CN104977818A - Single-air-outlet spin-coating development cavity - Google Patents
Single-air-outlet spin-coating development cavity Download PDFInfo
- Publication number
- CN104977818A CN104977818A CN201410148597.4A CN201410148597A CN104977818A CN 104977818 A CN104977818 A CN 104977818A CN 201410148597 A CN201410148597 A CN 201410148597A CN 104977818 A CN104977818 A CN 104977818A
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- CN
- China
- Prior art keywords
- even glue
- chamer body
- cowling panel
- spin
- glue chamer
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Abstract
The invention relates to a spin-coating development device in the field of semiconductor manufacturing, and particularly provides a single-air-outlet spin-coating development cavity, which includes an upper spin-coating cavity, a middle spin-coating cavity, a flow reshaping board and a lower spin-coating cavity. The bottom of the lower spin-coating cavity is provided with an air outlet. The upper spin-coating cavity is disposed on the top of the lower spin-coating cavity. The middle spin-coating cavity is disposed between the upper spin-coating cavity and the lower spin-coating cavity. The flow reshaping board is arranged between the air outlet and a wafer, is in an annular shape and is provided with a plurality of holes circumferentially therein. The device is reduced in the number of air outlets and is reduced in size, and is improved in uniformity of air flow neighboring the waver.
Description
Technical field
The present invention relates to the gel developer in field of semiconductor manufacture, specifically a kind of single air outlet even glue developing cavity, for optimizing the airflow field characteristic in even glue developing process cavity.
Background technology
For photoresist coating in field of semiconductor manufacture, a kind of process implementation method that right and wrong are usually shown in, its essential characteristic is: by wafer adsorption on circular magnetic chuck, and after photoresist is sprayed on crystal column surface, sucker drives wafer fast rotational evenly to be spread out at crystal column surface by photoresist.Whole process is carried out in a process cavity, is often referred to as cup in industry, and it has the function of collecting waste liquid and air draft.
In cup air draft process, the airflow field distribution of its inside is very large on technological effect impact, and irrational airflow field distribution can cause some even glue defect, as spiral lamination, thickness inequality etc.For traditional cup structure, can affect the airflow field distribution in cup according to single air outlet structure, the airflow field in cup is asymmetric, uneven, and this is unfavorable to process results.Same for developing process, single air outlet design also can bring relevant issues.Owing to only have employed an exhaust outlet, if adopt traditional CUP structure, the air-flow at crystal round fringes place is unbalanced, and obviously, the wind speed near exhaust outlet place wants large, and the wind speed away from exhaust outlet place is little, as shown in Figure 1-2.
Therefore, current cup design have employed many outlet structures, to make uniform stream in cup more; But many exhaust outlet designs also relate to the design challenges such as the equilibrium of each exhaust outlet, space layout; Therefore, single air outlet design also has its advantage in some aspects.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide a kind of single air outlet even glue developing cavity.This cavity solves the homogenising problem of even glue developing inside cavity air-flow.
To achieve these goals, the present invention is by the following technical solutions:
A kind of single air outlet even glue developing cavity, comprise even glue chamer body, in even glue chamer body, cowling panel and lower even glue chamer body, wherein the bottom of lower even glue chamer body is provided with an exhaust outlet, the top of described lower even glue chamer body is provided with even glue chamer body, even glue chamer body in being provided with between described even glue chamer body and lower even glue chamer body, described cowling panel is arranged between exhaust outlet and wafer.
Described cowling panel is annular and it is circumferentially laid with multiple hole.On described cowling panel, the area of each hole is directly proportional to the circumferential distance of hole to exhaust outlet.Each hole on described cowling panel is circumferentially sparse gradually along arranging near exhaust outlet direction.
The bottom of described lower even glue chamer body is inwardly provided with extension, and in described, even glue chamer body is arranged on described extension, and described cowling panel to be arranged on described extension by location structure and to be arranged in the bottom of even glue chamer body.
Described location structure is that the flange that the cylindrical of cowling panel is provided with matches with the locating notch that the extension of lower even glue chamer body is provided with.
