CN105009143B - Integrated form fingerprint sensor - Google Patents
Integrated form fingerprint sensor Download PDFInfo
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- CN105009143B CN105009143B CN201480009822.4A CN201480009822A CN105009143B CN 105009143 B CN105009143 B CN 105009143B CN 201480009822 A CN201480009822 A CN 201480009822A CN 105009143 B CN105009143 B CN 105009143B
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- sensing element
- fingerprint sensor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04106—Multi-sensing digitiser, i.e. digitiser using at least two different sensing technologies simultaneously or alternatively, e.g. for detecting pen and finger, for saving power or for improving position detection
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Include the multiple sensing elements being positioned on the first side of part the present invention relates to the fingerprint sensor for being used in particular for being integrated in the equipment with the covering made of insulating materials and fingerprint sensor system, fingerprint sensor system；Multiple probes in the preassigned pattern in the fingerprint sensing region in the second side for defining covering, multiple probes are stretched out at least partially through covering from the first side of covering；More lead wire of conductor for making multiple probes be interconnected with multiple sensing elements on the first side of covering；Multiple amplifiers of multiple sensing elements are connected to, the quantity of amplifier is less than the quantity of sensing element；And it is connected to the active circuit of multiple sensing elements, active circuit is suitable for exporting at least one activation signal.
Description
Technical field
The present invention relates to the fingerprint sensors for being integrated in smart phone or the like.
Background technology
The fingerprint sensor for including the electrode for measuring the feature in fingerprint surface be it is well known, such as EP0988614,
US5,963,679 and 6,069,970 describes the sensor based on the different principles for measuring impedance or capacitance, and including multiple
The bar shaped of individual sensor element or matrix sensor.
The sensor surface of current finger print sensor is generally not suitable for having with environment and be in direct contact on a large scale, and usually
Being necessarily provided with prevents circuit from moisture, abrasion, burn into chemical substance, electronic noise, mechanical influence, sunlight electric discharge etc.
Shell.United States Patent (USP) 5,862,248 provides the possibility solution to this problem, and wherein circuit is packaged into so that permitting
Perhaps finger is in direct contact by the opening in the top of shell with the sensing surface of sensor.
This solution will be not enough to provide required reliability in many cases,.On the surface of integrated circuit
The material (semiconductor, metal, medium) used is usually insufficient to reliably be exposed to during long period of time to stand
It is contacted in external environment and with finger, and therefore this solution also leads to integrity problem.Another solution can be with
It is to add additional metal and dielectric layer on the chip surface, such as in United States Patent (USP) 6, described in 069,970.However addition is thick
Dielectric layer typically result in measuring signal decaying and thus cause fingerprint sensor performance decaying.These layers also tend to increase
Production cost, and generally produce and (become with technological temperature, caused by temperature difference with the compatibility issue of semiconductor technology
The size of change etc. is related).The another solution of description is suffered in US EP1303828, which passes through substrate cloth by conductor
Line is positioned securely within inside equipment on the another side of substrate to processor, then conductor.
Touch screen driving equipment has front surface as smart phone and tablet-type personal computer's equipment, wherein aobvious
Show region close to up to 100% utilization rate, and with outside display area can be used for physical button or other users interaction is set
Standby very limited space.US 2013/0181949A1 disclose the transparent finger being covered in above the touch screen of smart phone
One possible realization of line sensor.US 8,564,314 discloses the finger integrated with capacitance touch alignment sensor
Another possible realization of line sensor, wherein sensor are located under glass.However, the patent is not discussed or proposes gram
Take any solution of the sensor performance deep fades caused by thick protective glass lid.
Invention content
Be integrated in it is in the glass of the touch panel device of such as mobile phone or tablet-type personal computer, be used in particular for leading to
It crosses the front glass of touch panel device or fingerprint sensor that protective cover is sensed realizes that prevent fingerprint sensor to be exposed to outer
The a variety of different designs and human engineering of the cost-effective solution and different hand-held device manufacturers of portion's environment
Learn critical design criterion.
Following aspect is described according to embodiment of the present disclosure：
1) providing the fingerprint sensing for being used in particular for being integrated in the equipment with the covering made of insulating materials
Device obtains these purposes, and wherein fingerprint sensor includes：The multiple sensing elements being positioned on the first side of part；Positioned at boundary
Determine multiple probes in the preassigned pattern in the fingerprint sensing region in the second side of covering, multiple probes at least partially through
Covering is stretched out from the first side of covering；And multiple probes is made to be interconnected with multiple sensing elements on the first side of covering
More lead wire of conductor.
2) such as project 1) as described in fingerprint sensor, wherein whole the multiple probe portions pass through the covering
Part extends.
3) such as project 1) as described in fingerprint sensor, wherein the probe portion of the first quantity in the multiple probe
Extend across the covering；And
The probe of the second quantity in the multiple probe extends across the covering.
