CN105023872B - Substrate adsorption structure, the device and method for making soft electronic component - Google Patents

Substrate adsorption structure, the device and method for making soft electronic component Download PDF

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Publication number
CN105023872B
CN105023872B CN201410151411.0A CN201410151411A CN105023872B CN 105023872 B CN105023872 B CN 105023872B CN 201410151411 A CN201410151411 A CN 201410151411A CN 105023872 B CN105023872 B CN 105023872B
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flexible base
base plate
carrier
processing procedure
support plate
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CN105023872A (en
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陈国峰
张志嘉
庄孟颖
林伟义
贡振邦
傅传旭
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Hannstar Display Corp
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Industrial Technology Research Institute ITRI
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Abstract

The present invention provides a kind of substrate adsorption structure, makes the method and electrostatic attaching device of soft electronic component.Aforesaid substrate adsorption structure includes an electret carrier, wherein having at least 10 in above-mentioned electret carrier‑7Coulomb/cm2Electrostatic charge to adsorb a bottom surface of a substrate；The one first protected material bed of material, it is arranged on above-mentioned electret carrier, and covers a part for a top surface of aforesaid substrate.

Description

Substrate adsorption structure, the device and method for making soft electronic component
Technical field
The invention relates to a kind of substrate adsorption structure, make soft electronic component method and electrostatic attaching device, Set up in particular to a kind of substrate adsorption structure for having electret structure, the method for making soft electronic component and electrostatic paster It is standby.
Background technology
Glass displays are frangible at present, not impact resistance and high weight and the missing of thickness can not be satisfied with lightweight, slim Change and deflection such as uses at the carry-on product of individual digital of demand, not only may be used using flexible base plate substitution glass as display base plate To solve the above problems, design freedom of the flat-panel screens in external form and crimpiness can be more provided, is with flexible display Research and development slowly form one upsurge.
However, because flexible base plate is easy to crimp so that flexible display easily has establishment of component cost high and processing procedure The situations such as complexity height, and cause the processing procedure volume production qualification rate of large scale flexible display to be difficult to be lifted.
The content of the invention
One embodiment of the invention is to provide a kind of substrate adsorption structure.Aforesaid substrate adsorption structure carries including an electret Tool, wherein having at least 10 in above-mentioned electret carrier-7Coulomb/cm2Electrostatic charge to adsorb a bottom surface of a substrate；One first The protected material bed of material, it is arranged on above-mentioned electret carrier, and covers a part for a top surface of aforesaid substrate.
Another embodiment of the present invention is to provide a kind of substrate adsorption structure.Aforesaid substrate adsorption structure includes an electret Carrier, wherein having at least 10 in above-mentioned electret carrier-7Coulomb/cm2Electrostatic charge is to adsorb a bottom surface of a substrate；One tired electricity Electret layer, it is arranged on above-mentioned electret carrier, wherein an at least surface for above-mentioned tired electroelectret layer connects with aforesaid substrate Touch
Another embodiment of the present invention is to provide a kind of method for making soft electronic component.Above-mentioned making soft electronic group The method of part includes providing an insulation carrier；One first charging processing procedure is carried out, will at least 10-7Coulomb/cm2The first electrostatic charge note Enter in above-mentioned insulation carrier, so that above-mentioned insulation carrier turns into the electret carrier with electrostatic charge；Carried in above-mentioned electret A substrate with a soft electronic component is set on tool, and wherein aforesaid substrate passes through above-mentioned quiet caused by above-mentioned electret carrier Electric charge and be adsorbed on above-mentioned electret carrier；In forming the one first protected material bed of material on above-mentioned electret carrier, wherein above-mentioned A part for one top surface of first protected material bed of material covering aforesaid substrate.
Another embodiment of the present invention is to provide a kind of attached to electrostatic and attached with reference to the electrostatic of flexible base plate and support plate Equipment.Above-mentioned electrostatic attaching device includes a carrier plate transmission platform, to carry and transmit a support plate；An at least charging device, It is arranged on above-mentioned carrier plate transmission platform, it is to will at least 10-7Coulomb/cm2Electrostatic charge inject above-mentioned support plate, with as one Electret carrier；One sticking type device, it is arranged on above-mentioned carrier plate transmission platform, it is above-mentioned a flexible base plate to be pasted to On support plate.
The more embodiment of the present invention is to provide a kind of method for making soft electronic component.Above-mentioned making soft electronic group The method of part includes providing a kind of electrostatic attaching device.Above-mentioned electrostatic attaching device includes a carrier plate transmission platform, to carry And one support plate of transmission；An at least charging device, it is arranged on above-mentioned carrier plate transmission platform, it is to will at least 10-7Coulomb/cm2 Electrostatic charge inject above-mentioned support plate, with as an electret carrier；One sticking type device, it is arranged at above-mentioned carrier plate transmission platform On, it is a flexible base plate is pasted on above-mentioned support plate；Support plate is placed on above-mentioned carrier plate transmission platform；Utilize above-mentioned load Above-mentioned support plate is sent in the above-mentioned charging device of above-mentioned electrostatic attaching device by plate transmission platform carries out a charging processing procedure, near Few 10-7Coulomb/cm2Electrostatic charge inject above-mentioned support plate；Flexible base plate is placed on above-mentioned support plate；Utilize above-mentioned carrier plate transmission Above-mentioned flexible base plate of the platform by above-mentioned support plate and thereon is sent to the above-mentioned sticking type device of above-mentioned electrostatic attaching device together It is interior to carry out an attaching processing procedure, above-mentioned flexible base plate is pasted on above-mentioned support plate.
One more embodiment of the present invention is to provide a kind of method for making soft electronic component.Above-mentioned making soft electronic group The method of part includes providing a kind of electrostatic attaching device.Above-mentioned electrostatic attaching device includes a carrier plate transmission platform, to carry And one support plate of transmission；An at least charging device, it is arranged on above-mentioned carrier plate transmission platform, it is to will at least 10-7Coulomb/cm2 Electrostatic charge inject above-mentioned support plate, with as an electret carrier；One sticking type device, it is arranged at above-mentioned carrier plate transmission platform On, it is a flexible base plate is pasted on above-mentioned support plate；One cutter device, it is arranged on above-mentioned carrier plate transmission platform, its In above-mentioned cutter device be to cut above-mentioned support plate and/or above-mentioned flexible base plate；Support plate is placed in above-mentioned carrier plate transmission platform On；Above-mentioned support plate is sent in the above-mentioned charging device of above-mentioned electrostatic attaching device using above-mentioned carrier plate transmission platform and carries out one Charge processing procedure, will at least 10-7Coulomb/cm2Electrostatic charge inject above-mentioned support plate；One flexible base plate is placed on above-mentioned support plate； Above-mentioned electrostatic attaching device is sent to together using the above-mentioned flexible base plate of above-mentioned carrier plate transmission platform by above-mentioned support plate and thereon Above-mentioned sticking type device in carry out one attach processing procedure, above-mentioned flexible base plate is pasted on above-mentioned support plate；Utilize above-mentioned support plate Above-mentioned flexible base plate of the transmission platform by above-mentioned support plate and thereon is sent to the above-mentioned cutting dress of above-mentioned electrostatic attaching device together Put, to carry out a cutting processing procedure, above-mentioned flexible base plate is separated into different flexible base plate fragments.
Brief description of the drawings
Figure 1A~Fig. 1 C show the processing procedure diagrammatic cross-section of the making soft electronic component of one embodiment of the invention；
Fig. 1 D, Fig. 1 E show the section signal of the soft electronic component before carrying out after cutting processing procedure and removing processing procedure Figure；
Fig. 1 F, Fig. 1 G show the diagrammatic cross-section for the soft electronic component shown in Fig. 1 D, Fig. 1 E remove processing procedure；
Fig. 2A~Fig. 2 D are that the section of the substrate adsorption structure of the carrying soft electronic structure of different embodiments of the invention shows It is intended to, shows the first protected material bed of material of different embodiments of the invention；
Fig. 3 A are the diagrammatic cross-sections for the substrate adsorption structure for showing different embodiments of the invention, and display sets substrate The one second charging processing procedure carried out after on electret carrier；
Fig. 3 B~Fig. 3 J are that the section of the substrate adsorption structure of the carrying soft electronic structure of different embodiments of the invention shows It is intended to, shows the tired electroelectret layer of different embodiments of the invention；
Fig. 4 A, Fig. 4 B are the tired electric electret of the substrate adsorption structure of the carrying soft electronic structure of different embodiments of the invention The top view of body pattern, show the configuration of the tired electroelectret pattern of different embodiments of the invention；
Fig. 5 A are the diagrammatic cross-section of the substrate adsorption structure of another embodiment of the present invention, show one embodiment of the invention The wire being embedded in electret carrier；
Fig. 5 B are the diagrammatic cross-section of the substrate adsorption structure of the carrying soft electronic structure of one embodiment of the invention；
Fig. 5 C, Fig. 5 D are the top view of the wire being embedded in electret carrier of different embodiments of the invention, and display is originally Invent the configuration of the wire of different embodiments；
Fig. 6 A~Fig. 6 C are that the section of the substrate adsorption structure of the carrying soft electronic structure of different embodiments of the invention shows It is intended to, shows the liquid guide flow layer of different embodiments of the invention；
Fig. 7 A, Fig. 7 B are the section signal of the substrate adsorption structure of the carrying soft electronic structure of different embodiments of the invention Figure, show the second protected material bed of material of different embodiments of the invention；
Fig. 8 A, Fig. 8 B remove processing procedure for the substrate adsorption structure of the carrying soft electronic structure applied to the present invention, again Referred to as machinery removes processing procedure；
Fig. 9 A~Fig. 9 D show the processing procedure of the electret carrier sandwich construction of the substrate adsorption structure of one embodiment of the invention Diagrammatic cross-section；
Figure 10 A, Figure 10 B are also the substrate adsorption structure of the carrying soft electronic structure applied to different embodiments of the invention Remove processing procedure, also known as neutralize electrostatic method remove processing procedure；
Figure 11 A, Figure 11 B also remove processing procedure for the substrate adsorption structure applied to different embodiments of the invention, and it is another One kind neutralizes electrostatic method and removes processing procedure；
Figure 12~Figure 23 shows the electrostatic attached to electrostatic with reference to flexible base plate and support plate of different embodiments of the invention Attaching device and processing procedure, the electrostatic of above-described embodiment attach processing procedure and are also known as piece to piece processing procedure (sheet to sheet process)；
Figure 24 shows being set up to electrostatic attaching with reference to the electrostatic paster of flexible base plate and support plate for other embodiments of the invention Standby and processing procedure, the electrostatic of above-described embodiment attach processing procedure and also known as rolled up to piece processing procedure (roll to sheet process)；
Figure 25 A~Figure 25 I are to carry out attaching step (lamination in the electrostatic attaching processing procedure shown in Figure 24 Process the change case of sticking type device)；
Figure 26 shows being set up to electrostatic attaching with reference to the electrostatic paster of flexible base plate and support plate for other embodiments of the invention Standby and processing procedure, the electrostatic of above-described embodiment attach processing procedure and are also known as volume to volume processing procedure (roll to roll process)；
Figure 27 A~Figure 27 I are to carry out attaching step (lamination in the electrostatic attaching processing procedure shown in Figure 26 Process the change case of sticking type device).
【Symbol description】
200th, 200a~electret carrier；
201st, 204,204b, 209a, 209b, 218~top surface；
202nd, 202c~substrate；
The sublevel of 202a~first；
The sublevel of 202b~second；
203rd, 203a, 203b, 214,217,317~side wall；
205th, 213~bottom surface；
The protected material bed of material of 206a, 206b, 206c, 206d, 206e~first；
207~soft electronic structure；
211a~211c~soft electronic component；
211d~211f~flexible electronic device；
212~groove；
216~tire out electroelectret layer；
220~support plate；
222~first electrode plate；
223rd, 224,323~tire out electric corona pin；
230th, 230a, 230b, 230c, 330,330a, 330b, 330c~wire；
232a, 232b, 232c~liquid guide flow layer；
The protected material bed of material of 236a, 236b~second；
300~cutting tool；
302nd, 302a, 302a2~taking off tool；
302b~taking off tool platform；
302c~remove microscope carrier；
303~curved surface；
316th, 316a, 316b~tired electroelectret pattern；
316a1~edge strengthening structure；
400th, 402,404,406,408,408-1,410~electrostatic charge；
500a~500n, 500p~500u, 500m-1~substrate adsorption structure；
601st, 603,605~direction；
900~electret carrier sandwich construction；
902a, 902b, 902c~electret layer；
A1, A2~area；
1200~roller bearing；
1202~conveyer belt；
1206a, 1208a~tire out electric corona pin；
1206b, 1208b~electrode；
1201st, 1231~carrier plate transmission platform；
1206th, 1208~charging device；
1210th, 1210-1,1210-2,1210-3,1210-4,1210-5,1210-6,1210-7,1210-8,1322A~ 1322I, 1326A~1326I~sticking type device；
1212nd, 1212a~support plate；
1214th, 1214a~flexible base plate；
1218th, 1218a~electric calorifie installation；
1219~increased pressure board；
1220~elastic material sheet；
1222~surface；
1224~flexible base plate coiled material；
1224a~flexible base plate web part；
1226th, 1230a~feed spool；
1228~cutter device
1230b~recovery axle；
1232~support plate coiled material；
1232a~support plate web part；
1302、1304、1306、1308A、1308B、1308C、1308D、1308E、1308F、1308G、1308H、1308I、 1308J, 1308K, 1322,1324~step；
1500a~1500n~electrostatic attaching device；
B1, B2~angle.
Embodiment
In order to which the present invention can become apparent, special embodiment below, and accompanying drawing appended by cooperation, it is described in detail. Description of the invention provides different embodiments to illustrate the technical characteristic of different embodiments of the present invention.Wherein, in embodiment The configuration of each component be for purposes of discussion, and be not used to the limitation present invention.And the part of drawing reference numeral repeats in embodiment, is For the purpose of simplifying the description, the relevance being not meant as between different embodiments.
The embodiment of the present invention is to provide a kind of substrate adsorption structure and one kind is made using aforesaid substrate adsorption structure The method of soft electronic component, can be more suitable for the mode of production of soft electronic component, and aforesaid substrate adsorption structure utilizes tired Electrically insulation carrier (such as glass carrier or plastics carrier) is made as staying with electrostatic charge by (such as corona discharge) Polar body carrier, via electrostatic charge sorbing substrate caused by electret carrier, and soft electronic device process is completed on substrate The substrate with soft electronic component can be separated with electret carrier through plain mode afterwards.
Figure 1A~Fig. 1 G show the processing procedure diagrammatic cross-section of the making soft electronic component of one embodiment of the invention.It refer to Figure 1A, there is provided an insulation carrier.In the present embodiment, the carrier that insulate can be arranged at one first electricity for being coupled to earth terminal One support plate 220 of pole plate 222 and be coupled between a positive voltage or the tired electric corona pin 223 of negative voltage, and insulate carrier with First electrode plate 222 contacts.One first charging is carried out using first electrode plate 222 and tired electric corona pin 223 to insulation carrier to make Journey, will at least 10-7Coulomb/cm2Electrostatic charge 400 inject in above-mentioned insulation carrier so that insulation carrier turn into carry electrostatic charge An electret carrier 200.In an embodiment of the present invention, above-mentioned electrostatic charge 400 can be positive charge or negative electrical charge.In Figure 1A institutes In the embodiment shown, above-mentioned electrostatic charge 400 is positive charge.In an embodiment of the present invention, the first charging processing procedure may include corona Electric discharge mise-a-la-masse method, triboelectric charging method, electron beam mise-a-la-masse method or thermal poling method.In the present embodiment, the first charging processing procedure is, for example, Corona discharge charges, and the principle of corona discharge mise-a-la-masse method is will at least 10 using an electric field-7Coulomb/cm2Electrostatic charge be stored in Insulate among carrier, the intensity of above-mentioned electric field is enough to make to be originally the air ionization arround insulator and produced substantial amounts of positive or negative Electric charge, when removing extra electric field, positive or negative electric charge can be stored in insulation carrier.And positive or negative electric charge will in the carrier that insulate Powered polarity is influenceed, when being charged as positive charge such as corona discharge, electret turns into the electrical body of positively charged, and corona discharge fills Electronegative electrical body will be turned into during electric negative electrical charge.
