CN105133806A - Water-resistant crack-resistant high bonding wallboard - Google Patents

Water-resistant crack-resistant high bonding wallboard Download PDF

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Publication number
CN105133806A
CN105133806A CN201510434786.2A CN201510434786A CN105133806A CN 105133806 A CN105133806 A CN 105133806A CN 201510434786 A CN201510434786 A CN 201510434786A CN 105133806 A CN105133806 A CN 105133806A
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parts
water
phenol
weight
cracking
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CN201510434786.2A
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CN105133806B (en
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杨金平
卜春华
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ANHUI FUCAI TECHNOLOGY CO.,LTD.
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Anhui Max Technology Co Ltd
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Abstract

The invention discloses a water-resistant crack-resistant high bonding wallboard, comprising a substrate, a bonding layer, a fireproof layer, a waterproof layer, an emulsion layer, and a decorative coating. The bonding layer is made of a phenolic resin glue adhesive. The raw materials of the phenolic resin glue adhesive by weight comprise 32-40 parts of phenol type epoxy resin, 12-16 parts of aliphatic glycidol ether, 5-15 parts of modified phenolic resin, 1-2 parts of curing agent, 0.5-1.5 parts of surface active agent, 1-3 parts of titanate coupling agent, 1.5-2 parts of softener, 5-10 parts of tricresyl phosphate, 3-6 parts of acetic acid vinyl ester, 0.5-2.5 parts of trimethylolethane, 5-10 parts of propylene glycol, 1-3 parts of asbestos powders, 2-6 parts of short-staple, and 15-25 parts of water. The water-resistant crack-resistant high bonding wallboard has excellent cohesiveness, crack resistance, and water resistance, and has excellent mechanical properties.

Description

A kind of water-fast resistance to cracking high bonding wallboard
Technical field
The present invention relates to wallboard technical field, particularly relate to a kind of water-fast resistance to cracking high bonding wallboard.
Background technology
Common decoration wallboard mostly is direct air nail or is directly bonded on metope by gluing, this wallboard is greatly influenced by ambient temperature, between wallboard inner materials, coefficient of thermal expansion between wallboard from metope is different, during variation of ambient temperature, because different expansions and amount of contraction easily cause the distortion of wallboard, cracking, both the perception having affected wallboard again reduces the integral protection effect of wallboard, along with people improve dwelling environment, require also progressively to improve to the adhesive property of wallboard, wherein phenolic resin adhesive is classified as very important cementing agent, due to its bad adhesion in aqueous environments, because which limit its application in wet condition, and then have impact on the overall performance of product.
Summary of the invention
Based on the technical problem that background technology exists, the present invention proposes a kind of water-fast resistance to cracking high bonding wallboard, caking property, resistance to cracking and water resistance are fabulous, excellent in mechanical performance.
The one that the present invention proposes is water-fast resistance to cracking high bonding wallboard, comprise set gradually from the inside to the outside basic unit, tack coat, fireprotection layer, waterproofing course, emulsion layer and decorative coveringn, described tack coat employing phenolic resin adhesive is made;
The raw material of described phenolic resin adhesive comprises by weight: phenol aldehyde type epoxy resin 32-40 part, aliphatic glycidyl ether 12-16 part, phenol-formaldehyde resin modified 5-15 part, curing compound 1-2 part, surfactant 0.5-1.5 part, titanate coupling agent 1-3 part, softening agent 1.5-2 part, tricresyl phosphate 5-10 part, vinyl acetate 3-6 part, trimethylolethane 0.5-2.5 part, propane diols 5-10 part, flake asbestos 1-3 part, short fiber 2-6 part, water 15-25 part.
Preferably, described curing compound is made up of one or more of benzene sulfonyl chloride, paratoluensulfonyl chloride, ethyl-sulfate, mahogany acid, NL curing compound, maleic anhydride and phthalic anhydride.
Preferably, the weight ratio of phenol aldehyde type epoxy resin, aliphatic glycidyl ether and phenol-formaldehyde resin modified is 34-36:13-14:10-12.
Preferably, the weight ratio of tricresyl phosphate, vinyl acetate, titanate coupling agent and curing compound is 6-8:4-5:1.5-2:1.5-1.8.