4) such as project 1) as described in fingerprint sensor, wherein a certain number of probes in the multiple probe pass through institute
State covering extension；And
At least one of a certain number of probes extended across the covering are covered with dielectric layer.
5) such as project 1) as described in fingerprint sensor, wherein the insulating materials be selected from by glass, poly-methyl methacrylate
The group of ester and makrolon composition.
6) such as project 1) as described in fingerprint sensor, wherein each sensing element is suitable for：
It is activated by ac current signal or ac voltage signal, and if be activated, what output was modulated by activation signal
Response signal, or if be not activated, not output signal.
7) such as project 6) as described in fingerprint sensor, wherein the sensing element is grouped into multigroup sensing element, and
Each sensing element in one group of sensing element is suitable for simultaneously common to all sensing elements in one group of sensing element
Activation signal activation.
8) such as project 1) as described in fingerprint sensor, wherein the multiple sensing element further includes：
The sensing electrode defined in the first conductive layer；
The first dielectric layer under the sensing electrode；And
The active electrode and pickoff electrode defined in the second conductive layer on the opposite side of first dielectric layer, and
The active electrode and the pickoff electrode are covered by the sensing electrode at least partly.
9) such as project 8) as described in fingerprint sensor, wherein first conductive layer is defined at the described of the covering
In lead wire of conductor layer on first side.
10) such as project 8) as described in fingerprint sensor, wherein the multiple sensing element is located on the second substrate and is electrically connected
The lead wire of conductor layer being connected on first side of the covering.
11) such as project 10) as described in fingerprint sensor, wherein second substrate is multiple layer polymer substrate.
12) such as project 8) as described in fingerprint sensor, wherein the multiple sensing element further includes：
The second dielectric layer under second conductive layer；And
The activated row defined in third conductive layer on the opposite side of second dielectric layer, and activated row electricity
It is connected to the active electrode.
13) such as project 12) as described in fingerprint sensor, wherein the activated row by conductive path be electrically connected to it is described swash
Electrode living.
14) such as project 12) as described in fingerprint sensor, wherein the activated row passes through on second dielectric layer
Capacitive coupling and be electrically connected to the active electrode.
15) such as project 1) as described in fingerprint sensor, wherein the probe is located in the transparent part of the covering, institute
The processing unit that lead wire of conductor is routed to except the transparent region is stated, and
The probe and the lead wire of conductor are made of substantially transparent material.
16) it is a further object of the present invention to provide be used in particular for being integrated in setting with the covering made of insulating materials
Fingerprint sensor system in standby, wherein fingerprint sensor system includes the multiple sensing elements being positioned on the first side of part
Part；Multiple probes in the preassigned pattern in the fingerprint sensing region in the second side for defining covering, multiple probes are at least
It is stretched out from the first side of covering partially across covering；Make multiple probes and multiple sensing elements on the first side of covering
More lead wire of conductor of part interconnection；Multiple amplifiers of multiple sensing elements are connected to, the quantity of amplifier preferably less than passes
The quantity of sensing unit；And it is connected to the active circuit of multiple sensing elements, active circuit is suitable for exporting at least one activation letter
Number.
17) such as project 16) as described in fingerprint sensor system, wherein each sensing element is suitable for by coming from the activation
The ac current signal or ac voltage signal of circuit activate, and if be activated, the sound that will be modulated by the activation signal
Induction signal is output to an amplifier in the multiple amplifier, or if be not activated, not output signal.
18) such as project 17) as described in fingerprint sensor system, wherein the sensing element is grouped into multigroup sensing element
In, and each sensing element in one group of sensing element be suitable for simultaneously by from the active circuit to one group of sensing element
Activation signal activation common to all sensing elements in part.
19) such as project 18) as described in fingerprint sensor system, wherein the active circuit is further adapted to one group of sensing
Each sensing element in element exports an activation signal, and
Sequentially switch between the activation signal once to activate a sensing element in one group of sensing element
Part.
20) such as project 16) as described in fingerprint sensor system, wherein the multiple sensing element further includes：
The sensing electrode defined in the first conductive layer；
The first dielectric layer under the sensing electrode；
The active electrode and pickoff electrode defined in the second conductive layer on the opposite side of first dielectric layer, and
The active electrode and the pickoff electrode are covered by the sensing electrode at least partly；
The active electrode is connected to the active circuit；And
The pickoff electrode is connected to an amplifier in the multiple amplifier.
21) such as project 20) as described in fingerprint sensor system, wherein the multiple sensing element further includes：
The second dielectric layer under second conductive layer；And
The activated row defined in third conductive layer on the opposite side of second dielectric layer, and activated row electricity
It is connected to the active electrode so that the active electrode is connected to the active circuit by the activated row.
22) such as project 17) and 21) as described in fingerprint sensor system, wherein the multiple probe be located at one-dimensional mode or
In two-dimensional model, the two-dimensional model corresponds to m rows sensing element and n biographies sensing units, wherein m >=1 and n>1；
The pickoff electrode of each sensing element in one row is connected to by public pickup row in n amplifier
One amplifier；
The active electrode of each sensing element in a line is connected to by public activated row in m activation signal
An activation signal；
The active circuit is configured to sequentially switch between the m activation signal, the activation signal activation one
Each sensing element in row so that thus the signal generated is sensed on corresponding pickoff electrode and by arranging amplification accordingly
Device amplifies.