Formed after electret carrier, refer to Figure 1B, in setting a substrate 202 on electret carrier 200, and in substrate A soft electronic structure 207 is made on 202 top surface 204.In an embodiment of the present invention, substrate 202 can pass through electret Electrostatic charge caused by body carrier 200 and be adsorbed on electret carrier 200, wherein cause 200 bands of electret carrier electrostatic The electrostatic charge 402 of 202 bands of lotus 400 and substrate is all close to the interface between electret carrier 200 and substrate 202.In the present invention In other embodiment, the alternative charging of progress one second processing procedure after substrate 202 is set on electret carrier 200 is (similar In the first charging processing procedure shown in Figure 1A), will at least 10-7Coulomb/cm2Electrostatic charge injection substrate 202 in, increase be stored in base The quantity of electrostatic charge 402 in plate 202, to strengthen the electrostatic adsorption force between electret carrier 200 and substrate 202.By After two charging processing procedures, substrate 202 also can be considered an electret.In the embodiment shown in Figure 1B, electrostatic charge 402 is negative electricity Lotus.In other embodiments of the present invention, electrostatic charge 400 and 402 can be positive charge or negative electrical charge.
Figure 1B is refer again to, substrate 202 can be surrounded in forming one first protected material bed of material 206a on electret carrier 200 Side wall 203 and portion top surface 204.As shown in Figure 1B, the protected material bed of material 206a of soft electronic structure 207 and first can cover respectively The different piece of the top surface 204 of lid substrate 202.In addition, the first protected material bed of material 206a is to surround soft electronic structure 207.Substrate The setting area of soft electronic structure 207 on 202 top surface 204 and the first protected material bed of material 206a setting area are each other not It is overlapping.In an embodiment of the present invention, forming the first protected material bed of material 206a may include carrying out a coating process, film-plating process Or fitting processing procedure, with one first protection materials of formation on electret carrier 200.In an alternative embodiment of the invention, above-mentioned painting Cloth processing procedure may include method of spin coating (spin coating), ramp type rubbing method (slide coating), screen painting method (screen printing), curtain method (curtain coating), slit coating method (slot coating), change Learn deposition or physical deposition methods.Afterwards, above-mentioned first protection materials are carried out with a hardening processing procedure, with electret carrier 200 Form the first protected material bed of material 206a.In an embodiment of the present invention, it may be UV cured method (UV to harden processing procedure ) or thermmohardening method (thermal curing) curing.In an embodiment of the present invention, the first protected material bed of material 206a can have Stop the function of water oxygen, can prevent aqueous vapor or air etc. from being contacted with electrostatic charge and reducing the absorption affinity of substrate 202, avoid electret Electrostatic charge in carrier 200 may be in wet process with being lost in during vacuum process.Wherein, the first protected material bed of material 206a can be assisted Help fixed and protective substrate 202.In an embodiment of the present invention, the first protected material bed of material 206a can be identical material with substrate 202 Matter.In an embodiment of the present invention, the first protected material bed of material 206a material may include to be coated with, the material of plated film or fitting, Such as polymeric material, adhesive tape, dry film photoresist or the nothing such as polyimides (PI), polyethylene terephthalate (PET) Machine material is such as semiconductor, conductor or non-conductive material.In an embodiment of the present invention, the first protected material bed of material 206a thickness Thickness (the top surface 204 of substrate 202 bottom of to of substrate 202 can be more than by spending (distance of the first protected material bed of material 206a top surfaces to bottom surface) The distance in face 205).In an embodiment of the present invention, the electret carrier 200 shown in Figure 1B, substrate 202, the first protection materials Layer 206a and soft electronic structure 207 are to form substrate adsorption structure 500a.
Fig. 1 C are refer to, a cutting processing procedure are carried out to substrate adsorption structure 500a using a cutting tool 300, along substrate 202 normal direction sequentially cuts the first protected material bed of material 206a and substrate 202 along the periphery of soft electronic structure 207.
Fig. 1 D, Fig. 1 E show respectively soft electronic component 211a before carrying out after cutting processing procedure and removing processing procedure, 211b.As shown in figure iD, in an embodiment of the present invention, cutting processing procedure can be carried out along the side wall 203 of substrate 202, base will be located at Part the first protected material bed of material 206a outside the side wall 203 of plate 202 separates with soft electronic structure 207.Therefore, cutting processing procedure is carried out Soft electronic component 211a afterwards can also be wrapped in addition to including electret carrier 200, substrate 202 and soft electronic structure 207 Include part the first protected material bed of material 206a on the portion top surface 204 of substrate 202.As referring to figure 1E, it is another in the present invention In embodiment, cutting processing procedure can be carried out along the outside of soft electronic structure 207, by the first protected material bed of material 206a and soft electronic Structure 207 separates.Therefore, carrying out the soft electronic component 211b after cutting processing procedure includes electret carrier 200, substrate 202 and soft electronic structure 207.
After processing procedure is cut, one can be carried out and remove processing procedure, by substrate 202 and the soft electronic structure being formed thereon 207 are removed together, to form flexible electronic device 211d, 211e, as shown in Fig. 1 F, Fig. 1 G.Fig. 1 F, Fig. 1 G are shown to soft respectively Property electronic building brick 211a, 211b carry out removing processing procedure.Fig. 1 F, Fig. 1 G are refer to, in an embodiment of the present invention, using for example The interface that one mechanical taking off tool 302 is stretched between substrate 202 and electret carrier 200, with to soft electronic component 211a, 211b carries out one and removes processing procedure, so that flexible electronic device 211d, 211e after cutting departs from from electret carrier 200, wherein Mechanical taking off tool 302 may include scraper.
Fig. 2A~Fig. 2 D be different embodiments of the invention carrying soft electronic structure substrate adsorption structure 500b, 500b-1,500b-2,500c diagrammatic cross-section, show the first protected material bed of material of different embodiments of the invention.It refer to figure 2A, in an embodiment of the present invention, carry the substrate adsorption structure 500b of soft electronic structure the first protected material bed of material 206b The top surface 204 and side wall 203 of substrate 202 is completely covered.In the present embodiment, substrate adsorption structure 500b the first protection materials Layer 206b minimum area A2 can design the minimum area A1 more than substrate 202.In such as Fig. 2A profile, on substrate 202 It is to be correspondingly arranged a soft electronic structure 207, and the border of soft electronic structure 207 is not over the side of counterpart substrate 202 Boundary, soft electronic structure 207 can be the first protected material bed of material 206b that part covering is located under it.
In the other embodiment of the substrate adsorption structure with the first protected material bed of material, electret carrier 200 can carry Multiple substrates 202.Fig. 2 B are refer to, in an alternative embodiment of the invention, carry the substrate adsorption structure of soft electronic structure 500b-1 electret carrier 200 is the multiple substrates 202 being spaced apart of carrying, and the He of top surface 204 of above-mentioned multiple substrates 202 Side wall 203 can be covered by same first protected material bed of material 206b.In such as Fig. 2 B profile, it can divide on each substrate 202 A soft electronic structure 207 is not correspondingly arranged, and the border of soft electronic structure 207 is not over the side of counterpart substrate 202 Boundary.Therefore, each soft electronic structure 207 can be the first protected material bed of material 206b that part covering is located under it.
Fig. 2 C are refer to, in still another embodiment of the process, carry the substrate adsorption structure 500b-2 of soft electronic structure Electret carrier 200 be the multiple substrates 202 being spaced apart of carrying, and the top surface 204 and side wall of above-mentioned multiple substrates 202 203 are completely covered by multiple the first protected material bed of material 206b being spaced apart respectively.Also, in such as Fig. 2 C profile, respectively A soft electronic structure 207 is correspondingly arranged on individual substrate 202 respectively, and the border of soft electronic structure 207 is not over right Answer the border of substrate 202.Therefore, each soft electronic structure 207 is that part covers the first protected material bed of material 206 under it.
Fig. 2 D are refer to, Fig. 2 D are the substrate adsorption structure 500c of the carrying soft electronic structure of different embodiments of the invention Diagrammatic cross-section.In an embodiment of the present invention, can design has in substrate adsorption structure 500c electret carrier 200a One groove 212, and substrate 202 is disposed in groove 212, a bottom surface 213 of its further groove 212 and a side wall 214 are adjacent respectively It is connected to a bottom surface 205 and the side wall 203 of substrate 202.In the present embodiment, substrate adsorption structure 500c the first protection materials Layer 206c only covers the top surface 204 of substrate 202.In the present embodiment, the first protected material bed of material 206c material may include glue Band or thin-film material.In addition, thin-film material can include the photoresistance of dry film.
Can in substrate adsorption structure increase by one layer of tired electroelectret layer, with increase the electret carrier of substrate adsorption structure and Electrostatic adhesive force between substrate.Fig. 3 A are to show one second for being arranged at substrate 202 and being carried out afterwards on electret carrier 200 Charge processing procedure.3B-3J figures are the substrate adsorption structure 500d-500l of the carrying soft electronic structure of different embodiments of the invention Diagrammatic cross-section, show the tired electroelectret layers of different embodiments of the invention.Fig. 3 A show another embodiment of the present invention Include the substrate adsorption structure 500d of a tired electroelectret layer 216, and show simultaneously and substrate 202 is arranged at electret carrier The one second charging processing procedure carried out after on 200.In the present embodiment, the accumulation amount of electrostatic charge for tiring out electroelectret layer 216 can be high In substrate 202.In the present embodiment, before substrate 202 is set on electret carrier 200, tired electroelectret layer 216 is set In on the top surface 201 of electret carrier 200.In the present embodiment, substrate adsorption structure 500d can not have the first protective layer. In the present embodiment, substrate adsorption structure 500d can be arranged to the load with the first electrode plate 222 for being coupled to earth terminal Plate 220 and it is coupled between the tired electric corona pin 224 of a positive voltage, and electret carrier 200 connects with first electrode plate 222 Touch.As shown in Figure 3A, when carrying out the second charging processing procedure to the substrate adsorption structure 500d with tired electroelectret layer 216, tire out The high electric field of electric corona pin 224 can promote electret carrier 200 and substrate 202 to mend and catch more charge, such as electret carrier 200 More positive electrostatic charges 400 and negative electrostatic charge 406 can be carried close at top surface 201 and bottom surface respectively, and for example in substrate 202 More positive electrostatic charges 404 and negative electrostatic charge 402 can be carried close at top surface 204 and bottom surface 205 respectively.Therefore, electric electret is tired out Body layer 216 can increase the quantity of the electrostatic charge 400,402 attracted one another between substrate 202 and electret carrier 200.Then, in Soft electronic structure 207 is made on the top surface 204 of substrate 202, and the border of soft electronic structure 207 can be no more than counterpart substrate 202 border.After above-mentioned processing procedure, the substrate adsorption knot of carrying soft electronic structure 207 as shown in Figure 3 B is formed into Structure 500d.In an embodiment of the present invention, at least surface for tiring out electroelectret layer 216 contacts with substrate 202.In the present embodiment In, tired electroelectret layer 216 is arranged between the bottom surface 205 of substrate 202 and the top surface 201 of electret carrier 200.In the present invention In one embodiment, the material of tired electroelectret layer 216 may include such as silica-base material, aluminum oxide (Al2O3), zinc oxide (ZnO), Barium monoxide (BaO), tantalum oxide (Ta2O3), barium titanate (BaTiO3), the inorganic material or example of lead zirconate titanate (PZT) or combinations thereof Such as Teflon (teflon), polytetrafluoroethylene (PTFE) (PTFE), fluorinated ethylene propylene (FEP) (FEP), polyvinyl chloride (PVC), Kynoar (PVDF), trifluoro-ethylene copolymer (ECTFE), polymethyl methacrylate (PMMA), hexafluoropropene (FHP), polypropylene (PP) Or the organic material of combinations thereof.In an embodiment of the present invention, such as the tired electroelectret layer 216 of silica-base material can be polycrystalline Or the semiconductor or insulator of amorphous, such as silica (SiOx), silicon nitride (SiNx), carborundum (SiC), silicon wafer insulator Or magnesium silicide (Mg (SOI)2Si), it also may include following silicon-based inorganic compound, such as silicon boride, amorphous sial, bismuth silica Compound, polysilicon halide, polysilicon hydrogen compound or silicon monoxide.In addition, for example, tired electric electret of Teflon (teflon) Body layer 216 can be simultaneously as optical layer, anti-soil layer or the gas-bearing formation that blocks water.Also, carry out such as Fig. 1 F, Fig. 1 G remove processing procedure it Afterwards, the substrate 202 departed from from electret carrier 200 can be attached to one with tired electroelectret layer 216 and soft electronic structure 207 Rise.
As shown in Fig. 3 C, Fig. 3 D, Fig. 3 E, in other embodiments of the present invention, the position of tired electroelectret layer can design position In the centre position of the substrate on the top surface of substrate or positioned at tool sandwich construction.As shown in Figure 3 C, soft electronic structure is carried 207 substrate adsorption structure 500e tired electroelectret layer 216 may be disposed on the top surface 204 of substrate 202.As shown in Figure 3 D, The substrate 202 for carrying the substrate adsorption structure 500f of soft electronic structure 207 is a sandwich construction, and it has at least one for the first time Layer 202a and at least one second sublevel 202b.In the present embodiment, the first sublevel 202a and the second sublevel 202b of substrate 202 can It is spaced apart by tired electroelectret layer 216.In the present embodiment, can be carried after electret carrier 200 is formed in electret First sublevel 202a is set on the top surface 201 of tool 200.Then, in the tired electroelectret layer 216 of setting one on the first sublevel 202a. Afterwards, in one second sublevel 202b of setting on tired electroelectret layer 216.In the present embodiment, substrate adsorption structure 500e can not With the first protective layer.As shown in FIGURE 3 E, the substrate adsorption structure 500g of soft electronic structure 207 tired electroelectret layer is carried 216 can be completely covered the top surface 204 and side wall 203 of substrate 202.In the present embodiment, electroelectret layer 216 is tired out except with increasing Outside the function of adding the electrostatic adhesive force between substrate adsorption structure 500g electret carrier and substrate, can also have and Fig. 2A The first shown protected material bed of material 206a identical functions.
As shown in Fig. 3 F~Fig. 3 H, in other embodiments of the present invention, substrate adsorption structure can include tiring out electric electret simultaneously Body layer and the first protective layer.As illustrated in Figure 3 F, carrying the substrate adsorption structure 500h of soft electronic structure 207 includes the first protection Layer 206b and tired electroelectret layer 216.In the present embodiment, substrate adsorption structure 500h tired electroelectret layer 216 is arranged at Between the bottom surface 205 of substrate 202 and the top surface 201 of electret carrier 200.In the present embodiment, substrate adsorption structure 500h Top surface 201, the top surface 204 and side wall 203 of substrate 202 of first protective layer 206b covering electrets carrier 200, and covering are tired The side wall 217 of electroelectret layer 216.In embodiment as shown in Figure 3 G, the substrate adsorption structure of carrying soft electronic structure 207 500i tired electroelectret layer 216 is arranged on the top surface 204 of substrate 202, and substrate adsorption structure 500i the first protective layer The top surface 201 of 206b covering electrets carrier 200, the side wall 203 of substrate 202, and the top surface of the tired electroelectret layer 216 of covering 218 and side wall 217.In embodiment as shown in figure 3h, substrate adsorption structure 500j tired electroelectret layer 216 is arranged at substrate Between 202 the first sublevel 202a and the second sublevel 202b, and substrate adsorption structure 500j the first protective layer 206b coverings are stayed The top surface 201 of polar body carrier 200, the first sublevel 202a of substrate 202 side wall 203a, the second sublevel 202b top surface 204b and Side wall 203b, and the side wall 217 of the tired electroelectret layer 216 of covering.
As shown in Fig. 3 I~Fig. 3 J, in other embodiments of the present invention, the substrate adsorption knot of carrying soft electronic structure 207 Structure 500k, 500l tired electroelectret layer include multiple tired electroelectret patterns 316 for being spaced apart, respectively with substrate 202 Portion bottom surface 205 contacts with the top surface 201 of part electret carrier 200.Due to tire out electroelectret pattern 316 configuration only with base The portion bottom surface 205 of plate 202 contacts with the top surface 201 of part electret carrier 200, therefore close to electret carrier 200 and base The distribution of the electrostatic charge 400,402 at the interface between plate 202 can also correspond to the set location of tired electroelectret pattern 316.Such as In embodiment shown in Fig. 3 I, the substrate adsorption structure 500k of carrying soft electronic structure 207 can not have the first protective layer.Such as In embodiment shown in Fig. 3 J, substrate adsorption structure 500l is that have the first protective layer 206b, and the first protective layer 206b is covered The top surface 201 of electret carrier 200, the top surface 204 of substrate 202 and side wall 203, and the tired electroelectret pattern 316 of covering Side wall 317.
