CN105082244A - High-effect spring stamping device for solar sensor circuit board - Google Patents
High-effect spring stamping device for solar sensor circuit board Download PDFInfo
- Publication number
- CN105082244A CN105082244A CN201510606853.4A CN201510606853A CN105082244A CN 105082244 A CN105082244 A CN 105082244A CN 201510606853 A CN201510606853 A CN 201510606853A CN 105082244 A CN105082244 A CN 105082244A
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- China
- Prior art keywords
- support plate
- circuit board
- mold
- counterdie
- sensor circuit
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- Pending
Links
- 238000004080 punching Methods 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention relates to a high-effect spring stamping device for a solar sensor circuit board. The high-effect spring stamping device comprises a lower carrier board and an upper carrier board installed above the lower carrier board. A lower mold is arranged on the lower carrier board. An air cylinder is arranged on the upper carrier board. A piston rod of the air cylinder penetrates through the upper carrier board. An upper mold is fixed to the end of the piston rod. The upper mold and the lower mold are opposite. The upper mold comprises an upper mold base, an upper mold bottom board arranged below the upper mold base, and a stamping male mold arranged below the upper mold bottom board. The lower mold comprises a lower mold base, a lower mold bottom board arranged above the lower mold base, and a stamping female mold arranged above the lower mold. Multiple concave holes are formed in the bottom of the stamping female mold. Springs are distributed in the concave holes. After being cut and stamped, the circuit board can be pushed through elasticity of the springs, it is guaranteed that all small pieces can be pushed, and the board sticking phenomenon is avoided.
Description
Technical field
The present invention relates to a kind of high-effect solar energy sensor circuit board spring decompressor.
Background technology
Solar energy sensor depends on a main body chip, realizes different induced signals by the 10 groups of resistance capacitances varied in size, and widely, manufacture is also large especially for market application foreground.Because number of parts is few, main body circuit is integrated in key chip, so finally the size of this circuit board is only 1 centimeter square, thickness only only has 0.6 millimeter, close to the thickness of traditional FPC, this brings great challenge to manufacturing industry.Plank is too little too light, have in cutting plate punching course certain probability can cause splitting after platelet be bonded at the top of diel, have impact on production efficiency and point plate causing next block product damages.
Summary of the invention
The object of the invention is the deficiency overcoming prior art existence, a kind of high-effect solar energy sensor circuit board spring decompressor is provided.
Object of the present invention is achieved through the following technical solutions:
High-effect solar energy sensor circuit board spring decompressor, feature is: the upper support plate comprising lower support plate and be installed on it, and described lower support plate arranges counterdie, described upper support plate is provided with cylinder, the piston rod of cylinder passes upper support plate, the end winding support patrix of piston rod, and patrix is relative with counterdie; The punching press punch that described patrix comprises upper die base, is arranged at the upper baffle plate below upper die base and is arranged at below baffle plate; the stamping cavity die that described counterdie comprises lower die base, is arranged at the lower mould bottom plate above lower die base and is arranged at above counterdie; the bottom of described stamping cavity die offers several shrinkage pool, is distributed with spring in shrinkage pool.
Further, above-mentioned high-effect solar energy sensor circuit board spring decompressor, wherein, described lower support plate is provided with track, and counterdie arranged by track.
Further, above-mentioned high-effect solar energy sensor circuit board spring decompressor, wherein, described upper support plate is fixed on lower support plate by four root posts.
Substantive distinguishing features and the progress of technical solution of the present invention are mainly reflected in:
The present invention designs uniqueness, novel structure, realizes after the punching press of circuit board cutting plate, by the elastic force of spring, circuit board is played to the effect of promotion, ensures that all small pieces can be pushed, avoid haftplatte phenomenon.
Accompanying drawing explanation
Fig. 1: structural representation of the present invention;
Fig. 2: the organigram of counterdie.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical solution of the present invention is described further:
As shown in Fig. 1 ~ Fig. 2, high-effect solar energy sensor circuit board spring decompressor, comprise lower support plate 1 and upper support plate 3, upper support plate 3 is fixed on lower support plate 1 by four root posts 2, and lower support plate 1 is provided with track 5, track 5 is arranged counterdie 6, upper support plate 3 is provided with cylinder 4, the piston rod of cylinder 4 passes upper support plate 3, the end winding support patrix of piston rod, and patrix is relative with counterdie; The punching press punch that patrix comprises upper die base, is arranged at the upper baffle plate below upper die base and is arranged at below baffle plate; the stamping cavity die that counterdie 6 comprises lower die base, is arranged at the lower mould bottom plate above lower die base and is arranged at above counterdie; the bottom of stamping cavity die offers several shrinkage pool, is distributed with spring 7 in shrinkage pool.
