CN105097341A - Key structure and input device - Google Patents

Key structure and input device Download PDF

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Publication number
CN105097341A
CN105097341A CN201510350864.0A CN201510350864A CN105097341A CN 105097341 A CN105097341 A CN 105097341A CN 201510350864 A CN201510350864 A CN 201510350864A CN 105097341 A CN105097341 A CN 105097341A
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China
Prior art keywords
layer
key
key cap
region
cap layer
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CN201510350864.0A
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Chinese (zh)
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CN105097341B (en
Inventor
廖瑞铭
许志和
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苏州达方电子有限公司
达方电子股份有限公司
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Publication of CN105097341A publication Critical patent/CN105097341A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/702Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
    • H01H13/705Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by construction, mounting or arrangement of operating parts, e.g. push-buttons or keys
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/84Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by ergonomic functions, e.g. for miniature keyboards; characterised by operational sensory functions, e.g. sound feedback
    • H01H13/85Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by ergonomic functions, e.g. for miniature keyboards; characterised by operational sensory functions, e.g. sound feedback characterised by tactile feedback features
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2209/00Layers
    • H01H2209/002Materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2215/00Tactile feedback

Abstract

The invention relates to a key structure and an input device. The key structure comprises a key cap layer, a circuit layer, a touch generator, a support structure layer and an adhesion layer, wherein the key cap layer comprises a key cap region and a peripheral region; the peripheral region is adjacent to the key cap region; the circuit layer is arranged below the key cap layer; the touch generator is electrically connected with the circuit layer; the support structure layer is arranged below the circuit layer, and comprises an accommodating space; the touch generator is located in the accommodating space; and the adhesive layer is arranged between the key cap layer and the circuit layer and corresponds to the peripheral region. According to the key structure and the input device provided by the invention, the adhesive layer is only arranged on the part (namely the peripheral region) outside the key cap region, so that the kinetic energy loss when the touch generator vibrates can be effectively reduced. Furthermore, according to the key structure and the input device provided by the invention, the vibration effect can be strengthened, the appearance design can be reinforced, the operation convenience can be improved or the cost can be reduced through the key cap layer with different structure designs and different material choices.

Description

按键结构及输入装置 Key input means and Structure

技术领域 FIELD

[0001] 本发明关于一种按键结构,具体而言,本发明关于一种降低触觉回馈能量耗损的按键结构及具有此按键结构的输入装置。 [0001] The present invention relates to a key structure, in particular, the present invention relates to a key structure tactile feedback to reduce energy dissipation of an input device and this button structure.

背景技术 Background technique

[0002] 随着电子装置的薄型化要求日益增高,适用的按键结构高度显著缩小。 [0002] As electronic devices thinner increasingly higher requirements for the height of the key structure significantly reduced. 因此,习知按压行程较大的机械式按键结构已逐渐为小行程按键或触碰式按键所取代。 Therefore, the pressing stroke of the larger conventional mechanical key structure has been gradually replaced by a small stroke keys or touch buttons. 然而,随着行程的缩小或采用触碰式输入,使用者通常难以感受到按压回馈,导致使用者无法确认按压操作是否完成,造成操作上的困扰。 However, with the stroke reduction or the use of touch-type input, user feedback is often difficult to feel pressed, causing the user can not confirm whether or not the pressing operation is completed, causing distress in operation.

[0003]目前已有以震动器产生震动以提供使用者按压回馈的设计,但此设计通常是在既有的按键结构加设震动器,或是震动器与按键结构的整合具有复杂的电路及支撑设计,不利于薄型化。 [0003] In currently existing vibrators to vibrate to provide the user presses the back design, but this design is typically added vibrators disposed in both key structure, or integrated with the key structures of the vibration having a complicated circuit and support design is not conducive to thin. 再者,行动装置,例如平板电脑或智慧型手机的屏幕键盘,在手指触碰时虽然会提供震动回馈,提示使用者已完成按压操作。 Moreover, mobile devices, such as tablet or smartphone screen keyboard, when the finger touches, although it will provide vibration feedback, prompt the user has completed the pressing operation. 然而,此类提供震动回馈的装置通常是使整个装置一起震动,或是使装置的某个面震动,无法提供独立与局部的回馈,不仅不利于操作确认,于震动时又产生较高的能量耗损。 However, such devices provide vibration feedback is usually the entire device with shock or vibration device to make a face, and can not provide independent local feedback, it is not conducive to confirm the operation, resulting in higher energy shock Shiyou consumption.

[0004] 因此,如何在薄型化同时达到有效的触觉回馈为按键结构设计的主要议题之一。 [0004] Thus, while achieving the thinning of how effective tactile feedback is one of the major issues key structure design.

发明内容 SUMMARY

[0005] 本发明之一目的在于提供一种按键结构及具有此按键结构的输入装置,以于提供独立及局部按压回馈的同时,降低回馈能量的耗损。 [0005] One object of the present invention is to provide a structure and the key input unit having this button structure, and simultaneously to provide independent feedback localized pressing, reducing energy consumption feedback.

[0006] 本发明之一目的在于提供一种按键结构及具有此按键结构的输入装置,其具有依据需求设计的键帽层,以加强震动效果、强化外观设计、提升操作便利或降低成本。 [0006] One object of the present invention is to provide a structure and the key input unit having this button structure having a key cap layer according to the design requirements, to enhance the shock effect, strengthening the design, reduce cost or enhance the convenience of operation.

[0007] 于一实施例,本发明提供一种按键结构,其包含键帽层、电路层、触觉产生器、支撑结构层以及黏着层。 [0007] In one embodiment embodiment, the present invention provides a key structure comprising a key cap layer, a circuit layer, a haptic generator, the support structure layer and the adhesive layer. 键帽层具有键帽区及周边区,周边区邻接键帽区。 Keycap having a key cap layer region and a peripheral, the peripheral region adjacent to the key top area. 电路层设置于键帽层下方。 Circuit layer disposed below the key cap layer. 触觉产生器电连接电路层。 The haptic generator is electrically connected to the circuit layer. 支撑结构层设置于电路层下方,其中支撑结构层具有容置空间,且触觉产生器位于容置空间中。 The support structure layer is disposed below the circuit layer, wherein the layer support structure having a receiving space, and a haptic generator located in the accommodation space. 黏着层设置于键帽层及电路层之间,黏着层仅对应周边区。 Adhesive layer disposed between the key cap layer and the circuit layer, the adhesive layer corresponding to only the peripheral region.

[0008] 于一实施例,键帽层于键帽区的厚度大于周边区的厚度。 [0008] In one embodiment, the key cap layer in a thickness greater than the thickness of the peripheral region keycap region.

[0009] 于一实施例,键帽层于对应键帽区的下表面形成有凹槽,凹槽中填充填充材料,其中填充材料与键帽层的材料不同。 [0009] In one embodiment, the key cap layer is formed on the lower surface of the key top region corresponding to a recess, the recess filled with a filling material, wherein the different material is filled with the material of the key cap layer.

[0010] 于一实施例,键帽层于对应键帽区的下表面形成定位部,且电路层具有定位孔,其中定位部自键帽层的下表面向下突出以定位于定位孔中。 [0010] In an embodiment examples corresponding to the key cap layer on the lower surface of the key top region of the positioning portion, and a circuit layer having a positioning hole, wherein the positioning portion from the lower surface of the key cap layer protruding downwardly to be positioned in the positioning hole.

[0011] 于一实施例,定位部自键帽层的下表面向下突出,定位部与键帽层的下表面形成空间,其中触觉产生器位于该空间中。 [0011] In one embodiment, the positioning portion from the lower surface of the key cap layer protruding downwardly, the lower surface of the positioning portion of the key cap layer is formed a space, wherein the haptic generator located in the space.

[0012] 于一实施例,电路层的硬度大于键帽层的硬度,且电路层的厚度小于键帽层的厚度。 [0012] In one embodiment, the hardness of the circuit layer is greater than the hardness of the key cap layer, and the thickness of the circuit layer is less than the thickness of the key cap layer.

[0013] 于一实施例,电路层由聚对苯二甲酸乙二酯(Polyethylene Terephthalate, PET)构成,且键帽层选自于聚酯(PU)、热塑聚酯(TPU)、皮革、织物的其中之一。 [0013] In one embodiment, the circuit layer is made of polyethylene terephthalate (Polyethylene Terephthalate, PET) configuration, and the key cap layer is selected from polyester (PU), thermoplastic polyesters (TPU), leather, one of the fabric.

[0014] 于一实施例,电路层的厚度为0.05mm至0.5mm,且键帽层的厚度为0.1mm至 [0014] In one embodiment, the thickness of the circuit layer is 0.05mm to 0.5mm, and the thickness of the key cap layer is 0.1mm to

0.2mmο 0.2mmο

[0015] 于一实施例,支撑结构层包含缓冲层及支撑层,其中支撑层具有开口,开口对应于键帽区,缓冲层具有突出部,突出部设置于容置空间的周围,突出部穿设于开口。 [0015] In one embodiment, the support structure comprises a buffer layer and a layer support layer wherein the support layer having an opening, an opening area corresponding to the keycap, the buffer layer has a peripheral projecting portion, the projecting portion is provided in the accommodating space of the projecting portion through disposed in the opening.

[0016] 于一实施例,键帽层的上表面具有区域界定符以界定键帽区。 [0016] In one embodiment, the key cap layer having an upper surface region to define a keycap delimiter area.

[0017] 于另一实施例,本发明提供一种输入装置,其包含复数个如上所述的按键结构,其中复数个按键结构的复数个键帽区藉由周边区连接形成单一键帽层,且黏着层设置于复数键帽区外的周边区。 [0017] In another embodiment embodiment, the present invention provides an input device comprising a plurality of key structure as described above, wherein a plurality of key structures by a plurality of the key top region joined to form a single region surrounding the key cap layer, and the adhesive layer is provided on the outer region of the peripheral region a plurality of keycaps.