23) such as project 17) as described in fingerprint sensor system, wherein multigroup sensing element arrangement is linear in itself
In array, every group of sensing element substantially defines scratching fingerprint sensor.
24) such as project 23) as described in fingerprint sensor system, wherein the active circuit is further adapted for connecing from touch control display
Receive input；And the active circuit activates one in one group of sensing element based on the input from the touch control display
A sensing element.
25) such as project 24) as described in fingerprint sensor system, wherein the input from the touch control display includes hand
Refer to the speed moved on the touch control display and direction.
Description of the drawings
Reference is only used as example and shows that the present invention is more fully described in the attached drawing of the present invention.
Fig. 1 shows the example devices according to the present invention for including fingerprint sensor.
Fig. 2 shows the exemplary layouts of circuit system according to the present invention.
Fig. 3 a-d show the cross section of the illustrative embodiments of fingerprint sensor according to the present invention.
Fig. 4 a-b show an exemplary sensor element or sensor pixel for fingerprint sensor according to the present invention.
Fig. 5 shows the another exemplary sensor element or sensor pixel of fingerprint sensor according to the present invention.
Fig. 6 is the schematic diagram of exemplary measuring principle according to the present invention.
Fig. 7 is the schematic diagram of the exemplary measuring principle of arrays of sensor elements according to the present invention.
Fig. 8 is the schematic diagram of example fingerprint sensor system according to the present invention.
Fig. 9 is the schematic diagram of another exemplary fingerprint sensor system according to the present invention.
Figure 10 shows the illustrative embodiments of the present invention realized in smart phone.
Specific implementation mode
Fig. 1 shows the smart phone 10 with front surface 11, and front surface 11 is by glass, PMMA (poly-methyl methacrylates
Ester), makrolon or other transparent glass equivalents (they are hereinafter simply referred to as glass) be made.Front surface 11 is preferably such as
The interface of the display for the enabling touch screen that those of skill in the art understand.Front surface 11 is generally made of one block of glass,
And the general transparent part 12 for being hereinafter known respectively as display 12 and button area 13 and opaque of being visually divided into
Part 13.As in the art technical staff understand smart phone 10 further include processor, memory, transceiver,
Touch screen driver and corresponding interconnection circuitry.As will hereinafter further disclosed in, it is as needed, as described herein
Fingerprint sensor can be located in display area 12 or button area 13, and can be alternatively coupled to touch screen driver.
Fig. 2 shows in the preassigned pattern of the sensitive zones on the front for the shell or covering 20 for defining such as glass
Multiple probes 21, equipment such as smart phone shown in 20 coverage diagram 1 of covering is exemplary.Each probe in multiple probes
21 at least partially through covering 20 from the back side of covering stretch out, and be further coupled on the back side make probe 21 with
More lead wire of conductor 22 of multiple sensing elements interconnection on the back side.Probe 21 provides and the finger surface on sensitive zones
(not shown) is electrically coupled, the different fingerprint measuring principle such as capacitance recognized according to such as those of skill in the art or
The measurement of fingerprint etc. is realized in resistance measurement.
The preassigned pattern for defining sensitive zones as shown in Figure 2 is to illustrate the simplification probe layout of the present invention.As being disclosed herein
Fingerprint sensor be not limited to any specific probe layout or sensing principle.One in bar shaped or scratching fingerprint sensor is shown
In example property embodiment, there will be multiple sensor elements to be used to measure movement of the finger relative to sensor, as above
It is discussed in the EP0988614 or EP1303828 that mention.Optionally, sensor can be such as in US6,289,114 to table
The submatrix of a series of images sampling in face.Another probe layout is described in EP1328919, wherein in order to navigating mesh,
Two line sensor elements are used to measure the movement of finger.In the another embodiment of touch sensor, probe will be by being laid out
The matrix of complete, motionless fingerprint is covered, this is as in US 6,512,381, US 6,862,942,6,525,547 Hes of US
It is discussed in US 6,327,376.
Fig. 3 a-3d show the cross section of the illustrative embodiments of the fingerprint sensor integrated with covering 20,
Covering 20 by such as PMMA (polymethyl methacrylate), makrolon or other transparent glass equivalents insulating materials system
At.Multiple sensing elements 27 are positioned on the first side of part 20.Biography is defined by probe 21,21 ' in the second side of covering
Sensillary area domain, probe 21,21 ' extends at least partially through covering 20 and the conductor being connected on the first side of covering draws
Line 22.Lead wire of conductor 22 constitute by signal from probe 21,21 ' be routed to multiple sensing elements 27 wiring layer or
Redistribute layer.Sensing element is connected further on the first side for example being adjusted for analog signal, being positioned over part
3 (not shown) of signal processor.Signal processor can be CMOS ASIC or any other IC appropriate.It is noted, however, that leading
Body trace layer can be a part for sensing element according to some embodiments of the present invention.Probe 21,21 ' and lead wire of conductor
22 are made of an electrically conducting material, and can be formed such that such as small characteristic size of tin indium oxide (ITO) or transparent material enable
Conductor becomes substantially invisible to user.Therefore, property embodiment according to an example of the present invention, is positioned over part 20
Probe 21,21 ' and lead wire of conductor 22 in transparent part 12 are routed to the processing unit 23 outside transparent region.
