CN105022183A - Manufacturing method of display panel structure - Google Patents

Manufacturing method of display panel structure Download PDF

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Publication number
CN105022183A
CN105022183A CN201410182129.9A CN201410182129A CN105022183A CN 105022183 A CN105022183 A CN 105022183A CN 201410182129 A CN201410182129 A CN 201410182129A CN 105022183 A CN105022183 A CN 105022183A
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CN
China
Prior art keywords
substrate
frame glue
manufacture method
array
transparency conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410182129.9A
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Chinese (zh)
Inventor
陈俊江
郭传宗
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Hannstar Display Corp
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Hannstar Display Corp
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Filing date
Publication date
Application filed by Hannstar Display Corp filed Critical Hannstar Display Corp
Priority to CN201410182129.9A priority Critical patent/CN105022183A/en
Priority to US14/699,549 priority patent/US20150316799A1/en
Publication of CN105022183A publication Critical patent/CN105022183A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a manufacturing method of a display panel structure. The manufacturing method of the display panel structure comprises the following steps: annularly arranging a plurality of pieces of first frame glue on the periphery of a plurality of liquid crystal display units on a first substrate respectively to form at least one array; forming at least one piece of second frame glue on the first substrate, wherein the second frame glue is annularly arranged on the periphery of the array section by section; and correspondingly attaching a second substrate to the first substrate, so that the second frame glue is connected between the first substrate and the second substrate. According to the manufacturing method of the display panel structure, the problems of substrate stripping, fragmenting and the like in the technology of back plating of a conductive layer can be solved, the inner attacking phenomenon of liquid crystals can be inhibited and the process yield is improved.

