CN105157388A - Chip conveying and drying device of chip assembling machine - Google Patents
Chip conveying and drying device of chip assembling machine Download PDFInfo
- Publication number
- CN105157388A CN105157388A CN201510653361.0A CN201510653361A CN105157388A CN 105157388 A CN105157388 A CN 105157388A CN 201510653361 A CN201510653361 A CN 201510653361A CN 105157388 A CN105157388 A CN 105157388A
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- chip
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- heater
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Abstract
The invention discloses a chip conveying and drying device of a chip assembling machine. The chip conveying and drying device of the chip assembling machine comprises a chip conveying device and a chip drying device. A conveying belt of the chip conveying device is arranged on an upper plate of a fixing support of the chip drying device in a sleeved mode. The chip conveying device further comprises a flat-belt wheel, a conveying connection shaft, a conveying bearing, a bearing support, a supporting base plate, a coupling, a conveying motor, a conveying motor mounting plate, synchronizers and transmission assemblies. The two ends of the conveying belt are arranged on the flat-belt wheel in a sleeved mode, and the flat-belt wheel is arranged on the conveying connection shaft. The left-side conveying is connected with a motor shaft of the conveying motor through the coupling. The two synchronizers are arranged below the right side of the conveying belt, and the two ends of the lower plane of the conveying belt are provided with the transmission assemblies. By means of the mode, workers can be replaced for drying chips, labor is saved, the production cost is lowered, and waste of resources is avoided.
Description
Technical field
The present invention relates to field of machinery automation, the chip particularly relating to the installation of a kind of chipset transmits drying unit.
Background technology
Along with the development of semiconductor technology, the chip that more and more can realize difference in functionality is used to the such as electronic goods such as mobile phone and computer, make the life of people more and more convenient, except the people's livelihood, outside Military Electronics industry, energy aspect such as solar energy industry and Lighting Industry all have sizable association with semiconductor, the chip that semiconductor technology is produced can be used in above-mentioned field widely, the qualification rate of chip directly determines the quality of end product, chip can be subject to different External Force Actings in an assembling process, easily make the die stress place of concentrating produce slight crack and even cause chip rupture, in view of this, be necessary that the chip of installing to existing chipset transmits drying unit and improved.
Summary of the invention
The chip that the technical problem that the present invention mainly solves is to provide the installation of a kind of chipset transmits drying unit, can substitute workman and carry out drying and processing to chip, saves labour, reduces production cost, avoids the wasting of resources.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the chip providing a kind of chipset to install transmits drying unit, the chip of this chipset installation transmits drying unit and comprises chip transfer apparatus and chip drying unit, the feed belt of described chip transfer apparatus is set in the support bracket fastened upper plate of chip drying unit, described chip transfer apparatus also comprises flat-belt pulley, transmit connecting axle, transmission bearing, the support of bearing, support backing plate, shaft coupling, transmit motor, transmit motor mounting plate, synchronized and transmission component, described feed belt two ends are set on flat-belt pulley, flat-belt pulley is installed on and transmits on connecting axle, transmit connecting axle two ends and transmission bearing is installed, transmission bearing is plugged in the support of bearing, the support of bearing is fixed on and supports plane on backing plate, left side is transmitted connecting axle and is connected to the motor shaft transmitting motor by shaft coupling, transmitting motor is installed on transmission motor mounting plate, transmit motor mounting plate and be connected to support backing plate by connecting plate, on Right side support backing plate, plane is fixed with two synchronizeds, synchronized is positioned at the below of feed belt, feed belt lower plane two ends are provided with transmission component, the driving drum of transmission component is close to feed belt,
Preferably, described transmission component also comprises power transmission shaft, drive bush and drive axle support, and described power transmission shaft is plugged in driving drum, and power transmission shaft two ends cover has drive bush, and drive bush is plugged in drive axle support, and drive axle support is fixed on and supports on backing plate;
Preferably, described chip drying unit also comprises guard shield, heater, heater installing plate, heating sheet-pile, heating plate, heater fixed head, thermal insulation board, thermocouple and thermocouple seat, described fixed support is installed in guard shield, support bracket fastened upper plate is fixedly connected with post with lower plate by the six roots of sensation and is connected, two pieces of heaters are fixed on heater installing plate lower plane, heater installing plate lower plane is provided with six roots of sensation heating sheet-pile, heating sheet-pile is all fixed on heating plate, heating sheet-pile four side and top are equipped with heater installing plate, heater installing plate lateral surface is equipped with heater fixed head, thermal insulation board is provided with between heater installing plate and heater fixed head, heating plate lower end is provided with two thermocouples, thermocouple is all through heater installing plate and heater fixed head, the installation of TC is on thermocouple seat, thermocouple seat is fixed on support bracket fastened lower plate.
The invention has the beneficial effects as follows: the chip of a kind of chipset installation of the present invention transmits drying unit, can substitute workman and carry out drying and processing to chip, save labour, reduce production cost, avoid the wasting of resources.
