CN104955319A - Apparatus for installing electromagnetic device - Google Patents
Apparatus for installing electromagnetic device Download PDFInfo
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- CN104955319A CN104955319A CN201410121212.5A CN201410121212A CN104955319A CN 104955319 A CN104955319 A CN 104955319A CN 201410121212 A CN201410121212 A CN 201410121212A CN 104955319 A CN104955319 A CN 104955319A
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Abstract
本发明提供了一种电磁器件安装装置，涉及电磁器件应用设计领域，解决现有技术中的电磁器件安装装置导热性能不好的问题，该电磁器件安装装置包括：一平台；设置于所述平台上的用于安装电磁器件的半封装壳体；所述平台与所述半封装壳体的接触面上，以及所述半封装壳体与所述平台的接触面上均具有多个出线孔。本发明的方案避免了将电磁器件全部灌封起来放于IP54以上防护等级的工作环境，简化了结构，使安装方便，散热性能好，且降低了材料和加工成本。
The invention provides an electromagnetic device installation device, which relates to the field of electromagnetic device application design and solves the problem of poor thermal conductivity of the electromagnetic device installation device in the prior art. The electromagnetic device installation device includes: a platform; The semi-encapsulation shell for installing electromagnetic devices on the top; the contact surface between the platform and the semi-encapsulation shell, and the contact surface between the semi-encapsulation shell and the platform all have a plurality of outlet holes. The solution of the present invention avoids potting and sealing all electromagnetic devices and placing them in a working environment with a protection level above IP54, simplifies the structure, facilitates installation, has good heat dissipation performance, and reduces material and processing costs.
Description
技术领域technical field
本发明涉及电磁器件应用设计领域，特别涉及一种电磁器件安装装置。The invention relates to the field of electromagnetic device application design, in particular to an electromagnetic device installation device.
背景技术Background technique
一般电磁器件出线部分需要工作在IP54以上的防护等级下，IP54类防护等级在工业中的的应用为防止粉尘堆积和防水来保护内部电磁器件不受损害。电磁器件在IP54防护等级工作时，由于空间密闭，内部环境温度较高，电磁器件散热比较困难，成本较高。使用者通常将封装壳体放置在一个被隔离的叶片或其他类型散热器的外露表面，通过散热硅脂将壳体的热传到散热片上，再由散热片将热量散出。在这样的情况下整个装置需要两个零件：封装壳体和散热器来组成。而且还要散热硅脂来保障两个零件之间的导热。不但增加了成本，而且还降低了导热效果。Generally, the outgoing parts of electromagnetic devices need to work under the protection level above IP54. The application of IP54 protection level in industry is to prevent dust accumulation and waterproof to protect internal electromagnetic devices from damage. When the electromagnetic device works at the IP54 protection level, due to the airtight space and high internal ambient temperature, it is difficult for the electromagnetic device to dissipate heat and the cost is high. Users usually place the package case on the exposed surface of an isolated blade or other type of heat sink, and transfer the heat from the case to the heat sink through the heat dissipation silicon grease, and then dissipate the heat from the heat sink. In such a case, the whole device needs two parts: the package housing and the heat sink. In addition, heat-dissipating silicone grease is required to ensure heat conduction between the two parts. Not only increases the cost, but also reduces the heat conduction effect.
发明内容Contents of the invention
本发明要解决的技术问题是提供一种电磁器件安装装置，避免将电磁器件全部灌封起来放于IP54以上防护等级的工作环境，简化结构，使安装方便，散热性能好，且降低材料和加工成本。The technical problem to be solved by the present invention is to provide an electromagnetic device installation device, which avoids all electromagnetic devices being potted and placed in a working environment with a protection level above IP54, simplifies the structure, facilitates installation, has good heat dissipation performance, and reduces material and processing costs. cost.
为解决上述技术问题，本发明的实施例提供一种电磁器件安装装置，包括：In order to solve the above technical problems, an embodiment of the present invention provides an electromagnetic device installation device, including:
一平台；a platform;
设置于所述平台上的用于安装电磁器件的半封装壳体；A semi-encapsulated casing for installing electromagnetic devices arranged on the platform;
所述平台与所述半封装壳体的接触面上，以及所述半封装壳体与所述平台的接触面上均具有多个出线孔。There are multiple outlet holes on the contact surface between the platform and the semi-encapsulation casing, and the contact surface between the semi-encapsulation casing and the platform.
其中，所述半封装壳体的未封装一面设置有固定板；所述固定板与所述半封装壳体的底面之间形成有用于安装电磁器件的至少一个安装孔。Wherein, the non-encapsulated side of the semi-encapsulated case is provided with a fixing plate; at least one installation hole for installing an electromagnetic device is formed between the fixed plate and the bottom surface of the semi-encapsulated case.