Fig. 4 A, Fig. 4 B are the top view of the tired electroelectret pattern of the substrate adsorption structure of different embodiments of the invention, are shown Show tired electroelectret pattern 316a, 316b of different embodiments of the invention configuration.In an embodiment of the present invention, substrate adsorption Structure has multiple tired electroelectret pattern 316a, 316b parallel to each other, in a top view, tires out electroelectret pattern 316a, 316b are respectively parallel to an edge of substrate, and in the above-mentioned edge of substrate.As shown in Fig. 4 A, Fig. 4 B, in this hair In a bright embodiment, the substantially multiple annular concentric coils of electroelectret pattern 316a, 316b are tired out.In reality as shown in Figure 4 A Apply in example, each tired electroelectret pattern 316a is high tired electric layer position distribution, tire out electric charge polarity can be positive polarity or Negative polarity.In addition, in embodiment as shown in Figure 4 A, tired electroelectret pattern 316a can be designed with multiple edge strengthening knots Structure 316a1, above-mentioned edge strengthening structure 316a1 shape may be, for example, T fonts.In an embodiment of the present invention, the side of T fonts Edge-reinforcing structure 316a1 narrower bottom can be connected with edge strengthening structure 316a1.In an embodiment of the present invention, can design Tired the electroelectret pattern 316a and mesosphere of outmost turns tired electroelectret pattern 316a edge strengthening structure 316a1 are each other It is staggered.In embodiment as shown in Figure 4 B, each tired electroelectret pattern 316b is high tired electric layer position distribution, is tired out Electric charge polarity can be positive polarity or negative polarity.
In other embodiments of the present invention, it can embed that parallel to each other and what is be spaced apart multiple leads in electret carrier 200 Line, change the distribution of electrostatic charge in a manner of extra electric field, remove with the cutting after collocation and mechanically processing procedure.Fig. 5 A are this The substrate adsorption structure 500m of another embodiment diagrammatic cross-section is invented, show one embodiment of the invention is embedded in electret Wire 230 (including wire 230a, 230b, 230c) in carrier 200, and show that substrate 202 is arranged at into electret carries simultaneously The one second charging processing procedure carried out after on tool 200.It can be filled after an insulation carrier is provided and to insulation carrier progress first Before electric processing procedure, in the embedded multiple wires 230 being spaced apart of insulation carrier, the wherein close insulation carrier of wire 230 and substrate An interface between 202.As shown in Figure 5A, carry out the first charging processing procedure to be formed after electret carrier 200, wire 230 is to set Put close to the interface (or top surface 201 close to electret carrier 200) between electret carrier 200 and substrate 202 and each other It is parallel.Each wire 230 can be respectively coupled to grounding ports, positive voltage or negative voltage, with close to the He of electret carrier 200 Interface between substrate 202 produces an extra electric field, makes static charge buildup in the stronger distributed areas of electric field (such as Fig. 5 A void Line).For example, when carrying out the second charging processing procedure, the tired electric corona pin 224 above substrate 202 may be coupled to a positive electricity Pressure, and the wire 230a being positioned proximate in the edge of substrate 202 is coupled to a positive voltage；Wire 230c is coupled to a negative electricity Pressure, and wire 230b is coupled to a ground voltage, now, (just) electrostatic charge 404 of substrate 202 can be close to substrate 202 The position (such as in Fig. 5 A close to the position of side wall 203) at the edge of top surface 204 forms aggregation, (negative) electrostatic charge 402 of substrate 202 It can assemble close to the position (such as in Fig. 5 A bottom surfaces 205 close to the position of side wall 203) at the edge of bottom surface 205 of substrate 202.
In making soft electronic structure 207 on the top surface 204 of substrate 202, and the border of soft electronic structure 207 can not surpass Cross the border of counterpart substrate 202.After above-mentioned processing procedure, carrying soft electronic structure 207 as shown in Figure 5 B is formed into Substrate adsorption structure 500m-1.As shown in Figure 5 B, carrying the substrate adsorption structure 500m-1 of soft electronic structure 207 can also include The first the protective layer 206a, the first protective layer 206a for covering the substrate 202 of electret carrier 200 is to surround soft electronic structure 207.By applying voltage to above-mentioned wire, to change the distribution mode of electrostatic charge, after cutting processing procedure is carried out, electrostatic charge point The region of cloth comparatively dense can separate (close to the position at the edge of substrate 202) with flexible electronic device, can help to be taken Lower processing procedure, flexible electronic device part is set to be easier to be removed because of electrostatic charge distribution loosely (negligible amounts).
Fig. 5 C, Fig. 5 D are embedded in the electret carrier 200 as shown in Fig. 5 A, Fig. 5 B for different embodiments of the invention The top view of wire 230 (including wire 230a, 230b, 230c), shows the configuration of the wire 230 of different embodiments of the invention. In an embodiment of the present invention, in a top view, the edge that wire 230a, 230b, 230c are respectively parallel to substrate (such as is schemed The position of side wall 203 of substrate 202 shown in 5A).As shown in Fig. 5 C, Fig. 5 D, in an embodiment of the present invention, wire 230a, The substantially multiple annular concentric coils of 230b, 230c.As shown in Figure 5 C, in an embodiment of the present invention, it is positioned proximate in base The wire 230a at the edge (such as position of side wall 203 of the substrate 202 shown in Fig. 5 A) of plate 202 is coupled to a positive voltage (sign For "+"), a negative voltage (being denoted as "-") is coupled to by the wire 230c that wire 230a is surrounded, and led by what wire 230c was surrounded Line 230b is coupled to a ground voltage (being denoted as " ground ").In an alternative embodiment of the invention, wire 230a may be coupled to One negative voltage, and wire 230c is coupled to a positive voltage.Also, in embodiment as shown in Figure 5 D, it is positioned proximate in substrate The wire 230a at 202 edge is coupled to a positive voltage (being denoted as "+"), and one is coupled to by the wire 230b that wire 230a is surrounded Ground voltage (is denoted as " ground "), and the wire 230c that wire 230b is surrounded is coupled to a negative voltage (being denoted as "-").Class As, in an alternative embodiment of the invention, wire 230a may be coupled to a negative voltage, and wire 230c is coupled to a positive voltage.
In other embodiments of the present invention, the wire 230a in the electret carrier 200 as shown in Fig. 5 A~Fig. 5 D, The voltage of 230b, 230c coupling can have different combinations, and the mode of above-mentioned different extra electric field can also change electrostatic charge Distribution, removes with the cutting after collocation and mechanically processing procedure.In other embodiments of the present invention, can design such as Fig. 5 A~Fig. 5 D Shown wire 230a is coupled to the one of which of a positive voltage, a negative voltage or a ground voltage, and wire 230b is coupled to One positive voltage, a negative voltage or a ground voltage it is wherein another, and wire 230c be coupled to a positive voltage, a negative voltage or The residue of one ground voltage is a kind of.For example, when design wire 230a is coupled to a negative voltage, wire 230b couplings can be designed Ground voltage is coupled to a positive voltage and wire 230c.Or design wire 230a can be designed and led when being coupled to a negative voltage Line 230b is coupled to a ground voltage and wire 230c is coupled to positive voltage.For as another example, the 230a couplings of design wire During to a ground voltage, it can design that wire 230b is coupled to a positive voltage and wire 230c is coupled to a negative voltage.Or design When wire 230a is coupled to a ground voltage, it can design that wire 230b is coupled to a negative ground voltage and wire 230c is coupled to positive electricity Pressure.
In other embodiments of the present invention, can be after substrate 202 be set on electret carrier 200, in electret carrier 200 are not set a liquid guide flow layer on top surface 201 that substrate 202 covers, are protected in favor of for example forming first with coating process During protective material, because the characteristic, electrically charged polarity or surface roughness of liquid guide flow layer material material hydrophilic/hydrophobic itself produce Capillarity cause above-mentioned first protection materials to be easy to flow toward the direction of above-mentioned liquid guide flow layer surface, and can avoid State the interface that the first protection materials are penetrated between substrate and electret carrier during coating process and reduce substrate and electret Absorption affinity between carrier.Fig. 6 A~Fig. 6 C are the substrate adsorption of the carrying soft electronic structure 207 of different embodiments of the invention Structure 500n, 500p, 500q diagrammatic cross-section, show the liquid guide flow layer 232a-232c of different embodiments of the invention.Such as figure Shown in 6A~Fig. 6 C, liquid guide flow layer 232a-232c is disposed between the first protected material bed of material 206b and electret carrier 200 An interface on.As shown in Figure 6A, in an embodiment of the present invention, liquid guide flow layer 232a may include a hydrophobic film. In one embodiment of the invention, compound (such as silicon of the hydrophobic film for example including fluorine-containing serial polymer or siloxane series Oxygen alkane/polyurethane film, dimethyl silicone polymer (PDMS)), containing one or more fluorinated groups (such as perfluoroalkyl, Perfluoroether and perfluoropolyether group) silane compound or combinations thereof.Such as photoresistance is thus formed with coating process first During protected material bed of material 206b, hydrophobic first protected material bed of material 206b material can be along direction 601 to for example, hydrophobicity The liquid guide flow layer 232a flowings of film.As shown in Figure 6B, in an alternative embodiment of the invention, liquid guide flow layer 232b may include One positive charge layer or a negatively charged layers, thus with coating process formed such as photoresistance the first protected material bed of material 206b when, first Protected material bed of material 206b material can be because electrostatic attraction be along direction 603 to for example, positive charge layer or the liquid of negatively charged layers Guide layer 232b flows.As shown in Figure 6 C, in an alternative embodiment of the invention, liquid guide flow layer 232c can have a coarse table Face, thus with coating process formed such as photoresistance the first protected material bed of material 206b when, the first protected material bed of material 206b material It can be flowed because having capillarity caused by the liquid guide flow layer 232c of rough surface along direction 605 to liquid guide flow layer 232c.
Fig. 7 A~Fig. 7 B be the carrying soft electronic structure 207 of different embodiments of the invention substrate adsorption structure 500r, 500s diagrammatic cross-section, the second protected material bed of material 236a, 236b of different embodiments of the invention is shown, in electret carrier Before setting substrate 202 on 200, it can be designed at being formed to surround one second protected material of substrate 202 on electret carrier 200 The bed of material 236a, above-mentioned second protected material bed of material 236a have barrier functionality, can avoid forming the first protected material bed of material 206d Period, interface that the first protected material bed of material 206d is penetrated between substrate 202 and electret carrier 200 and reduce substrate 202 and stay Absorption affinity between polar body carrier 200.In an embodiment of the present invention, using depositional mode (or for coating, printing attach Mode) and the second protected material bed of material 236a of follow-up patterning process formation.As shown in Figure 7 A, soft electronic structure 207 is carried Substrate adsorption structure 500r the second protected material bed of material 236a surround substrate 202, and the second protected material bed of material 236a can with The top surface 201 of polar body carrier 200 and the side wall 203 of substrate 202 contact.In the present embodiment, the first protected material bed of material 206d is not Cover the top surface 201 of (contact) electret carrier 200.As shown in Figure 7 B, in the present embodiment, soft electronic structure 207 is carried Substrate adsorption structure 500s the second protected material bed of material 236b surround substrate 202, and with the top surface 201 of electret carrier 200 Contact.Second protected material bed of material 236b is separated by the first protected material bed of material 206e with substrate 202.
Fig. 8 A, Fig. 8 B remove processing procedure for the substrate adsorption structure applied to different embodiments of the invention, can be described as machinery again Remove processing procedure.Fig. 8 A, Fig. 8 B are to carry out removing system to carry out the soft electronic component 211c after cutting processing procedure as embodiment Journey.Above-mentioned soft electronic component 211c includes substrate 202, the first protected material bed of material 206b and soft electronic structure 207, and first Protected material bed of material 206b separates substrate 202 and soft electronic structure 207.However, remove processing procedure as shown in Fig. 8 A, Fig. 8 B The soft electronic component of other embodiments of the invention is can be applied to, is not limited to the present invention.As shown in Figure 8 A, cut After cutting processing procedure, using a taking off tool 302a of one curved surface 303 of tool, the curved surface 303 of taking off tool is glued with roll mode A top surface 209a of soft electronic structure 207 is labelled to carry out removing processing procedure.Carry out that during removing processing procedure soft electronic knot can be made The top surface 209a of structure 207 affixes to the curved surface 303 of taking off tool, so that the substrate 202 after cutting is from the top of electret carrier 200 Face 201 departs from.Or as shown in Figure 8 B, in an alternative embodiment of the invention, using taking off tool 302a2 absorption for example One top surface 209b of substrate adsorption structure 500b soft electronic structure 207 mode carries out one and removes processing procedure, so that after cutting Substrate 202 depart from from the top surface 201 of electret carrier 200.
Fig. 9 A~Fig. 9 D show the processing procedure of the electret carrier sandwich construction of the substrate adsorption structure of one embodiment of the invention Diagrammatic cross-section.Fig. 9 A~Fig. 9 C are please also refer to, in an alternative embodiment of the invention, in a manner of similar to shown in Figure 1A, Respectively multiple insulating barriers are carried out with one first charging processing procedure, electrostatic charge is injected separately into above-mentioned multilayer dielectric layer, to be formed respectively Multiple electret layer 902a, 902b, 902c.Then, multiple electret layer 902a, 902b, 902c are stacked, to be formed such as Fig. 9 D institutes The electret carrier sandwich construction 900 shown.Aforesaid way can increase or control the electret carrier sandwich construction 900 of formation Amount of electrostatic charge and its stability.
Figure 10 A, Figure 10 B are that the soft electronic component of other embodiments of the invention removes processing procedure, again can be described as neutralizing quiet Electrical method removes processing procedure.Figure 10 A, Figure 10 B are to carry out the flexible electronic device 211f after cutting processing procedure to carry out removing processing procedure. Above-mentioned flexible electronic device 211f is to include substrate 202, the first protected material bed of material 206b and soft electronic structure 207, and first Protected material bed of material 206b is between substrate 202 and soft electronic structure 207.In an embodiment of the present invention, can be soft to carrying Property electronic structure 207 substrate adsorption structure 500b (Fig. 2A) cut processing procedure to form above-mentioned flexible electronic device 211f. However, the soft electronic component removed processing procedure and can also be applied to other embodiments of the invention as shown in Figure 10 A, Figure 10 B, not To limit the present invention.As shown in Figure 10 A, in an alternative embodiment of the invention, after carrying out cutting processing procedure, removed using one Tool platform 302b removes processing procedure neutralize electrostatic method.Such as substrate adsorption structure 500b is arranged at taking off tool platform Above 302b, the embedded multiple wires 330 being spaced apart of wherein taking off tool platform 302b, wherein wire 330 is positioned proximate to stay One bottom surface of polar body carrier 200 and parallel to each other.To be positioned proximate to couple of conductor 330a in the edge of electret carrier 200, 330b is respectively coupled to a positive voltage and a ground voltage, and wire 330c, 330d of setting interlaced with each other are respectively coupled to One positive voltage and a ground voltage, or wire 330a, 330b, 330c, 330d are coupled to AC power.By being led to above-mentioned Line applies electric field, to neutralize the electrostatic charge between electret carrier 200 and substrate 202, makes electret carrier 200 and substrate 202 It is easier to be removed because of electrostatic charge distribution loosely (negligible amounts).As shown in Figure 10 B, carry out after removing processing procedure, it is soft Electronic installation 211f substrate 202 can depart from electret carrier 200, and substrate 202 is still covered by the first protected material bed of material 206b Lid.
Figure 11 A, Figure 11 B are to remove processing procedure applied to the soft electronic components of different embodiments of the invention, as Figure 11 A, Processing procedure of removing shown in Figure 11 B removes processing procedure for another electrostatic method that neutralizes.Figure 11 A, Figure 11 B are to carry soft electronic structure Remove processing procedure exemplified by 207 substrate adsorption structure 500c, but removing processing procedure and can also answer as shown in Figure 11 A, Figure 11 B For the substrate adsorption structure of other embodiments of the invention, the present invention is not limited to.As shown in Figure 11 A, cutting system is carried out After journey, microscope carrier 302c is removed using one, and the accumulation amount of electrostatic charge for removing microscope carrier 302c is higher than such as substrate adsorption knot The electret carrier 200 and substrate 202 of structure 500c substrate adsorption structure (make to remove microscope carrier and are more than electret to the absorption affinity of substrate Absorption affinity of the body carrier to substrate) mode carry the substrate adsorption structure 500c of soft electronic structure 207 neutralization Electrostatic method removes processing procedure, substrate 202 is electrostatically adsorbed to removing on microscope carrier 302c and departs from electret carrier 200.At this Invent in an embodiment, a charging processing procedure can be carried out to removing microscope carrier 302c and then taken using the high accumulation amount of electrostatic charge of tool The mode of download desk 302c sorbing substrates 202 carry the substrate adsorption structure 500c of soft electronic structure 207 neutralization Electrostatic method removes processing procedure.In other embodiments of the present invention, can simultaneously to remove microscope carrier 302c and set remove microscope carrier 302c in The substrate adsorption structure 500c of top carries out a charging processing procedure, and make the high accumulation amount of electrostatic charge of tool removes microscope carrier 302c sorbing substrates 202 mode removes processing procedure to carry out substrate adsorption structure 500c neutralization electrostatic method.As shown in Figure 11 A, in the present embodiment, The substrate adsorption structure 500c that carry soft electronic structure 207 can be arranged at and remove microscope carrier 302c be coupled to earth terminal And be coupled between the tired electric corona pin 323 of a negative voltage or positive voltage (Figure 11 A are negative voltage), while to removing microscope carrier 302c and substrate adsorption structure 500c carry out the mode of a charging processing procedure carry the substrate adsorption of soft electronic structure 207 Structure 500c neutralization electrostatic method removes processing procedure, and wherein substrate adsorption structure 500c substrate 202 is to approach to remove microscope carrier 302c. During above-mentioned charging processing procedure, 200 bands of original substrate 202 and electret carrier can be neutralized by tiring out the high electric field of electric corona pin 323 Electrostatic charge 408 (negative electrical charge), produce new electrostatic charge 408-1 (negative electrical charge) and electrostatic charge 410 (positive charge) in addition in substrate 202 and microscope carrier 302c is removed, thus make to remove microscope carrier 302c and electret carrier 200 is more than to substrate to the absorption affinity of substrate 202 202 absorption affinity.As shown in Figure 11 B, carry out it is above-mentioned remove processing procedure (charging processing procedure) after, the electret carrier 200 after cutting It can depart from substrate 202, and the protected material bed of material 206b of substrate 202 and first for carrying soft electronic structure 207 can be adsorbed to Remove on microscope carrier 302c.