The example manufacturing process of fingerprint sensor as described in this article utilizes commercially available cover material and essence
Close processing technology.First, hole and/or blind hole are made in substrate material, to pass through side known to those of skill in the art
Method defines position and the depth of probe such as laser drill, machine drilling, ion boring, ion(ic) etching.Secondly, pass through this
Method known to technical staff in field is come to be filled and/or covered with conductive material such as deposition, ion exchange metal
Hole and surface.Third, the mark that can be partly known using such as those of skill in the art on the front of substrate and/or the back side
Quasi-optical lithography and etch process handle electrode and lead wire of conductor.
Turning now to Fig. 3 a, show and covering 20 integrates made of the insulating materials of such as glass finger
First illustrative embodiments of line sensor.Probe 21 pass through covering extend and substantially with the second side of covering 20 or
The surface of upside flushes.According to the fingerprint sensing principle of selected fingerprint sensing principle, especially capacitance sensing, dielectric layer 31
Also probe 21 can be covered to provide the capacitive coupling with finger surface.Dielectric layer 31 can cover all or most of probe 21.Not
Capped probe 21 can provide the current coupling with finger surface.
The fingerprint sensor that Fig. 3 b are shown Yu covering 20 integrates made of the insulating materials of such as glass
Second illustrative embodiments.Second embodiment is different from first embodiment place and is only that probe 21 extends to covering
On the upside of part 20.This allows the wiring of the probe 21 on the upside of covering.Again, according to selected fingerprint sensing
The fingerprint sensing principle of principle, especially capacitance sensing, dielectric layer 31 can also cover probe 21 to provide the electricity with finger surface
Hold coupling.Dielectric layer 31 can cover all or most of probe 21.Uncovered probe 21 can provide the electricity with finger surface
Stream coupling.Although it is not shown, the combination of two first embodiments is also possible, such as multiple probes can be upper with covering
The surface of side flushes, and some probes may extend on surface.
The fingerprint sensor that Fig. 3 c are shown Yu covering 20 integrates made of the insulating materials of such as glass
Third illustrative embodiments.In this embodiment, probe 21 ' extends partially across covering 20.In probe 21 '
The distance between end and the surface of upside of covering 20 d21’48 are selected such that probe 21 ' can provide and finger surface
Capacitive coupling.This allows fingerprint sensor using capacitance sensor principle without dielectric layer to be added to the upper table in covering 20
On the top in face.
The fingerprint sensor that Fig. 3 d are shown Yu covering 20 integrates made of the insulating materials of such as glass
4th illustrative embodiments.In this embodiment, there is the probe 21 ' extended partially across covering 20 and across covering
The probe 21 that cover piece 20 extends.As described in above for Fig. 3 c, the surface in the end of probe 21 ' and the upside of covering 20
The distance between d21’48, which are chosen to probe 21 ', can provide capacitive coupling with finger surface.Probe 21 can provide and hand
Refer to the current coupling on surface.Although it is not shown, but as in greater detail, probe 21 also may extend into surface to reference chart 3b above
On, allow the wiring on the upside of covering 20 and probe structure.
Lead wire of conductor 22 in an exemplary embodiment of the present invention is made of at least one conductive layer, and at least one
A conductive layer is directly on covering 20 via method known to those of skill in the art by applying and patterning at least
Layer of conductive material is handled.Lead wire of conductor can be used as redistribution layer so that the general very narrow spacing of probe 21,21 ' is divided
Scatter to make the interconnection of subsequent signal processing unit to be easy.In this way, redistribution layer also makes at subsequent signal
The size of the size and sensitive zones of managing unit decouples.Optionally, lead wire of conductor 22 can be provided that such as BGA balls, be used for
It is interconnected to subsequent signal processing unit.In following article about in Fig. 4 a and 4b embodiment another in greater detail, conductor
Lead is the part of sensing element.