Description

The manufacture method of display panel structure
Technical field
The present invention is about a kind of manufacture method of display panel structure.
Background technology
Liquid crystal display (Liquid Crystal Display, LCD) device is low with its power consumption, thermal value is few, lightweight and non-radiation type etc. advantage, be used in electronic product miscellaneous, and little by little replace traditional cathode-ray tube (CRT) (Cathode Ray Tube, CRT) display device.
Generally speaking, liquid crystal indicator mainly comprises a display panels, a driver module and a backlight module.Wherein, display panels mainly has a thin film transistor base plate (TFTsubstrate), a colored optical filtering substrates (CF substrate) and is located in liquid crystal layer between two substrates.
In the manufacture process of a kind of display panels known, such as can be coated with multiple frame glue on a thin film transistor base plate, and liquid crystal is injected in each frame glue, again under vacuum environment by after corresponding with a colored optical filtering substrates for film transistor substrate bonding by frame adhesive curing, to obtain the display panel structure with multiple liquid crystal display, afterwards, circumferential periphery again in panel construction is coated with another frame glue, carry out substrate thinning, technique such as the back of the body plating transparency conducting layer and cutting etc. again, to obtain multiple display panels.
But, in the subsequent technique of back of the body plating transparency conducting layer, owing at the outside surface of colored optical filtering substrates in vacuum environment lower back plating layer of transparent conductive layer, therefore, need easily there is the problems such as strippable substrate (peeling) and fragmentation.In addition, bind corresponding with colored optical filtering substrates for film transistor substrate under vacuum environment, because frame glue solidifies not yet completely, liquid crystal molecule to be there is under atmospheric pressure environment the inside fire attack phenomenon of frame glue is attacked (panel size is less in the substrate after therefore binding in replying, inside fire attack situation is more serious), the leakage of liquid crystal can be caused time serious and yield is reduced.
Summary of the invention
Object of the present invention, for providing a kind of manufacture method of display panel structure, not only can be improved the problem such as the strippable substrate that occurs and fragmentation in the technique of back of the body plating conductive layer, also can restrain the inside fire attack phenomenon of liquid crystal and improve process yields.
For reaching above-mentioned purpose, the manufacture method according to a kind of display panel structure of the present invention comprises the following steps: on a first substrate, most first frame glue is located on respectively the periphery of most liquid crystal display, to form at least an array; Form at least one second frame glue on first substrate, and make the second frame glue grading ring be located at array periphery; And fit corresponding with first substrate for a second substrate, be linked between first substrate and second substrate to make the second frame glue.
In one embodiment, when forming the step of at least an array, by the formula injection method that drips insert respectively liquid crystal to these the first frame glue enclose in the region of formation.
In one embodiment, when forming the step of at least one second frame glue, the second frame glue is configured between these arrays.
In one embodiment, when forming the step of at least one second frame glue, the second frame glue is configured between these array and edges of first substrate.
In one embodiment, when forming the step of at least one second frame glue, these the second frame glue are configured to the array-like be made up of with row row.
In one embodiment, when forming the step of at least one second frame glue, two these the second frame glue adjacent form an interval region in the row direction or along column direction.
In one embodiment, manufacture method also comprises a step: form the periphery that one the 3rd frame rubber seal closes first substrate and second substrate.
In one embodiment, manufacture method also comprises a step: form at least one transparency conducting layer in the outside surface of first substrate or second substrate.
In one embodiment, when forming the step of at least one transparency conducting layer, comprise the following steps: on the surface of first substrate or second substrate, form non-crystal transparent conductive layer; With this non-crystal transparent conductive layer of a high energy pulse patterning, the non-crystal transparent conductive layer change of this patterning is made to become patterned polysilicon transparency conducting layer; And non-patterned non-crystal transparent conductive layer is removed in etching.
From the above, in the manufacture method of display panel structure of the present invention, comprise the following steps: on first substrate, most first frame glue is located on respectively the periphery of most liquid crystal display, with formed at least an array, form at least one second frame glue on first substrate, and make the second frame glue grading ring be located at array periphery and fit corresponding with first substrate for second substrate, be linked between first substrate and second substrate to make the second frame glue.Whereby, compare with prior art, array periphery is located at by the second frame glue grading ring, not only can improve the problem such as strippable substrate and fragmentation occurred when display panel structure forms electrically conducting transparent layer process under vacuum environment, also can restrain first substrate and second substrate under vacuum environment corresponding fit after, the liquid crystal inside fire attack phenomenon that substrate causes under replying atmospheric pressure environment and improve process yields.
Accompanying drawing explanation
Figure 1A is the flow chart of steps of a kind of display panel structure manufacture method of the preferred embodiment of the present invention.
Figure 1B is another flow chart of steps of a kind of display panel structure manufacture method of the preferred embodiment of the present invention.
Fig. 2 A and Fig. 2 B is respectively the process schematic of display panel structure manufacture method.
Fig. 2 C and Fig. 2 D is respectively another process schematic of display panel structure manufacture method.
Fig. 3 A and Fig. 3 B is respectively the another process schematic of display panel structure manufacture method.
Embodiment
Hereinafter with reference to relevant drawings, the manufacture method of the display panel structure according to the preferred embodiment of the present invention is described, wherein identical assembly is illustrated with identical reference marks.In order to clear expression feature of the present invention, below in all schematic diagram overlooked, though each first frame glue and each second frame glue are shown as a dotted line, in fact it is the structure of one deck and has certain width.