[0018] 相较于习知技术,本发明的按键结构及输入装置藉由黏着层仅设置于键帽区外的部分(即周边区),可有效降低触觉产生器发生震动时的动能损耗。 [0018] compared to conventional technology, the input device and the key structure according to the present invention by an adhesive layer is provided only on the portion (i.e., peripheral region) outside the region of the keycap, can effectively reduce the loss of kinetic energy when the vibrotactile generator occurs. 再者,本发明的按键结构及输入装置可藉由不同结构设计、不同材质选择的键帽层,来加强震动效果、强化外观设计、提升操作便利或降低成本。 Furthermore, the structure and the key input device of the present invention may be designed by different structures, different materials selected key cap layer, to enhance the shock effect, strengthening the design, reduce cost or enhance the convenience of operation.

附图说明 BRIEF DESCRIPTION

[0019]图1A为本发明一实施例的按键结构的爆炸图; [0019] FIG. 1A exploded view of the key structure according to an embodiment of the present invention;

[0020] 图1B为本发明一实施例的按键结构的电路层、触觉产生器及缓冲层的配置示意图; [0020] FIG. 1B circuit layer key structure according to an embodiment of the present invention, the generator and the buffer layer configuration diagram of a haptic;

[0021] 图1C为图1A的按键结构的截面示意图; [0021] FIG. 1C is a schematic cross-sectional configuration of the key of Figure 1A;

[0022] 图1D为图1A的按键结构的作动示意图; [0022] FIG. 1D is a schematic view of a configuration of the actuator button of FIG. 1A;

[0023]图2A为本发明另一实施例的按键结构的爆炸图; [0023] FIG 2A present an exploded view of the key structure according to another embodiment of the invention;

[0024] 图2B为本发明另一实施例的按键结构的电路层、触觉产生器、支撑层及缓冲层的配置示意图; Key circuit layer structure according to [0024] another embodiment of the present invention. FIG. 2B, the haptic generator, the support layer and the buffer layer configuration diagram;

[0025] 图2C为图2A的按键结构的截面示意图; [0025] FIG. 2C is a schematic cross-sectional configuration of the key of FIG. 2A;

[0026] 图2D为图2A的按键结构的作动示意图; [0026] FIG 2D is a schematic view of a configuration of the actuator button of FIG. 2A;

[0027] 图3A至图3D为本发明不同实施例的按键结构的示意图; [0027] The schematic structure of a different embodiment of the key of FIGS. 3A to 3D of the present invention;

[0028]图4A及图4B分别为本发明一实施例的输入装置的爆炸图及组合图; [0028] FIGS. 4A and 4B are an exploded view of the input device of the present embodiment in view of an embodiment of the invention and combinations;

[0029] 图5A为图4A的输入装置的键帽层的示意图; [0029] FIG 5A is a schematic diagram of the key cap layer of the input device of FIG. 4A;

[0030] 图5B为图4A的输入装置的电路层的示意图; [0030] FIG 5B is a circuit schematic diagram of the input layer of the device of Figure 4A;

[0031] 图5C为图4A的输入装置的支撑层的示意图; [0031] FIG 5C is a schematic view of the input device of FIG. 4A of the support layer;

[0032] 图为图4A的输入装置的缓冲层的示意图; The buffer layer is a schematic view of the input device [0032] The graph of FIG. 4A;

[0033] 图6为本发明的输入装置的键帽层及黏着层的配置示意图。 And the key cap layer configuration diagram of the adhesive layer of the input device [0033] FIG. 6 of the present invention.

具体实施方式 Detailed ways

[0034] 本发明提供一种按键结构及具有此按键结构的输入装置,尤其是一种具有降低触觉回馈能量耗损的按键结构及具有此按键结构的输入装置。 [0034] The present invention provides a structure and the key input unit having this button structure, in particular a key structure having reduced energy consumption and haptic feedback input device having this button structure. 具体而言,本发明的输入装置可为任何具有按键结构的输入装置,例如独立的键盘装置、整合于电子产品的输入装置(例如行动装置、平板电脑等配备的按键或键盘等),但不以此为限。 Specifically, the input device of the present invention may be any input device having a key structure of a keyboard apparatus such as an independent, integrated electronic input device (e.g. mobile device, tablet, etc. with a key or keyboard, etc.), but not limited thereto. 于后以键盘为例,参考图式详细说明本发明实施例的按键结构及输入装置的细节。 In an example after the keyboard, construction details and embodiments of the key input device of the embodiment of the present invention is described in detail with reference to the drawings.

[0035] 如图1A至图1C所示,于一实施例,本发明的按键结构100具有多层式薄膜结构,其包含键帽层110、电路层120、触觉产生器130、缓冲层150及黏着层180 (见图1C)。 [0035] 1A to 1C, in one embodiment, the key structure 100 of the invention has a multilayer thin-film structure, comprising a key cap layer 110, the circuit layer 120, a haptic generator 130, a buffer layer 150, and adhesive layer 180 (see FIG. 1C). 于此实施例,键帽层110作为使用者按压按键结构100的介面层。 In this embodiment, the key cap layer 110 as the user presses the button 100 of the interface layer structure. 电路层120设置于键帽层110下方,作为提供驱动触觉产生器130的信号传递途径的电路径层及载置触觉产生器130的基板层。 A circuit layer 120 is disposed below the key cap layer 110, a tactile signal generator 130 to provide a drive transmission path layer, the substrate layer is electrically and pathway placement of the haptic generator 130. 触觉产生器130设置于电路层120下方并电连接电路层120,以作为按压后的触觉回馈层。 The haptic generator 130 is provided below the circuit layer 120 and circuit layer 120 is electrically connected to a haptic feedback layer after pressing. 缓冲层150设置于电路层120下方,以作为传导按压力至感应单元160的力传导层及支撑电路层120的支撑结构层。 The buffer layer 150 disposed below the circuit layer 120, as the pressing force to the conductance of the sensing unit 160 of the support structure and the support layer, the conductive layer 120 of the circuit layer. 黏着层180设置于键帽层110及电路层120之间并仅对应周边区114,以黏着键帽层110及电路层120。 Adhesive layer 180 disposed on the key cap layer 110 and the circuit layer 120 and only the peripheral zone 114 corresponds to the key cap layer 110 and the adhesive layer 120 circuitry.

[0036] 本发明的按键结构100更可包含感应单元160、控制电路170 (见图1C)等元件,其中感应单元160设置于缓冲层150下方,且感应单元160被触发时可输出触发信号T。 [0036] The key structure 100 according to the present invention may further comprise a sensing unit 160, a control circuit 170 (see FIG. 1C) and other components, wherein the sensing unit 160 is provided below the buffer layer 150, and the sensing unit 160 may output a trigger signal is the trigger T . 控制电路170耦接于感应单元160与电路层120,且可依据实际应用需求设置于任何合宜的位置。 The control circuit 170 is coupled to the sensing unit 160 and the circuit layer 120, and may be disposed at any convenient position according to the actual application requirements. 控制电路170用以接收感应单元160的触发信号T以产生感应信号及驱动触觉产生器130的驱动信号D。 A drive control circuit 170 to generate a sensing signal and the driving signal generator 130 of the haptic to the trigger signal receiving sensing unit 160 T D. 具体而言,电路层120用以电连接触觉产生器130,并提供驱动触觉产生器130的电路径,使得控制电路170可通过电路层120电连接触觉产生器130。 Specifically, the circuit layer 120 for electrically connecting the haptic generator 130, and a haptic generator supplies a drive electrical path 130, so that control circuit 170 can be connected to a haptic generator 130 by an electrical circuit layer 120. 缓冲层150用以传递按压力,当外界施加按压力时,按压力通过缓冲层150向下传递以触发感应单元160。 The buffer layer 150 for transmitting the pressing force when the pressing force applied from the outside, a buffer layer 150 is passed down to trigger the sensor unit 160 by pressing force. 感应单元160为开关式感应单元,当感应单元160被按压触发时,感应单元160可输出触发信号T,进而使控制电路170产生(I)使用者输入字元或指令的感应信号,及(2)驱动触觉产生器130震动之驱动信号D。 Sensing unit 160 sensing switching means, the sensing unit 160 when the trigger is pressed, the sensing unit 160 may output a trigger signal T, thereby enabling the control circuit 170 generates (I) or a user command input characters of the sensing signal, and (2 ) of the vibration drive signal drives the haptic generator 130 D.

[0037] 再者,本发明于此所述的“触觉产生器”泛指可受驱动信号D驱动而提供触觉回馈(例如震动)的元件。 [0037] Further, according to the present invention herein "haptic generator" refers receiving element driving signal D may provide tactile feedback driver (e.g., vibration) of. 触觉产生器可包含,例如但不限于:压电致动器(piezoelectricactuator)、声圈致动器(voice coil actuator)、震动马达(pager motor)、电磁震动器(solenoid)或其他类型的触觉产生器。 The haptic generator may comprise, for example, but not limited to: a piezoelectric actuator (piezoelectricactuator), a voice coil actuator (voice coil actuator), the vibration of the motor (pager motor), an electromagnetic shaker (Solenoid) or other type of haptic feedback generated device. 压电致动器具有非常薄且小的优点,因此非常适合用于多层式薄膜结构的按键结构。 The piezoelectric actuator has the advantage that very thin and small, so it is suitable for the key structure of the multilayer thin-film structure. 于后,以压电致动器为例,说明本发明的按键结构各元件的细部结构及相互作用。 After, to the piezoelectric actuator to illustrate the detailed structure of the key structure of the present invention, the elements and interaction.