Fig. 4 a show an exemplary sensing element or sensor pixel 40 for fingerprint sensor according to the present invention.Sensing
Device element is made of covering 20 and probe 21 ', and covering 20 is made of insulating materials such as glass, and probe 21 ' is by conduction
Material is made, and is stretched out from the back side of lid partially across covering 20.Probe 21 ' is connected on the first dielectric layer 42
The lead wire of conductor or sensing electrode 22 defined in first conductive layer.Sensing electrode 22 covers the first dielectric layer 42 at least partly
The active electrode 43 and pickoff electrode 44 defined in the second conductive layer on opposite side.Active electrode 43 and pickoff electrode 44 are by boundary
It is scheduled in same level layer and is made of an electrically conducting material.Sensing element may also comprise on the opposite side of the second dielectric layer 45
, the third conductor defined in the third conductive layer of the lower section of active electrode 43 or activated row 46.Activated row 46 is electrically connected to activation
Electrode 43, active electrode 43 are capacitance or are electric currents by conductive path 47 on dielectric layer 45.It should be noted that activation electricity
Pole 43 and pickoff electrode 44 can be realized based on specific come handoff functionality.In another exemplary embodiment, sensing element 40
The 4th conductive layer (not shown) being provided between second and third conductive layer.4th conductive layer will serve as 46 He of activated row
Shielded layer between pickoff electrode 44.Fig. 4 b show that the optional embodiment of fingerprint sensor, wherein sensing element 40 further include
The probe 21 made of the conductive material extended from the back side of covering 20 and across covering 20.Each sensing shown here
There are one device element or sensor pixels penetrates probe 21, it is noted, however, that as being applicable in specific realize, fingerprint sensing
Device may only have one or only several of these probes.
Fig. 5 shows the optional embodiment of the present invention, is such as to be described, using for example in PCT/ about Fig. 4 a and 4b
Readily available technology sensing element or sensor pixel made of multiple layer polymer substrate disclosed in EP2010/070787
50.Polymer substrate by chip mounting technique readily available known to those of skill in the art be connected to probe 21,
21 ' and lead wire of conductor 22, as shown in raised connector 58.What sensing element 50 was included on the first dielectric layer 52 first leads
The sensing electrode 51 defined in electric layer.What sensing electrode 51 was covered at least partly on the opposite side of the first dielectric layer 52 second leads
The active electrode 53 and pickoff electrode 54 defined in electric layer.Active electrode 53 and pickoff electrode 54 are defined in same level layer
And it is made of an electrically conducting material.Sensing element also be included in it is on the opposite side of the second dielectric layer 55, under active electrode 53
The third conductor or activated row 56 defined in the third conductive layer of side.Activated row 56 is electrically connected to active electrode 53, active electrode
53 are capacitance on dielectric layer 55 or are electric currents by conductive path 57.It should be noted that active electrode 53 and pickoff electrode
54 can be realized based on specific come handoff functionality.In another exemplary embodiment, sensing element 50 is provided with positioned at second
The 4th conductive layer (not shown) between third conductive layer.4th conductive layer will serve as activated row 56 and pickoff electrode 54 it
Between shielded layer.
Exemplary measuring principle according to the present invention is shown with reference to figure 4a and 4b in figure 6.Signal processing unit 23 (such as
ASIC include) that the amplifier 66 for signal of the amplification from there for being connected to pickoff electrode 44 and other signals adjust circuit system
System.AC voltage signals from active electrode 43 are coupled to sensing electrode 22.To amplifier 66 current input signal by with from
The concatenated capacitor 62 of total capacitance of the end of probe 21 ' to earthing potential determines.The total capacitance with 63 by (passing through sensor
Dielectric 48) and 64 (passing through the ridge (ridge) of finger 41 or the air gaps in the paddy (valley)) series capacitance simultaneously
The 67 of connection provide.It is insignificant that this discussion, which is assumed, across the additional series impedance 68 of finger to bulk potential.
Because all other element is fixed, the amplitude of current input signal will change, capacitance 64 according to the amplitude of capacitance 64
According to whether having the finger ridge being present on probe 21 ' or paddy and change.Signal code can be amplified by ASIC, filtered and be demodulated
(such as synchronously).That is, when AC voltages are applied to active electrode 43, will have from active electrode 43 and pass through sensor
Capacitance stream of the electrode 22 to the electric current of pickoff electrode 44.When the fingerprint valley that there is the filling air on probe 21 '
When, pass through the impedance of finger 41 to bulk potential 61 will be actually unlimited from sensor element.On the other hand, when by fingerprint
In the presence of ridge, there will be pass through finger 41 to the much lower finite resistance of bulk potential 61 from probe 21 '.This will cause picking up
Take the reduction of received signal electric current at electrode 44.This reduction of signal code will cause the signal contrast between ridge and paddy
Degree, can be visualized when signal is amplified and is digitized as such as " gray level " fingerprint image.According to the present invention one
A illustrative embodiments bulk potential 61 is from being coupled to finger 41 with penetrating 21 capacitance of probe or electric current.Optionally, according to this
The another exemplary embodiment of invention, finger 41 is by body-coupled to really.
