CN105161446A - Semiconductor MGP plastic packaging die full-automatic high-efficient material discharging apparatus - Google Patents
Semiconductor MGP plastic packaging die full-automatic high-efficient material discharging apparatus Download PDFInfo
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- CN105161446A CN105161446A CN201510677610.XA CN201510677610A CN105161446A CN 105161446 A CN105161446 A CN 105161446A CN 201510677610 A CN201510677610 A CN 201510677610A CN 105161446 A CN105161446 A CN 105161446A
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- 239000000463 material Substances 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000007599 discharging Methods 0.000 title abstract description 9
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 238000003860 storage Methods 0.000 claims abstract description 11
- 235000012970 cakes Nutrition 0.000 claims description 38
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 210000004279 Orbit Anatomy 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000012535 impurity Substances 0.000 abstract description 2
- 230000002708 enhancing Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 235000021050 feed intake Nutrition 0.000 description 1
- 239000006052 feed supplement Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000630 rising Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
The invention discloses a semiconductor MGP plastic packaging die full-automatic high-efficient material discharging apparatus comprising a cabinet. A worktable is disposed on the top of the cabinet. A storage push module is arranged in the cabinet. A discharging mechanical arm and a fixing clamp are arranged on the worktable. The discharging mechanical arm may move transversely or longitudinally along the worktable. A workpiece is fixedly arranged on the fixing clamp. The storage push module pushes a material to the discharging mechanical arm and then the discharging mechanical arm automatically moves to a position over the workpiece in order to discharge the material at an assigned position. The semiconductor MGP plastic packaging die full-automatic high-efficient material discharging apparatus increases an automation degree, decreases the labor intensity of workers, protects the body health of the workers, improves production efficiency and production capacity, prevents impurities from entering the products because of manual operation, improves production environment, and enhances product quality, detects whether materials are discharged, and timely gives an prompt and automatically supplements the materials when the materials are insufficiently discharged.
Description
Technical field
The present invention relates to automatic discharging apparatus field, be specifically related to a kind of semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment.
Background technology
The rising of semiconductor industry boom promotes the progress of domestic Electronic Encapsulating Technology, the semiconductor manufacturing industry of China just slowly enters the stage of ripeness, the fiery appearance of very-high speed computer, digitlization audiovisual, mobile communication and portable electronic machine, the progress of direct drive electronic chip package technology, the intellectuality of manufacturing is more and more higher.But the automaticity of semiconductor integrated circuit plastic packaging is still not high, larger by labor workload, labor strength is large, and efficiency is low, and cost of labor is high, runs in the opposite direction with industry 4.0.Especially the MGP plastic sealed mould (multi-cylinder injection mould) of paster encapsulation, according to the difference of product category, the material cake quantity of each mould time does not have 2 to 40 not etc.
Operationally, adopt manual completely feeding intake often, operate so very inconvenient, there will be during operation inaccurate, the time consumption of feeding intake large, affect product quality, easily lack blowing simultaneously, affect operating efficiency, the rate of finished products that envelope directly reduces product once few blowing causes product to lack.
Summary of the invention
For the problems referred to above, the present invention aims to provide a kind of compact conformation, space availability ratio is high and the semiconductor MGP plastic sealed mould full automatic high efficiency that efficiency is high discharge material cake equipment.
For realizing this technical purpose, the solution of the present invention is: a kind of semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment, comprise cabinet, workbench is provided with above described cabinet, storage pushing module is provided with in described cabinet, described workbench is provided with and throws in manipulator and stationary fixture, described input manipulator along workbench transverse direction or can vertically move, described stationary fixture is fixedly installed workpiece, after material cake pushes to and throws in manipulator by described storage pushing module, described input manipulator automatically moves to above workpiece and throws in material cake at assigned address.
As preferably, described storage pushing module comprises vibrations hopper, picks pipe, push channel, charging ram, cylinder, track, material cake is placed with in described vibrations hopper, be connected with below described vibrations hopper and pick pipe, described pipe side of picking is provided with push channel, described cylinder can be pushed into picking pipe level and is connected with push channel, is provided with charging ram below described push channel, and described charging ram is arranged in orbit.
As preferably, the mechanical hand of described input comprises putting module, horizontal driver module and zigzag tread patterns module, on the table, described horizontal drive module setting is in zigzag tread patterns module, and described putting module is arranged on zigzag tread patterns block for described zigzag tread patterns module installation.
As preferably, described putting module front end is provided with the feed bin for depositing material cake, and described feed bin is hollow cylindrical structure.
As preferably, be provided with bottom described putting module for detecting the detecting sensor of whether throwing in material cake.
