * | 1987-01-23 | 1988-07-27 | Matsushita Electric Ind Co Ltd | Resin molding mold |
| JPH10109319A (en) * | 1996-10-04 | 1998-04-28 | Sanyo Electric Co Ltd | Injection mold of hollow molded product and molding thereof |
| CN1778538A (en) * | 2004-11-26 | 2006-05-31 | 日立工业设备系统株式会社 | Molding method and mold |
| CN202498702U (en) * | 2012-03-15 | 2012-10-24 | 中山市朗华模具注塑有限公司 | Injection mold ejection mechanism |
| CN103341557A (en) * | 2013-06-28 | 2013-10-09 | 苏州唐氏机械制造有限公司 | Intelligent temperature-control pressurization stamping die |
| CN104149291A (en) * | 2014-08-29 | 2014-11-19 | 苏州正豪塑胶电子有限公司 | Bottom injection mould |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106239809A (en) * | 2016-08-31 | 2016-12-21 | 滁州市精英家电设备有限公司 | End mould |
| CN106313488A (en) * | 2016-08-31 | 2017-01-11 | 滁州市精英家电设备有限公司 | Vacuum forming mold for inner container of refrigerator |
| CN109530619A (en) * | 2019-01-23 | 2019-03-29 | 陈孝 | A kind of Metallic Casting Die & Mold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151223 |