Fig. 7 shows the array of sensing element or sensor pixel 40 according to the present invention, wherein each sensing element 40a-d
It is capacitively coupled to same pickoff electrode 44.Each sensing element can be activated by its associated activation electrode 43a-d.It such as can be from Fig. 7
See, if active electrode (such as 43a) keeps floating or remaining unchanged at fixed current potential, actually there is no slave phase
Signal codes of the sensing element 40a answered to pickoff electrode 44.This shortage of signal code is regardless of whether having in element 40a
The finger ridge or recess portion of top.This means that will only be caused by activation signal tune by those of AC voltage-activateds sensing element 40
The response signal of system, specifically signal code.Sensing element 40 can be grouped into multigroup sensing element so that in one group of biography
Each sensing element in sensing unit can be swashed by the activation signal common to all sensing elements in this group of sensing element simultaneously
It is living.This allows not simultaneous interpretation of the signal of the active electrode 43 used as combination activation and control signal on public pickup row 44
Effective passive multiplex between sensing unit 40.This passive multiplex greatly reduces the size of signal processing unit, because each
The additional active switch and relevant control circuit system of sensor element is unwanted.
Fig. 8 is the schematic diagram of the illustrative embodiments of system of fingerprints according to the present invention.System of fingerprints includes being located at boundary
Determine multiple probes 21 ' in the preassigned pattern in the fingerprint sensing region in the second side of covering 20, covering is in insulating materials
Such as manufactured on glass, plurality of probe 21 ' prolongs from the first side of covering 20 and at least partially through covering 20
It stretches.The more lead wire of conductor 22 on the first side of covering 20 make multiple probes 21 ' on the first side of covering with it is multiple
Sensing element 40 interconnects.Fig. 8 shows multiple sensing elements 40 on the first side of covering 20 and is connected to multiple sensing elements
Multiple amplifier 66a-d of part, the wherein quantity of amplifier 66a-d are less than the quantity of sensing element 40.The company of also showing that in fig. 8
It is connected to the active circuit of multiple sensing elements 40, wherein active circuit is suitable for exporting at least one activation signal.Sensing element 40,
Signal processing unit 23 and associated interconnection circuitry can be within the scope of the invention multiple and different configurations carry out
Arrangement, the configuration include but not limited to line sensor configuration, the configuration of submatrix sensor and matrix configuration as discussed earlier.
In order to illustrate book for the sake of simplicity, fingerprint sensor shown in Fig. 8 by the 2x4 matrixes of sensing element 40 and with being connected respectively to
The signal processing unit 23 of four amplifier 66a-d of four pickoff electrode 44a-d and the activation fed to active electrode 43
Circuit system forms.However, matrix can take any size and form, such as 1x n and m x n.Active circuit system can be such as
The form with the AC driving circuits 81 for being coupled to m output raceway groove by multiplexer 82 as shown.In the schematic diagram of Fig. 8
In, active electrode 43 is connected to AC driving circuits by m=2 driving row 46a-b by access 47.AC driving circuits are connected to drive
Dynamic row 46a, therefore the sensing element (40aa, 40ab, 40ac and 40ad) of the row is activated by corresponding active electrode 43, and thus
The signal of generation is sensed on pickup row or column 44a-d accordingly and is amplified by corresponding column amplifier 66a-d.Followed by
The AC driving circuits of driving row 46b are connected to, the sensing element (40ba, 40bb, 40bc and 40bd) of the row by activating accordingly
Electrode 43 activates, and thus the signal that generates be sensed on pickup row or column 44a-d accordingly and by corresponding column amplifier
66a-d amplifies.
Active circuit is further adapted to each of this group of sensing element and exports an activation signal, and between activation signal
Sequentially switch once to activate one in this group of sensing element.
The 1x n matrixes of sensing element are illustrated above for the description of Fig. 8, wherein all sensing elements in a row
40 are connected to a driving circuit 81 by common driver row 46.However, another exemplary embodiment according to the present invention, passes
The linear array of sensing unit 40 is connected to multiple driving rows 46 to allow the multiplexing of the pickoff electrode 44 in line sensor.In this way
Configuration in, such as driving row 46a may be connected to sensing element 40aa and 40ac, and row 46b be driven to may be connected to sensing element
40ab and 40ad.In another linear array configuration according to the present invention, driving row 46 is defined at and active electrode 43 and picks up
Take 44 identical level course of electrode, i.e. in the second conductive layer, it is thus eliminated that third conductive layer.
Fig. 9 shows the another exemplary embodiment of fingerprint sensor system according to the present invention.Fingerprint sensor 90 by
The substantially linear array composition of sensing element 40, wherein linear array substantially stretches the width of touch screen 91.Sensing element
Part 40 is organized into multigroup sensing element 92a-92n, wherein every group of substantially definition scratches fingerprint sensor.It is every in group 92
The active electrode 43 of a sensing element is connected to common driver row, and 44 quilt of pickoff electrode of each sensing element in one group
The column amplifier 66 being routed in signal processing unit 23.This column amplifier 66 in signal processing unit 23 is that this group passes
Common to each of sensing unit 92.Therefore, fingerprint sensor 90 by multiple multiplexings or switch sweep the fingerprint sensor of survey
Composition.In an exemplary embodiment, this allows concurrently to measure multiple fingers.In another exemplary embodiment,
Signal processing unit 23 is also received from touch control display and is inputted, such as digit speed and/or direction, allows signal processing unit 23
Activate one group of sensor element 92 appropriate.