其中，所述半封装壳体的底面上设置有多个第一弧形凹槽，所述固定板具有第二弧形凹槽，其中所述第一弧形凹槽与所述第二弧形凹槽形成所述安装孔。Wherein, a plurality of first arc-shaped grooves are provided on the bottom surface of the semi-encapsulated housing, and the fixing plate has a second arc-shaped groove, wherein the first arc-shaped grooves are connected with the second arc-shaped grooves. A groove forms the mounting hole.
其中，每个所述安装孔在所述平台以及所述半封装壳体对应的区域具有多个所述出线孔。Wherein, each of the installation holes has a plurality of outlet holes in the area corresponding to the platform and the semi-encapsulated housing.
其中，所述安装孔为圆形安装孔。Wherein, the mounting hole is a circular mounting hole.
其中，所述平台上设置有一与所述半封装壳体的底面形状一致的密封凹槽，所述半封装壳体设置于所述密封凹槽中。Wherein, the platform is provided with a sealing groove consistent with the shape of the bottom surface of the semi-encapsulating casing, and the semi-encapsulating casing is arranged in the sealing groove.
其中，所述平台还具有第一固定孔。Wherein, the platform also has a first fixing hole.
其中，所述半封装壳体的未封装一面上具有第二固定孔，所述固定板通过所述第二固定孔与所述半封装壳体固定连接。Wherein, the non-encapsulated side of the semi-encapsulated case has a second fixing hole, and the fixing plate is fixedly connected to the semi-encapsulated case through the second fixing hole.
其中，所述平台、所述半封装壳体及所述固定板均采用铝合金材料制成。Wherein, the platform, the semi-encapsulated shell and the fixing plate are all made of aluminum alloy.
本发明的上述技术方案的有益效果如下：The beneficial effects of above-mentioned technical scheme of the present invention are as follows:
本发明实施例的电磁器件安装装置，包括一平台及设置于平台上的半封装壳体，其中平台与半封装壳体的接触面上，以及半封装壳体与平台的接触面上均具有多个出线孔。可以将电磁器件安装于半封装壳体中，同时将电磁器件的出线部分通过出线孔引出。在出线部分满足IP54以上防护等级的要求下，电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，避免了使用导热硅脂和散热片等散热材料，简化了结构，使安装方便，且大大降低了材料和加工成本。The electromagnetic device installation device of the embodiment of the present invention includes a platform and a semi-encapsulated casing arranged on the platform, wherein the contact surface between the platform and the semi-encapsulated casing, and the contact surface between the semi-encapsulated casing and the platform have multiple outlet holes. The electromagnetic device can be installed in the semi-encapsulated casing, and at the same time, the outlet part of the electromagnetic device is led out through the outlet hole. When the outlet part meets the requirements of protection level above IP54, the electromagnetic device can be placed in the cooling air duct space without the requirement of protection level above IP54, avoiding the use of heat dissipation materials such as thermal conductive silicone grease and heat sink, simplifying the structure and making installation It is convenient and greatly reduces the cost of materials and processing.
附图说明Description of drawings
图1为本发明电磁器件安装装置的第一结构示意图；Fig. 1 is the first structural schematic diagram of the electromagnetic device installation device of the present invention;
图2为本发明电磁器件安装装置的第二结构示意图；Fig. 2 is a second structural schematic diagram of the electromagnetic device installation device of the present invention;
图3为本发明电磁器件安装装置的平面主视图；Fig. 3 is the plane front view of the electromagnetic device installation device of the present invention;
图4为本发明电磁器件安装装置的平面俯视图；4 is a plan view of the electromagnetic device installation device of the present invention;
图5为本发明电磁器件安装装置的平面左视图；Fig. 5 is a plane left view of the electromagnetic device installation device of the present invention;
图6为本发明电磁器件安装装置的安装示意图；6 is a schematic diagram of installation of the electromagnetic device installation device of the present invention;
图7为本发明电磁器件安装装置的安装平面主视图；Fig. 7 is a front view of the mounting plane of the electromagnetic device mounting device of the present invention;
图8为本发明电磁器件安装装置的安装平面俯视图；Fig. 8 is a top view of the mounting plane of the electromagnetic device mounting device of the present invention;
图9为本发明电磁器件安装装置的安装平面左视图。Fig. 9 is a left side view of the installation plane of the electromagnetic device installation device of the present invention.
附图标记说明：Explanation of reference signs:
1-平台，11-第一固定孔，2-半封装壳体，21-第一弧形凹槽，22-第二固定孔，3-固定板，31-第二弧形凹槽，4-密封凹槽，5-出线孔。1-platform, 11-first fixing hole, 2-semi-encapsulated shell, 21-first arc-shaped groove, 22-second fixing hole, 3-fixing plate, 31-second arc-shaped groove, 4- Seal groove, 5-outlet hole.