Accompanying drawing explanation
Fig. 1 is the structural representation of the chip transmission drying unit of chipset of the present invention installation;
Fig. 2 is the part-structure schematic diagram of the chip transmission drying unit of chipset of the present invention installation;
Fig. 3 is the structural representation of the chip transfer apparatus of the chip transmission drying unit of chipset of the present invention installation.
Detailed description of the invention
Below in conjunction with accompanying drawing, present pre-ferred embodiments is described in detail, to make the advantage of invention and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Refer to Fig. 1 to Fig. 3, the embodiment of the present invention comprises:
A kind of chip of chipset installation transmits drying unit, the chip of this chipset installation transmits drying unit and comprises chip transfer apparatus 821 and chip drying unit 822, the feed belt 8211 of described chip transfer apparatus 821 is set in the upper plate of the fixed support 8221 of chip drying unit 822, described chip transfer apparatus also comprises flat-belt pulley 8212, transmit connecting axle 8213, transmission bearing 8214, the support of bearing 8215, support backing plate 8216, shaft coupling 8217, transmit motor 8218, transmit motor mounting plate 8219, synchronized 82110 and transmission component 82111, described feed belt 8211 two ends are set on flat-belt pulley 8212, flat-belt pulley 8212 is installed on and transmits on connecting axle 8213, transmit connecting axle 8213 two ends and transmission bearing 8214 is installed, transmission bearing 8214 is plugged in the support of bearing 8215, the support of bearing 8215 is fixed on and supports plane on backing plate 8216, left side is transmitted connecting axle 8213 and is connected to the motor shaft transmitting motor 8218 by shaft coupling 8217, transmitting motor 8218 is installed on transmission motor mounting plate 8219, transmit motor mounting plate 8219 and be connected to support backing plate 8216 by connecting plate, on Right side support backing plate 8216, plane is fixed with two synchronizeds 82110, synchronized 82110 is positioned at the below of feed belt 8211, feed belt 8211 lower plane two ends are provided with transmission component 82111, the driving drum 821111 of transmission component 82111 is close to feed belt 8211,
Described transmission component 82111 also comprises power transmission shaft 821112, drive bush 821113 and drive axle support 821114, described power transmission shaft 821112 is plugged in driving drum 821111, power transmission shaft 821112 two ends cover has drive bush 821113, drive bush 821113 is plugged in drive axle support 821114, and drive axle support 821114 is fixed on and supports on backing plate 8216;
Described chip drying unit 822 also comprises guard shield 8222, heater 8223, heater installing plate 8224, heating sheet-pile 8225, heating plate 8226, heater fixed head 8227, thermal insulation board 8228, thermocouple 8229 and thermocouple seat 82210, described fixed support 8221 is installed in guard shield 8222, the upper plate of fixed support 8221 is fixedly connected with post with lower plate by the six roots of sensation and is connected, two pieces of heaters 8223 are fixed on heater installing plate 8224 lower plane, heater installing plate 8224 lower plane is provided with six roots of sensation heating sheet-pile 8225, heating sheet-pile 8225 is all fixed on heating plate 8226, heating sheet-pile 8,225 four side and top are equipped with heater installing plate 8224, heater installing plate 8224 lateral surface is equipped with heater fixed head 8227, thermal insulation board 8228 is provided with between heater installing plate 8224 and heater fixed head 8227, heating plate 8226 lower end is provided with two thermocouples 8229, thermocouple 8229 is all through heater installing plate 8224 and heater fixed head 8227, thermocouple 8229 is installed on thermocouple seat 82210, thermocouple seat 82210 is fixed on the lower plate of fixed support 8221.
The chip of chipset installation of the present invention transmits drying unit, can substitute workman and carry out drying and processing to chip, save labour, reduce production cost, avoid the wasting of resources.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. the chip of a chipset installation transmits drying unit, it is characterized in that: the chip of this chipset installation transmits drying unit and comprises chip transfer apparatus and chip drying unit, the feed belt of described chip transfer apparatus is set in the support bracket fastened upper plate of chip drying unit, described chip transfer apparatus also comprises flat-belt pulley, transmit connecting axle, transmission bearing, the support of bearing, support backing plate, shaft coupling, transmit motor, transmit motor mounting plate, synchronized and transmission component, described feed belt two ends are set on flat-belt pulley, flat-belt pulley is installed on and transmits on connecting axle, transmit connecting axle two ends and transmission bearing is installed, transmission bearing is plugged in the support of bearing, the support of bearing is fixed on and supports plane on backing plate, left side is transmitted connecting axle and is connected to the motor shaft transmitting motor by shaft coupling, transmitting motor is installed on transmission motor mounting plate, transmit motor mounting plate and be connected to support backing plate by connecting plate, on Right side support backing plate, plane is fixed with two synchronizeds, synchronized is positioned at the below of feed belt, feed belt lower plane two ends are provided with transmission component, the driving drum of transmission component is close to feed belt.