Unit may also include optional silicon bare die and circuit system 24 is used for safe biologic certification.Exemplary options include being used for
It runs biological algorithm and communication and needs the microcontroller of other functions of logical process, for authorizing financial transaction or service to carry
The various safety elements and USIM chips of donor identification and the NFC controller for radio communication.
As shown in Fig. 2, unit may also comprise the other parts or aerial lug and the interface of equipment 25 of smart phone.It
Line (not shown) may also combine integrated with NFC controller.
Therefore fingerprint sensor may be integrated in touch panel device such as mobile phone or tablet-type personal computer
Consider to design and the ergonomics critical design criterion of hand-held device manufacturer simultaneously in shell.This will provide additional excellent
Point, such as：
● design
● ergonomics and availability
● integrated and enhancing the durability simplified
● the user feedback to increased biological property
● the direct interaction with Graphics Application and animation
Figure 10 shows smart phone 100, wherein unit according to the present invention uses standard intelligent card controller and NFC chip
Group realizes that NFC chipset group has antenna and is combined to simulate autonomous, the biological, standard in glass cover 101 in the phone
EMV cards.
Claims (24)
1. a kind of fingerprint sensor is used to be integrated in the equipment with the covering made of insulating materials, the fingerprint
Sensor includes：
Multiple sensing elements are located on the first side of the covering, wherein the multiple sensing element includes：
The sensing electrode defined in the first conductive layer；
The first dielectric layer under the sensing electrode；And
The active electrode and pickoff electrode defined in the second conductive layer on the opposite side of first dielectric layer, and it is described
Active electrode and the pickoff electrode are covered by the sensing electrode at least partly；
Multiple probes are located in the preassigned pattern in the fingerprint sensing region in the second side for defining the covering, described more
A probe is stretched out at least partially through the covering from first side of the covering；And
More lead wire of conductor make the multiple probe and the multiple sensing element on first side of the covering
Interconnection.
2. fingerprint sensor as described in claim 1, wherein pass through the covering to whole the multiple probe portions
Extend.
3. fingerprint sensor as described in claim 1, wherein wear to the probe portion of the first quantity in the multiple probe
The covering is crossed to extend；And
The probe of the second quantity in the multiple probe extends across the covering.
4. fingerprint sensor as described in claim 1, wherein a certain number of probes in the multiple probe pass through described
Covering extends；And
At least one of a certain number of probes extended across the covering are covered with dielectric layer.
5. fingerprint sensor as described in claim 1, wherein the insulating materials is selected from by glass, polymethyl methacrylate
With the group of makrolon composition.
6. fingerprint sensor as described in claim 1, wherein each sensing element is suitable for：
It is activated by ac current signal or ac voltage signal, and if be activated, exports the response modulated by activation signal
Signal, or if be not activated, not output signal.
7. fingerprint sensor as claimed in claim 6, wherein the multiple sensing element is grouped into multigroup sensing element
In, and each sensing element in one group of sensing element is suitable for simultaneously by all sensing element institutes in one group of sensing element
Shared activation signal activation.
8. fingerprint sensor as described in claim 1, wherein first conductive layer is defined at the described of the covering
In lead wire of conductor layer on first side.
9. fingerprint sensor as described in claim 1, wherein the multiple sensing element is located on the second substrate and is electrically connected
To the lead wire of conductor layer on first side of the covering.
10. fingerprint sensor as claimed in claim 9, wherein second substrate is multiple layer polymer substrate.
11. fingerprint sensor as described in claim 1, wherein the multiple sensing element further includes：
The second dielectric layer under second conductive layer；And
The activated row defined in third conductive layer on the opposite side of second dielectric layer, and the activated row is electrically connected
To the active electrode.
12. fingerprint sensor as claimed in claim 11, described swash wherein the activated row is electrically connected to by conductive path
Electrode living.
13. fingerprint sensor as claimed in claim 11, wherein the activated row passes through on second dielectric layer
Capacitive coupling and be electrically connected to the active electrode.
14. fingerprint sensor as described in claim 1, wherein the multiple probe is located at the transparent part of the covering
In, the lead wire of conductor is routed to the processing unit except the transparent part, and
The multiple probe and the lead wire of conductor are made of substantially transparent material.