Preferably, the raw material of described phenolic resin adhesive comprises by weight: phenol aldehyde type epoxy resin 34-36 part, aliphatic glycidyl ether 13-14 part, phenol-formaldehyde resin modified 10-12 part, curing compound 1.5-1.8 part, surfactant 0.6-1 part, titanate coupling agent 1.5-2 part, softening agent 1.6-1.8 part, tricresyl phosphate 6-8 part, vinyl acetate 4-5 part, trimethylolethane 1-1.6 part, propane diols 6-8 part, flake asbestos 2-2.4 part, short fiber 4-5 part, water 20-24 part.
Preferably, described phenol-formaldehyde resin modified adopts following technique to prepare:
By weight 100 portions of pre-gelatinized corn starches are added in 120-140 part water and stir, DEG C 0.004-0.0045 part α-1 is added from room temperature to 50-60,4-glucan-4-glucose hydrolysis enzyme and 0.006-0.008 part isoamylase, add sodium hydrate regulator solution pH value to 6.2-6.8, constant temperature enzymolysis 1-3h, continuing to add sodium hydrate regulator solution pH value is 9-9.5, add 0.002-0.005 part alpha-amylase, be warming up to 65-70 DEG C of constant temperature enzymolysis 10-12h, be cooled to room temperature and obtain the first material;
100 parts of catechols and 110-130 part terpene aldehyde are mixed by weight, adding manganese hydrogen sodium regulating solution pH value is 7.4-8, and by material from room temperature to 85-90 DEG C, insulation reaction 1-3h obtains the second material;
By weight by 100 part of second material and 1-2 part first mixing of materials, adding NaOH regulates material pH value to be 7.2-8, then from room temperature to 90-94, DEG C isothermal reaction is 55-65mPas to material viscosity, is cooled to 50-60 DEG C, obtains phenol-formaldehyde resin modified.
Preferably, in the preparation process of the first material, by weight 100 portions of pre-gelatinized corn starches are added in 130-136 part water and stir, DEG C 0.0042-0.0044 part α-1 is added from room temperature to 54-56, 4-glucan-4-glucose hydrolysis enzyme and 0.007-0.0078 part isoamylase, add sodium hydrate regulator solution pH value to 6.4-6.6, constant temperature enzymolysis 2-2.5h, continuing to add sodium hydrate regulator solution pH value is 9.2-9.4, add 0.003-0.0036 part alpha-amylase, be warming up to 66-68 DEG C of constant temperature enzymolysis 11-11.5h, be cooled to room temperature and obtain the first material.
Preferably, in the preparation process of the second material, by weight 100 parts of catechols and 120-126 part terpene aldehyde are mixed, add manganese hydrogen sodium regulating solution pH value be 7.6-7.8 by material from room temperature to 86-88 DEG C, insulation reaction 1.5-2.5h obtains the second material.
Preferably, in the preparation process of described phenol-formaldehyde resin modified, by weight by 100 part of second material and 1.5-1.8 part first mixing of materials, adding NaOH regulates material pH value to be 7.4-7.6, then from room temperature to 91-92, DEG C isothermal reaction to material viscosity is 60-64mPas, be cooled to 55-58 DEG C, obtain phenol-formaldehyde resin modified.
In the present invention, phenolic resins is formed by phenols and aldehyde condensation polymer, have have good heat-resisting, medium-resistance, but cured glue layer is crisp, the present invention by certain way to phenolic resin modified, not only can strengthen the film forming of phenolic resin adhesive, improve the adhesive power with basic unit, bonding more firm with base material and fireprotection layer, by adopting a certain amount of pre-gelatinized corn starch to phenolic resin modified, goods are adhesive power and adhesive property excellence not only, and bending strength and impact strength are all higher, the gel solidification time of the phenolic resins of modification obviously shortens, significantly can reduce energy consumption, boost productivity.By adopting a certain amount of α-1, 4-glucan-4-glucose hydrolysis enzyme, isoamylase and the pre-gelatinized corn starch of alpha-amylase to remnants carry out enzymolysis, bending strength and the impact of phenolic resin adhesive can be improved, even if in wet environment, adhesive property is also very excellent, and the distortion of wallboard can not be caused because of different expansions and amount of contraction, cracking, phenol-formaldehyde resin modified and phenol aldehyde type epoxy resin in addition, aliphatic glycidyl ether acts synergistically, and add titanate coupling agent, curing compound mating reaction, Mechanical Properties of Products is good, water-fast and adhesive property strengthens further.The present invention has excellent water-fast effect, and the adhesive prepared is put into after water soaks 80h, and weight gain 4.3-7.5wt%, the peel strength of adhesive is 12.6-16.4N/mm.