The present invention has the following advantages and beneficial effect:
1., while the present invention reduces exhaust outlet quantity, reduced volume, improve the airflow homogeneity near wafer.
2. the present invention is in order to the asymmetry in balance row air port, at air-flow by path, ground increases another asymmetric structure, makes even glue developing inside cavity uniform stream.
Accompanying drawing explanation
Fig. 1 is the skeleton view of existing single air outlet even glue developing cavity;
Fig. 2 is the schematic perspective view of the light body of existing single air outlet even glue developing;
Fig. 3 is skeleton view of the present invention;
Fig. 4 is the vertical view of Fig. 3;
Fig. 5 is the A-A cut-open view in Fig. 4;
Fig. 6 is three-dimensional cutaway view of the present invention;
Fig. 7 is the schematic perspective view of cowling panel in the present invention;
Fig. 8 is the vertical view of cowling panel in the present invention;
Fig. 9 is front view of the present invention;
Figure 10 is B-B cut-open view in Fig. 9;
Figure 11 is I place enlarged drawing in Figure 10.
Wherein: 1 is exhaust outlet, 2 is binder removal mouth, and 3 is upper even glue chamer body, 4 be in even glue chamer body, 5 is cowling panel, and 6 is lower even glue chamer body, and 7 is cowling panel exhaust outlet position, and 8 is location structure, and M is wind speed minimum position, and N is wind speed maximum position.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
As in Figure 3-5, the present invention includes even glue chamer body 3, in even glue chamer body 4, cowling panel 5 and lower even glue chamer body 6, wherein the bottom of lower even glue chamer body 6 is provided with an exhaust outlet 1, the top of described lower even glue chamer body 6 is provided with even glue chamer body 3, even glue chamer body 4 in being provided with between described even glue chamer body 3 and lower even glue chamer body 6, described cowling panel 5 is arranged between exhaust outlet 1 and wafer.
The bottom of described lower even glue chamer body 6 is inwardly provided with extension, and in described, even glue chamer body 4 is arranged on described extension, and described cowling panel 5 to be arranged on described extension by location structure 8 and to be arranged in the bottom of even glue chamer body 4.
As shown in figs 6-8, described cowling panel 5 is for cirque structure its are circumferentially laid with multiple hole, and each hole on described cowling panel 5 is sparse gradually in the direction arrangement circumferentially along close exhaust outlet 1.On described cowling panel 5, the area of each hole is directly proportional to the circumferential distance of hole to exhaust outlet 1, and namely the circumferential distance of hole distance exhaust outlet 1 is far away, and the area of this hole is larger.The asymmetry of exhaust outlet 1 so just can be made mutually balanced with the asymmetry of cowling panel 5, make the uniform stream at crystal round fringes place.
As shown in figs. 9-11, described location structure 8 is that the flange that the cylindrical of cowling panel 5 is provided with matches with the locating notch that the extension of lower even glue chamer body 6 is provided with, and so just makes cowling panel 5 and lower even glue chamer body 6 accurately locate.
Principle of work of the present invention is:
The present invention by increasing cowling panel structure between exhaust outlet and wafer, the pressure of adjustment cup inner air and speed, and then realize the homogenising of crystal column surface speed and pressure, namely when wafer is static, crystal circle center's static pressure is the highest, edge is minimum, velocity reversal is that radial direction is outside, and the two is about crystal circle center's rotational symmetry.For the cup (namely for different wafer size) of different specifications, the size of cowling panel is different, but its design feature that will follow is consistent, and the closer to exhaust outlet, the hole area on cowling panel is less, arranges more sparse.
Claims (6)
1. a single air outlet even glue developing cavity, it is characterized in that: comprise even glue chamer body (3), in even glue chamer body (4), cowling panel (5) and lower even glue chamer body (6), wherein the bottom of lower even glue chamer body (6) is provided with an exhaust outlet (1), the top of described lower even glue chamer body (6) is provided with even glue chamer body (3), even glue chamer body (4) in being provided with between described even glue chamer body (3) and lower even glue chamer body (6), described cowling panel (5) is arranged between exhaust outlet (1) and wafer.