Please refer to Figure 1A and coordinate shown in Fig. 2 A and Fig. 2 B, wherein, Figure 1A is the flow chart of steps of a kind of display panel structure manufacture method of the preferred embodiment of the present invention, and Fig. 2 A and Fig. 2 B is respectively the process schematic of display panel structure manufacture method.
As shown in Figure 1A, the manufacture method of display panel structure comprises step S01 to rapid S03.
First, carry out step S01, as shown in Figure 2 A, on a first substrate 11, most first frame glue 14 is located on respectively the periphery of most liquid crystal display 13, to form at least an array A.Wherein, first substrate 11 can be made by light-permeable material, and its material is such as glass, quartz or analog, plastics, rubber, glass fibre or other macromolecular material; Or first substrate 11 also can be made by light tight material, and be such as metal-glass fiber composite plate, metal-ceramic composite plate, or printed circuit board (PCB), or other material, do not limit.In addition, these liquid crystal displays 13 of the present embodiment are rectangular (two-dimensional arraies) that are configured to be made up of with row (direction X) row (direction Y).Wherein, these liquid crystal displays 13 can be respectively edge electrical field switching type (fringe field switching, FFS) liquid crystal display or plane suitching type (in-plane switch, IPS) (FFS and IPS need arrange a shielding electrode to liquid crystal display on substrate, the image quality shown to prevent electrostatic influence), do not limit.In addition, the first frame glue 14 can be heat-curable glue, optic-solidified adhesive or its combination.Be with the first frame glue 14 for optic-solidified adhesive (such as UV glue) in the present embodiment, and be formed on first substrate 11 for coating method such as but not limited in air.Wherein, the region that each first frame glue 14 continuous loop is established forms an accommodation space, forms a liquid crystal display 13 in liquid crystal molecule can be filled in accommodation space that the first frame glue 14 encloses.Wherein, such as but not limited to the formula injection method that drips (One Drop Filling, ODF) insert respectively liquid crystal molecule to these the first frame glue 14 enclose in the region of formation, make these the first frame glue 14 be located on the periphery of these liquid crystal displays 13 respectively.
Then, carry out step S02: form at least one second frame glue 15 on first substrate 11, and it is peripheral to make the second frame glue 15 grading ring be located at array A.In the present embodiment, be for a second frame glue 15.Second frame glue 15 can be heat-curable glue, optic-solidified adhesive or its combination.In the present embodiment, with the second frame glue 15 be heat-curable glue, optic-solidified adhesive be combined as example.Second frame glue 15 such as can be formed on first substrate 11 with coating method in air, and grading ring is located at the periphery of these liquid crystal displays 13 of array A.In other words, the second frame glue 15 has multiple sections (having an opening O between section and section), and these sections are formed at the periphery of these liquid crystal displays 13 in array configurations.Wherein, as shown in Figure 2 A, in the second frame glue 15, the distance D1 between section and section can be greater than 3 centimetres (that is the opening O between section and section is at least 3 centimetres).In addition, the second frame glue 15 length D2 of every section is less than or equal to 30 centimetres (that is D2≤30 centimetre).But, in other embodiment, the second frame glue 15 length D2 of every section also can be greater than 30 centimetres.
Then, carry out step S03, as shown in Figure 2 B, fit corresponding with first substrate 11 for a second substrate 12, be linked between first substrate 11 and second substrate 12 to make the second frame glue 15.Second substrate 12 also can be light-permeable material and makes, and its material is such as glass, quartz or analog, plastics, rubber, glass fibre or other macromolecular material; Or second substrate 12 also can be made by light tight material, and be such as metal-glass fiber composite plate, metal-ceramic composite plate, or printed circuit board (PCB), or other material.In the present embodiment, the material of first substrate 11 and second substrate 12 all for the glass of light-permeable, and carries out attaching process under vacuum environment.Wherein, first substrate 11 can comprise at least one thin film transistor (TFT) array, and second substrate 12 can comprise at least one colour filter array and black matrix".But, in other embodiments, the filter layer of colour filter array or black matrix" also can be arranged on first substrate 11 respectively, become a COA (color filter on array) substrate, or become a BOA (BMon array) substrate, do not limited.After completing steps S03, also by a curing process, these the first frame glue 14 and the second frame glue 15 are cured (not shown).In this, such as, in air, the second frame glue 15 (carrying out vacation to fix) can be irradiated with ultraviolet light (UV), toast with baking box (oven) more afterwards, the first frame glue 14 and the second frame glue 15 are solidified completely.
In addition, please refer to Figure 1B and coordinate shown in Fig. 2 C and Fig. 2 D, wherein, Figure 1B is another flow chart of steps of display panel structure manufacture method, and Fig. 2 C and Fig. 2 D is respectively another process schematic of display panel structure manufacture method.
Except step S01 to step S03, as shown in Figure 1B, manufacture method also can comprise step S04 to step S06.
As shown in Fig. 2 C and Fig. 2 D, step S04 is: form the periphery that one the 3rd frame glue 16 closes first substrate 11 and second substrate 12.Wherein, the 3rd frame glue 14 also can be heat-curable glue, optic-solidified adhesive or its combination.In the present embodiment, with the 3rd frame glue 14 for optic-solidified adhesive (such as UV glue), and such as but not limited to being formed at the outer periphery of first substrate 11 with second substrate 12 with coating method.Linked by the 3rd frame glue 16 and close first substrate 11 and the outer periphery of second substrate 12, can prevent in follow-up technique, chemical agent destroys the inner structure of display panel structure 1.
After the step S04 completing the 3rd frame glue 16 but before carrying out step S05, also by another curing process, the 3rd frame glue 16 is cured (not shown).Then, then the step S05 of a substrate thinning is carried out, with thinning first substrate 11 or second substrate 12.At this, the modes such as grinding, polishing or etching such as can be utilized to reduce the thickness of first substrate 11 and second substrate 12, make the thickness of first substrate 11 and second substrate 12 be less than 0.4 millimeter.