[0038] 具体而言,如图1A至图1C所示,键帽层110覆盖于电路层120上,且键帽层110具有键帽区112及周边区114,其中周边区114邻接于键帽区112的周围。 [0038] Specifically, as shown in FIG. 1A to 1C, the key cap layer 110 covers the circuit layer 120, and the key cap layer 110 having a key cap 112 and a peripheral region 114, wherein the peripheral region 114 adjacent to the keycap peripheral region 112. 键帽区112对应触觉产生器130并作为供使用者按压的区域,且周边区114用于连接下方的电路层120。 Keycap corresponding to the haptic region 112 and the generator 130 as an area for a user presses, and the surrounding region 114 for connecting the circuit layer 120 below. 于此实施例,周边区114环绕键帽区112设置,且键帽区112可具有字符或图案112a,以指示按键结构100所输入的对应指令或字符。 In this embodiment, the peripheral region 114 disposed around the key top region 112, and region 112 may have a keycap characters or patterns 112a, to indicate the corresponding instruction key structure 100 or the input character. 再者,于键帽区112周围可具有区域界定符111,以定义键帽区112的范围,让使用者轻易辨识键帽区112的位置,提高按压的正确性。 Furthermore, in the area around the key top 112 may have a delimiter area 111, to define the scope of the keycap region 112, so that the user easily identify the position of the key top region 112, to improve the accuracy of the pressing. 换言之,区域界定符111设置于键帽区112及周边区114的交界处,以界定出键帽区112及周边区114。 In other words, the delimiter area 111 disposed at the junction of the key top 112 and a peripheral region 114, region 112 to define a keycap 114 and the surrounding region. 于此实施例,区域界定符111可为突起的框形图案,且于框形图案内定义为键帽区112,于框形图案外定义为周边区114。 In this embodiment, region 111 may be a frame delimiter pattern projection, and the key top region 112 is defined as the inner frame-shaped pattern is defined as the region 114 to the outer periphery of the frame-shaped pattern. 当使用者进行盲打时,可藉由键帽区112周围突起的区域界定符111辨识键帽区112的位置,有助于提升输入的速度及正确性。 When the user performs touch typing, the keycap region by region around the protrusion 112 defines locator 111 keycap recognition region 112, help to improve the speed and accuracy of input. 再者,区域界定符111及字符或图案112a可藉由印刷、压印、黏贴、雷射等方式形成于键帽层110之上表面,且区域界定符111及字符或图案112a可具有不同形式,不以实施例所示为限。 Further, the region 111 and the delimiter character or pattern 112a may be by printing, stamping, adhesive, laser, etc. is formed on the surface of the key cap layer 110, and a delimiter area 111 and a character or pattern 112a may have different form, is not limited to the embodiment shown in FIG.

[0039] 键帽层110的厚度较佳为0.1〜2mm,且较佳为软性材质,以增加使用者按压按键结构100的舒适感。 Thickness [0039] of the key cap layer 110 is preferably 0.1~2mm, and preferably is a flexible material, in order to increase the comfort of the user presses the key structure 100. 当使用者按压键帽区112时,软性材质可具有相对较低的硬度以提升按压舒适感,且在按压点的径向上具有较小的能量损失。 When the user presses the key top region 112, a relatively soft material may have a low hardness to enhance the comfort of the pressing, and having a small energy loss in the radial direction of the pressed point. 此外,软性材质因为键帽区112的按压挠曲对于接受触觉回馈亦可提供较佳的效应。 Further, since the soft material is pressed flexure region 112 of the key top for receiving tactile feedback can provide better effects. 当键帽区112的按压挠曲越大时,键帽区112对应按压点的厚度越小,使得将能量传递至使用者(例如手指)的路径越短,有利于减少触觉产生器130发生震动时的动能损耗。 When the keycap larger deflection region 112 is pressed, corresponding to the thickness of the key top region of the pressing point 112 is smaller, so that the energy transfer path to the user (e.g., a finger) is shorter, it helps to reduce the occurrence of vibration haptic generator 130 when the kinetic energy loss. 键帽层110的材料可包含例如聚酯(PU)、热塑聚酯(TPU)、皮革、织物、硅胶等。 Material of the key cap layer 110 may comprise, for example, polyester (PU), thermoplastic polyesters (TPU), leather, fabrics, silica and the like.

[0040] 此外,于一实施例,键帽层110可仅覆盖于电路层120上作为按键结构100的最上层;此时按键结构100可选择性具有将各元件整合的壳体,使得各元件设置于壳体中且裸露出键帽层110供使用者操作。 [0040] Further, in one embodiment, the key cap layer 110 may cover only the circuit layer 120 as the uppermost layer of the key structure 100; in this case the key structure 100 may selectively integrate elements each having a housing, so that the elements disposed in the housing 110 and exposed for the user to operate the key cap layer. 再者,按键结构100可选择性包含基底层(未图示),其中基底层设置于感应单元160下方,以增进按键结构100的整体结构强度。 Further, the key structure 100 may optionally comprise a base layer (not shown), wherein the base layer is provided below the sensing unit 160, to enhance the overall structural strength of the key structure 100. 基底层较佳为相对刚性较大的材质(例如金属板材,硬质塑料或聚合物层),以维持按键结构100的强度而不至于弯折损坏。 The base layer is preferably a relatively stiffer material (e.g. sheet metal, rigid plastic or polymer layer), to maintain the strength of the key structure 100 is bent without becoming damaged. 上述壳体亦可与基底层整合在一起,使得壳体的底部作为基底层。 The housing may also be integrated with the base layer, so that the bottom of the housing as the base layer. 于另一实施例,键帽层110可作为包覆按键结构100的整体元件的包覆层,但不以此为限。 In another embodiment, the key cap layer 110 as a clad layer covering the entire element structure 100 of the key, but not limited thereto.

[0041] 电路层120较佳为相对较硬的材料所构成的薄片形式,以作为载置触觉产生器130的基板。 [0041] The circuit layer 120 is preferably relatively hard material in the form of a sheet composed, as the mounting substrate 130 haptic generator. 电路层120的厚度较佳为0.05〜0.5mm,且电路层120可由绝缘层及设置于绝缘层的导电路径线路所构成,其中绝缘层可由例如聚对苯二甲酸乙二酯(PolyethyleneTerephthalate, PET)所构成。 Thickness of the circuit layer 120 is preferably 0.05~0.5mm, and the circuit layer 120 and the insulating layer may be composed of a conductive path provided on the wiring insulating layer, wherein the insulating layer may be formed, for example, polyethylene terephthalate (PolyethyleneTerephthalate, PET) posed. 换言之,电路层120的硬度大于键帽层110的硬度,且电路层120的厚度较佳小于键帽层110的厚度。 In other words, the hardness of the circuit layer 120 is greater than the hardness of the key cap layer 110, and the thickness of the circuit layer 120 is preferably less than the thickness of the key cap layer 110. 如图1A及图1B所示,电路层120设置于键帽层110下方,其中电路层120的下表面对应键帽区112具有电隔离的至少一第一接点122a及至少一第二接点124a,以供电连接触觉产生器130。 1A and 1B, the circuit layer 120 is disposed below the key cap layer 110, wherein the lower surface of the circuit layer 120 corresponding keycap region 112 having at least one electrically isolating the at least one first contact 122a and second contact 124a, in the haptic generator 130 connected to the power supply. 具体而言,电路层120具有提供驱动信号D传递至触觉产生器130的第一电路径122及第二电路径124,其中第一电路径122及第二电路径124电隔离地设置于电路层120的下表面,且分别包含第一接点122a及第二接点124a。 Specifically, the circuit layer 120 having a drive signal D is transmitted to a first haptic generator 122 and the electrical path 130 of the second electrical path 124, wherein the first and second electrical paths 122 electrically isolates electrical paths 124 provided on the circuit layer the lower surface 120, respectively comprising a first and second contact points 122a and 124a. 亦即,第一电路径122及第二电路径124设置于电路层120背向于键帽层110的一侧(即下侧),以使得触觉产生器130及键帽层110分别设置电路层120的两相对侧。 That is, a first electrical path 122 and a second electrical path 124 to the circuit layer 120 is disposed on a side facing away from the key cap layer 110 (i.e., lower side), the haptic generator 130 so that the key cap layer 110 and the circuit layer are provided opposite sides 120.

[0042] 于此实施例,触觉产生器130由压电材料所构成,且较佳为片状形式,其中压电材料可包含例如压电单晶体、压电多晶体(压电陶瓷)、压电聚合物、或压电复合材料,但不以此为限。 [0042] In this embodiment, the haptic generator 130 composed of a piezoelectric material, and preferably in the form of a sheet, which may comprise a piezoelectric material such as piezoelectric single crystal, polycrystal piezoelectric (piezoelectric ceramic), piezoelectric polymer, or a piezoelectric composite material, but not limited thereto. 触觉产生器130设置于电路层120下方,且电连接第一电路径122的第一接点122a及第二电路径124的第二电接点124a,使得驱动信号D可经由电路径122、124传递,以驱动触觉产生器130产生应变而提供触觉回馈(例如震动)。 The haptic generator 130 is provided below the circuit layer 120, and electrically connected to a first level and a second path 122 of the first contact 122a and a second electrical path 124 contacts 124a, so that the drive signal D may be transmitted via the electrical path 122, to drive a haptic generator 130 generates strain provides tactile feedback (e.g., vibration). 在此需注意,触觉产生器130较佳仅藉由第一接点122a及第二电接点124a实体连接于电路层120,以使得触觉产生器130具有较大震动效应。 It should be noted here, only the preferred haptic generator 130 by a first contact 122a and a second electrical contact 124a is connected to the physical layer circuit 120, the haptic generator 130 so that the vibration having a large effect. 亦即,触觉产生器130可藉由例如银胶、焊锡等电连接材料连接第一接点122a及第二电接点124a,进而达到实体连接电路层120,使得触觉产生器130未连接电路层120的部分具有较大的震动效应。 That is, the haptic generator 130 can be, for example, by silver paste, such as solder electrically connecting material connecting the first contacts 122a and the second electrical contact 124a, thus achieving the physical connection circuit layer 120, such that the haptic generator 130 is not connected to the circuit layer 120 portion having a larger shock effect. 然而,于其他实施例,除了藉由第一接点122a及第二电接点124a外,触觉产生器130可藉由其他黏着方式加强与电路层120的实体连接,以防止触觉产生器130自电路层120脱离但仍保有预期的触觉回馈效应。 However, in other embodiments, except by the first contact 122a and a second electrical contact 124a, the haptic generator 130 can enhance physical circuit connected to the other layer 120 by adhesive manner, to prevent the layer 130 from the haptic generator circuit 120 out of but still retain the desired tactile feedback effects. 再者,触觉产生器130相对于电路层120的震动方向可包含例如上/下蝶式震动或水平伸缩式震动,且振动方式可包含例如连续震动或脉冲式震动,但不以此为限。 Further, the haptic generator 130 with respect to the vibration direction of the circuit layer 120 may comprise, for example, upper / lower horizontal butterfly telescopic shock or vibration, and the vibration mode may comprise, for example, a continuous vibration or shock pulse, but not limited thereto.