2. by single air outlet even glue developing cavity according to claim 1, it is characterized in that: described cowling panel (5) is for annular and it is circumferentially laid with multiple hole.
3. by single air outlet even glue developing cavity according to claim 2, it is characterized in that: the area of the upper each hole of described cowling panel (5) is directly proportional to the circumferential distance of hole to exhaust outlet (1).
4. by single air outlet even glue developing cavity according to claim 3, it is characterized in that: each hole on described cowling panel (5) is circumferentially sparse gradually along arranging near exhaust outlet direction.
5. by the single air outlet even glue developing cavity described in any one of claim 1-4, it is characterized in that: the bottom of described lower even glue chamer body (6) is inwardly provided with extension, in described, even glue chamer body (4) is arranged on described extension, and described cowling panel (5) to be arranged on described extension by location structure (8) and to be arranged in the bottom of even glue chamer body (4).
6., by single air outlet even glue developing cavity according to claim 5, it is characterized in that: the locating notch that the flange that the cylindrical that described location structure (8) is cowling panel (5) is provided with is provided with the extension of lower even glue chamer body (6) matches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410148597.4A CN104977818A (en) | 2014-04-14 | 2014-04-14 | Single-air-outlet spin-coating development cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410148597.4A CN104977818A (en) | 2014-04-14 | 2014-04-14 | Single-air-outlet spin-coating development cavity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104977818A true CN104977818A (en) | 2015-10-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410148597.4A Pending CN104977818A (en) | 2014-04-14 | 2014-04-14 | Single-air-outlet spin-coating development cavity |
Country Status (1)
| Country | Link |
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| CN (1) | CN104977818A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112748639A (en) * | 2019-10-31 | 2021-05-04 | 沈阳芯源微电子设备股份有限公司 | FFU rectifying plate with airflow partition regulation and control function and glue coating process for adjusting glue shape |
| CN116984194A (en) * | 2023-09-27 | 2023-11-03 | 宁波润华全芯微电子设备有限公司 | Wafer rubber coating unit wind channel structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005235950A (en) * | 2004-02-18 | 2005-09-02 | Tokyo Electron Ltd | Apparatus and method of processing application |
| CN1851053A (en) * | 2005-12-08 | 2006-10-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Shielding plate for enhancing flow field uniformity |
| CN101960568A (en) * | 2008-02-28 | 2011-01-26 | 应用材料公司 | Be suitable for use in the air-flow balancing disk in the substrate processing chambers |
| CN202174043U (en) * | 2011-07-04 | 2012-03-28 | 江苏捷捷微电子股份有限公司 | High-viscosity photoresist applying device free of photoresist silks |
| CN103021778A (en) * | 2011-09-21 | 2013-04-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Airflow balancing plate, chamber device and substrate processing device |
-
2014
- 2014-04-14 CN CN201410148597.4A patent/CN104977818A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005235950A (en) * | 2004-02-18 | 2005-09-02 | Tokyo Electron Ltd | Apparatus and method of processing application |
| CN1851053A (en) * | 2005-12-08 | 2006-10-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Shielding plate for enhancing flow field uniformity |
| CN101960568A (en) * | 2008-02-28 | 2011-01-26 | 应用材料公司 | Be suitable for use in the air-flow balancing disk in the substrate processing chambers |
| CN202174043U (en) * | 2011-07-04 | 2012-03-28 | 江苏捷捷微电子股份有限公司 | High-viscosity photoresist applying device free of photoresist silks |
| CN103021778A (en) * | 2011-09-21 | 2013-04-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Airflow balancing plate, chamber device and substrate processing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112748639A (en) * | 2019-10-31 | 2021-05-04 | 沈阳芯源微电子设备股份有限公司 | FFU rectifying plate with airflow partition regulation and control function and glue coating process for adjusting glue shape |
| CN116984194A (en) * | 2023-09-27 | 2023-11-03 | 宁波润华全芯微电子设备有限公司 | Wafer rubber coating unit wind channel structure |
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| C06 | Publication | ||
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Applicant before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151014 |