Finally, step S06 is carried out: form at least one transparency conducting layer 17 in the outside surface of first substrate 11 or second substrate 12.In the present embodiment, transparency conducting layer 17 such as can be formed at the outer surface of second substrate 12 under vacuum environment.The material of transparency conducting layer 17 can be for example and without limitation to indium tin oxide (indium-tin oxide, ITO) or indium-zinc oxide (indium-zinc oxide, IZO), or other material.If these liquid crystal displays 13 of display panel structure 1 be edge electrical field switching type liquid crystal display or plane suitching type liquid crystal display time, then transparency conducting layer 17 can be used as the electrostatic protection layer of liquid crystal display 13, can improve the electrostatic protection function of display panel structure 1 whereby; In addition, if when these liquid crystal displays 13 are respectively touch liquid crystal display unit (FFS or IPS), then display panel structure 1 can be applicable on such as On-Cell formula contact panel, now transparency conducting layer 17 can be a pixel control layer (can comprise drive electrode and sensing electrode, figure does not show).Wherein, transparency conducting layer 17 can be a patterned polysilicon (crystalline) transparency conducting layer (in icon non-shows patterned metal), and patterned polysilicon transparency conducting layer can by the layer change of an amorphous (amorphous) electrically conducting transparent.The method forming patterned polysilicon transparency conducting layer can comprise following steps: on the surface of second substrate 12, form at least one non-crystal transparent conductive layer (material is such as ITO); With this non-crystal transparent conductive layer of a high energy pulse patterning, the non-crystal transparent conductive layer change of patterning is made to become a patterned polysilicon transparency conducting layer; And this non-patterned non-crystal transparent conductive layer is removed in etching.In enforcement, such as, be form a non-crystal transparent conductive layer in the outer surface of second substrate 12 with such as sputtering process, thickness be such as 200 to between, then, one excimer laser tempering (excimer laser annealing is carried out to non-crystal transparent conductive layer, ELA) process, by this non-crystal transparent conductive layer of laser straight map interlinking patterning of high energy pulse, non-crystal transparent conductive layer can be made within the quite short time to be exposed to high temperature under, and then be transformed into patterned polysilicon transparency conducting layer, finally, carry out an etch process, utilization the chemical agent (such as oxalic acid) of etching method for amorphous material can only remove non-patterned non-crystal transparent conductive layer, to obtain patterned polysilicon transparency conducting layer.Wherein, multi-crystal transparent conductive layer has electric conductivity more better than non-crystal transparent conductive layer.In addition, carry out patterning with laser and can omit one photoresistance technique, such as, expose and develop.After the technique forming transparency conducting layer 17, can a cutting technique (not shown) be carried out again and obtain display panels or the touch-control display panel with multiple liquid crystal display 13.
Proved by actual measurement, compare with prior art, in the display panel structure 1 that the manufacture method of the present embodiment obtains, the periphery of array A is located at by the second frame glue 15 grading ring, not only can improve display panel structure 1 under vacuum environment when the outside surface of second substrate 12 forms electrically conducting transparent layer process the problem such as the strippable substrate that occurs and fragmentation, also the first substrate 11 can restraining display panel structure 1 and second substrate 12 are corresponding when fitting under vacuum environment, the liquid crystal inside fire attack phenomenon caused before the first frame glue 15 is uncured and improve process yields.
In addition, please refer to shown in Fig. 3 A and Fig. 3 B, it is respectively the another process schematic of display panel structure manufacture method.
As shown in Fig. 3 A and Fig. 3 B, the manufacture method of display panel structure 1a is roughly the same with the manufacture method of display panel structure 1, main difference is, in step S01, the periphery most the first frame glue 14 being located on respectively most liquid crystal displays 13 on first substrate 11, to form most array A.In this, these arrays A system forms two-dimensional array shape.In addition, when step S02, be form most the second frame glue 15 on first substrate 11, and make each second frame glue 15 grading ring be located at the periphery of corresponding array A.Therefore, display panel structure 1a has four array A and four the second frame glue 15, these arrays A is configured to two-dimensional matrix, and each second frame glue 15 grading ring is located at the periphery of these liquid crystal displays 13 of corresponding array A, makes display panel structure 1a be a panel.Wherein, the second frame glue 15 segmented configuration is between these arrays A, and the second frame glue 15 segmented configuration is between these arrays A and the edge of first substrate 11.In addition, these the second frame glue 15 are spaced configuration, make to have an interval region between two adjacent second frame glue 15.In other words, these the second frame glue 15 are configured to the array-like be made up of with row (direction X) row (direction Y), and two these the second frame glue 15 adjacent form an interval region in the row direction or along column direction.In this, as shown in Figure 2 A, along on the Y of direction, between two adjacent second frame glue 15 separately, and along on the X of direction, to form criss-cross interval region on cubic plate between two adjacent second frame glue 15 also separately.
In addition much more no longer, the further feature of display panel structure 1a manufacture method can refer to described in the manufacture method of display panel structure 1, to explain at this.
In sum, in manufacture method because of display panel structure of the present invention, comprise the following steps: on first substrate, most first frame glue is located on respectively the periphery of most liquid crystal display, with formed at least an array, form at least one second frame glue on first substrate, and make the second frame glue grading ring be located at array periphery and fit corresponding with first substrate for second substrate, be linked between first substrate and second substrate to make the second frame glue.Whereby, compare with prior art, array periphery is located at by the second frame glue grading ring, not only can improve the problem such as strippable substrate and fragmentation occurred when display panel structure forms electrically conducting transparent layer process under vacuum environment, also can restrain first substrate and second substrate under vacuum environment corresponding fit after, the liquid crystal inside fire attack phenomenon that substrate causes under replying atmospheric pressure environment and improve process yields.
The foregoing is only illustrative, but not be restricted.Anyly do not depart from spirit of the present invention and scope, and to its equivalent modifications of carrying out or change, all should be contained in claims.
[symbol description]
1,1a: display panel structure
11: first substrate
12: second substrate
13: liquid crystal display
14: the first frame glue
15: the second frame glue
16: the three frame glue
A: array
D1: distance
D2: length
O: opening
S01 ~ S06: step
X, Y, Z: direction