Detailed description of the invention
Below, by specific embodiment, technical scheme of the present invention is described in detail.
Embodiment 1
A kind of water-fast resistance to cracking high bonding wallboard, comprise set gradually from the inside to the outside basic unit, tack coat, fireprotection layer, waterproofing course, emulsion layer and decorative coveringn, described tack coat employing phenolic resin adhesive is made;
The raw material of described phenolic resin adhesive comprises by weight: phenol aldehyde type epoxy resin 32 parts, aliphatic glycidyl ether 16 parts, phenol-formaldehyde resin modified 5 parts, 2 parts, curing compound, 0.5 part, surfactant, titanate coupling agent 3 parts, softening agent 1.5 parts, tricresyl phosphate 10 parts, vinyl acetate 3 parts, trimethylolethane 2.5 parts, propane diols 5 parts, flake asbestos 3 parts, 2 parts, short fiber, 25 parts, water.
Embodiment 2
A kind of water-fast resistance to cracking high bonding wallboard, comprise set gradually from the inside to the outside basic unit, tack coat, fireprotection layer, waterproofing course, emulsion layer and decorative coveringn, described tack coat employing phenolic resin adhesive is made;
The raw material of described phenolic resin adhesive comprises by weight: phenol aldehyde type epoxy resin 40 parts, aliphatic glycidyl ether 12 parts, phenol-formaldehyde resin modified 15 parts, 1 part, curing compound, 1.5 parts, surfactant, titanate coupling agent 1 part, softening agent 2 parts, tricresyl phosphate 5 parts, vinyl acetate 6 parts, trimethylolethane 0.5 part, propane diols 10 parts, flake asbestos 1 part, 6 parts, short fiber, 15 parts, water.
Embodiment 3
A kind of water-fast resistance to cracking high bonding wallboard, comprise set gradually from the inside to the outside basic unit, tack coat, fireprotection layer, waterproofing course, emulsion layer and decorative coveringn, described tack coat employing phenolic resin adhesive is made;
The raw material of described phenolic resin adhesive comprises by weight: phenol aldehyde type epoxy resin 36 parts, aliphatic glycidyl ether 13 parts, phenol-formaldehyde resin modified 12 parts, 1.5 parts, curing compound, 1 part, surfactant, titanate coupling agent 1.5 parts, softening agent 1.8 parts, tricresyl phosphate 6 parts, vinyl acetate 5 parts, trimethylolethane 1 part, propane diols 8 parts, flake asbestos 2 parts, 5 parts, short fiber, 20 parts, water.
Described curing compound is paratoluensulfonyl chloride.
Described phenol-formaldehyde resin modified adopts following technique to prepare:
By weight 100 portions of pre-gelatinized corn starches are added in 140 parts of water and stir, 0.0045 part of α-1 is added to 50 DEG C from room temperature, 4-glucan-4-glucose hydrolysis enzyme and 0.006 part of isoamylase, add sodium hydrate regulator solution pH value to 6.8, constant temperature enzymolysis 1h, continuing to add sodium hydrate regulator solution pH value is 9.5, adds 0.002 part of alpha-amylase, be warming up to 70 DEG C of constant temperature enzymolysis 10h, be cooled to room temperature and obtain the first material;
100 parts of catechols and 130 parts of terpene aldehydes are mixed by weight, adding manganese hydrogen sodium regulating solution pH value is 7.4, and by material from room temperature to 90 DEG C, insulation reaction 1h obtains the second material;
By weight by 100 part of second material and 2 part of first mixing of materials, add NaOH and regulate material pH value to be 7.2, be then 55mPas from room temperature to 94 DEG C isothermal reaction to material viscosity, be cooled to 60 DEG C, obtain phenol-formaldehyde resin modified.