[0043] 如图1A至图1C所示,缓冲层150设置于电路层120下方,且缓冲层150具有容置空间150a,其中触觉产生器130位于容置空间150a中。 [0043] 1A to 1C, a buffer layer 150 is disposed below the circuit layer 120 and the buffer layer 150 has an accommodating space 150a, wherein the haptic generator 130 located in the accommodating space 150a. 具体而言,缓冲层150包含膜片部152及突出部154,其中膜片部152具有容置区152a,突出部154设置于容置区152a周围并自膜片部152突起,以定义容置空间150a供容置触觉产生器130。 Specifically, the buffer layer 150 comprises a diaphragm portion 152 and the projecting portion 154, wherein the diaphragm portion 152 has an accommodating region 152a, the protruding portion 154 is provided in the accommodation area from around the diaphragm portion 152a and the projection 152 to define a receiving space 150a for accommodating haptic generator 130. 于此实施例,膜片部152具有通孔以作为容置区152a。 In this embodiment, the diaphragm portion 152 has a through hole to serve as accommodation area 152a. 换言之,突出部154设置于通孔152a周围并自膜片部152上表面朝电路层120突起,以形成容置空间150a,使得突出部154的顶面高于膜片部152的上表面。 In other words, the protruding portion 154 is provided around the through-hole 152a and from the upper surface of the diaphragm portion 152 projecting toward the circuit layer 120, to form an accommodating space 150a, so that the top surface of the projecting portion 154 is higher than the upper surface of the diaphragm portion 152. 在此需注意,于此实施例,虽以通孔作为膜片部152的容置区152a,但不以此为限。 Here it should be noted that, in this embodiment, although the through-hole to a diaphragm portion 152 of accommodating area 152a, but not limited thereto. 于其他实施例,膜片部152的容置区152a可为膜片部152的部分表面区域或凹陷区域。 In other embodiments, the diaphragm portion 152a accommodating area 152 may be a diaphragm portion 152 recessed surface region or regions. 此夕卜,容置区152a较佳对应于键帽区112,且可依据按键实际需求设计,而不限于图1A所示的矩形。 This evening Bu, accommodating area 152a corresponding to the keycap preferred region 112, and the key may be designed according to actual demand, not limited to rectangular as shown in Figure 1A. 于其他实施例(未图示),容置区152a可为圆形、椭圆形或任何合宜形状。 In other embodiments (not shown), accommodating region 152a may be circular, oval, or any suitable shape. 对应于容置区152a的形状,突出部154可仅环绕容置区152a的部分周边或实质环绕容置区152a的所有周边。 Corresponds to the shape of the accommodation area 152a, the protruding portion 154 may surround only a portion of the peripheral region receiving or accommodating substantial 152a all around the peripheral region 152a.

[0044] 于此实施例,突出部154较佳为连续的突出结构,但不以此为限。 [0044] In this embodiment, projecting portion 154 is preferably a continuous projection structure, but is not limited thereto. 于其他实施例,突出部154亦可为不连续的突出结构,即突出部154可由复数个凸柱或凸块沿容置区152a之周围设置所构成。 In other embodiments, the protruding portion 154 may be discontinuous projecting structure, i.e., a plurality of projecting portions 154 may be studs or bumps along the accommodating region 152a disposed around the constituted. 当缓冲层150作为电路层120的支撑结构层时,突出部154的厚度较佳大于触觉产生器130的厚度,且当触觉产生器130于容置空间150a震动时,突出部154的厚度足以提供触觉产生器130适当的震动空间(即触觉产生器130的下方具有足够空间)。 When the buffer layer 150 as a support structure layer 120 of the circuit layer, the thickness of the projecting portion 154 is preferably greater than the thickness of the haptic generator 130, and when the haptic generator 130 in the accommodating space 150a vibration, the thickness of the projecting portion 154 is sufficient to provide the haptic generator 130 suitable vibration space (i.e., below the haptic generator 130 has sufficient space).

[0045] 再者,于一实施例,缓冲层150更具有延伸部156,其中延伸部156自突出部154朝容置空间150a内侧延伸,且延伸部156的顶面低于突出部154的顶面。 [0045] Further, in one embodiment, the buffer layer 150 further has an extension portion 156 which extends from the projecting portion 156 toward portion 154 extending inside the accommodating space 150a, a top surface portion 156 and extends lower than the top of the projecting portion 154 surface. 如图1C所示,当触觉产生器130容置于容置空间150a时,触觉产生器130较佳部分重叠延伸部156。 1C, when the 150a, haptics generator 130 accommodated in the accommodating space of generator 130 preferably extending portion 156 partially overlap. 换言之,延伸部154的顶面较佳高于膜片部152的上表面且低于触觉产生器130的底面,且延伸部154较佳朝容置空间150a内侧延伸至部分触觉产生器130下方。 In other words, the top surface of the extension portion 154 is preferably higher than the upper surface of the diaphragm portion 152 and lower than the bottom surface of the haptic generator 130, and extending portion 154 is preferably toward the inside of the accommodating space 150a extends to a portion below the haptic generator 130. 藉此,缓冲层150向上突起的突出部154于键帽层110下方提供触觉产生器130震动的空间(例如150a),且延伸部156提供触觉产生器130发生震动时的局部支撑,以免触觉产生器130压抵感应单元160。 Accordingly, the projecting portion 150 projecting upwardly on the buffer layer 154 provides a space below the key cap layer 110 (e.g., 150a) of the haptic vibration generator 130, and the extended portion 156 provides local support haptic generator 130 when vibration occurs, in order to avoid generating haptic 130 is pressed against the sensing unit 160.

[0046] 缓冲层150较佳由硬度70A以下的缓冲材,更佳由硬度1A〜60A的缓冲材,藉由雷射或热压模技术所制成。 [0046] Preferably, the buffer layer 150, more preferably, by laser techniques or hot-press cushion material is made of a hardness less than the hardness of 70A 1A~60A the cushion material. 于一实施例,缓冲层150由例如硅胶材料所制成。 In one embodiment, for example, a buffer layer 150 made of silicone material. 亦即,缓冲层150可为软性材料,以免设置于感应单元160上时会因其自身的重量而使感应单元160在键帽层110未被按压的情况下产生误触信号。 That is, the buffer layer 150 may be a soft material, is provided in order to avoid an induction unit 160 due to their own weight sensing unit 160 generates the signal if inadvertently the key cap layer 110 is not pressed. 如上所述,缓冲层150用以传递按压力至其下方的感应单元160,以触发感应单元160输出触发信号T。 As described above, the buffer layer 150 for transmitting the pressing force to the sensing unit 160 below it, in order to trigger the sensing unit 160 outputs a trigger signal T. 于此实施例,按压力可通过两种途径向下传递至感应单元160,例如(I)按压力通过电路层120及突出部154传递,(2)按压力通过电路层120、触觉产生器130及延伸部156传递。 In this embodiment, the pressing force may be transmitted in two ways down to the sensing unit 160, for example, (I) and the pressing force transmitted through the projection 120 of the circuit layer 154, (2) the pressing force by the circuit layer 120, a haptic generator 130 and an extending portion 156 is transmitted.

[0047] 再者,如图1C所示,黏着层180设置于键帽层110下表面且位于键帽区112之外,以黏着键帽层110及电路层120。 [0047] Further, as shown in FIG. 1C, the adhesive layer 180 disposed on the lower surface of the key cap layer 110 and the key cap is located outside the area 112, the key cap layer 110 to the adhesive layer 120 and a circuit. 具体而言,黏着层180仅设置于键帽层110对应于周边区114的下表面。 Specifically, adhesive layer 180 is provided only on the key cap layer 110 corresponding to the lower surface of the peripheral region 114. 换言之,黏着层180并未设置于键帽层110对应于键帽区112的下表面,使得键帽区112及电路层120对应键帽区112的部分不黏着在一起(或有空隙)。 In other words, the adhesive layer 180 disposed on the key cap layer 110 does not correspond to the region of the lower keycap surface 112, such that the keycap 112 and the circuit region 120 corresponds to the key cap layer region portion 112 is not adhesive together (or voids). 藉此,当触觉产生器130受到驱动信号D的驱动而震动时,可避免或降低触觉产生器130接收到驱动信号D发生震动时带动键帽区112的震动,进而减少触觉产生器130发生震动时的动能损耗。 Whereby, when the haptic generator 130 by driving signal D and vibration, can be avoided or reduced tactile vibration generator 130 receives a drive signal to drive D keycap region 112 to vibrate, thereby reducing the occurrence of vibration haptic generator 130 when the kinetic energy loss. 亦即,若电路层120与键帽层110的键帽区112及周边区114全部都黏起来时,触觉产生器130的“负载”加重,不易产生震动,而使得动能损耗加大。 That is, if the key cap layer 120 and the circuit region 110 of the key cap layer 112 and the surrounding region 114 all stick together, haptic generator 130 "load" increase, easy to produce vibrations, so that the kinetic energy losses increase. 于此实施例,黏着层180的厚度较佳小于0.5mm,但不以此为限。 The thickness of this embodiment, the adhesive layer 180 is preferably less than 0.5mm, but not limited thereto. 再者,按键结构100的其余元件(例如电路层120、缓冲层150、感应单元160等)之间亦可藉由黏着方式固定,以定位各元件间的相对位置。 Furthermore, among the remaining elements (e.g., circuit layer 120, a buffer layer 150, the sensing unit 160, etc.) of the key structure 100 may also be secured by adhesive, to locate the relative positions of the elements.