Claims (10)

1. a manufacture method for display panel structure, comprises the following steps:
On a first substrate, most first frame glue is located on respectively the periphery of most liquid crystal display, to form at least an array;
Form at least one second frame glue on described first substrate, and make described second frame glue grading ring be located at described array periphery; And
Fit corresponding with described first substrate for a second substrate, be linked between described first substrate and described second substrate to make described second frame glue.
2. manufacture method as claimed in claim 1, wherein when forming the step of described at least one array, by the formula injection method that drips insert respectively liquid crystal to described first frame glue enclose in the region of formation.
3. manufacture method as claimed in claim 1, wherein when forming the step of described at least one second frame glue, described second frame glue is configured between described array.
4. manufacture method as claimed in claim 3, wherein when forming the step of described at least one second frame glue, described second frame glue be configured at described array and described first substrate edge between.
5. manufacture method as claimed in claim 1, wherein when forming the step of described at least one second frame glue, described second frame glue is configured to the array-like be made up of with row row.
6. manufacture method as claimed in claim 5, wherein when forming the step of described at least one second frame glue, two adjacent described second frame glue form an interval region in the row direction or along column direction.
7. manufacture method as claimed in claim 1, also comprises a step:
Form the periphery that one the 3rd frame rubber seal closes described first substrate and described second substrate.
8. manufacture method as claimed in claim 1, also comprises a step:
Form at least one transparency conducting layer in the outside surface of described first substrate or described second substrate.
9. manufacture method as claimed in claim 8, wherein when forming the step of at least one transparency conducting layer, described transparency conducting layer is a patterned polysilicon transparency conducting layer, and described patterned polysilicon transparency conducting layer is by a non-crystal transparent conductive layer change.
10. manufacture method as claimed in claim 9, when wherein forming the step of at least one transparency conducting layer, comprises the following steps:
Described non-crystal transparent conductive layer is formed on the surface of described first substrate or described second substrate;
With non-crystal transparent conductive layer described in a high energy pulse patterning, the described non-crystal transparent conductive layer change of described patterning is made to become described patterned polysilicon transparency conducting layer; And
Non-patterned described non-crystal transparent conductive layer is removed in etching.
CN201410182129.9A 2014-04-30 2014-04-30 Manufacturing method of display panel structure Pending CN105022183A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201410182129.9A CN105022183A (en) 2014-04-30 2014-04-30 Manufacturing method of display panel structure
US14/699,549 US20150316799A1 (en) 2014-04-30 2015-04-29 Display panel structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410182129.9A CN105022183A (en) 2014-04-30 2014-04-30 Manufacturing method of display panel structure

Publications (1)

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CN105022183A true CN105022183A (en) 2015-11-04

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1504813A (en) * 2002-11-28 2004-06-16 Lg.������Lcd��ʽ���� method for manufacturing liquid-crystal display device
JP2006201276A (en) * 2005-01-18 2006-08-03 Sharp Corp Manufacturing method of liquid crystal display panel
CN101078828A (en) * 2006-05-24 2007-11-28 群康科技(深圳)有限公司 Liquid crystal panel
US20100008026A1 (en) * 2008-07-14 2010-01-14 Samsung Mobile Display Co., Ltd. Flat panel display apparatus and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1504813A (en) * 2002-11-28 2004-06-16 Lg.������Lcd��ʽ���� method for manufacturing liquid-crystal display device
JP2006201276A (en) * 2005-01-18 2006-08-03 Sharp Corp Manufacturing method of liquid crystal display panel
CN101078828A (en) * 2006-05-24 2007-11-28 群康科技(深圳)有限公司 Liquid crystal panel
US20100008026A1 (en) * 2008-07-14 2010-01-14 Samsung Mobile Display Co., Ltd. Flat panel display apparatus and method of manufacturing the same

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