Embodiment 4
A kind of water-fast resistance to cracking high bonding wallboard, comprise set gradually from the inside to the outside basic unit, tack coat, fireprotection layer, waterproofing course, emulsion layer and decorative coveringn, described tack coat employing phenolic resin adhesive is made;
The raw material of described phenolic resin adhesive comprises by weight: phenol aldehyde type epoxy resin 34 parts, aliphatic glycidyl ether 14 parts, phenol-formaldehyde resin modified 10 parts, 1.8 parts, curing compound, 0.6 part, surfactant, titanate coupling agent 2 parts, softening agent 1.6 parts, tricresyl phosphate 8 parts, vinyl acetate 4 parts, trimethylolethane 1.6 parts, propane diols 6 parts, flake asbestos 2.4 parts, 4 parts, short fiber, 24 parts, water.
Described curing compound is made up of benzene sulfonyl chloride, ethyl-sulfate, mahogany acid.
Described phenol-formaldehyde resin modified adopts following technique to prepare:
By weight 100 portions of pre-gelatinized corn starches are added in 120 parts of water and stir, 0.004 part of α-1 is added to 60 DEG C from room temperature, 4-glucan-4-glucose hydrolysis enzyme and 0.008 part of isoamylase, add sodium hydrate regulator solution pH value to 6.2, constant temperature enzymolysis 3h, continuing to add sodium hydrate regulator solution pH value is 9, adds 0.005 part of alpha-amylase, be warming up to 65 DEG C of constant temperature enzymolysis 12h, be cooled to room temperature and obtain the first material;
100 parts of catechols and 110 parts of terpene aldehydes are mixed by weight, adding manganese hydrogen sodium regulating solution pH value is 8, and by material from room temperature to 85 DEG C, insulation reaction 3h obtains the second material;
By weight by 100 part of second material and 1 part of first mixing of materials, add NaOH and regulate material pH value to be 8, be then 65mPas from room temperature to 90 DEG C isothermal reaction to material viscosity, be cooled to 50 DEG C, obtain phenol-formaldehyde resin modified.
Embodiment 5
A kind of water-fast resistance to cracking high bonding wallboard, comprise set gradually from the inside to the outside basic unit, tack coat, fireprotection layer, waterproofing course, emulsion layer and decorative coveringn, described tack coat employing phenolic resin adhesive is made;
The raw material of described phenolic resin adhesive comprises by weight: phenol aldehyde type epoxy resin 35 parts, aliphatic glycidyl ether 13.4 parts, phenol-formaldehyde resin modified 11 parts, 1.6 parts, curing compound, 0.8 part, surfactant, titanate coupling agent 1.8 parts, softening agent 1.7 parts, tricresyl phosphate 7 parts, vinyl acetate 4.5 parts, trimethylolethane 1.3 parts, propane diols 7 parts, flake asbestos 2.2 parts, 4.5 parts, short fiber, 22 parts, water.
Described curing compound is made up of benzene sulfonyl chloride, paratoluensulfonyl chloride, ethyl-sulfate, mahogany acid, NL curing compound, maleic anhydride and phthalic anhydride.
Described phenol-formaldehyde resin modified adopts following technique to prepare:
By weight 100 portions of pre-gelatinized corn starches are added in 130 parts of water and stir, 0.0042 part of α-1 is added to 55 DEG C from room temperature, 4-glucan-4-glucose hydrolysis enzyme and 0.007 part of isoamylase, add sodium hydrate regulator solution pH value to 6.5, constant temperature enzymolysis 2h, continuing to add sodium hydrate regulator solution pH value is 9.3, adds 0.004 part of alpha-amylase, be warming up to 68 DEG C of constant temperature enzymolysis 11h, be cooled to room temperature and obtain the first material;
100 parts of catechols and 120 parts of terpene aldehydes are mixed by weight, adding manganese hydrogen sodium regulating solution pH value is 7.7, and by material from room temperature to 88 DEG C, insulation reaction 2h obtains the second material;
By weight by 100 part of second material and 1.2 part of first mixing of materials, add NaOH and regulate material pH value to be 7.5, be then 60mPas from room temperature to 92 DEG C isothermal reaction to material viscosity, be cooled to 55 DEG C, obtain phenol-formaldehyde resin modified.