15. a kind of fingerprint sensor system is used to be integrated in the equipment with the covering made of insulating materials, described
Fingerprint sensor system includes：
Multiple sensing elements are located on the first side of the covering；
Multiple probes are located in the preassigned pattern in the fingerprint sensing region in the second side for defining the covering, described more
A probe is stretched out at least partially through the covering from first side of the covering；
More lead wire of conductor make the multiple probe and the multiple sensing element on first side of the covering
Interconnection；
Multiple amplifiers, are connected to the multiple sensing element, and the quantity of the amplifier is less than the number of the sensing element
Amount；And
Active circuit, is connected to the multiple sensing element, and the active circuit is suitable for exporting at least one activation signal；
Wherein the multiple sensing element further includes：
The sensing electrode defined in the first conductive layer；
The first dielectric layer under the sensing electrode；And
The active electrode and pickoff electrode defined in the second conductive layer on the opposite side of first dielectric layer, wherein described
Active electrode and the pickoff electrode are covered by the sensing electrode at least partly.
16. fingerprint sensor system as claimed in claim 15, wherein each sensing element is suitable for by coming from the activation electricity
The ac current signal or ac voltage signal on road activate, and if be activated, will be by the ac current signal or exchange
The response signal of voltage signal modulation is output to an amplifier in the multiple amplifier, or if be not activated, no
Output signal.
17. fingerprint sensor system as claimed in claim 16, wherein the multiple sensing element is grouped into multigroup sensing
In element, and each sensing element in one group of sensing element be suitable for simultaneously by from the active circuit to one group of biography
Activation signal activation common to all sensing elements in sensing unit.
18. fingerprint sensor system as claimed in claim 17, wherein the active circuit is further adapted to one group of sensing
Each sensing element in element exports an activation signal, and
Sequentially switch once to activate described one between all activated signal exported for one group of sensing element
A sensing element in group sensing element.
19. fingerprint sensor system as claimed in claim 15, wherein the active electrode is connected to the active circuit；
And
The pickoff electrode is connected to an amplifier in the multiple amplifier.
20. fingerprint sensor system as claimed in claim 15, wherein the multiple sensing element further includes：
The second dielectric layer under second conductive layer；And
The activated row defined in third conductive layer on the opposite side of second dielectric layer, wherein the activated row is electrically connected
To the active electrode so that the active electrode is connected to the active circuit by the activated row.
21. fingerprint sensor system as claimed in claim 20, wherein the multiple probe is located at one-dimensional mode or two-dimentional mould
In formula, the two-dimensional model corresponds to m rows sensing element and n biographies sensing units, wherein m >=1 and n>1；
The pickoff electrode of each sensing element in one row is connected to one in n amplifier by public pickup row
Amplifier；
The active electrode of each sensing element in a line is connected to one in m activation signal by public activated row
A activation signal；
The active circuit is configured to sequentially switch between the m activation signal, described in the m activation signal
Activation signal activates each sensing element in a line so that thus the signal generated is sensed simultaneously on corresponding pickoff electrode
Amplified by corresponding column amplifier.
22. fingerprint sensor system as claimed in claim 17, wherein multigroup sensing element arranges battle array linear in itself
In row, every group of sensing element substantially defines scratching fingerprint sensor.
23. fingerprint sensor system as claimed in claim 22, wherein the active circuit is further adapted for connecing from touch control display
Receive input；And the active circuit activates one in multigroup sensing element based on the input from the touch control display
Group sensing element.
24. fingerprint sensor system as claimed in claim 23, wherein the input from the touch control display includes finger
The speed moved on the touch control display and direction.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO20130289A NO340311B1 (en) | 2013-02-22 | 2013-02-22 | INTEGRATED FINGER PRINT SENSOR |
| NO20130289 | 2013-02-22 | ||
| NO20131423 | 2013-10-28 | ||
| NO20131423A NO20131423A1 (en) | 2013-02-22 | 2013-10-28 | Integrated fingerprint sensor |
| PCT/EP2014/053427 WO2014128260A1 (en) | 2013-02-22 | 2014-02-21 | Integrated fingerprint sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105009143A CN105009143A (en) | 2015-10-28 |
| CN105009143B true CN105009143B (en) | 2018-09-14 |
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ID=50238360
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480009822.4A Active CN105009143B (en) | 2013-02-22 | 2014-02-21 | Integrated form fingerprint sensor |
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| Country | Link |
|---|---|
| US (2) | US9501685B2 (en) |
| EP (1) | EP2959430B1 (en) |
| JP (1) | JP6276293B2 (en) |
| KR (1) | KR102157891B1 (en) |
| CN (1) | CN105009143B (en) |
| NO (1) | NO20131423A1 (en) |
| WO (1) | WO2014128260A1 (en) |
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| EP2959430B1 (en) | 2019-03-27 |
| KR102157891B1 (en) | 2020-09-21 |
| JP6276293B2 (en) | 2018-02-07 |
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| WO2014128260A1 (en) | 2014-08-28 |
| JP2016507846A (en) | 2016-03-10 |
| US20170068836A1 (en) | 2017-03-09 |
| US9881196B2 (en) | 2018-01-30 |
| US20140241595A1 (en) | 2014-08-28 |
| EP2959430A1 (en) | 2015-12-30 |
| CN105009143A (en) | 2015-10-28 |
| NO20131423A1 (en) | 2014-08-25 |
| US9501685B2 (en) | 2016-11-22 |
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