Figure 12~Figure 23 shows the electrostatic attached to electrostatic with reference to flexible base plate and support plate of different embodiments of the invention Attaching device and processing procedure, the electrostatic of above-described embodiment attach processing procedure and are also known as piece to piece processing procedure (sheet to sheet process).Refer to Figure 12, the electrostatic attaching device 1500a of one embodiment of the invention include a carrier plate transmission platform 1201, Charging device 1206 and 1208 and a sticking type device 1210.In an embodiment of the present invention, carrier plate transmission platform 1201 is to use With the flexible base plate 1214 for carrying and transmitting support plate 1212 or be arranged on support plate 1212.In embodiments of the present invention, support plate Transmission platform 1201 includes a conveyer belt 1202 and at least two roller bearings 1200.As shown in figure 12, conveyer belt 1202 is cladding two The outer surface of individual roller bearing 1200, and above-mentioned two roller bearing 1200 is driven by its frictional force between conveyer belt 1202, is made defeated Band 1202 is sent to continuously run.In an embodiment of the present invention, charging device 1206 and 1208 is arranged at carrier plate transmission platform 1201 On, charging device 1206 is to will at least 10-7Coulomb/cm2Electrostatic charge injection support plate 1212 so that support plate 1212 produce electrostatic Lotus turns into the support plate 1212a with electrostatic charge to adsorb a bottom surface of a substrate (such as flexible base plate 1214).In the present invention one In embodiment, support plate 1212a can be an electret carrier.In addition, charging device 1208 is to will at least 10-7Coulomb/cm2It is quiet Electric charge injects flexible base plate 1214, so that flexible base plate 1214 produces an electrostatic charge and turns into the flexible base plate with electrostatic charge 1214a is to increase the electrostatic adsorption force between the support plate 1212a and flexible base plate 1214a with electrostatic charge that carry electrostatic charge. In one embodiment of the invention, charging device 1206,1208 may include a corona discharge charging device, liquid contact charging dress Put, a vacuum electronic gun charging device, one friction send a telegraph device or an electrical breakdown charging device.In embodiments of the present invention, fill Electric installation 1206 includes being coupled to the tired electric corona pin 1206a of a positive voltage (can also include negative voltage) and is coupled to earth terminal An electrode 1206b, and tire out electric corona pin 1206a and electrode 1206b can be respectively arranged at conveyer belt 1202 over and under, A part of the conveyer belt 1202 with body is set to be located at caused by charging device 1206 in electric field.Similarly, in one embodiment of the invention In, charging device 1208 includes being coupled to the tired electric corona pin 1208a of a positive voltage (can also include negative voltage) and is coupled to One electrode 1208b of earth terminal, and tired electric corona pin 1208a and electrode 1208b can be respectively arranged at the top of conveyer belt 1202 And lower section, a part of the conveyer belt 1202 with body is located at caused by charging device 1208 in electric field.As shown in figure 12, sticking type Device 1210 its flexible base plate 1214 is pasted on support plate 1212.In an embodiment of the present invention, sticking type device 1210 may include a pair of roller bearings 1210a, 1210b, conveyer belt 1202 is located in body between roller bearing 1210a, 1210b.At this Invent in another embodiment, roller bearing 1210a, 1210b there can be heating function in itself.In an alternative embodiment of the invention, attach Formula device 1210 may include the scraper being arranged on conveyer belt 1202 (figure is not shown).In an embodiment of the present invention, attach Formula device 1210, which can be removed further, is likely located at the support plate 1212a with electrostatic charge and the flexible base plate with electrostatic charge Residual bubble between 1214a, with increase the support plate 1212a with electrostatic charge and flexible base plate 1214a with electrostatic charge it Between electrostatic adsorption force.In an embodiment of the present invention, sticking type device 1210 may be disposed at an atmospheric pressure environment or subnormal ambient In, to lift the residual bubble being located between the support plate 1212a with electrostatic charge and the flexible base plate 1214a with electrostatic charge Removal efficiency.
Illustrate the electrostatic attaching that flexible base plate and support plate are combined to electrostatic attaching of one embodiment of the invention with Figure 12 Processing procedure, also known as piece are to piece processing procedure (sheet to sheet process).First, as shown in Figure 12 step 1302, by one Support plate 1212 is placed on the conveyer belt 1202 of carrier plate transmission platform 1201.Then, step 1304 is carried out, passes through carrier plate transmission platform Frictional force between 1201 two roller bearings 1200 and conveyer belt 1202, driving conveying belt 1202 are continuously run, by support plate 1212 It is sent in electrostatic attaching device 1500a charging device 1206 and carries out a charging processing procedure, will at least 10-7Coulomb/cm2Electrostatic Lotus injects support plate 1212 with as the support plate 1212a with electrostatic charge.In an embodiment of the present invention, support plate 1212a can be one Electret carrier.One flexible base plate 1214 is placed on the support plate 1212a with electrostatic charge.Then, step 1306, profit are carried out The support plate 1212a with electrostatic charge and flexible base plate thereon 1214 are sent to another fill together with carrier plate transmission platform 1201 Another road charging processing procedure is carried out in electric installation 1208, will at least 10-7Coulomb/cm2Electrostatic charge injection flexible base plate 1214 with into For the flexible base plate 1214a with electrostatic charge, to increase the support plate 1212a with electrostatic charge and the flexible base plate with electrostatic charge Electrostatic adsorption force between 1214a.The charging processing procedure of above-mentioned steps 1304 and 1306 may include corona discharge charging processing procedure, one Processing procedure or electrical breakdown charging processing procedure are sent a telegraph in liquid contact charging processing procedure, vacuum electronic gun charging processing procedure, a friction.Then, Carry out step 1308A, using carrier plate transmission platform 1201 by the support plate 1212a with electrostatic charge and thereon carry electrostatic charge Flexible base plate 1214a is sent in electrostatic attaching device 1500a sticking type device 1210 together carries out an attaching processing procedure, utilizes Flexible base plate 1214a of roller bearing 1210a, 1210b rolling with electrostatic charge and the support plate 1212a with electrostatic charge, removal carry Residual bubble between the flexible base plate 1214a of electrostatic charge and the support plate 1212a with electrostatic charge, by the flexible base plate with electrostatic charge 1214a is pasted on the support plate 1212a with electrostatic charge.
In the electrostatic attaching device 1500b of another embodiment of the present invention shown in Figure 13, sticking type device 1210 and fill The setting position of electric installation 1208 can exchange, and make piece to the substrate charging processing procedure of step 1306 in piece processing procedure with step 1308A's Attaching the order of processing procedure can exchange.As shown in figure 13, step 1304 is carried out, support plate 1212 is charged, and a flexible base plate 1214 are placed on the support plate 1212a with electrostatic charge.After carrying out step 1304, step 1308A is then carried out, utilizes support plate Flexible base plate 1214a with electrostatic charge of the transmission platform 1201 by the support plate 1212a with electrostatic charge and thereon is transmitted together One is carried out in electrostatic attaching device 1500b sticking type device 1210 and attaches processing procedure, is rolled using roller bearing 1210a, 1210b soft Property the substrate 1214 and support plate 1212a with electrostatic charge, remove between flexible base plate 1214 and support plate 1212a with electrostatic charge Residual bubble, flexible base plate 1214 is pasted on the support plate 1212a with electrostatic charge.Carry out step 1308A and then walked Rapid 1306, the support plate 1212a with electrostatic charge and flexible base plate thereon 1214 are passed together using carrier plate transmission platform 1201 Deliver in another charging device 1208 and carry out charging processing procedure, will at least 10-7Coulomb/cm2Electrostatic charge injection flexible base plate 1214 With as the flexible base plate 1214a with electrostatic charge, support plate 1212a of the increase with electrostatic charge and the soft base with electrostatic charge Electrostatic adsorption force between plate 1214a.
In the electrostatic attaching device 1500c of another embodiment of the present invention as shown in figure 14, sticking type device 1210-1 It may include a pair of roller bearings 1210a, 1210b and an electric calorifie installation 1218.As shown in figure 14, the sticking type dress of the embodiment of the present invention Roller bearing 1210a, the 1210b for putting 1210-1 are to be respectively arranged above and below conveyer belt 1202 and positioned opposite to each other, are made Conveyer belt 1202 is located between the two with body, and electric calorifie installation 1218 is positioned proximate in roller bearing 1210a, 1210b side, And positioned at the lower section of conveyer belt 1202.In an embodiment of the present invention, electric calorifie installation 1218 may include a thermal resistance wire heater, one Infrared heater, a storage heater, a quartz halogen heaters or a ceramic heater.In an embodiment of the present invention, When the support plate 1212a with electrostatic charge and the flexible base plate 1214 being arranged on are by electric calorifie installation 1218, electric calorifie installation 1218 can carry out a heating stepses to both the support plate 1212a with electrostatic charge and flexible base plate 1214, expel positioned at both it Between residual bubble, can further increase support plate 1212a and flexible base plate 1214 electrostatic adsorption force between the two.
The electrostatic of different embodiments of the invention shown in Figure 14 and Figure 12 attach processing procedure do not exist together for：Carrying out step After 1304 pairs of support plates 1212 charge, step 1308B is then carried out, using carrier plate transmission platform 1201 by the load with electrostatic charge Plate 1212a and flexible base plate 1214 thereon are sent in electrostatic attaching device 1500c sticking type device 1210-1 together Row one attaches processing procedure.Above-mentioned attaching processing procedure is first with electric calorifie installation 1218 to support plate 1212a and flexible base plate with electrostatic charge 1214 both one heating stepses of progress, expel the residual bubble positioned between the two.Rolled followed by roller bearing 1210a, 1210b Flexible base plate 1214 and the support plate 1212a with electrostatic charge, further remove flexible base plate 1214 and the load with electrostatic charge Residual bubble between plate 1212a, flexible base plate 1214 is pasted on the support plate 1212a with electrostatic charge.It can carry out again another Charging processing procedure (step 1306) together, will at least 10-7Coulomb/cm2Electrostatic charge inject flexible base plate 1214 with as with quiet The flexible base plate 1214a of electric charge, between increase the support plate 1212a with electrostatic charge and the flexible base plate 1214a with electrostatic charge Electrostatic adsorption force.
In an alternative embodiment of the invention, the roller bearing of sticking type device and electric calorifie installation can be integrated in same position, made The attaching processing procedure that support plate and flexible base plate are heated and pressurizeed.In the electrostatic paster of another embodiment of the present invention as shown in figure 15 In applying equipment 1500d, sticking type device 1210-2 may include a pair of roller bearings 1210a, 1210b and an electric calorifie installation 1218.Such as Shown in Figure 15, the sticking type device 1210-2 of the embodiment of the present invention roller bearing 1210a, 1210b are to be respectively arranged at conveyer belt Above and below in the of 1202 and positioned opposite to each other, electric calorifie installation 1218 is set between roller bearing 1210a, 1210b, and position In the lower section of conveyer belt 1202.In other words, a part for conveyer belt 1202 is positioned at the top of electric calorifie installation 1218, and conveying It can be located between a pair of roller bearings 1210a, 1210b with 1202 above-mentioned part and electric calorifie installation 1218.
The electrostatic of different embodiments of the invention shown in Figure 15 and Figure 14 attach processing procedure do not exist together for：Carrying out step After 1304 pairs of support plates 1212 charge, step 1308C is then carried out, using carrier plate transmission platform 1201 by the load with electrostatic charge Plate 1212a and flexible base plate 1214 thereon are sent in electrostatic attaching device 1500d sticking type device 1210-2 together Row one attaches processing procedure.Above-mentioned attaching processing procedure is using electric calorifie installation 1218 from the lower section of flexible base plate 1214 to the load with electrostatic charge Both plate 1212a and flexible base plate 1214 carry out a heating stepses, expel the residual bubble positioned between the two.Carry out heating step During rapid, using roller bearing 1210a, 1210b rolling flexible base plate 1214 and the support plate 1212a with electrostatic charge, can further it go Residual bubble except flexible base plate 1214 between the support plate 1212a with electrostatic charge, flexible base plate 1214 is pasted to and carried On the support plate 1212a of electrostatic charge.Carry out above-mentioned attaching processing procedure and then carry out another road charging processing procedure (step 1306), it is near Few 10-7Coulomb/cm2Electrostatic charge injection flexible base plate 1214 to be carried as the flexible base plate 1214a with electrostatic charge, increase Electrostatic adsorption force between the support plate 1212a of electrostatic charge and the flexible base plate 1214a with electrostatic charge.
In another embodiment of the present invention as shown in figure 16, electrostatic attaching device 1500e sticking type device 1210-3 An increased pressure board 1219 can also be included, same position is integrated in electric calorifie installation 1218, made with the support plate 1212a of electrostatic charge and soft The attaching processing procedure that property substrate 1214 is heated and pressurizeed.In the electrostatic attaching device 1500e of another embodiment of the present invention, patch Attached formula device 1210-3 may include a pair of roller bearing 1210a, 1210b, an electric calorifie installation 1218 and an increased pressure board 1219.Such as Figure 16 Shown, the sticking type device 1210-3 of the embodiment of the present invention roller bearing 1210a, 1210b are respectively arranged at conveyer belt 1202 Above and below and it is positioned opposite to each other, conveyer belt 1202 is located between the two with body.In addition, sticking type device 1210-3 Increased pressure board 1219 and electric calorifie installation 1218 be to be positioned proximate in roller bearing 1210a, 1210b side, and be respectively arranged at conveying With above and below 1202 and positioned opposite to each other, conveyer belt 1202 is set to be located between the two with body.
The electrostatic of different embodiments of the invention shown in Figure 16 and Figure 14 attach processing procedure do not exist together for：Carrying out step After 1304 pairs of support plates 1212 charge, step 1308D is then carried out, using carrier plate transmission platform 1201 by the load with electrostatic charge Plate 1212a and flexible base plate 1214 thereon are sent in electrostatic attaching device 1500e sticking type device 1210-3 together Row one attaches processing procedure.Above-mentioned attaching processing procedure is utilized positioned at the electric calorifie installation 1218 of the lower section of conveyer belt 1202 and positioned at conveyer belt 1202 Both support plate 1212a with electrostatic charge and flexible base plate 1214 are heated the increased pressure board 1219 of top simultaneously and pressurization step Suddenly, the residual bubble positioned between the two is expelled.Afterwards, using carrier plate transmission platform 1201 by the support plate with electrostatic charge 1212a and flexible base plate 1214 thereon are sent between roller bearing 1210a, 1210b together, utilize roller bearing 1210a, 1210b rolling Flexible base plate 1214 and the support plate 1212a with electrostatic charge are pressed, can further remove flexible base plate 1214 and with electrostatic charge Residual bubble between support plate 1212a, flexible base plate 1214 is pasted on the support plate 1212a with electrostatic charge.Carry out above-mentioned Attach processing procedure and then carry out another road charging processing procedure (step 1306), will at least 10-7Coulomb/cm2Electrostatic charge injection it is soft Substrate 1214 is so that as the flexible base plate 1214a with electrostatic charge, increase carries the support plate 1212a of electrostatic charge and with electrostatic charge Flexible base plate 1214a between electrostatic adsorption force.