[0048] 如图1D所示,当外界施加按压力F时,按压力F通过缓冲层150向下传递以触发感应单元160,使得感应单元160输出触发信号T到控制电路170。 [0048] FIG. 1D, when the pressing force F applied from the outside, the pressing force F is transmitted via a buffer layer 150 downwardly to trigger the sensing unit 160, so that the sensing unit 160 outputs a trigger signal T to the control circuit 170. 控制电路170接收触发信号T而可输出驱动信号D给触觉产生器130进而驱动触觉产生器130发生震动。 The control circuit 170 receives the trigger signal T and the drive signal D to output a haptic generator 130 in turn drives the haptic generator 130 to vibrate. 亦即,当使用者按压按键结构100时(例如按压于键帽层110的键帽区112时),藉由缓冲层150的结构特性(例如突出部154、延伸部156),按压力通过上述的两种途径向下传递以触发感应单元160发出触发信号T,触发信号T 一方面作为操作按键结构100以输入相应的字元或指令的感应信号,另一方面亦作为产生驱动信号D的指示信号,使得控制电路170接收触发信号T而发出驱动信号D。 That is, when the user presses the key structure 100 (e.g. area 112 when the keycap is pressed against the key cap layer 110), with structural features (e.g., protrusions 154, 156 extending portion) of the buffer layer 150, the pressing force by the above the two ways to trigger the downward transmission unit 160 sensing a trigger signal T, the trigger signal T on the one hand as an operation key 100 to input the detection signal structure corresponding to the characters or instructions, on the other hand also as an indication generates a driving signal D signal, so that control circuit 170 receives the trigger signal T to emit a drive signal D. 当触觉产生器130经由电路层120的电路径(例如第一电路径122及第二电路径124)接收到来自控制电路170的驱动信号D时,触觉产生器130可于容置空间150a中产生震动,以提供使用者确认按压的震动回馈。 The haptic generator 130 receives the drive signal D from the control circuit 170 via an electrical path (e.g., a first electrical path 122 and the second electrical path 124) when the circuit layer 120, the haptic generator 130 may generate in the accommodating space 150a vibration, in order to provide the user presses the confirmation of vibration feedback.

[0049] 此外,上述实施例以缓冲层150同时作为按键结构100的支撑结构层及力传导层,然而于其他实施例,按键结构可具有其他结构作为支撑结构层。 [0049] Further, the above-described embodiment, the buffer layer 150 at the same time as the key structure and the force support structure layer, a conductive layer 100, however, in other embodiments, the key structure may have other structures as a support structure layer. 如图2A至图2D所示,按键结构100'进一步可包含支撑层140,以作为支撑电路层120的支撑结构层。 As shown in FIG. 2A to 2D, the key structure 100 'may further comprise a support layer 140, a support layer, the support structure as the circuit layer 120. 具体而言,支撑层140设置于电路层120及缓冲层150之间,以作为按键结构100的主要支撑结构层,并提供触觉产生器130震动的空间。 Specifically, the support layer 140 is disposed between the circuit layer 120 and the buffer layer 150, as the primary support structure layer key structure 100, and provides a space tactile vibration generator 130. 支撑层140设置于膜片部152上且具有开口140a,使得突出部154穿设于开口140。 The support layer 140 is disposed on the diaphragm 152 and has an opening portion 140a, so that the protruding portion 154 disposed through the opening 140. 亦即,开口140a较佳对应键帽层110的键帽区112且范围涵盖环绕容置区152a的突出部154,而使得支撑层140设置于膜片部152上时,突出部154位于开口140a中(如图2C所示)。 That is, preferred opening 140a corresponding to the key top region 112 of the key cap layer 110 covers and surrounds the protruding portion 152a of the accommodating area 154, such that when the support layer 140 disposed on the diaphragm portion 152, projecting portion 154 located in the opening 140a in (as shown in Figure 2C). 于此实施例,支撑层140的硬度较佳大于缓冲层150的硬度,且支撑层140之厚度系大于触觉产生器130之厚度,以确保触觉产生器130震动的空间。 In this embodiment, the hardness of the support layer 140 is preferably greater than the hardness of the buffer layer 150, and the thickness of the support layer 140 is larger than the thickness of the lines of the haptic generator 130, to ensure spatial tactile vibration generator 130. 换言之,支撑层140的设置可确保使用者按压键帽层110时使触觉产生器130具有足够的震动空间,而不会因为缓冲层150的硬度太低而变形压缩容置空间150a,进而使得触觉产生器130压抵感应单元160而无法发生震动回馈。 In other words, the support layer 140 may be provided to ensure that the haptic generator layer 110 the user presses the key cap 130 has a sufficient vibration space, and not because of the hardness of the buffer layer 150 is too low compression deformation of the accommodating space 150a, thereby making the haptic generator 130 is pressed against the sensor unit 160 and vibration feedback can not occur. 相对地,如图1A所示的实施例,当按压力不会使缓冲层150过度变形压缩容置空间150a时,可选择不设置支撑层140。 In contrast, the embodiment shown in FIG. 1A, when the pressing force does not cause excessive deformation of the buffer layer 150 is compressed when the accommodating space 150a, a support layer 140 may choose not to.

[0050] 具体而言,支撑层140的厚度取决于触觉产生器130的厚度及震动空间的高度。 [0050] Specifically, the thickness of the support layer 140 depends on the height and thickness of the vibration generating haptic space 130. 举例而言,当震动空间的高度大于例如0.8_时,触觉产生器130会具有较佳的震动效果。 For example, when the height of the space is larger than 0.8_ when the vibration, the haptic generator 130 will have better effects such as vibration. 因此,支撑层140的厚度较佳设计为大于触觉产生器130的厚度且在按压时能于触觉产生器130下方保有高度大于0.8mm的震动空间。 Thus, the thickness of the support layer 140 is preferably designed to be larger than a thickness of the haptic generator 130 and can be pressed in at the bottom of the haptic generator 130 to maintain the space height is greater than the vibration of 0.8mm. 于一实施例,支撑层140的开口140a较佳对应键帽区112,亦即开口140a的形状、大小、位置较佳与键帽区112对应,以使得使用者按压于键帽区112时可确保藉由缓冲层150的力传递部分(例如突出部154、延伸部156)传递按压力至感应单元160。 When in an embodiment, the openings 140a corresponding to the preferred region of the support layer 140 of the key cap 112, i.e., the opening 140a of the shape, size, position 112 corresponds with the preferred keycap region, so that the user region 112 may be pressed against the keycap by the buffer layer 150 to ensure that the force transmitting portion (e.g., the protruding portion 154, extension 156) is transmitted to the pressing force sensing unit 160. 再者,感应单元160的感应线路较佳对应于缓冲层150的力传递部分(例如突出部154、延伸部156)设置,以使得按压力仅藉由上述的两种途径传递,而不会通过支撑层140传递,进而降低误触发感应单元160的可能性。 Furthermore, the sensing unit 160 sensing circuit 150 preferably corresponds to a force transmitting portion of the buffer layer (e.g., the protruding portion 154, extension 156) is provided, so that the two ways by the above-described pressing force is transmitted only, and not by transmitting support layer 140, thereby reducing the possibility of false triggering of the sensing unit 160.

[0051] 如图2D所示,当外界施加按压力F时,按压力F通过缓冲层150向下传递以触发感应单元160,使得感应单元160输出触发信号T到控制电路170。 [0051] As shown in Figure 2D, when the pressing force F applied from the outside, the pressing force F is transmitted via a buffer layer 150 downwardly to trigger the sensing unit 160, so that the sensing unit 160 outputs a trigger signal T to the control circuit 170. 控制电路170接收触发信号T而可输出驱动信号D给触觉产生器130进而驱动触觉产生器130发生震动。 The control circuit 170 receives the trigger signal T and the drive signal D to output a haptic generator 130 in turn drives the haptic generator 130 to vibrate. 亦即,当使用者按压按键结构100时(例如按压于键帽层110的键帽区112时),支撑层140在按压力的作用下使触觉产生器130仍有足够的震动空间,且藉由缓冲层150的结构特性(例如突出部154、延伸部156),按压力通过上述的两种途径向下传递以触发感应单元160发出触发信号T,触发信号T 一方面作为操作按键结构100以输入相应的字元或指令的感应信号,另一方面亦作为产生驱动信号D的指示信号,使得控制电路170接收触发信号T而发出驱动信号D。 That is, when the user presses the key structure 100 (such as pressing a key cap layer 110 in the region of the key cap 112), the support layer 140 so that the haptic generator under the action of the pressing force is still sufficient vibration space 130, and by by the structural features (e.g., the protruding portion 154, extension 156) of the buffer layer 150, the pressing force by the above two ways to trigger the sensing units passed down a trigger signal 160. T, the trigger signal T on the one hand as an operation key structure 100 enter the appropriate command character or induced signal, on the other hand also as an indication signal generates a drive signal D, so that control circuit 170 receives the trigger signal T to emit a drive signal D. 当触觉产生器130经由电路层120的电路径(例如第一电路径122及第二电路径124)接收到来自控制电路170的驱动信号D时,触觉产生器130可于容置空间150a中产生震动,以提供使用者确认按压的震动回馈。 The haptic generator 130 receives the drive signal D from the control circuit 170 via an electrical path (e.g., a first electrical path 122 and the second electrical path 124) when the circuit layer 120, the haptic generator 130 may generate in the accommodating space 150a vibration, in order to provide the user presses the confirmation of vibration feedback.