As preferably, described push channel is the hollow cylindrical structure of four guide rods compositions, and described guide rod is high rigidity chromium plating polished rod.
As preferably, described input manipulator is the hermetically sealed high-accuracy screw mandrel module of diaxon.
Beneficial effect of the present invention, improves automaticity, reduces employee's production intensity, protects employee healthy, improve production efficiency and production capacity, avoid the impurity brought because of manual operation in product simultaneously and be mixed into, improve production environment; Improve product quality, due to automatic-discharging materials device, can detect with or without discharge material, if can remind in time and automatically supplement during few discharge.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the front view of this practicality.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further details.
As Fig. 1, shown in 2, specific embodiment of the present invention is a kind of semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment, comprise cabinet 1, workbench 2 is provided with above described cabinet 1, be provided with in described cabinet 1 and store pushing module 3, described workbench 2 is provided with and throws in manipulator 4 and stationary fixture 5, described input manipulator 4 along workbench 2 transverse direction or can vertically move, described stationary fixture 5 is fixedly installed workpiece, after material cake pushes to and throws in manipulator 4 by described storage pushing module 3, described input manipulator 4 automatically moves to above workpiece and throws in material cake at assigned address.
Described storage pushing module 3 comprises vibrations hopper 31, picks pipe 32, push channel 33, charging ram 34, cylinder 35, track 36, material cake is placed with in described vibrations hopper 31, be connected with below described vibrations hopper 31 and pick pipe 32, described pipe 32 side of picking is provided with push channel 33, described cylinder 35 can be pushed into picking pipe 32 level and is connected with push channel 33, be provided with charging ram 34 below described push channel 33, described charging ram 34 is arranged on track 36.The material-uploading style of material cake is built-in, and namely power adopts special vibrations hopper, and enter after picking pipe and material cake is sequenced team one by one on request, cylinder will be picked pipe level and be pushed into below push channel, and push rod rises and material cake is pushed into push channel.Charging ram adopts circular bar design, and increases anti-error function below push rod, not only can ensure in material cake lifting process quick, steadily.And under material cake abnormal conditions, can judge in time and process.Throw in manipulator once can deposit 1-15 material cake, can when system standby automatic material stock.When system needs discharge, within the extremely short time, material cake can be put.Described storage pushing module is placed in below workbench, and under making material cake leaving workbench in, design effectively can save operating space, and stores pushing module in use procedure and throw between manipulator and also can not clash; Throw in manipulator again to feed intake in process and automatically carry out material cake preparation by shaking hopper simultaneously, after having thrown in, feed supplement can be carried out by pushing away passage at once, can effectively increase work efficiency.
Described input manipulator 4 comprises putting module 41, horizontal driver module 42 and zigzag tread patterns module 43, described zigzag tread patterns module 43 is arranged on workbench 2, described horizontal driver module 42 is arranged in zigzag tread patterns module 43, and described putting module 41 is arranged on zigzag tread patterns block 43.Throw in manipulator and will expect that cake is thrown in relevant position by the mobile of portraitlandscape.
Described putting module 41 front end is provided with the feed bin 44 for depositing material cake, and described feed bin 44 is the hollow cylindrical structure of four guide rod compositions.Described push channel 33 is hollow cylindrical structure, and described guide rod 37 is high rigidity chromium plating polished rod.Be provided with bottom described putting module 41 for detecting the detecting sensor 45 of whether throwing in material cake.Owing to avoiding dust adhesion on detecting sensor camera lens.So increase aeration cleaning lens function in sensor lens side.
Described input manipulator 4 is the hermetically sealed high-accuracy screw mandrel module of diaxon.Throw in the high speed of locating when manipulator not only can ensure discharge to stablize, the noise produced in high-speed cruising can also be reduced.And the useful life more than one times of module can be extended.
The above; be only preferred embodiment of the present invention; not in order to limit the present invention, every above embodiment is done according to technical spirit of the present invention any trickle amendment, equivalently replace and improve, within the protection range that all should be included in technical solution of the present invention.
Claims (7)
1. semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment, comprise cabinet, workbench is provided with above described cabinet, it is characterized in that: in described cabinet, be provided with storage pushing module, described workbench is provided with and throws in manipulator and stationary fixture, described input manipulator along workbench transverse direction or can vertically move, described stationary fixture is fixedly installed workpiece, after material cake pushes to and throws in manipulator by described storage pushing module, described input manipulator automatically moves to above workpiece and throws in material cake at assigned address.
2. semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment according to claim 1, it is characterized in that: described storage pushing module comprises vibrations hopper, picks pipe, push channel, charging ram, cylinder, track, material cake is placed with in described vibrations hopper, be connected with below described vibrations hopper and pick pipe, described pipe side of picking is provided with push channel, described cylinder can be pushed into picking pipe level and is connected with push channel, be provided with charging ram below described push channel, described charging ram is arranged in orbit.
3. semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment according to claim 2, it is characterized in that: the mechanical hand of described input comprises putting module, horizontal driver module and zigzag tread patterns module, described zigzag tread patterns module installation on the table, described horizontal drive module setting is in zigzag tread patterns module, and described putting module is arranged on zigzag tread patterns block.
4. semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment according to claim 2, is characterized in that: described putting module front end is provided with the feed bin for depositing material cake, and described feed bin is hollow cylindrical structure.
5. semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment according to claim 2, is characterized in that: be provided with bottom described putting module for detecting the detecting sensor of whether throwing in material cake.
6. semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment according to claim 2, is characterized in that: described push channel is the hollow cylindrical structure of four guide rod compositions, and described guide rod is high rigidity chromium plating polished rod.
7. semiconductor MGP plastic sealed mould full automatic high efficiency discharge material cake equipment according to claim 2, is characterized in that: described input manipulator is the hermetically sealed high-accuracy screw mandrel module of diaxon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510677610.XA CN105161446B (en) | 2015-10-16 | 2015-10-16 | Semiconductor MGP plastic sealed moulds full automatic high efficiency discharge material cake equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510677610.XA CN105161446B (en) | 2015-10-16 | 2015-10-16 | Semiconductor MGP plastic sealed moulds full automatic high efficiency discharge material cake equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105161446A true CN105161446A (en) | 2015-12-16 |
| CN105161446B CN105161446B (en) | 2018-06-08 |
Family
ID=54802263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510677610.XA Active CN105161446B (en) | 2015-10-16 | 2015-10-16 | Semiconductor MGP plastic sealed moulds full automatic high efficiency discharge material cake equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105161446B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970336A (en) * | 2018-09-27 | 2020-04-07 | 湖南嘉业达电子有限公司 | Piezoelectric ceramic substrate processing device for piezoelectric element |
| CN111650893A (en) * | 2020-04-01 | 2020-09-11 | 安徽大华半导体科技有限公司 | Automatic core sheet material cake feeding control method and system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201655772U (en) * | 2010-02-09 | 2010-11-24 | 东莞朗诚模具有限公司 | Full-automatic substrate arranging machine |
| CN102358449A (en) * | 2011-06-21 | 2012-02-22 | 中国电子科技集团公司第二研究所 | Full-automatic silicon wafer loader |
| US20130330479A1 (en) * | 2011-08-30 | 2013-12-12 | Panasonic Corporation | Liquid-application device and liquid-application method |
| CN205194662U (en) * | 2015-10-16 | 2016-04-27 | 深圳市华龙精密模具有限公司 | Full -automatic high -efficient material cake equipment that discharges of semiconductor MGP plastic envelope mould |
-
2015
- 2015-10-16 CN CN201510677610.XA patent/CN105161446B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201655772U (en) * | 2010-02-09 | 2010-11-24 | 东莞朗诚模具有限公司 | Full-automatic substrate arranging machine |
| CN102358449A (en) * | 2011-06-21 | 2012-02-22 | 中国电子科技集团公司第二研究所 | Full-automatic silicon wafer loader |
| US20130330479A1 (en) * | 2011-08-30 | 2013-12-12 | Panasonic Corporation | Liquid-application device and liquid-application method |
| CN205194662U (en) * | 2015-10-16 | 2016-04-27 | 深圳市华龙精密模具有限公司 | Full -automatic high -efficient material cake equipment that discharges of semiconductor MGP plastic envelope mould |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970336A (en) * | 2018-09-27 | 2020-04-07 | 湖南嘉业达电子有限公司 | Piezoelectric ceramic substrate processing device for piezoelectric element |
| CN110970336B (en) * | 2018-09-27 | 2022-05-03 | 湖南嘉业达电子有限公司 | Piezoelectric ceramic substrate processing device for piezoelectric element |
| CN111650893A (en) * | 2020-04-01 | 2020-09-11 | 安徽大华半导体科技有限公司 | Automatic core sheet material cake feeding control method and system |
| CN111650893B (en) * | 2020-04-01 | 2021-10-26 | 安徽大华半导体科技有限公司 | Automatic core sheet material cake feeding control method and system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105161446B (en) | 2018-06-08 |
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