Because increased pressure board 1219 as shown in figure 16 with roller bearing 1210a, 1210b has similar function, thus above-mentioned two Person can also select one and be arranged in sticking type device.In another embodiment of the present invention as shown in figure 17, has electrostatic attaching device 1500f sticking type device 1210-4 includes the increased pressure board 1219 that same position is integrated in electric calorifie installation 1218, makes with quiet The attaching processing procedure that the support plate 1212a and flexible base plate 1214 of electric charge are heated and pressurizeed, remove flexible base plate 1214 and carry Residual bubble between the support plate 1212a of electrostatic charge, to increase between support plate 1212a and flexible base plate 1214 with electrostatic charge Electrostatic adsorption force.
The electrostatic of different embodiments of the invention shown in Figure 17 and Figure 14 attach processing procedure do not exist together for：Carrying out step After 1304 pairs of support plates 1212 charge, step 1308E is then carried out, using carrier plate transmission platform 1201 by the load with electrostatic charge Plate 1212a and flexible base plate 1214 thereon are sent in electrostatic attaching device 1500f sticking type device 1210-4 together Row one attaches processing procedure.Above-mentioned attaching processing procedure is utilized positioned at the electric calorifie installation 1218 of the lower section of conveyer belt 1202 and positioned at conveyer belt 1202 Both support plate 1212a with electrostatic charge and flexible base plate 1214 are heated the increased pressure board 1219 of top and pressurization steps, The residual bubble positioned between the two is expelled, flexible base plate 1214 is pasted on the support plate 1212a with electrostatic charge.Carry out State and attach processing procedure and then carry out another road charging processing procedure (step 1306), will at least 10-7Coulomb/cm2Electrostatic charge injection it is soft Property substrate 1214 with as the flexible base plate 1214a with electrostatic charge, support plate 1212a of the increase with electrostatic charge and with electrostatic Electrostatic adsorption force between the flexible base plate 1214a of lotus.
In another embodiment of the present invention, as shown in figure 18, electric calorifie installation 1218a can be arranged to the top of conveyer belt 1202, Above-mentioned electric calorifie installation 1218a has the dual-use function of heating and pressurization.In the quiet of another embodiment of the present invention as shown in figure 18 In electric attaching device 1500g, sticking type device 1210-5 may include a pair of roller bearings 1210a, 1210b and an electric calorifie installation 1218a.As shown in figure 18, the sticking type device 1210-5 of embodiment of the present invention roller bearing 1210a, 1210b is to be respectively arranged at It is above and below conveyer belt 1202 and positioned opposite to each other, conveyer belt 1202 is located between the two with body, and electric heating fills Putting 1218a is positioned proximate in roller bearing 1210a, 1210b side, and positioned at the top of conveyer belt 1202.
The electrostatic of different embodiments of the invention shown in Figure 18 and Figure 14 attach processing procedure do not exist together for：Carrying out step After 1304 pairs of support plates 1212 charge, step 1308F is then carried out, using carrier plate transmission platform 1201 by the load with electrostatic charge Plate 1212a and flexible base plate 1214 thereon are sent in electrostatic attaching device 1500g sticking type device 1210-5 together Row one attaches processing procedure.Above-mentioned attaching processing procedure using electric calorifie installation 1218a from the top of the support plate 1212a with electrostatic charge to Both carry out heating stepses and pressurization steps to the support plate 1212a and flexible base plate 1214 of electrostatic charge, expel and are located between the two Residual bubble simultaneously makes the surfacing of flexible base plate 1214.Afterwards, the and of flexible base plate 1214 is rolled using roller bearing 1210a, 1210b Support plate 1212a with electrostatic charge, can further it remove residual between flexible base plate 1214 and support plate 1212a with electrostatic charge Bubble is stayed, flexible base plate 1214 is pasted on the support plate 1212a with electrostatic charge.Carry out above-mentioned attaching processing procedure and then enter Another road of row charging processing procedure (step 1306), will at least 10-7Coulomb/cm2Electrostatic charge inject flexible base plate 1214 with as band There are the flexible base plate 1214a of electrostatic charge, increase the support plate 1212a with electrostatic charge and the flexible base plate 1214a with electrostatic charge Between electrostatic adsorption force.
Because electric calorifie installation 1218a as shown in figure 18 and roller bearing 1210a, 1210b have similar (pressurization) function, because And it is above-mentioned both can select one and be arranged in sticking type device.Therefore, electrostatic attaching device 1500h as shown in figure 19 sticking type Device is electric calorifie installation 1218a.The electrostatic of different embodiments of the invention shown in Figure 19 and Figure 14 attaches not existing together for processing procedure For：After carrying out step 1304 and support plate 1212 is charged, step 1308G is then carried out, will using carrier plate transmission platform 1201 Support plate 1212a with electrostatic charge and flexible base plate thereon 1214 are sent to electrostatic attaching device 1500h electric heating dress together The lower section for putting 1218a carries out an attaching processing procedure.Above-mentioned attaching processing procedure utilizes electric calorifie installation 1218a from the support plate with electrostatic charge Support plate 1212a with electrostatic charge and both the progress heating stepses of flexible base plate 1214 and pressurization steps are driven 1212a top Off normal in residual bubble between the two and make the surfacing of flexible base plate 1214., can be again after carrying out above-mentioned attaching processing procedure Another road charging processing procedure (step 1306) is carried out, will at least 10-7Coulomb/cm2Electrostatic charge injection flexible base plate 1214 with as Flexible base plate 1214a with electrostatic charge, support plate 1212a of the increase with electrostatic charge and the flexible base plate with electrostatic charge Electrostatic adsorption force between 1214a.
In another embodiment of the present invention, an elastic material sheet 1220 can be arranged on electric calorifie installation 1218a, above-mentioned elasticity Material piece 1220 is designed as an inclined-plane in face of a surface 1222 of substrate and (implies that the angle between above-mentioned surface and substrate surface More than 0 degree and less than 90 degree), increase removes the efficiency of residual bubble.In the quiet of another embodiment of the present invention as shown in figure 20 In electric attaching device 1500i, sticking type device 1210-6 may include a pair of roller bearing 1210a, 1210b, an electric calorifie installation 1218a with An and elastic material sheet 1220.As shown in figure 20, the sticking type device 1210-6 of embodiment of the present invention roller bearing 1210a, 1210b Be be respectively arranged at it is above and below conveyer belt 1202 and positioned opposite to each other, make conveyer belt 1202 with body be located in both it Between, and the electric calorifie installation 1218a and elastic material sheet 1220 being connected to each other are to be positioned proximate to one in roller bearing 1210a, 1210b Side, and positioned at the top of conveyer belt 1202.Elastic material sheet 1220 can be compared with electric calorifie installation 1218a closer to conveyer belt 1202. In one embodiment of the invention, two relative sides of elastic material sheet 1220 and the included angle B 1 on bottom surface (surface 1222), B2 are neither For right angle (90 degree).In an embodiment of the present invention, a side and bottom surface (surface 1222) therein for elastic material sheet 1220 Included angle B 1 be less than 90 degree, and the included angle B 2 on another side and bottom surface (surface 1222) be then more than 90 degree and with the complementation of included angle B 1.
The electrostatic of different embodiments of the invention shown in Figure 20 and Figure 14 attach processing procedure do not exist together for：Carrying out step After 1304 pairs of support plates 1212 charge, step 1308H is then carried out, using carrier plate transmission platform 1201 by the load with electrostatic charge Plate 1212a and flexible base plate 1214 thereon are sent to electrostatic attaching device 1500i electric calorifie installation 1218a and elastic material together The lower section of tablet 1220 carries out one and attaches processing procedure.Above-mentioned attaching processing procedure utilizes sticking type device 1210-6 electric calorifie installation 1218a Both support plate 1212a with electrostatic charge and flexible base plate 1214 are added from the top of the support plate 1212a with electrostatic charge Hot step.During carrying out heating stepses, the elastic material sheet 1220 for being connected to electric calorifie installation 1218a can be from the load with electrostatic charge Plate 1212a top carries out pressurization steps to both the support plate 1212a with electrostatic charge and flexible base plate 1214, expels positioned at two Residual bubble between person simultaneously makes the surfacing of flexible base plate 1214.Because above-mentioned elastic material sheet faces a surface of substrate An inclined-plane is designed as, so during processing procedure is attached, can be by position while above-mentioned elastic material sheet 1220 pressurizes to substrate Interface between support plate 1212a and flexible base plate 1214 with electrostatic charge remains bubble by the support plate with electrostatic charge (such as being pushed from Figure 20 left hand edge to right hand edge) is pushed in one edge of 1212a and flexible base plate 1214 to other edge, carries Height removes the efficiency of residual bubble.Afterwards, roller bearing 1210a, 1210b rolling flexible base plate 1214 and the load with electrostatic charge are utilized Plate 1212a, the residual bubble between flexible base plate 1214 and support plate 1212a with electrostatic charge is further removed, will be soft Substrate 1214 is pasted on the support plate 1212a with electrostatic charge.After carrying out above-mentioned attaching processing procedure, another road charging can be carried out again Processing procedure (step 1306), will at least 10-7Coulomb/cm2Electrostatic charge inject flexible base plate 1214 with as with the soft of electrostatic charge Property substrate 1214a, the electrostatic between the increase support plate 1212a with electrostatic charge and flexible base plate 1214a with electrostatic charge inhales Attached power.
Due to the electric calorifie installation 1218a being connected to each other as shown in figure 20 and elastic material sheet 1220 and roller bearing 1210a, 1210b has similar (pressurization) function, thus may be selected that electric calorifie installation 1218a and elastic material sheet 1220 only are arranged at into patch In attached formula device.Therefore, electrostatic attaching device 1500j as shown in figure 21 sticking type device 1210-7 is by electric calorifie installation 1218a and elastic material sheet 1220 are formed.The electrostatic of different embodiments of the invention shown in Figure 21 and Figure 14 attaches processing procedure not Exist together for：After carrying out step 1304 and support plate 1212 is charged, step 1308I is then carried out, utilizes carrier plate transmission platform Support plate 1212a with electrostatic charge and flexible base plate thereon 1214 are sent to electrostatic attaching device 1500j's by 1201 together Sticking type device 1210-7 lower section carries out one and attaches processing procedure.Above-mentioned attaching processing procedure is filled using sticking type device 1210-7 electric heating 1218a is put from the top of the support plate 1212a with electrostatic charge to both support plate 1212a with electrostatic charge and flexible base plate 1214 Carry out heating stepses.During carrying out heating stepses, the elastic material sheet 1220 for being connected to electric calorifie installation 1218a can be from electrostatic The support plate 1212a of lotus top carries out pressurization steps to both the support plate 1212a with electrostatic charge and flexible base plate 1214, expels Positioned at residual bubble between the two and make the surfacing of flexible base plate 1214.After carrying out above-mentioned attaching processing procedure, it can enter again Another road of row charging processing procedure (step 1306), will at least 10-7Coulomb/cm2Electrostatic charge inject flexible base plate 1214 with as band There are the flexible base plate 1214a of electrostatic charge, increase the support plate 1212a with electrostatic charge and the flexible base plate 1214a with electrostatic charge Between electrostatic adsorption force.
In another embodiment of the present invention, electric calorifie installation 1218 and elastic material sheet 1220 can be respectively arranged at conveyer belt Above and below in the of 1202 and positioned opposite to each other, the set-up mode of above-mentioned electric calorifie installation 1218 and elastic material sheet 1220 also may be used So that the attaching processing procedure that support plate 1212a and flexible base plate 1214 with electrostatic charge are heated and pressurizeed.As shown in figure 22 Another embodiment of the present invention electrostatic attaching device 1500k in, sticking type device 1210-8 may include a pair of roller bearing 1210a, 1210b, an electric calorifie installation 1218 and an elastic material sheet 1220.As shown in figure 22, the sticking type device of the embodiment of the present invention 1210-8 roller bearing 1210a, 1210b is to be respectively arranged above and below conveyer belt 1202 and positioned opposite to each other, is made defeated Band 1202 is sent to be located between the two with body.In addition, sticking type device 1210-8 elastic material sheet 1220 and electric calorifie installation 1218 are positioned proximate in roller bearing 1210a, 1210b side, are respectively arranged above and below conveyer belt 1202 and each other It is oppositely arranged, conveyer belt 1202 is located between the two with body.
The electrostatic of different embodiments of the invention shown in Figure 22 and Figure 14 attach processing procedure do not exist together for：Carrying out step After 1304 pairs of support plates 1212 charge, step 1308J is then carried out, using carrier plate transmission platform 1201 by the load with electrostatic charge Plate 1212a and flexible base plate 1214 thereon are sent in electrostatic attaching device 1500k sticking type device 1210-8 together Row one attaches processing procedure.Above-mentioned attaching processing procedure is utilized positioned at the electric calorifie installation 1218 of the lower section of conveyer belt 1202 and positioned at conveyer belt 1202 Both support plate 1212a with electrostatic charge and flexible base plate 1214 are heated the elastic material sheet 1220 of top and pressurization step Suddenly, the residual bubble positioned between the two is expelled, above-mentioned elastic material sheet 1220 will can be located at quiet while pressurization Interface residual bubble between the support plate 1212a and flexible base plate 1214 of electric charge is by the support plate 1212a with electrostatic charge and soft (such as being pushed from Figure 22 left hand edge to right hand edge) is pushed in one edge of substrate 1214 to other edge, improves and removes residue gas The efficiency of bubble.Afterwards, using carrier plate transmission platform 1201 by the support plate 1212a with electrostatic charge and flexible base plate thereon 1214 It is sent to together between roller bearing 1210a, 1210b, flexible base plate 1214 is rolled and with electrostatic charge using roller bearing 1210a, 1210b Support plate 1212a, further remove the residual bubble between flexible base plate 1214 and support plate 1212a with electrostatic charge, will Flexible base plate 1214 is pasted on the support plate 1212a with electrostatic charge.After carrying out above-mentioned attaching processing procedure, another road can be carried out again Charge processing procedure (step 1306), will at least 10-7Coulomb/cm2Electrostatic charge inject flexible base plate 1214 with as with electrostatic charge Flexible base plate 1214a, it is quiet between the increase support plate 1212a with electrostatic charge and flexible base plate 1214a with electrostatic charge Adsorption force.
Due to the electric calorifie installation 1218 being connected to each other as shown in figure 22 and elastic material sheet 1220 and roller bearing 1210a, 1210b has similar (pressurization) function, thus may be selected only by electric calorifie installation 1218 and elastic material sheet 1220 as attaching In formula device.Therefore, electrostatic attaching device 1500l as shown in figure 23 sticking type device 1210-9 is by the He of electric calorifie installation 1218 Elastic material sheet 1220 is formed.The electrostatic of different embodiments of the invention shown in Figure 23 and Figure 14 attach processing procedure do not exist together for： After carrying out step 1304 and support plate 1212 is charged, step 1308K is then carried out, will be carried using carrier plate transmission platform 1201 The support plate 1212a of electrostatic charge and flexible base plate 1214 thereon are sent to electrostatic attaching device 1500l sticking type device together One is carried out in 1210-9 and attaches processing procedure.Above-mentioned attaching processing procedure utilizes the electric calorifie installation 1218 for being located at the lower section of conveyer belt 1202 and is located at The elastic material sheet 1220 of the top of conveyer belt 1202 adds to both the support plate 1212a with electrostatic charge and flexible base plate 1214 Heat and pressurization steps, expel the residual bubble positioned between the two, and above-mentioned elastic material sheet 1220 can incite somebody to action while pressurization Interface between support plate 1212a and flexible base plate 1214 with electrostatic charge remains bubble by the support plate with electrostatic charge (such as being pushed from Figure 23 left hand edge to right hand edge) is pushed in one edge of 1212a and flexible base plate 1214 to other edge, carries Height removes the efficiency of residual bubble.After carrying out above-mentioned attaching processing procedure, another road charging processing procedure (step 1306) can be carried out again, will At least 10-7Coulomb/cm2Electrostatic charge injection flexible base plate 1214 as the flexible base plate 1214a with electrostatic charge, to increase band There is the electrostatic adsorption force between the support plate 1212a of electrostatic charge and the flexible base plate 1214a with electrostatic charge.
Figure 24 shows being set up to electrostatic attaching with reference to the electrostatic paster of flexible base plate and support plate for other embodiments of the invention Standby 1500m.Each component in above-mentioned accompanying drawing if any with same or analogous part shown in Figure 12~Figure 23, then refer to above Correlation narration, does not do repeat specification herein.As shown in figure 24, electrostatic attaching device 1500m is used soft in processing procedure is carried out Substrate is a flexible base plate coiled material 1224, and above-mentioned flexible base plate coiled material 1224 is wound around on a feed spool 1226.Pasted It is that a part for flexible base plate coiled material 1224 is placed in the defeated of carrier plate transmission platform 1201 by scrolling feed spool 1226 before attached processing procedure Send on band 1202, recycle the frictional force between flexible base plate coiled material 1224 and conveyer belt 1202 continuously to drive feed spool volume 1226 It is dynamic flexible base plate coiled material 1224 is constantly disengaged and (is gone out band).Can be also in the electrostatic attaching device 1500m of other embodiments of the invention Including a cutter device 1228, it is arranged on carrier plate transmission platform 1201.In an embodiment of the present invention, cutter device 1228 is To carry out cutting processing procedure cutting flexible base plate coiled material 1224, flexible base plate coiled material 1224 is separated into different soft bases Plate segment.In an embodiment of the present invention, cutter device 1228 may include a contact cutter device or one for a such as blade Non-contact cutter device.