[0052] 在此需注意,于上述图1D及图2D的实施例中,因载置触觉产生器130的电路层120仅与键帽层110的周边区114黏着在一起,当触觉产生器130发生震动时,对应于触觉产生器130的键帽区112与触觉产生器130无直接连动关系(即并未与电路层110黏接或有空隙),使得触觉产生器130震动时的负载较低有效降低能量的耗损,又不易带动键帽层110震动而可增进键帽层110操作时的外观表现。 [0052] It should be noted here, in the above-described embodiment of FIG. 1D and 2D, the circuit layer due to the placement of the haptic generator 130 and only the peripheral region 114 of the key cap layer 110 with the adhesive 120, when the haptic generator 130 when compared with the occurrence of shock load corresponding to the haptic region 130 of the generator 112 and the keycap haptic generator 130 is not directly linked relationship (i.e., bonding layer 110 and the circuit is not or voids), so that the haptic vibration during generator 130 low energy consumption is reduced effectively, and the appearance is not easy to drive when the performance of the key cap layer 110 can enhance the vibration operation of the key cap layer 110.

[0053] 再者,于上述图1A及图2A的实施例中,键帽层110可由单一材料制成或多种材料制成。 [0053] Further, in the above-described embodiment of FIG. 1A and FIGS. 2A, a material made of or more key cap layer 110 formed by a single material. 举例而言,于一实施例,键帽层110较佳由聚酯(HJ)、热塑聚酯(TPU)、皮革、织物、硅胶其中之一材料所制成。 For example, in one embodiment, the key cap layer 110 Preferably, the thermoplastic polyester (TPU), leather, fabric, wherein the silicone material is one made of polyester (HJ). 举例而言,于一实施例,键帽层110可为0.5mm的PU层,而可具有较佳的外观表面。 For example, in the embodiment, the key cap layer 110 may be an embodiment of 0.5mm PU layer, but may have a better surface appearance. 于另一实施例,键帽层110可为1.5mm的娃胶层,而可具有较佳的操作效果。 In another embodiment, the key cap layer 110 may be a 1.5mm adhesive layer of the baby, but may have better operational effect. 此外,键帽层110亦可为多层结构。 In addition, the key cap layer 110 may also be a multilayer structure. 亦即,可在上述材料制成的底层键帽层上设置厚度相对较薄且材质硬度相对较高的顶层键帽层,以保护软质的底层键帽层,甚至增加外观美感。 That is, a thickness can be relatively thin and relatively high material hardness key cap layer on top of the bottom layer is made of the key cap layer material to protect the underlying soft key cap layer, and even increase the aesthetic appearance. 举例而言,于一实施例,底层键帽层可为厚度约0.1mm〜2_的聚酯层或娃胶层,而顶层键帽层可为厚度约0.075mm〜0.25mm的PET层,但不以此为限。 For example, in the embodiment, the key cap layer underlying a thickness of about 0.1mm~2_ embodiment may be a polyester layer or a subbing layer baby, the key cap layer and the top layer may be a PET layer thickness of about 0.075mm~0.25mm but It is not limited thereto.

[0054] 再者,于上述图1A及图2A的实施例中,键帽层110为上/下表面皆为平坦的表面(即键帽区112及周边区114厚度实质相同),然而于其他实施,键帽层可具有不同设计以加强震动效果、强化外观设计、提升操作便利或降低成本等。 [0054] Further, in the above-described embodiment of FIGS. 1A and 2A, the upper key cap layer 110 / the lower surface are both flat surfaces (i.e., substantially the same as the thickness of the key top 114 and a peripheral region 112), whereas the other embodiment, the key cap layer may have a different design to enhance the shock effect, strengthening design, facilitate or enhance the operation cost reduction.

[0055] 举例而言,于图3A的实施例中,键帽层IlOA具有突起外形,其中键帽层IlOA于键帽区112A的厚度大于周边区114的厚度,使得键帽区112A突出于周边区114。 [0055] For example, in the embodiment of FIG. 3A, the outline of the protrusion having a key cap layer IlOA, wherein the thickness of the key cap layer IlOA keycap region 112A is thicker than the surrounding region 114, such that the keycap 112A projecting in the peripheral zone region 114. 于此实施例,键帽层I1A可由上述例如PU、TPU、皮革、织物、硅胶等材质制成。 In this embodiment, the key cap layer may be made of the above-described example I1A PU, TPU, leather, fabric, silicone and other materials. 藉此设计,键帽层I1A可选择设置或不设置上述的区域界定符111,使用者藉由突起的键帽区112A亦可于盲打时有效辨识出键帽区112A的位置,有助于提升输入的速度及正确性。 Whereby the design of the key cap layer selectively disposed I1A or without arranging the delimiter area 111, the user of the key top region 112A by the projection at the time of touch typing can effectively identify the position of the key top region 112A helps enhance the speed and accuracy of input. 再者,依据实验结果显示,图3A中突起的键帽区112A相对于图1A的平面键帽区112具有较少的途径分散震动,因此具有较佳的震动效果。 Further, according to the experimental results are shown in FIG. 3A projection region 112A with key cap 112 has less shock to the plane of the keycap way dispersion region of FIG. 1A, and therefore has a better vibration effect.

[0056] 于图3B及图3C的实施例中,键帽层由多种材料制成。 [0056] Example embodiments in FIGS. 3B and 3C, the key cap layer is made of various materials. 如图3B及图3C所示,键帽层110B、110C于对应键帽区112B、112C的下表面形成有凹槽112a,填充材料116填充于凹槽112a中,其中填充材料116与键帽层112B、112C的材料不同。 And FIG. 3B, the key cap layer 110B, 110C corresponding to the lower surface of the key top region 112B, 112C has a groove 112a, a filling material 116 filled in the groove 112a in which the filler material layer 116 in FIG. 3C keycap 112B, 112C of different materials. 举例而言,键帽层112B、112C可由PU材料制成,以提升键帽层的外观美感,而填充材料116可为硅胶,以提供较佳的效果。 For example, the key cap layer 112B, 112C may be made of PU material, to enhance the aesthetic appearance of the key cap layer and the fill material 116 may be a silica gel, to provide better results.

[0057] 于图3D的实施例中,键帽层IlOD于对应键帽区112D的下表面形成定位部118。 [0057] in the embodiment of Figure 3D, the key cap layer IlOD the positioning portion 118 is formed corresponding to the lower surface of the key top region 112D. 相应于此,电路层120具有定位孔120a,其中定位部118自键帽层IlOD的下表面向下突出以定位于定位孔120a中。 In response to this, the circuit layer 120 has a positioning hole 120a, wherein the lower surface of the positioning portion 118 protruding from the key cap layer IlOD downwardly to be positioned in the positioning hole 120a. 具体而言,定位部118自键帽层IlOD的下表面向下突出的凸柱,且与键帽层IlOD的下表面共同定义出空间S,触觉产生器130位于空间S中。 Specifically, from the lower surface 118 of the key cap layer IlOD positioning boss portion projecting downwardly, and the lower surface of the key cap layer IlOD together define the space S, the haptic generator 130 located in the space S. 换言之,空间S对应于容置空间150a,其中当定位部118定位于定位孔120a时,定位部118较佳位于突出部154的外侧(或支撑层140与突出部154之间),使得电路层120对应键帽区112D的部分位于空间S中,且触觉产生器130的上部位于空间S,而触觉产生器130的下部位于容置空间150a。 In other words, the space S corresponding to the accommodating space 150a, wherein when the positioning portion 118 is positioned when the positioning hole 120a, the positioning portion 118 is preferably located at (or between support layer 140 and the projecting portion 154) of the outer projection portion 154, so that the circuit layer region 112D corresponding to the key top portion 120 is located in the space S, and the upper portion 130 to generate a haptic the space S, and the lower haptic generator 130 located in the accommodating space 150a.

[0058] 如图4A及图4B所示,于另一实施例,本发明提供一种包含多个前述实施例的按键结构的输入装置10。 [0058] FIG. 4A and 4B, in another embodiment, the present invention provides a configuration of a key input device 10 of the embodiment comprises a plurality of the foregoing. 在此需注意,于此实施例,输入装置10以键盘装置为例进行说明,但于其他实施例,输入装置可包含一个以上的按键结构且以任何合宜的方式配置,不以实施例所示为限。 Here should be noted that, in this embodiment, the input device 10 will be described as an example keyboard device, but in other embodiments, the input device may comprise one or more key structure and arranged in any convenient manner, not illustrated in Example limit. 再者,于此实施例,输入装置10以图2A的按键结构为例说明,但不以此为限。 Further, in this embodiment, the key input device 10 in FIG. 2A structure of an example, but not limited thereto. 亦即,本发明的输入装置可由上述实施例的多个按键结构所组成。 That is, the input device of the present invention may be a plurality of key structures composed of the above-described embodiments.

[0059] 具体而言,如图4A所示,输入装置10包含键帽层210、电路层220、复数个触觉产生器230、支撑层240、缓冲层250、感应层260、控制电路270 (参见图4B)及黏着层280 (参见图6)。 [0059] Specifically, as shown in FIG 4A input device 10 comprises a key cap layer 210, the circuit layer 220, a plurality of haptic generator 230, a support layer 240, buffer layer 250, sensing layer 260, control circuit 270 (see FIG. 4B) and the adhesive layer 280 (see FIG. 6). 于此实施例,键帽层210具有复数个键帽区212。 A plurality of regions keycap embodiment, the key cap layer 210 having a 212 thereto. 电路层220设置于键帽层210下方,且电路层220的下表面对应复数个键帽区212的每一键帽区212具有电隔离的至少一第一接点222a及至少一第二接点224a。 The circuit layer 220 is disposed below the key cap layer 210, and the lower surface of the circuit layer 220 corresponding to each of the plurality of key caps keycap region 212 region 212 having at least a first contact 222a is electrically isolated and at least one second contact 224a. 缓冲层250设置于电路层220下方,且缓冲层250对应复数个键帽区212具有复数个容置空间250a,复数个容置空间250a以供分别容置复数个触觉产生器230。 The buffer layer 250 disposed below the circuit layer 220 and the buffer layer 250 corresponding to the plurality of key caps having a plurality of regions 212 accommodating space 250a, a plurality of the accommodating space 250a for respectively accommodating a plurality of haptic generator 230. 感应层260设置于缓冲层250下方,且感应层260包含复数个感应单元262,复数个感应单元262分别对应复数个键帽区212。 Sensing layer disposed on the buffer layer 260 below the 250, and the sensing layer 260 comprises a plurality of sensing units 262, a plurality of sensing units 262 corresponding to the plurality of keytop regions 212, respectively. 换言之,当多个按键结构整合成输入装置10 (例如键盘)时,各按键结构的元件可对应整合成单一部件层。 In other words, when a plurality of key structures are integrated into the input device 10 (e.g. a keyboard), the element structure may correspond to each of the keys into a single component layer.