The above; be only the present invention's preferably detailed description of the invention; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to according to technical scheme of the present invention and inventive concept thereof and replace or change, all should be encompassed within protection scope of the present invention.

Claims (9)

1. a water-fast resistance to cracking high bonding wallboard, is characterized in that, comprise set gradually from the inside to the outside basic unit, tack coat, fireprotection layer, waterproofing course, emulsion layer and decorative coveringn, described tack coat adopts phenolic resin adhesive to make;
The raw material of described phenolic resin adhesive comprises by weight: phenol aldehyde type epoxy resin 32-40 part, aliphatic glycidyl ether 12-16 part, phenol-formaldehyde resin modified 5-15 part, curing compound 1-2 part, surfactant 0.5-1.5 part, titanate coupling agent 1-3 part, softening agent 1.5-2 part, tricresyl phosphate 5-10 part, vinyl acetate 3-6 part, trimethylolethane 0.5-2.5 part, propane diols 5-10 part, flake asbestos 1-3 part, short fiber 2-6 part, water 15-25 part.
2. water-fast resistance to cracking high bonding wallboard according to claim 1, it is characterized in that, described curing compound is made up of one or more of benzene sulfonyl chloride, paratoluensulfonyl chloride, ethyl-sulfate, mahogany acid, NL curing compound, maleic anhydride and phthalic anhydride.
3. water-fast resistance to cracking high bonding wallboard according to claim 1 and 2, it is characterized in that, the weight ratio of phenol aldehyde type epoxy resin, aliphatic glycidyl ether and phenol-formaldehyde resin modified is 34-36:13-14:10-12.
4. the water-fast resistance to cracking high bonding wallboard according to any one of claim 1-3, it is characterized in that, the weight ratio of tricresyl phosphate, vinyl acetate, titanate coupling agent and curing compound is 6-8:4-5:1.5-2:1.5-1.8.
5. the water-fast resistance to cracking high bonding wallboard according to any one of claim 1-4, it is characterized in that, the raw material of described phenolic resin adhesive comprises by weight: phenol aldehyde type epoxy resin 34-36 part, aliphatic glycidyl ether 13-14 part, phenol-formaldehyde resin modified 10-12 part, curing compound 1.5-1.8 part, surfactant 0.6-1 part, titanate coupling agent 1.5-2 part, softening agent 1.6-1.8 part, tricresyl phosphate 6-8 part, vinyl acetate 4-5 part, trimethylolethane 1-1.6 part, propane diols 6-8 part, flake asbestos 2-2.4 part, short fiber 4-5 part, water 20-24 part.
6. the water-fast resistance to cracking high bonding wallboard according to any one of claim 1-5, it is characterized in that, described phenol-formaldehyde resin modified adopts following technique to prepare:
By weight 100 portions of pre-gelatinized corn starches are added in 120-140 part water and stir, DEG C 0.004-0.0045 part α-1 is added from room temperature to 50-60,4-glucan-4-glucose hydrolysis enzyme and 0.006-0.008 part isoamylase, add sodium hydrate regulator solution pH value to 6.2-6.8, constant temperature enzymolysis 1-3h, continuing to add sodium hydrate regulator solution pH value is 9-9.5, add 0.002-0.005 part alpha-amylase, be warming up to 65-70 DEG C of constant temperature enzymolysis 10-12h, be cooled to room temperature and obtain the first material;
100 parts of catechols and 110-130 part terpene aldehyde are mixed by weight, adding manganese hydrogen sodium regulating solution pH value is 7.4-8, and by material from room temperature to 85-90 DEG C, insulation reaction 1-3h obtains the second material;
By weight by 100 part of second material and 1-2 part first mixing of materials, adding NaOH regulates material pH value to be 7.2-8, then from room temperature to 90-94, DEG C isothermal reaction is 55-65mPas to material viscosity, is cooled to 50-60 DEG C, obtains phenol-formaldehyde resin modified.