Using Figure 24 to illustrate the electrostatic attached to electrostatic with reference to flexible base plate and support plate of other embodiments of the invention Processing procedure is attached, can be described as volume again to piece processing procedure (roll to sheet process).First, as shown in Figure 24 step 1302, One support plate 1212 is placed on the conveyer belt 1202 of carrier plate transmission platform 1201.Then, step 1304 is carried out, passes through carrier plate transmission Frictional force between two roller bearings 1200 and conveyer belt 1202 of platform 1201, driving conveying belt 1202 is continuously run, by support plate 1212 are sent in electrostatic attaching device 1500m charging device 1206 and carry out a charging processing procedure, will at least 10-7Coulomb/cm2's Electrostatic charge injects support plate 1212 with as the support plate 1212a with electrostatic charge.Then, scrolling feed spool 1226 rolls up flexible base plate A part for material 1224 is placed on the conveyer belt 1202 of carrier plate transmission platform 1201, recycles flexible base plate coiled material 1224 and conveying The scrolling of feed spool 1226 is continuously driven flexible base plate coiled material 1224 is constantly disengaged and (is gone out band) with the frictional force between 1202.Connect , carry out step 1322, using carrier plate transmission platform 1201 by support plate 1212a and flexible base plate coiled material 1224 with electrostatic charge It is sent to together in electrostatic attaching device 1500m sticking type device 1322A~1322I and carries out an attaching processing procedure, by soft base A part for coiled material 1224 is pasted on the support plate 1212a with electrostatic charge.Then, step 1306 is carried out, is passed using support plate Support plate 1212a with electrostatic charge and flexible base plate coiled material 1224 thereon a part are sent to separately by defeated platform 1201 together Another road charging processing procedure is carried out in one charging device 1208, will at least 10-7Coulomb/cm2Electrostatic charge injection flexible base plate coiled material 1224 part is with as the flexible base plate web part 1224a with electrostatic charge, support plate 1212a of the increase with electrostatic charge Electrostatic adsorption force between the flexible base plate web part 1224a with electrostatic charge.The charging of above-mentioned steps 1304 and 1306 Processing procedure may include that corona discharge charging processing procedure, liquid contact charging processing procedure, vacuum electronic gun charging processing procedure, a friction cause Electric processing procedure or electrical breakdown charging processing procedure.Step 1324 is carried out, this is carried to the load of electrostatic charge using carrier plate transmission platform 1201 The plate 1212a and flexible base plate web part 1224a with electrostatic charge thereon is sent to the cutting of electrostatic attaching device together Device 1228, to carry out a cutting processing procedure, the flexible base plate coiled material with electrostatic charge is separated into from flexible base plate coiled material 1224 Part 1224a.
Figure 25 A~Figure 25 I are to carry out attaching step in the electrostatic attaching processing procedure shown in Figure 24 (laminationprocess) change case of 1322 sticking type device, for the sake of showing conveniently, Figure 25 A~Figure 25 I are not Show the conveyer belt 1202 shown in Figure 24.In addition, each component in above-mentioned accompanying drawing is if any the identical or phase with shown in Figure 12~Figure 24 As part, then refer to related narration above, do not do repeat specification herein.As shown in fig. 25 a, another embodiment of the present invention To carry out attach step 1322 (Figure 24) sticking type device 1322A may include a pair of roller bearings 1210a, 1210b and one Electric calorifie installation 1218.Above-mentioned sticking type device 1322A set-up mode is analogous to sticking type device 1210- as shown in figure 14 1, related narration above is referred to, does not do repeat specification herein.In embodiment as shown in fig. 25 a, above-mentioned attaching processing procedure is first A heating stepses are carried out to both support plate 1212a with electrostatic charge and flexible base plate coiled material 1224 using electric calorifie installation 1218, Expel the residual bubble positioned between the two.Followed by roller bearing 1210a, 1210b rolling flexible base plate coiled material 1224 and carry The support plate 1212a of electrostatic charge, can further it remove residual between flexible base plate coiled material 1224 and support plate 1212a with electrostatic charge Bubble is stayed, a part for flexible base plate coiled material 1224 is pasted on the support plate 1212a with electrostatic charge.
As shown in Figure 25 B, another embodiment of the present invention to carry out attach step 1322 (Figure 24) sticking type device 1322B may include a pair of roller bearing 1210a, 1210b, an electric calorifie installation 1218 and an increased pressure board 1219.Above-mentioned sticking type device 1322B set-up mode is analogous to sticking type device 1210-3 as shown in figure 16, refers to related narration above, herein Do not do repeat specification.In embodiment as shown in Figure 25 B, above-mentioned attaching processing procedure is first with positioned at the support plate with electrostatic charge Electric calorifie installation 1218 below 1212a and the increased pressure board 1219 above the support plate 1212a with electrostatic charge are to electrostatic Both support plate 1212a and flexible base plate coiled material 1224 of lotus are heated and pressurization steps, expel the residual positioned between the two Bubble.Afterwards, using carrier plate transmission platform 1201 by the support plate 1212a with electrostatic charge and flexible base plate coiled material 1224 thereon It is sent to together between roller bearing 1210a, 1210b, flexible base plate coiled material 1224 is rolled and with quiet using roller bearing 1210a, 1210b The support plate 1212a of electric charge, it can further remove the residual between flexible base plate coiled material 1224 and support plate 1212a with electrostatic charge Bubble, a part for flexible base plate coiled material 1224 is pasted on the support plate 1212a with electrostatic charge.
As shown in fig. 25 c, another embodiment of the present invention to carry out attach step 1322 (Figure 24) sticking type device 1322C may include the increased pressure board 1219 that same position is integrated in electric calorifie installation 1218.Above-mentioned sticking type device 1322C setting Mode is analogous to sticking type device 1210-4 as shown in figure 17, refers to related narration above, does not do repetition herein and say It is bright.In embodiment as shown in fig. 25 c, above-mentioned attaching processing procedure utilizes the electric heating being located at below the support plate 1212a with electrostatic charge Device 1218 and increased pressure board 1219 above the support plate 1212a with electrostatic charge to the support plate 1212a with electrostatic charge and Both flexible base plate coiled materials 1224 are heated and pressurization steps, the residual bubble positioned between the two are expelled, by flexible base plate A part for coiled material 1224 is pasted on the support plate 1212a with electrostatic charge.
As shown in Figure 25 D, another embodiment of the present invention to carry out attach step 1322 (Figure 24) sticking type device 1322D may include a pair of roller bearings 1210a, 1210b and an electric calorifie installation 1218a.Above-mentioned sticking type device 1322D setting side Formula is analogous to sticking type device 1210-5 as shown in figure 18, refers to related narration above, does not do repeat specification herein. In embodiment as shown in Figure 25 D, above-mentioned attaching processing procedure is using electric calorifie installation 1218a from the support plate 1212a's with electrostatic charge Top expels to the support plate 1212a with electrostatic charge and both the progress heating stepses of flexible base plate coiled material 1224 and pressurization steps Positioned at residual bubble between the two and make the surfacing of flexible base plate coiled material 1224.Afterwards, roller bearing 1210a, 1210b are utilized Flexible base plate coiled material 1224 and the support plate 1212a with electrostatic charge are rolled, can further remove flexible base plate coiled material 1224 and band There is the residual bubble between the support plate 1212a of electrostatic charge, a part for flexible base plate coiled material 1224 is pasted to electrostatic charge Support plate 1212a on.
As seen in figure 25e, another embodiment of the present invention to carry out attach step 1322 (Figure 24) sticking type device 1322E is electric calorifie installation 1218a, refers to Figure 19 related narration, does not do repeat specification herein.Reality as shown in Figure 25 D Apply in example, above-mentioned attaching processing procedure is using electric calorifie installation 1218a from the top of the support plate 1212a with electrostatic charge to electrostatic charge Support plate 1212a and flexible base plate coiled material 1224 both carry out heating stepses and pressurization steps, expel residual positioned between the two Stay bubble and make the surfacing of flexible base plate coiled material 1224, a part for flexible base plate coiled material 1224 is pasted to electrostatic On the support plate 1212a of lotus.
As shown in fig. 25f, another embodiment of the present invention to carry out attach step 1322 (Figure 24) sticking type device 1322F may include a pair of roller bearing 1210a, 1210b, an electric calorifie installation 1218a and an elastic material sheet 1220.Above-mentioned sticking type Device 1322F set-up mode is analogous to sticking type device 1210-6 as shown in figure 20, refers to related narration above, Repeat specification is not done herein.In embodiment as shown in fig. 25f, above-mentioned attaching processing procedure utilizes sticking type device 1322F electric heating Device 1218a is from the top of the support plate 1212a with electrostatic charge to support plate 1212a and flexible base plate coiled material with electrostatic charge 1224 both progress heating stepses.During carrying out heating stepses, the elastic material sheet 1220 for being connected to electric calorifie installation 1218a can be from The top of support plate 1212a with electrostatic charge is carried out to both the support plate 1212a with electrostatic charge and flexible base plate coiled material 1224 Pressurization steps, expel positioned at residual bubble between the two and make the surfacing of flexible base plate coiled material 1224.Due to above-mentioned bullet Property material piece 1220 be designed as an inclined-plane in face of a surface of flexible base plate coiled material 1224, so during processing procedure is attached, on State while elastic material sheet 1220 pressurizes to flexible base plate coiled material 1224 can by positioned at the support plate 1212a with electrostatic charge and An edge of interface residual bubble from the support plate 1212a with electrostatic charge between flexible base plate coiled material 1224 push away to other edge (such as being pushed from Figure 25 F left hand edge to right hand edge) is squeezed, improves the efficiency for removing residual bubble.Afterwards, roller bearing is utilized 1210a, 1210b rolling flexible base plate coiled material 1224 and the support plate 1212a with electrostatic charge, can further remove flexible base plate volume Residual bubble between material 1224 and support plate 1212a with electrostatic charge, a part for flexible base plate coiled material 1224 is pasted to On support plate 1212a with electrostatic charge.
As shown in Figure 25 G, another embodiment of the present invention to carry out attach step 1322 (Figure 24) sticking type device 1322G can be made up of electric calorifie installation 1218a and elastic material sheet 1220.Above-mentioned sticking type device 1322G set-up mode is class Sticking type device 1210-7 as shown in figure 21 is similar to, related narration above is referred to, does not do repeat specification herein.Such as figure In embodiment shown in 25G, above-mentioned attaching processing procedure is using sticking type device 1322G electric calorifie installation 1218a from electrostatic charge Both carry out heating stepses to the support plate 1212a with electrostatic charge and flexible base plate coiled material 1224 support plate 1212a top.Enter During row heating stepses, the elastic material sheet 1220 for being connected to electric calorifie installation 1218a can be from the support plate 1212a's with electrostatic charge Top carries out pressurization steps to both the support plate 1212a with electrostatic charge and flexible base plate coiled material 1224, expels positioned at both it Between residual bubble and make the surfacing of flexible base plate coiled material 1224, a part for flexible base plate coiled material 1224 is pasted to band Have on the support plate 1212a of electrostatic charge.
As shown in Figure 25 H, another embodiment of the present invention to carry out attach step 1322 (Figure 24) sticking type device 1322H may include a pair of roller bearing 1210a, 1210b, an electric calorifie installation 1218 and an elastic material sheet 1220.Above-mentioned sticking type Device 1322H set-up mode is similar sticking type device 1210-8 as shown in figure 22, refers to related narration above, This does not do repeat specification.In embodiment as shown in Figure 25 H, above-mentioned attaching processing procedure, which utilizes, is located at the support plate with electrostatic charge Electric calorifie installation 1218 below 1212a and the elastic material sheet 1220 above the support plate 1212a with electrostatic charge can be to bands Have electrostatic charge support plate 1212a and flexible base plate coiled material 1224 both heated and pressurization steps, expel positioned between the two Residual bubble, while above-mentioned elastic material sheet 1220 pressurizes to flexible base plate coiled material 1224 can will be located at carry electrostatic charge Support plate 1212a and flexible base plate coiled material 1224 between interface residual bubble by the support plate 1212a with electrostatic charge one side Edge pushes (such as being pushed from Figure 25 H left hand edge to right hand edge) to other edge, improves the efficiency for removing residual bubble.It Afterwards, the support plate 1212a with electrostatic charge and flexible base plate coiled material 1224 thereon are passed together using carrier plate transmission platform 1201 Deliver between roller bearing 1210a, 1210b, flexible base plate coiled material 1224 is rolled and with electrostatic charge using roller bearing 1210a, 1210b Support plate 1212a, the residual bubble between flexible base plate coiled material 1224 and support plate 1212a with electrostatic charge can be further removed, A part for flexible base plate coiled material 1224 is pasted on the support plate 1212a with electrostatic charge.
As shown in Figure 25 I, another embodiment of the present invention to carry out attach step 1322 (Figure 24) sticking type device 1322I can be made up of electric calorifie installation 1218 and elastic material sheet 1220.Above-mentioned sticking type device 1322I set-up mode is similar Sticking type device 1210-9 shown in Figure 23, related narration above is referred to, does not do repeat specification herein.As shown in Figure 25 I Embodiment in, above-mentioned attaching processing procedure utilize be located at electrostatic charge support plate 1212a below electric calorifie installation 1218 and be located at Elastic material sheet 1220 above support plate 1212a with electrostatic charge is rolled up to the support plate 1212a with electrostatic charge and flexible base plate Both are heated and pressurization steps material 1224, expel the residual bubble positioned between the two, above-mentioned elastic material sheet 1220 in The interface between support plate 1212a and flexible base plate coiled material 1224 with electrostatic charge can be remained bubble while pressurization Push and (such as pushed away from Figure 25 I left hand edge to right hand edge from an edge of the support plate 1212a with electrostatic charge to other edge Squeeze), the efficiency for removing residual bubble is improved, a part for flexible base plate coiled material 1224 is pasted to the support plate with electrostatic charge On 1212a.
Figure 26 shows being set up to electrostatic attaching with reference to the electrostatic paster of flexible base plate and support plate for other embodiments of the invention Standby 1500n.Each component in above-mentioned accompanying drawing if any with same or analogous part shown in Figure 12~Figure 25 I, then refer to before Related narration, do not do repeat specification herein.As shown in figure 26, in other embodiments of the present invention, electrostatic attaching device 1500n Carrier plate transmission platform 1231 include a support plate coiled material 1232, a feed spool 1230a and one recovery axle 1230b, wherein support plate roll up Material 1232 is the outer surface for coating feed spool 1230a and reclaiming axle 1230b.In addition, electrostatic attaching device 1500n is carrying out processing procedure The middle flexible base plate used is a flexible base plate coiled material 1224, and above-mentioned flexible base plate coiled material 1224 coats another feed spool 1226 Outer surface and recovery axle 1230b outer surface, and reclaim axle 1230b and pass through its frictional force between support plate coiled material 1232, band Dynamic flexible base plate coiled material 1224 and support plate coiled material 1232 are continuously disengaged by feed spool 1230a and feed spool 1226 respectively and (go out band) simultaneously Reclaimed by recovery axle 1230b.