2. the chip of chipset installation according to claim 1 transmits drying unit, it is characterized in that: described transmission component also comprises power transmission shaft, drive bush and drive axle support, described power transmission shaft is plugged in driving drum, power transmission shaft two ends cover has drive bush, drive bush is plugged in drive axle support, and drive axle support is fixed on and supports on backing plate.
3. the chip of chipset installation according to claim 1 transmits drying unit, it is characterized in that: described chip drying unit also comprises guard shield, heater, heater installing plate, heating sheet-pile, heating plate, heater fixed head, thermal insulation board, thermocouple and thermocouple seat, described fixed support is installed in guard shield, support bracket fastened upper plate is fixedly connected with post with lower plate by the six roots of sensation and is connected, two pieces of heaters are fixed on heater installing plate lower plane, heater installing plate lower plane is provided with six roots of sensation heating sheet-pile, heating sheet-pile is all fixed on heating plate, heating sheet-pile four side and top are equipped with heater installing plate, heater installing plate lateral surface is equipped with heater fixed head, thermal insulation board is provided with between heater installing plate and heater fixed head, heating plate lower end is provided with two thermocouples, thermocouple is all through heater installing plate and heater fixed head, the installation of TC is on thermocouple seat, thermocouple seat is fixed on support bracket fastened lower plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510653361.0A CN105157388A (en) | 2015-10-12 | 2015-10-12 | Chip conveying and drying device of chip assembling machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510653361.0A CN105157388A (en) | 2015-10-12 | 2015-10-12 | Chip conveying and drying device of chip assembling machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105157388A true CN105157388A (en) | 2015-12-16 |
Family
ID=54798338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510653361.0A Pending CN105157388A (en) | 2015-10-12 | 2015-10-12 | Chip conveying and drying device of chip assembling machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105157388A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111998653A (en) * | 2020-08-18 | 2020-11-27 | 涌明科技(上海)有限公司 | Semiconductor chip dehumidification method |
| CN112556396A (en) * | 2020-11-09 | 2021-03-26 | 彩虹（合肥）液晶玻璃有限公司 | Adjusting device for changing temperature and humidity of cleaning air knife section |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103440A (en) * | 1980-01-21 | 1981-08-18 | Mitsubishi Electric Corp | Apparatus for treating semiconductor substrate |
| US4406944A (en) * | 1981-03-23 | 1983-09-27 | Radiant Technology Corp. | Devices for mounting infrared lamps in furnaces |
| CN202700866U (en) * | 2012-07-26 | 2013-01-30 | 江阴迪林生物电子技术有限公司 | Chip cleaning and drying line |
| CN202828711U (en) * | 2012-08-10 | 2013-03-27 | 北京通尼科技有限公司 | Bidirectional belt conveyor |
| CN103807257A (en) * | 2014-02-25 | 2014-05-21 | 珠海真晟机电设备有限公司 | Automation equipment for assembling and solidifying insulating rubber |
| CN104567309A (en) * | 2014-12-29 | 2015-04-29 | 东莞市骏泰精密机械有限公司 | Soft package lithium battery vacuum baking tunnel furnace device |
| CN205066360U (en) * | 2015-10-12 | 2016-03-02 | 苏州达恩克精密机械有限公司 | Chip conveying drying device of chip mounting machine |
-
2015
- 2015-10-12 CN CN201510653361.0A patent/CN105157388A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103440A (en) * | 1980-01-21 | 1981-08-18 | Mitsubishi Electric Corp | Apparatus for treating semiconductor substrate |
| US4406944A (en) * | 1981-03-23 | 1983-09-27 | Radiant Technology Corp. | Devices for mounting infrared lamps in furnaces |
| CN202700866U (en) * | 2012-07-26 | 2013-01-30 | 江阴迪林生物电子技术有限公司 | Chip cleaning and drying line |
| CN202828711U (en) * | 2012-08-10 | 2013-03-27 | 北京通尼科技有限公司 | Bidirectional belt conveyor |
| CN103807257A (en) * | 2014-02-25 | 2014-05-21 | 珠海真晟机电设备有限公司 | Automation equipment for assembling and solidifying insulating rubber |
| CN104567309A (en) * | 2014-12-29 | 2015-04-29 | 东莞市骏泰精密机械有限公司 | Soft package lithium battery vacuum baking tunnel furnace device |
| CN205066360U (en) * | 2015-10-12 | 2016-03-02 | 苏州达恩克精密机械有限公司 | Chip conveying drying device of chip mounting machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111998653A (en) * | 2020-08-18 | 2020-11-27 | 涌明科技(上海)有限公司 | Semiconductor chip dehumidification method |
| CN112556396A (en) * | 2020-11-09 | 2021-03-26 | 彩虹（合肥）液晶玻璃有限公司 | Adjusting device for changing temperature and humidity of cleaning air knife section |
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Application publication date: 20151216 |