By cylinder 4 drived control patrix, set air pressure size and delay time in advance; Circuit board is positioned between patrix and counterdie, starting switch; The small pieces section of each circuit board is stretched out through cylinder pressure effect and is cut off by product, now white acrylic place jacking block is because spring action is compressed, patrix playbacks by cylinder, section simultaneously returns to patrix inside, and acrylic jacking block is because spring release action guarantees that the product of each small pieces can be pushed away on counterdie.Solve the circuit board haftplatte problem produced in die-cut point of plate technique.After cutting plate punching press, by the elastic force of spring, circuit board is played to the effect of promotion, ensure that all small pieces can be pushed, avoid haftplatte phenomenon.
It is emphasized that: be only preferred embodiment of the present invention above, not any pro forma restriction is done to the present invention, every above embodiment is done according to technical spirit of the present invention any simple modification, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (3)
1. high-effect solar energy sensor circuit board spring decompressor, it is characterized in that: the upper support plate comprising lower support plate and be installed on it, described lower support plate arranges counterdie, described upper support plate is provided with cylinder, the piston rod of cylinder is through upper support plate, the end winding support patrix of piston rod, patrix is relative with counterdie; The punching press punch that described patrix comprises upper die base, is arranged at the upper baffle plate below upper die base and is arranged at below baffle plate; the stamping cavity die that described counterdie comprises lower die base, is arranged at the lower mould bottom plate above lower die base and is arranged at above counterdie; the bottom of described stamping cavity die offers several shrinkage pool, is distributed with spring in shrinkage pool.
2. high-effect solar energy sensor circuit board spring decompressor according to claim 1, is characterized in that: described lower support plate is provided with track, and counterdie arranged by track.
3. high-effect solar energy sensor circuit board spring decompressor according to claim 1, is characterized in that: described upper support plate is fixed on lower support plate by four root posts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510606853.4A CN105082244A (en) | 2015-09-22 | 2015-09-22 | High-effect spring stamping device for solar sensor circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510606853.4A CN105082244A (en) | 2015-09-22 | 2015-09-22 | High-effect spring stamping device for solar sensor circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105082244A true CN105082244A (en) | 2015-11-25 |
Family
ID=54564007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510606853.4A Pending CN105082244A (en) | 2015-09-22 | 2015-09-22 | High-effect spring stamping device for solar sensor circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105082244A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4212815A1 (en) * | 1991-06-20 | 1992-12-24 | Fuji Electric Co Ltd | Piezoelectric actuator for thin metal foil components - has opening and closure of die-set for access provided by pneumatic actuator |
| CN201283586Y (en) * | 2008-08-20 | 2009-08-05 | 李小南 | Pneumatic circuit soft plate blanking machine |
| CN202290939U (en) * | 2011-11-11 | 2012-07-04 | 合肥华美机电配套有限公司 | Pneumatic corner cutting die for patterned aluminum plate |
| CN202667408U (en) * | 2012-03-22 | 2013-01-16 | 张志军 | V-shaped piece bending die |
| CN203409069U (en) * | 2013-07-25 | 2014-01-29 | 贵阳市乌当区精诚电器压铸厂 | Stamping device |
| CN103737669A (en) * | 2014-01-16 | 2014-04-23 | 珠海格莱利模具有限公司 | Punching tool with floating positioning structure |
| CN204036890U (en) * | 2014-08-05 | 2014-12-24 | 东莞市劲威智能冲压成套设备有限公司 | A kind of low noise automatic stamping equipment |
| CN204914032U (en) * | 2015-09-22 | 2015-12-30 | 欧朗科技（苏州）有限公司 | High -effect solar energy sensor circuit flat spring stamping device |
-
2015
- 2015-09-22 CN CN201510606853.4A patent/CN105082244A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4212815A1 (en) * | 1991-06-20 | 1992-12-24 | Fuji Electric Co Ltd | Piezoelectric actuator for thin metal foil components - has opening and closure of die-set for access provided by pneumatic actuator |
| US5413018A (en) * | 1991-06-20 | 1995-05-09 | Fuji Electric Co., Ltd. | Piezo-electric actuator operated press |
| CN201283586Y (en) * | 2008-08-20 | 2009-08-05 | 李小南 | Pneumatic circuit soft plate blanking machine |
| CN202290939U (en) * | 2011-11-11 | 2012-07-04 | 合肥华美机电配套有限公司 | Pneumatic corner cutting die for patterned aluminum plate |
| CN202667408U (en) * | 2012-03-22 | 2013-01-16 | 张志军 | V-shaped piece bending die |
| CN203409069U (en) * | 2013-07-25 | 2014-01-29 | 贵阳市乌当区精诚电器压铸厂 | Stamping device |
| CN103737669A (en) * | 2014-01-16 | 2014-04-23 | 珠海格莱利模具有限公司 | Punching tool with floating positioning structure |
| CN204036890U (en) * | 2014-08-05 | 2014-12-24 | 东莞市劲威智能冲压成套设备有限公司 | A kind of low noise automatic stamping equipment |
| CN204914032U (en) * | 2015-09-22 | 2015-12-30 | 欧朗科技（苏州）有限公司 | High -effect solar energy sensor circuit flat spring stamping device |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |
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| RJ01 | Rejection of invention patent application after publication |