Then, using Figure 26 to illustrate being attached to electrostatic with reference to flexible base plate and support plate for other embodiments of the invention Electrostatic attaches processing procedure, also known as volume to volume processing procedure (roll to roll process).First, using feed spool 1230a and return Receiving the frictional force between axle 1230b and support plate coiled material 1232 drives support plate coiled material 1232 continuously to disengage (to go out by feed spool 1230a Band).Support plate coiled material 1232 drives flexible base plate coiled material 1224 by feed spool by itself and the frictional force of flexible base plate coiled material 1224 1226 continuously disengage and (go out band).Then, step 1304 is carried out, is aligned using electrostatic attaching device 1500n charging device 1206 A charging processing procedure is carried out in a part of support plate coiled material 1232 in charging device 1206, will at least 10-7Coulomb/cm2Electrostatic charge A part of support plate coiled material 1232 is injected with as the support plate web part 1232a with electrostatic charge.Then, scrolling feed spool 1226 A part for flexible base plate coiled material 1224 is placed on the support plate coiled material 1232 of carrier plate transmission platform 1231, recycles flexible base plate Frictional force between coiled material 1224 and support plate coiled material 1232 continuously drives the scrolling of feed spool 1226 to make flexible base plate coiled material 1224 not It is disconnected to disengage and (go out band).Attaching step is carried out, using the scrolling support plate coiled material 1232 of carrier plate transmission platform 1231, by with electrostatic charge Support plate web part 1232a and flexible base plate coiled material 1224 are sent to electrostatic attaching device 1500n sticking type device together One is carried out in 1326A~1326I and attaches processing procedure, a part for flexible base plate coiled material 1224 is pasted to the support plate with electrostatic charge On web part 1232a.Then, step 1306 is carried out, using the scrolling support plate coiled material 1232 of carrier plate transmission platform 1231, will be carried A part for the support plate web part 1232a of electrostatic charge and flexible base plate coiled material 1224 thereon is sent to another charging dress together Put and charging processing procedure is carried out in 1208, will at least 10-7Coulomb/cm2Electrostatic charge injection flexible base plate coiled material 1224 a part with As the flexible base plate web part 1224a with electrostatic charge, increase carries the support plate web part 1232a of electrostatic charge and carried Electrostatic adsorption force between the flexible base plate web part 1224a of electrostatic charge.The charging processing procedure of above-mentioned steps 1304 and 1306 can Processing procedure is sent a telegraph including corona discharge charging processing procedure, liquid contact charging processing procedure, vacuum electronic gun charging processing procedure, a friction Or one electrical breakdown charging processing procedure.It can all be carried by the support plate coiled material 1232 and flexible base plate coiled material 1224 of recovery axle 1230b recovery Electrostatic charge.
Figure 27 A~Figure 27 I are to carry out attaching step (lamination in the electrostatic attaching processing procedure shown in Figure 26 Process the change case of sticking type device 1326A~1326I), in addition, each component in above-mentioned accompanying drawing if any with Figure 12~ Same or analogous part shown in Figure 26, then related narration above is referred to, does not do repeat specification herein.As shown in fig. 27 a, Another embodiment of the present invention may include a pair of rollings to carry out the sticking type device 1326A of attaching step (Figure 27 A~Figure 27 I) Axle 1210a, 1210b and an electric calorifie installation 1218.Above-mentioned sticking type device 1326A set-up mode is analogous to such as Figure 14 institutes The sticking type device 1210-1 shown, related narration above is referred to, does not do repeat specification herein.Implementation as shown in fig. 27 a In example, above-mentioned attaching processing procedure can be to the support plate web part 1232a with electrostatic charge and soft base first with electric calorifie installation 1218 Both carry out a heating stepses to coiled material 1224, expel the residual bubble positioned between the two.Followed by roller bearing 1210a, 1210b rolling flexible base plates coiled material 1224 and the support plate web part 1232a with electrostatic charge, can further remove flexible base plate Residual bubble between coiled material 1224 and support plate web part 1232a with electrostatic charge, by the one of flexible base plate coiled material 1224 Part is pasted on the support plate web part 1232a with electrostatic charge.
As shown in figure 27b, another embodiment of the present invention carrying out the sticking type device 1326B of attaching step (Figure 26) It may include a pair of roller bearing 1210a, 1210b, an electric calorifie installation 1218 and an increased pressure board 1219.Above-mentioned sticking type device 1326B Set-up mode be analogous to sticking type device 1210-3 as shown in figure 16, refer to related narration above, do not do herein Repeat specification.In embodiment as shown in figure 27b, above-mentioned attaching processing procedure fills first with the electric heating positioned at the lower section of support plate coiled material 1232 Put 1218 and the increased pressure board 1219 above support plate coiled material 1232 to the support plate web part 1232a with electrostatic charge and soft Both substrate coils 1224 are heated and pressurization steps, expel the residual bubble positioned between the two.Afterwards, passed using support plate Support plate web part 1232a with electrostatic charge and flexible base plate coiled material 1224 thereon are sent to roller bearing by defeated platform 1231 Between 1210a, 1210b, flexible base plate coiled material 1224 and the support plate coiled material with electrostatic charge are rolled using roller bearing 1210a, 1210b Part 1232a, can further it remove residual between flexible base plate coiled material 1224 and support plate web part 1232a with electrostatic charge Bubble is stayed, a part for flexible base plate coiled material 1224 is pasted on the support plate web part 1232a with electrostatic charge.
As seen in fig. 27 c, another embodiment of the present invention carrying out the sticking type device 1326C of attaching step (Figure 26) It may include the increased pressure board 1219 that same position is integrated in electric calorifie installation 1218.Above-mentioned sticking type device 1326C set-up mode Sticking type device 1210-4 as shown in figure 17 is analogous to, related narration above is referred to, does not do repeat specification herein.Such as In embodiment shown in Figure 27 C, above-mentioned attaching processing procedure utilizes the electricity being located at below the support plate web part 1232a with electrostatic charge Thermal 1218 and increased pressure board 1219 above the support plate web part 1232a with electrostatic charge are to the load with electrostatic charge Both are heated and pressurization steps for coiled material part 1232a and flexible base plate coiled material 1224, are expelled residual positioned between the two Bubble is stayed, a part for flexible base plate coiled material 1224 is pasted on the support plate web part 1232a with electrostatic charge.
As shown in Figure 27 D, another embodiment of the present invention carrying out the sticking type device 1326D of attaching step (Figure 26) It may include a pair of roller bearings 1210a, 1210b and an electric calorifie installation 1218a.Above-mentioned sticking type device 1326D set-up mode is Similar to sticking type device 1210-5 as shown in figure 18, related narration above is referred to, does not do repeat specification herein.Such as figure In embodiment shown in 27D, above-mentioned attaching processing procedure can be from the support plate web part with electrostatic charge using electric calorifie installation 1218a 1232a top carries out heating stepses to both the support plate web part 1232a with electrostatic charge and flexible base plate coiled material 1224 And pressurization steps, expel positioned at residual bubble between the two and make the surfacing of flexible base plate coiled material 1224.Afterwards, utilize Roller bearing 1210a, 1210b rolling flexible base plate coiled material 1224 and the support plate web part 1232a with electrostatic charge, can further go The residual bubble between support plate web part 1232a except flexible base plate coiled material 1224 and with electrostatic charge, flexible base plate is rolled up A part for material 1224 is pasted on the support plate web part 1232a with electrostatic charge.
As shown in Figure 27 E, another embodiment of the present invention carrying out the sticking type device 1326E of attaching step (Figure 26) As electric calorifie installation 1218a, Figure 19 related narration is referred to, does not do repeat specification herein.Embodiment as shown in Figure 27 D In, above-mentioned attaching processing procedure is using electric calorifie installation 1218a from the top of the support plate web part 1232a with electrostatic charge to quiet Both carry out heating stepses and pressurization steps to the support plate web part 1232a and flexible base plate coiled material 1224 of electric charge, expel and are located at Residual bubble between the two simultaneously makes the surfacing of flexible base plate coiled material 1224, and a part for flexible base plate coiled material 1224 is pasted It is attached on the support plate web part 1232a with electrostatic charge.
As shown in Figure 27 F, another embodiment of the present invention carrying out the sticking type device 1326F of attaching step (Figure 26) It may include a pair of roller bearing 1210a, 1210b, an electric calorifie installation 1218a and an elastic material sheet 1220.Above-mentioned sticking type device 1326F set-up mode is analogous to sticking type device 1210-6 as shown in figure 20, refers to related narration above, herein Do not do repeat specification.In embodiment as shown in Figure 27 F, above-mentioned attaching processing procedure utilizes sticking type device 1326F electric calorifie installation 1218a is from the top of the support plate web part 1232a with electrostatic charge to the support plate web part 1232a with electrostatic charge and soft Property substrate coil 1224 both carry out heating stepses.During carrying out heating stepses, electric calorifie installation 1218a elastomeric material is connected to Piece 1220 can be from the top of the support plate web part 1232a with electrostatic charge to the support plate web part 1232a with electrostatic charge Both carry out pressurization steps with flexible base plate coiled material 1224, expel positioned at residual bubble between the two and make flexible base plate coiled material 1224 surfacing.The surface that flexible base plate coiled material 1224 is faced due to above-mentioned elastic material sheet is designed as an inclined-plane, So during processing procedure is attached, above-mentioned elastic material sheet can be by positioned at the support plate coiled material portion with electrostatic charge while pressurization The residual bubble of the interface between 1232a and flexible base plate coiled material 1224 is divided to be pushed away from an edge of support plate coiled material 1232 to other edge (such as being pushed from Figure 27 F left hand edge to right hand edge) is squeezed, improves the efficiency for removing residual bubble.Afterwards, roller bearing is utilized 1210a, 1210b rolling flexible base plate coiled material 1224 and the support plate web part 1232a with electrostatic charge, can further be removed soft Residual bubble between property substrate coil 1224 and support plate web part 1232a with electrostatic charge, by flexible base plate coiled material 1224 part is pasted on the support plate web part 1232a with electrostatic charge.
As shown in Figure 27 G, another embodiment of the present invention carrying out the sticking type device 1326G of attaching step (Figure 26) It can be made up of electric calorifie installation 1218a and elastic material sheet 1220.Above-mentioned sticking type device 1326G set-up mode be analogous to as Sticking type device 1210-7 shown in Figure 21, related narration above is referred to, does not do repeat specification herein.As shown in Figure 27 G Embodiment in, above-mentioned attaching processing procedure using sticking type device 1326G electric calorifie installation 1218a from electrostatic charge support plate volume Material part 1232a top adds to both the support plate web part 1232a with electrostatic charge and flexible base plate coiled material 1224 Hot step.During carrying out heating stepses, the elastic material sheet 1220 for being connected to electric calorifie installation 1218a can be from the load with electrostatic charge Coiled material part 1232a top is entered to both the support plate web part 1232a with electrostatic charge and flexible base plate coiled material 1224 Row pressurization steps, expel positioned at residual bubble between the two and make the surfacing of flexible base plate coiled material 1224, by soft base A part for coiled material 1224 is pasted on the support plate web part 1232a with electrostatic charge.
As shown in Figure 27 H, another embodiment of the present invention carrying out the sticking type device 1326H of attaching step (Figure 26) It may include a pair of roller bearing 1210a, 1210b, an electric calorifie installation 1218 and an elastic material sheet 1220.Above-mentioned sticking type device 1326H set-up mode is similar sticking type device 1210-8 as shown in figure 22, refers to related narration above, herein not Do repeat specification.In embodiment as shown in Figure 27 H, above-mentioned attaching processing procedure, which utilizes, is located at the support plate web part with electrostatic charge Electric calorifie installation 1218 below 1232a and the elastic material sheet above the support plate web part 1232a with electrostatic charge Both support plate web part 1232a with electrostatic charge and flexible base plate coiled material 1224 are heated for 1220 meetings and pressurization step Suddenly, the residual bubble positioned between the two is expelled, band can will be located at while above-mentioned elastic material sheet 1220 pressurizes to substrate There is the interface between the support plate web part 1232a of electrostatic charge and flexible base plate coiled material 1224 to remain bubble by with electrostatic charge (such as being pushed from Figure 27 H left hand edge to right hand edge) is pushed in a support plate web part 1232a edge to other edge, improves Remove the efficiency of residual bubble.Afterwards, using the scrolling support plate coiled material 1232 of carrier plate transmission platform 1231, by the load with electrostatic charge Coiled material part 1232a and flexible base plate coiled material 1224 thereon are sent between roller bearing 1210a, 1210b together, utilize roller bearing 1210a, 1210b rolling flexible base plate coiled material 1224 and the support plate web part 1232a with electrostatic charge, can further be removed soft Residual bubble between property substrate coil 1224 and support plate web part 1232a with electrostatic charge, by flexible base plate coiled material 1224 part is pasted on the support plate web part 1232a with electrostatic charge.
As shown in Figure 27 I, another embodiment of the present invention carrying out the sticking type device 1326I of attaching step (Figure 26) It can be made up of electric calorifie installation 1218 and elastic material sheet 1220.Above-mentioned sticking type device 1326I set-up mode is similar Figure 23 Shown sticking type device 1210-9, related narration above is referred to, does not do repeat specification herein.Reality as shown in Figure 27 I Apply in example, above-mentioned attaching processing procedure utilizes the He of electric calorifie installation 1218 being located at below the support plate web part 1232a with electrostatic charge Elastic material sheet 1220 above the support plate web part 1232a with electrostatic charge can be to the support plate coiled material with electrostatic charge Both part 1232a and flexible base plate coiled material 1224 are heated simultaneously and pressurization steps, expels the residual positioned between the two Bubble, above-mentioned elastic material sheet 1220 while pressurization can by positioned at the support plate web part 1232a with electrostatic charge and Interface between flexible base plate coiled material 1224 remains bubble from an edge of the support plate web part 1232a with electrostatic charge to another (such as being pushed from Figure 27 I left hand edge to right hand edge) is pushed at one edge, the efficiency for removing residual bubble is improved, by flexible base plate A part for coiled material 1224 is pasted on the support plate web part 1232a with electrostatic charge.
The embodiment of the present invention is to provide a kind of substrate adsorption structure and one kind is made using aforesaid substrate adsorption structure The method of soft electronic component.The substrate adsorption structure of one embodiment of the invention and the method for making soft electronic component are available Electrostatic Absorption method so that electret carrier (such as glass) and substrate interface carry at least 10-7Coulomb/cm2Electrostatic charge, it is quiet Electric charge can provide an absorption affinity, complete to be coated after electret carrier and substrate Electrostatic Absorption the first protected material bed of material (such as Block water gas-bearing formation) possibility that is neutralized of electrostatic isolation.After soft electronic device process is completed, the mode of removing can be to use cutting side Formula cuts away the first protected material bed of material, recycles in water or ion wind and electrostatic charge is completed to remove action.In addition, the present invention one is implemented The substrate adsorption structure of example can also include tired electroelectret layer, to increase between the electret carrier of substrate adsorption structure and substrate Electrostatic adhesive force.The substrate adsorption structure of one embodiment of the invention can be embedded parallel to each other and is spaced apart in electret carrier Multiple wires, change the distribution of electrostatic charge using the mode of extra electric field, with the cutting after collocation and remove processing procedure.This Outside, the substrate adsorption structure of one embodiment of the invention can not set a liquid to lead in electret carrier on the top surface of substrate covering Fluid layer, when can be beneficial to for example form the first protected material bed of material with coating process, because of liquid guide flow layer material, material itself is hydrophilic/thin Capillarity caused by the characteristic of water, electrically charged polarity or surface roughness causes above-mentioned first protection materials to be easy to toward above-mentioned The direction flowing of liquid guide flow layer surface, and above-mentioned first protection materials can be avoided to penetrate into substrate during coating process and stay Interface between polar body carrier and reduce the absorption affinity between substrate and electret carrier.In other embodiments of the present invention, in Before setting substrate on electret carrier, it can be designed at being formed to surround one second protection materials of substrate on electret carrier Layer, the above-mentioned second protected material bed of material have barrier functionality, can avoided during the first protected material bed of material is formed, the first protection materials The interface penetrated between substrate and electret carrier and reduce the absorption affinity between substrate and electret carrier.The embodiment of the present invention Substrate adsorption structure and make the method for flexible electronic device and can reduce the cost of manufacture of flexible electronic device, it is qualified to improve Rate, and applied to the processing procedure of the soft device of large scale.
The embodiment of the present invention be to provide it is a kind of to electrostatic attach with reference to flexible base plate and support plate electrostatic attaching device and Processing procedure, can continous way production electrostatic adsorption type flexible base plate method and apparatus, utilize special tired electricity and de-bubble mode will Flexible base plate is attached with support plate electrostatic and combined, and can be improved residual bubble phenomenon, can be increased the electrostatic adsorption force of flexible base plate and support plate, Residual bubble phenomenon is avoided to be influenceed for caused by successive process.Above-mentioned electrostatic attaching device and processing procedure can quickly allow flexible base plate band Have electrostatic charge, wherein the flexible base plate with electrostatic charge can firmly adsorb support plate (such as:Glass substrate), and can integrate In such as Thin Film Transistor-LCD (TFT-LCD) processing procedure, after TFT-LCD processing procedures stacking and gold-tinted processing procedure, then Electrostatic charge, which is eliminated, can remove flexible display device, and the cost of manufacture of flexible display device is greatly reduced, and it is complicated to reduce processing procedure Degree, increase the volume production chance of flexible display device.
Although the present invention is exposed in embodiment, so it is not limited to the present invention, any to be familiar with this skill Person, without departing from the spirit and scope of the present invention, when can make a little change and retouching, therefore protection scope of the present invention is worked as It is defined depending on the scope of which is defined in the appended claims.