7. water-fast resistance to cracking high bonding wallboard according to claim 6, it is characterized in that, in the preparation process of the first material, by weight 100 portions of pre-gelatinized corn starches are added in 130-136 part water and stir, DEG C 0.0042-0.0044 part α-1 is added from room temperature to 54-56, 4-glucan-4-glucose hydrolysis enzyme and 0.007-0.0078 part isoamylase, add sodium hydrate regulator solution pH value to 6.4-6.6, constant temperature enzymolysis 2-2.5h, continuing to add sodium hydrate regulator solution pH value is 9.2-9.4, add 0.003-0.0036 part alpha-amylase, be warming up to 66-68 DEG C of constant temperature enzymolysis 11-11.5h, be cooled to room temperature and obtain the first material.
8. the water-fast resistance to cracking high bonding wallboard according to claim 6 or 7, it is characterized in that, in the preparation process of the second material, by weight 100 parts of catechols and 120-126 part terpene aldehyde are mixed, add manganese hydrogen sodium regulating solution pH value be 7.6-7.8 by material from room temperature to 86-88 DEG C, insulation reaction 1.5-2.5h obtains the second material.
9. the water-fast resistance to cracking high bonding wallboard according to any one of claim 6-8, it is characterized in that, in the preparation process of described phenol-formaldehyde resin modified, by weight by 100 part of second material and 1.5-1.8 part first mixing of materials, adding NaOH regulates material pH value to be 7.4-7.6, then from room temperature to 91-92, DEG C isothermal reaction is 60-64mPas to material viscosity, is cooled to 55-58 DEG C, obtains phenol-formaldehyde resin modified.
CN201510434786.2A 2015-07-21 2015-07-21 A kind of water-fast resistance to cracking is high to bond wallboard Active CN105133806B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111138152A (en) * 2020-01-03 2020-05-12 肇庆北新建材有限公司 Waterproof gypsum board core, preparation method thereof and waterproof gypsum board

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPS633074A (en) * 1986-06-23 1988-01-08 Fujikura Ltd Adhesive agent
CN103059771A (en) * 2011-10-18 2013-04-24 郑梅 Phenolic resin plywood glue and formula thereof
CN203129489U (en) * 2013-02-28 2013-08-14 山东赛德丽涂料有限公司 Outer wall heat-insulating decorating board
CN103601865A (en) * 2013-11-27 2014-02-26 山东圣泉化工股份有限公司 Starch modified phenolic resin and application thereof
CN104343190A (en) * 2014-10-21 2015-02-11 江苏尼高科技有限公司 Composite energy-saving system with self-heat preservation wall
CN104531026A (en) * 2014-12-25 2015-04-22 东莞翔思电子科技有限公司 Aluminum substrate binder and aluminum substrate using same
CN104559869A (en) * 2015-02-10 2015-04-29 安徽希玛欧美佳装饰材料工业有限公司 High-toughness thermal-resistance adhesive for chemical resistant laminate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS633074A (en) * 1986-06-23 1988-01-08 Fujikura Ltd Adhesive agent
CN103059771A (en) * 2011-10-18 2013-04-24 郑梅 Phenolic resin plywood glue and formula thereof
CN203129489U (en) * 2013-02-28 2013-08-14 山东赛德丽涂料有限公司 Outer wall heat-insulating decorating board
CN103601865A (en) * 2013-11-27 2014-02-26 山东圣泉化工股份有限公司 Starch modified phenolic resin and application thereof
CN104343190A (en) * 2014-10-21 2015-02-11 江苏尼高科技有限公司 Composite energy-saving system with self-heat preservation wall
CN104531026A (en) * 2014-12-25 2015-04-22 东莞翔思电子科技有限公司 Aluminum substrate binder and aluminum substrate using same
CN104559869A (en) * 2015-02-10 2015-04-29 安徽希玛欧美佳装饰材料工业有限公司 High-toughness thermal-resistance adhesive for chemical resistant laminate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111138152A (en) * 2020-01-03 2020-05-12 肇庆北新建材有限公司 Waterproof gypsum board core, preparation method thereof and waterproof gypsum board
CN111138152B (en) * 2020-01-03 2022-02-22 肇庆北新建材有限公司 Waterproof gypsum board core, preparation method thereof and waterproof gypsum board

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