[0060] 举例而言,如图4A及图5A所示,复数个键帽区212可藉由周边区214相互连接形成单一键帽层210。 [0060] For example, as shown in FIG. 4A and FIG. 5A, a plurality of the key top region 212 may be a single key cap layer 210 is formed by the peripheral region 214 connected to each other. 具体而言,键帽层210可依据各按键配置的位置于其上表面形成复数个区域界定符211,以界定出对应的复数个键帽区212,而复数个键帽区212之间的空间及周边部分即形成周边区214。 Specifically, the key cap layer 210 may be formed on the surface thereof depending on the position of each key of a plurality of regions arranged delimiter 211, to define a plurality of corresponding key caps region 212 and the space 212 between the plurality of key caps region i.e., the peripheral region and the peripheral portion 214 is formed. 类似于上述,复数个键帽区212的每一键帽区212具有对应的字符或图案(未图示),以指示各按键结构所输入的对应指令或字符。 Similar to the above, each of the plurality of the key top region 212 has a region 212 keycap corresponding character or pattern (not shown), an instruction to indicate corresponding or each character input key structure. 于此实施例,键帽层210可具有与上述键帽层110U10A〜IlOD类似的特性,例如结构、材质、厚度等,于此不再赘述。 In this embodiment, the key cap layer 210 may have the above-described key cap layer 110U10A~IlOD similar characteristics, such as structural, material, thickness, etc., is omitted herein.

[0061] 如图4A及图5B所示,电路层220设置于键帽层210下方,且电路层220的下表面对应复数个键帽区212的每一键帽区212具有电隔离的至少一第一接点222a及至少一第二接点224a,供电连接对应的复数个触觉产生器230。 , The circuit layer 220 is disposed below [0061] FIG. 4A and 5B to the key cap layer 210, and the lower surface of the circuit layer 220 of the region 212 corresponding to each keycap keycap region 212 having a plurality of electrically isolated from at least one of at least a first contact 222a and second contact 224a, the power supply connected to the corresponding plurality of haptic generator 230. 亦即,复数个触觉产生器230对应复数个键帽区212设置于电路层220下方且分别电连接对应的第一接点222a及第二接点224a。 That is, a plurality of haptic generator 230 corresponding to the plurality of key caps region 212 disposed below the circuit layer 220 and electrically connected to the corresponding first contact 222a and second contact 224a. 在此需注意,触觉产生器230具有类似于上述触觉产生器130的特性,且其与电路层220的连接方式亦可参考上述图1A实施例的相关说明,于此不再赘述。 It should be noted here, haptic generator 230 has a characteristic similar to the aforementioned haptic generator 130, and its connection to the circuit layer 220 is also described above with reference to FIG. 1A instructions embodiment, it is omitted herein. 具体而言,电路层220包含复数条第一线路222及复数条第二线路224,以分别提供驱动对应复数个触觉产生器230的电路径。 Specifically, the circuit layer 220 includes a plurality of first lines and a plurality of second line 222 224 to corresponding electrical paths are provided driving a plurality of haptic generator 230. 于此实施例,复数条第一线路222作为驱动触觉产生器230的驱动路径,而复数条第二路径224作为驱动触觉产生器230的接地路径。 In this embodiment, a plurality of first touch 222 is generated as the driving path of the drive circuit 230, and a plurality of second path 224 as a drive haptic generator ground path 230. 复数个触觉产生器230的复数个接地路径(即复数个第二线路224)较佳分组连接在一起,使得每一条第二线路224具有一个或至少两个的第二接点224a,且复数条第二线路224所包含的第二接点224a的总数量与复数个触觉产生器230的数量相同,以达到简化电路径的布局,减少所需的布局面积,进而缩小输入装置的尺寸。 A plurality of haptic generator 230, a plurality of ground path (i.e., a plurality of second line 224) preferred grouping together, such that each of the second line 224 has one or at least two second contacts 224a, and plural article the total number of the second contact 224a dicarboxylic line 224 contains the same number of a plurality of haptic generator 230 to achieve a simplified electrical path layout, reduce the required layout area, and thus reduce the size of the input device.

[0062] 如图4A及图5C所示,支撑层240设置于电路层220及缓冲层250之间,其中支撑层240具有复数开口240a分别对应复数键帽区212,且复数开口240a供复数突出部254分别穿设于其中。 [0062] FIG. 4A and FIG. 5C, the support layer 240 is provided between the circuit layer 220 and the buffer layer 250, wherein a plurality of the support layer 240 having an opening 240a corresponding to a plurality of key top region 212 respectively, and a plurality of openings for a plurality of projections 240a portions 254 are bored therein. 类似于上述,支撑层240的硬度大于缓冲层250的硬度,且支撑层250的厚度大于触觉产生器230的厚度,以提供触觉产生器230震动的空间。 Hardness similar to the above, the support layer 240 is greater than the hardness of the buffer layer 250, and the thickness of the support layer 250 is greater than the thickness of the haptic generator 230 to generate space 230 provide a tactile vibration.

[0063] 如图4A及图所示,缓冲层250设置于电路层220下方,其中缓冲层250对应复数个键帽区212具有复数个容置空间250a,以供容置复数个触觉产生器230。 [0063] FIG. 4A and FIG., A buffer layer 250 disposed below the circuit layer 220, wherein the buffer layer 250 corresponding to the plurality of key caps region 212 having a plurality of receiving spaces 250a, for accommodating a plurality of haptic generator 230 . 具体而言,缓冲层250包含膜片部252及复数个突出部254,其中复数个突出部254藉由膜片部252相互连接成单一缓冲层250。 Specifically, the buffer layer 250 comprises a diaphragm portion 252 and a plurality of projecting portions 254, 254 of the diaphragm portion by a plurality of protruding portions 252 are connected to each other into a single buffer layer 250. 亦即,类似于上述,膜片部252具有复数个容置区(例如复数个通孔),且复数个突出部254分别设置于复数个容置区(例如通孔)周围并自膜片部252朝电路层220突起,以形成复数个容置空间250a,复数个容置空间250a供分别容置复数个触觉产生器230。 That is, similarly to the above, the diaphragm portion 252 has a plurality of receiving areas (e.g. a plurality of through holes), and plural portions protruding from the diaphragm portion 254 are provided in a plurality of accommodation area (e.g., vias) and around protrusion 220 toward the circuit layer 252 to form a plurality of accommodating space 250a, a plurality of respectively accommodating space 250a for accommodating a plurality of haptic generator 230. 类似地,如图4A及图5C所示,当支撑层240设置于缓冲层250的膜片部252时,复数突出部254分别穿设于复数个开口240a。 Similarly, as shown in FIG. 4A and 5C, the time when 252, respectively, through a plurality of projecting portions of the diaphragm portion 240 of the support layer 250 is disposed on the buffer layer 254 disposed on a plurality of openings 240a. 再者,缓冲层250更具有复数个延伸部256,其中复数个延伸部256自复数个突出部254朝对应的容置空间250a内侧延伸,且复数个延伸部256的每一延伸部256的顶面低于每一延伸部256对应的每一突出部254的顶面。 Further, the buffer layer 250 further has a plurality of extending portions 256, wherein the plurality of portions 256 extending from the plurality of protruding portions 254 toward the corresponding extending inside the accommodating space 250a, and a plurality of extending portions 256 of each of the top 256 of the extension portions each portion extending below the surface of each projecting portion 256 corresponding to the top surface 254. 再者,复数个延伸部256的每一延伸部256较佳延伸于对应的每一触觉产生器230的下表面,以使得每一触觉产生器230部分重叠对应的每一延伸部256。 Further, each of the plurality of extension portions extending portion 256 preferably extends to the lower surface 256 corresponding to each of the haptic generator 230, such that each haptic generator 230 corresponding to the overlapping portion of each extending portion 256.

[0064] 再者,如图4A及图4B所示,复数个感应单元262可整合于感应层260,且可藉由单一控制电路270控制多个按键,以简化制造程序及组装程序,但不以此为限。 [0064] Further, as shown in FIG. 4A and FIG. 4B, a plurality of sensing unit 262 may be integrated in the sensing layer 260, and may be controlled by a single control circuit 270 a plurality of keys to simplify manufacturing and assembly procedures, but does not limited thereto.

[0065] 类似于图1D或图2D所示的作动说明,当外界施加按压力于复数个键帽区212其中一个时,按压力通过与复数个键帽区212其中之一对应的缓冲层250的力传递部分(例如突出部254、延伸部256)经由上述的两种途径向下传递以触发对应的感应单元262,使得对应的感应单元262输出触发信号T到控制电路270。 [0065] FIG similar to FIG. 1D or 2D operation explanatory illustrated, wherein when a pressing force is applied to the outside when a plurality of key top regions 212, 212 by pressing force with which the region corresponding to one of the plurality of key caps buffer layer force transmission portion 250 (e.g., the protruding portions 254, the extending portion 256) via the two transmission routes down to trigger the corresponding sensing unit 262, so that the corresponding sensing unit 262 outputs a trigger signal T to the control circuit 270. 触发信号T 一方面作为操作按键结构以输入相应的字元或指令的感应信号,同时亦作为产生驱动信号D的指示信号,使得控制电路270接收触发信号T而可输出驱动信号D给对应的触觉产生器230。 The trigger signal T on the one hand as an operation key structure corresponding to the input character or command detection signal, but also generates a drive signal as an indication signal D, so that the control circuit 270 receives the trigger signal T and the output drive signal D corresponding to the tactile generator 230. 当对应的触觉产生器230经由对应的电路层220的电路径(例如对应的第一电路径222及第二电路径224)接收到来自控制电路270的驱动信号时,对应的触觉产生器230可于对应的容置空间250a中产生震动,以提供使用者确认按压的震动回馈。 When the corresponding haptic generator 230 receives the drive signal from the control circuit 270 via an electrical path (e.g., a first electrical path to a second electrical path 224 and 222) corresponding to the circuit layer 220, the corresponding haptic generator 230 can 250a to vibrate in a corresponding receiving space, in order to provide the user presses the confirm vibration feedback.