Claims (54)

  1. A kind of 1. substrate adsorption structure, it is characterised in that including：
    Have at least 10 in one electret carrier, wherein the electret carrier-7Coulomb/cm2Electrostatic charge to adsorb a soft base One bottom surface of plate；And
    The one first protected material bed of material, be arranged on the electret carrier, and cover a top surface of the flexible base plate a part and One side wall, and wherein the substrate adsorption structure is used to make soft electronic component.
  2. 2. substrate adsorption structure according to claim 1, it is characterised in that it is soft that this is completely covered in the first protected material bed of material The top surface of property substrate, and extend over from the top surface of the flexible base plate side wall of the flexible base plate.
  3. 3. substrate adsorption structure according to claim 1, it is characterised in that also include：
    One tired electroelectret layer, is arranged on the electret carrier, and an at least surface for the wherein tired electroelectret layer is soft with this Property substrate contact.
  4. 4. substrate adsorption structure according to claim 3, it is characterised in that the tired electroelectret layer includes what is be spaced apart Multiple tired electroelectret patterns, contacted respectively with the part of the flexible base plate bottom surface and the part electret carrier.
  5. 5. substrate adsorption structure according to claim 3, it is characterised in that the tired electroelectret layer is arranged at the soft base On one top surface of plate.
  6. 6. substrate adsorption structure according to claim 3, it is characterised in that the tired electroelectret layer include silica-base material, Aluminum oxide, zinc oxide, barium monoxide, tantalum oxide, barium titanate, the wherein inorganic material of lead zirconate titanate or combinations thereof, the silicon substrate Material includes silica, silicon nitride, carborundum, silicon wafer insulator, magnesium silicide, silicon boride, amorphous sial, bismuth Si oxide, polycrystalline Silicon halide or polysilicon hydrogen compound.
  7. 7. substrate adsorption structure according to claim 3, it is characterised in that the tired electroelectret layer be include Teflon, Polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), polyvinyl chloride, Kynoar, trifluoro-ethylene copolymer, polymethyl methacrylate, six The organic material of fluoropropene, polypropylene or combinations thereof.
  8. 8. substrate adsorption structure according to claim 1, it is characterised in that also include：
    Multiple wires, be embedded in the electret carrier and be spaced apart, and close to the electret carrier and the flexible base plate it Between an interface.
  9. 9. substrate adsorption structure according to claim 8, it is characterised in that one of them of the wire is being coupled to one just The one of which of voltage, a negative voltage or a ground voltage, and the wire this one of them be positioned proximate to it is soft in this One edge of substrate.
  10. 10. substrate adsorption structure according to claim 9, it is characterised in that the part coupling of the remaining wire To the wherein another kind, and the remainder of the remaining wire is coupled to of a positive voltage, a negative voltage or a ground voltage One positive voltage, the residue of a negative voltage or a ground voltage are a kind of, and the part of the wherein remaining wire with it is remaining The remainder of the wire is setting interlaced with each other, and positioned at this one of them region for being surrounded of the wire It is interior.
  11. 11. substrate adsorption structure according to claim 1, it is characterised in that also include：
    One liquid guide flow layer, it is arranged on the interface between the first protected material bed of material and the electret carrier.
  12. 12. substrate adsorption structure according to claim 11, it is characterised in that it is thin that the liquid guide flow layer includes a hydrophobicity Film, the wherein hydrophobic film include the compound of fluorine-containing serial polymer or siloxane series, are fluorinated containing one or more The silane compound or combinations thereof of group.
  13. 13. substrate adsorption structure according to claim 12, it is characterised in that the hydrophobic film includes siloxanes/poly- Amidocarbonic acid ester film, dimethyl silicone polymer, the silane compound containing perfluoroalkyl, perfluoroether or perfluoropolyether group.
  14. A kind of 14. substrate adsorption structure, it is characterised in that including：
    Have at least 10 in one electret carrier, wherein the electret carrier-7Coulomb/cm2Electrostatic charge to adsorb a soft base One bottom surface of plate；And
    One tired electroelectret layer, is arranged on the electret carrier, and an at least surface for the wherein tired electroelectret layer is soft with this Property substrate contact, and wherein the substrate adsorption structure be used for make soft electronic component.
  15. 15. substrate adsorption structure according to claim 14, it is characterised in that it is soft that this is completely covered in the tired electroelectret layer Property substrate a top surface and the flexible base plate a side wall.
  16. A kind of 16. method for making soft electronic component, it is characterised in that comprise the following steps：
    One insulation carrier is provided；
    One first charging processing procedure is carried out, will at least 10-7Coulomb/cm2The first electrostatic charge inject in the insulation carrier so that this is exhausted Edge carrier turns into the electret carrier with first electrostatic charge；
    In setting the flexible base plate with a soft electronic structure on the electret carrier, the wherein flexible base plate is stayed by this First electrostatic charge caused by polar body carrier and be adsorbed on the electret carrier；
    In forming the one first protected material bed of material on the electret carrier, wherein the first protected material bed of material covers the flexible base plate A part for one top surface and a side wall.
  17. 17. the method according to claim 16 for making soft electronic component, it is characterised in that providing the insulation carrier is Including providing one first insulating barrier and one second insulating barrier, and wherein carry out the first charging processing procedure and include：
    At least 10 by described in-7Coulomb/cm2The part of the first electrostatic charge inject first insulating barrier, stayed with forming one first Polar body layer；And
    At least 10 by described in-7Coulomb/cm2The remainder of the first electrostatic charge inject second insulating barrier, to form one second Electret layer, and wherein carry out also including after the first charging processing procedure：
    Stack first electret layer and second electret layer.
  18. 18. the method according to claim 16 for making soft electronic component, it is characterised in that on the electret carrier The flexible base plate is set also to include afterwards：
    One second charging processing procedure is carried out, will at least 10-7Coulomb/cm2The second electrostatic charge inject in the flexible base plate.
  19. 19. the method according to claim 16 for making soft electronic component, it is characterised in that on the electret carrier The flexible base plate is set also to include afterwards：
    Tire out electroelectret layer in setting one on the flexible base plate.
  20. 20. the method according to claim 16 for making soft electronic component, it is characterised in that the flexible base plate includes heap Folded at least one first sublevel and at least one second sublevel, the flexible base plate, which is arranged on the electret carrier, to be included：
    In setting first sublevel on the electret carrier；
    Tire out electroelectret layer in setting one on first sublevel；And
    Tire out one second sublevel of setting on electroelectret layer in this, wherein first sublevel and second sublevel tires out electric electret by this Body layer is spaced apart.
  21. 21. the method according to claim 16 for making soft electronic component, it is characterised in that on the electret carrier Form the first protected material bed of material also includes afterwards：
    Carry out a cutting processing procedure, along the normal direction of the flexible base plate sequentially cut on the outside of the soft electronic component this The one protected material bed of material and the flexible base plate；And
    Carry out one and remove processing procedure, the flexible base plate is departed from from the electret carrier.
  22. 22. the method according to claim 21 for making soft electronic component, it is characterised in that this, which removes processing procedure, includes：
    Using a taking off tool, an interface of the flexible base plate and the electret carrier is stretched into.
  23. 23. the method according to claim 21 for making soft electronic component, it is characterised in that the first protected material bed of material It is completely covered the top surface of the flexible base plate, and wherein this is removed processing procedure and included：
    Using a taking off tool of one curved surface of tool, the curved surface is affixed to a top of the soft electronic structure completely with roll mode Face.
  24. 24. the method according to claim 21 for making soft electronic component, it is characterised in that the first protected material bed of material It is completely covered the top surface of the flexible base plate, and wherein this is removed processing procedure and included：
    A top surface of the soft electronic structure is directly adsorbed using a taking off tool.
  25. 25. the method according to claim 21 for making soft electronic component, it is characterised in that this, which removes processing procedure, includes：
    The electret carrier for being provided with the flexible base plate is arranged above a taking off tool platform, wherein this removes work Multiple first wires and multiple second wires that tool platform built-in is spaced apart, wherein first wire and second wire It is to be staggered；And
    First wire is coupled to a positive voltage, and second wire is coupled to a ground voltage, with neutralize this One electrostatic charge.
  26. 26. the method according to claim 21 for making soft electronic component, it is characterised in that this, which removes processing procedure, includes：
    There is provided one and remove microscope carrier, wherein this, which removes microscope carrier, has an amount of electrostatic charge, and the amount of electrostatic charge is more than in the electret carrier First electrostatic charge an amount of electrostatic charge；
    The electret carrier for being provided with the flexible base plate is arranged at into this to remove above microscope carrier, wherein the flexible base plate is Microscope carrier is removed close to this.
  27. It is 27. a kind of making the equipment of soft electronic component, it is characterised in that including：
    One carrier plate transmission platform, to carry and transmit a support plate；
    An at least charging device, it is arranged on the carrier plate transmission platform, it is to will at least 10-7Coulomb/cm2Electrostatic charge injection The support plate, with as an electret carrier；And
    One sticking type device, it is arranged on the carrier plate transmission platform, it is a flexible base plate is pasted on the support plate.
  28. It is 28. according to claim 27 making the equipment of soft electronic component, it is characterised in that the carrier plate transmission is put down Platform includes：
    One conveyer belt；
    At least two roller bearings, the wherein conveyer belt are the outer surfaces for coating at least two roller bearings, and the wherein at least two rolling Axle drives the conveyer belt to continuously run by the frictional force between at least two roller bearings and the conveyer belt.
  29. It is 29. according to claim 28 making the equipment of soft electronic component, it is characterised in that the flexible base plate is One flexible base plate coiled material, it is wound on one first feed spool.
  30. It is 30. according to claim 29 making the equipment of soft electronic component, it is characterised in that the carrier plate transmission is put down Platform includes：
    One support plate coiled material；
    One second feed spool and a recovery axle, the wherein support plate coiled material is to coat second feed spool and the appearance of the recovery axle Face, and the flexible base plate coiled material coats an outer surface of one first feed spool and the outer surface of the recovery axle, and wherein this time Receive axle by its frictional force between the support plate coiled material drive the flexible base plate coiled material and the support plate coiled material respectively by this first Feed spool and the second feed spool this continuously go out band.
  31. It is 31. according to claim 27 making the equipment of soft electronic component, it is characterised in that the charging device bag Include a corona discharge charging device, a liquid contact charging device, a vacuum electronic gun charging device, one friction send a telegraph device or One electrical breakdown charging device.
  32. It is 32. according to claim 31 making the equipment of soft electronic component, it is characterised in that the corona discharge fills Electric installation includes a grounding electrode.
  33. It is 33. according to claim 27 making the equipment of soft electronic component, it is characterised in that the sticking type device Including a roller bearing or a scraper.
  34. It is 34. according to claim 33 making the equipment of soft electronic component, it is characterised in that the roller bearing have plus Hot function.
  35. It is 35. according to claim 27 making the equipment of soft electronic component, it is characterised in that the sticking type device Including an electric calorifie installation.
  36. It is 36. according to claim 35 making the equipment of soft electronic component, it is characterised in that the electric calorifie installation bag Include a thermal resistance wire heater, an infrared heater, a storage heater, a quartz halogen heaters or a ceramic heater.
  37. It is 37. according to claim 28 making the equipment of soft electronic component, it is characterised in that the sticking type device Including an electric calorifie installation, the electric calorifie installation is arranged above or below the conveyer belt.
  38. It is 38. according to claim 35 making the equipment of soft electronic component, it is characterised in that the sticking type device Including an elastic material sheet, an increased pressure board or combinations thereof.
  39. 39. according to claim 38 making the equipment of soft electronic component, it is characterised in that the elastic material sheet Connect the electric calorifie installation.
  40. It is 40. according to claim 27 making the equipment of soft electronic component, it is characterised in that the sticking type device It is arranged in an atmospheric pressure environment and subnormal ambient.
  41. It is 41. according to claim 29 making the equipment of soft electronic component, it is characterised in that also to include：
    One cutter device, it is arranged on the carrier plate transmission platform, wherein the cutter device is to cut the support plate and/or this is soft Property substrate.
  42. It is 42. according to claim 41 making the equipment of soft electronic component, it is characterised in that the cutter device bag Include a contact cutter device or a non-contact cutter device.
  43. A kind of 43. method for making soft electronic component, it is characterised in that comprise the following steps：
    As claimed in claim 27 one is provided to make the equipment of soft electronic component；
    One support plate is placed on the carrier plate transmission platform；
    The support plate is sent to this to make the charging device of the equipment of soft electronic component using the carrier plate transmission platform It is interior to carry out a charging processing procedure, will at least 10-7Coulomb/cm2Electrostatic charge inject the support plate；
    One flexible base plate is placed on the support plate；And
    This is sent to together to make soft electronic using the flexible base plate of the carrier plate transmission platform by the support plate and thereon One is carried out in the sticking type device of the equipment of component and attaches processing procedure, the flexible base plate is pasted on the support plate.
  44. 44. the method according to claim 43 for making soft electronic component, it is characterised in that put the flexible base plate After on the support plate, one is sent to together using the flexible base plate of the carrier plate transmission platform by the support plate and thereon and is additionally filled An additional charge processing procedure is carried out in electric installation, will at least 10-7Coulomb/cm2Electrostatic charge inject the flexible base plate.
  45. 45. the method according to claim 43 for making soft electronic component, it is characterised in that the charging processing procedure includes one Processing procedure or an electricity are sent a telegraph in corona discharge charging processing procedure, liquid contact charging processing procedure, vacuum electronic gun charging processing procedure, a friction Breakdown charging processing procedure.
  46. 46. the method according to claim 45 for making soft electronic component, it is characterised in that corona discharge charging dress Put including a grounding electrode.
  47. 47. the method according to claim 43 for making soft electronic component, it is characterised in that the sticking type device includes One roller bearing or a scraper, and wherein carry out the attaching processing procedure and roll the flexible base plate and the support plate using the roller bearing.
  48. 48. the method according to claim 47 for making soft electronic component, it is characterised in that the roller bearing has heating work( Can, and wherein carry out the attaching processing procedure and one heating stepses are carried out to the flexible base plate and the support plate using the roller bearing.
  49. 49. the method according to claim 43 for making soft electronic component, it is characterised in that the sticking type device includes One electric calorifie installation, and wherein carry out the attaching processing procedure and the flexible base plate and support plate progress one are added using the electric calorifie installation Hot step.
  50. 50. the method according to claim 49 for making soft electronic component, it is characterised in that the heating stepses include one Thermal resistance wire heating, an infrared heating method, a Hot-blast Heating method, a quartz halogen heating or a ceramic heat method.
  51. 51. the method according to claim 49 for making soft electronic component, it is characterised in that the sticking type device also wraps Include an elastic material sheet, an increased pressure board or combinations thereof, and wherein carry out the attaching processing procedure using the elastic material sheet, should Increased pressure board or combinations thereof carry out a pressurization steps to the flexible base plate and the support plate.
  52. 52. the method according to claim 51 for making soft electronic component, it is characterised in that the elastic material sheet connects The electric calorifie installation, and wherein carry out the attaching processing procedure and also the flexible base plate and the support plate are carried out using the elastic material sheet One heating stepses.
  53. 53. the method according to claim 43 for making soft electronic component, it is characterised in that the attaching processing procedure is normal in one Pressure ring border in subnormal ambient with carrying out.
  54. A kind of 54. method for making soft electronic component, it is characterised in that comprise the following steps：
    As claimed in claim 41 one is provided to make the equipment of soft electronic component；
    One support plate is placed on the carrier plate transmission platform；
    The support plate is sent to this to make the charging device of the equipment of soft electronic component using the carrier plate transmission platform It is interior to carry out a charging processing procedure, will at least 10-7Coulomb/cm2Electrostatic charge inject the support plate；
    One flexible base plate is placed on the support plate；
    This is sent to together to make soft electronic using the flexible base plate of the carrier plate transmission platform by the support plate and thereon One is carried out in the sticking type device of the equipment of component and attaches processing procedure, the flexible base plate is pasted on the support plate；And
    This is sent to together to make soft electronic using the flexible base plate of the carrier plate transmission platform by the support plate and thereon The cutter device of the equipment of component, to carry out a cutting processing procedure, the flexible base plate is separated into different flexible base plate fragments.
CN201410151411.0A 2014-04-16 2014-04-16 Substrate adsorption structure, the device and method for making soft electronic component Active CN105023872B (en)

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TWI653147B (en) 2017-01-25 2019-03-11 元太科技工業股份有限公司 Fabrication method of flexible electronic device
CN108346612B (en) * 2017-01-25 2022-01-25 元太科技工业股份有限公司 Method for manufacturing flexible electronic device
CN108391382A (en) * 2018-04-25 2018-08-10 深圳市精诚达电路科技股份有限公司 FPC hollow out wiring board preparation processes
KR20200124163A (en) * 2019-04-22 2020-11-02 삼성디스플레이 주식회사 Rollable display device

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