[0066] 再者,如图6所示,黏着层280设置于键帽层210下表面且位于复数键帽区212之夕卜,以黏着键帽层210及电路层220。 [0066] Further, as shown in Figure 6, the adhesive layer 280 disposed on the lower surface of the key cap layer 210 and a plurality of key top is located Bu Xi region 212, the key cap layer 210 to the adhesive layer 220 and a circuit. 类似于上述,黏着层280仅设置于键帽层210对应于周边区214的下表面。 Similar to the above, the adhesive layer 280 is provided only on the key cap layer 210 corresponding to the lower surface 214 of the peripheral region. 换言之,黏着层280并未设置于键帽层210对应于键帽区212的下表面,使得键帽区212及电路层220对应键帽区212的部分不黏着在一起(或有空隙)。 In other words, the adhesive layer 280 is not provided on the key cap layer 210 corresponding to the lower surface of the key top region 212, such that the keycap 212 and the circuit region 220 corresponds to the key cap layer region portion 212 is not adhesive together (or voids). 藉此,当触觉产生器230受到驱动信号的驱动而震动时,可以减少触觉产生器230发生震动时的动能损耗。 Whereby, when the haptic generator 230 by driving signal and vibration can be reduced kinetic energy loss at the time of the occurrence of shock haptic generator 230. 亦即,若电路层220与键帽层210全部都黏起来时,触觉产生器230的“负载”加重,不易产生震动,而使得动能损耗加大。 That is, if the circuit layer 220 and the key cap layer 210 all stick together, haptic generator 230 "load" increase, easy to produce vibrations, so that the kinetic energy losses increase. 再者,输入装置10的其余元件(例如电路层220、支撑层240、缓冲层250、感应单元260等)之间亦可藉由黏着方式固定,以定位各元件间的相对位置。 Furthermore, among the remaining elements (e.g., circuit layer 220, support layer 240, buffer layer 250, the sensing unit 260, etc.) of the input device 10 may also be secured by adhesive, to locate the relative positions of the elements.

[0067] 相较于习知技术,本发明的按键结构及输入装置藉由黏着层仅设置于键帽区外的部分(即周边区),可有效降低触觉产生器发生震动时的动能损耗。 [0067] compared to conventional technology, the input device and the key structure according to the present invention by an adhesive layer is provided only on the portion (i.e., peripheral region) outside the region of the keycap, can effectively reduce the loss of kinetic energy when the vibrotactile generator occurs. 再者,本发明的按键结构及输入装置可藉由不同结构设计、不同材质选择的键帽层,来加强震动效果、强化外观设计、提升操作便利或降低成本。 Furthermore, the structure and the key input device of the present invention may be designed by different structures, different materials selected key cap layer, to enhance the shock effect, strengthening the design, reduce cost or enhance the convenience of operation.

[0068] 本发明已由上述实施例加以描述,然而上述实施例仅为例示目的而非用于限制。 [0068] The present invention has been described in the above embodiments be, however, the above-described embodiments are only illustrative and not for purposes of limitation. 熟此技艺者当知在不悖离本发明精神下,于此特别说明的实施例可有例示实施例的其他修改。 This known art when cooked by the present invention without departing from the spirit, the particular embodiments described herein other modifications of the illustrative embodiments may have. 因此,本发明范畴亦涵盖此类修改且仅由所附申请专利权利要求的范围限制。 Accordingly, the scope of the present invention also encompasses such modifications and is limited only by the scope of the appended patent claims.

Claims (12)

1.一种按键结构,其特征在于,该按键结构包含: 键帽层,其具有键帽区及周边区,该周边区邻接该键帽区; 电路层,其设置于该键帽层下方; 触觉产生器,其电连接该电路层; 支撑结构层,其设置于该电路层下方,该支撑结构层具有容置空间,该触觉产生器位于该容置空间中;以及黏着层,其设置于该键帽层及该电路层之间,且该黏着层对应该周边区。 A key structure, wherein the key structure comprising: a key cap layer having a key top and a peripheral region, the peripheral region adjacent to the key top region; circuit layer disposed below the key cap layer; the haptic generator electrically connected to the circuit layer; a support structure layer, which is disposed below the circuit layer, the support structure layer having a receiving space, the haptic generator located in the accommodating space; and an adhesive layer provided on between the key cap layer and the circuit layer, the adhesive layer and the peripheral region should be.
2.如权利要求1所述的按键结构,其特征在于,该键帽层于该键帽区的厚度大于该周边区的厚度。 The key structure as claimed in claim 1, wherein the key cap to the key cap layer has a thickness greater than a thickness of the peripheral zone region.
3.如权利要求1或2所述的按键结构,其特征在于,该键帽层于对应该键帽区的下表面形成有凹槽,于该凹槽中填充填充材料,该填充材料与该键帽层的材料不同。 3. The key structure according to claim 1, wherein the key cap layer to be within a recess formed in the lower surface of the key top region, filled with the filling material in the recess, the filling material and the keycap layers of different materials.
4.如权利要求1或2所述的按键结构,其特征在于,该键帽层于对应该键帽区的下表面形成定位部,该电路层具有定位孔,该定位部自该键帽层的下表面向下突出以定位于该定位孔中。 4. The key structure as claimed in claim 1 or 2 or the positioning portion from the key cap layer, characterized in that, the key cap layer is formed on the lower surface portion positioned to be keycap region, the circuit layer having a positioning hole, projecting downward to the lower surface positioned in the positioning hole.
5.如权利要求4所述的按键结构,其特征在于,该定位部自该键帽层的下表面向下突出,该定位部与该键帽层的该下表面以形成空间,该触觉产生器位于该空间中。 5. The key structure as claimed in claim 4, wherein the positioning portion from the lower surface of the key cap layer protruding downwardly, the positioning portion and the lower surface of the key cap layer to form a space, generating the haptic It is located in the space.
6.如权利要求1所述的按键结构,其特征在于,该电路层的硬度大于该键帽层的硬度,且该电路层的厚度小于该键帽层的厚度。 The key structure as claimed in claim 1, characterized in that the hardness of the circuit layer is greater than the hardness of the key cap layer, and the thickness of the circuit layer is less than the thickness of the key cap layer.
7.如权利要求6所述的按键结构,其特征在于,该电路层由聚对苯二甲酸乙二酯构成,该键帽层选自于聚酯、热塑聚酯、皮革、织物、硅胶的其中之一。 7. The key structure according to claim 6, characterized in that the circuit layer is made of polyethylene terephthalate, the key cap layer is selected from polyester, thermoplastic polyester, leather, textiles, silica gel It is one of them.
8.如权利要求7所述的按键结构,其特征在于,该电路层的厚度为0.05mm至0.5mm,该键帽层的厚度为0.1mm至2mm。 8. The key structure according to claim 7, wherein the thickness of the circuit layer is 0.05mm to 0.5mm, the thickness of the key cap layer is 0.1mm to 2mm.
9.如权利要求1所述的按键结构,其特征在于,该支撑结构层包含缓冲层及支撑层,该支撑层具有开口,该开口对应于该键帽区,该缓冲层具有突出部,该突出部设置于该容置空间的周围,该突出部穿设于该开口中。 9. The key structure according to claim 1, wherein the support structure comprises a buffer layer and a layer support layer, the support layer having an opening corresponding to the keycap region, the buffer layer has a protruding portion, which peripheral projection disposed in the accommodating space provided in the projection portion through the opening.
10.如权利要求1所述的按键结构,其特征在于,该键帽层的上表面具有区域界定符以界定该键帽区。 10. The key structure according to claim 1, characterized in that the upper surface of the key cap layer to define a region of the keycap delimiter area.
11.如权利要求1所述的按键结构,其特征在于,还包括: 感应单元,其设置于该支撑结构层下方,当该感应单元被触发时可输出触发信号;以及控制电路,其耦接于该感应单元与该电路层,该控制电路接收该触发信号而输出驱动信号给该触觉产生器; 其中,当外界施加按压力时,该按压力透过该支撑结构层向下传递以触发该感应单元,使该感应单元输出该触发信号,进而使该触觉产生器接收到该驱动信号而震动。 11. The key structure according to claim 1, characterized in that, further comprising: sensing means disposed below the supporting structure layer, when the sensing unit may output a trigger signal is triggered; and a control circuit coupled in the sensing unit and the circuit layer, the control circuit receives the trigger signal and outputs a drive signal to the haptic generator; wherein, when the pressing force applied from the outside, the pressing force transmitted through the support structure layer is passed down to the trigger sensing means, so that the sensing unit to output the trigger signal, thereby enabling the haptic generator receiving the drive signal and vibration.
12.—种输入装置,特征在于,该输入装置包含: 复数个如权利要求1至10项任一所述的按键结构,其中该复数个按键结构的该复数个键帽区藉由该周边区连接形成单一键帽层,该黏着层设置于该复数键帽区外的该周边区。 12.- types of input means, wherein the input means comprises: a plurality of key structure as claimed in any one of claims 1 to 10, wherein the plurality of regions of the plurality of key caps of the key structure by the peripheral region joined to form a single key cap layer, the adhesive layer is disposed on the outer peripheral region of the plurality of the key top region.
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