具体实施方式Detailed ways
为使本发明要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.
本发明实施例的电磁器件安装装置，避免了将电磁器件全部灌封起来放于IP54以上防护等级的工作环境，简化了结构，使安装方便，散热性能好，且降低了材料和加工成本。The electromagnetic device installation device of the embodiment of the present invention avoids potting all electromagnetic devices and placing them in a working environment with a protection level above IP54, simplifies the structure, facilitates installation, has good heat dissipation performance, and reduces material and processing costs.
如图1-5所示，本发明实施例的电磁器件安装装置，包括：一平台1；设置于所述平台1上的用于安装电磁器件的半封装壳体2；所述平台1与所述半封装壳体2的接触面上，以及所述半封装壳体2与所述平台1的接触面上均具有多个出线孔5。As shown in Figures 1-5, the electromagnetic device installation device of the embodiment of the present invention includes: a platform 1; a semi-encapsulated housing 2 for installing electromagnetic devices arranged on the platform 1; the platform 1 and the There are a plurality of outlet holes 5 on the contact surface of the semi-encapsulation casing 2 and the contact surface of the semi-encapsulation casing 2 and the platform 1 .
本发明实施例的电磁器件安装装置，包括一平台1及设置于平台1上的半封装壳体2，其中平台1与半封装壳体2的接触面上，以及半封装壳体2与平台1的接触面上均具有多个出线孔5。可以将电磁器件安装于半封装壳体2中，同时将电磁器件的出线部分通过出线孔5引出。在出线部分满足IP54以上防护等级的要求下，电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，避免了使用导热硅脂和散热片等散热材料，简化了结构，使安装方便，且大大降低了材料和加工成本。The electromagnetic device installation device of the embodiment of the present invention includes a platform 1 and a semi-encapsulated casing 2 arranged on the platform 1, wherein the contact surface between the platform 1 and the semi-encapsulated casing 2, and the semi-encapsulated casing 2 and the platform 1 There are multiple outlet holes 5 on the contact surface. The electromagnetic device can be installed in the semi-encapsulated casing 2 , and the outlet part of the electromagnetic device is led out through the outlet hole 5 . When the outlet part meets the requirements of protection level above IP54, the electromagnetic device can be placed in the cooling air duct space without the requirement of protection level above IP54, avoiding the use of heat dissipation materials such as thermal conductive silicone grease and heat sink, simplifying the structure and making installation It is convenient and greatly reduces the cost of materials and processing.
本发明的具体实施例中，所述半封装壳体2的未封装一面设置有固定板3；所述固定板3与所述半封装壳体2的底面之间形成有用于安装电磁器件的至少一个安装孔。In a specific embodiment of the present invention, the unencapsulated side of the semi-encapsulated case 2 is provided with a fixing plate 3; between the fixed plate 3 and the bottom surface of the semi-encapsulated case 2 is formed at least a mounting hole.
此时，电磁器件可安装于固定板3与半封装壳体2之间形成的安装孔中，并通过固定板3进行固定，结构简单，且安装方便，降低了材料和加工成本。At this time, the electromagnetic device can be installed in the mounting hole formed between the fixing plate 3 and the semi-encapsulated casing 2, and fixed by the fixing plate 3, the structure is simple, the installation is convenient, and the material and processing costs are reduced.
具体的，电磁器件可通过导热环氧树脂胶或导热硅胶、聚氨酯灌封胶等半封装于安装孔中，保证了良好的导热性。Specifically, the electromagnetic device can be semi-encapsulated in the mounting hole by heat-conducting epoxy resin glue, heat-conducting silica gel, polyurethane potting glue, etc., so as to ensure good heat conductivity.
其中，所述半封装壳体2的底面上设置有多个第一弧形凹槽21，所述固定板3具有第二弧形凹槽31，其中所述第一弧形凹槽21与所述第二弧形凹槽31形成所述安装孔。Wherein, a plurality of first arc-shaped grooves 21 are arranged on the bottom surface of the semi-encapsulation shell 2, and the fixing plate 3 has a second arc-shaped groove 31, wherein the first arc-shaped grooves 21 are connected with the The second arc-shaped groove 31 forms the installation hole.
此时，第一弧形凹槽21和第二弧形凹槽31形成的安装孔能够稳固存放电磁器件，且结构简单，安装方便。At this time, the installation hole formed by the first arc-shaped groove 21 and the second arc-shaped groove 31 can store electromagnetic devices stably, and has a simple structure and is easy to install.
进一步的，每个所述安装孔在所述平台1以及所述半封装壳体2对应的区域具有多个所述出线孔5。Further, each of the installation holes has a plurality of outlet holes 5 in the area corresponding to the platform 1 and the semi-encapsulated casing 2 .
此时，存放于安装孔中的电磁器件能通过平台1及半封装壳体2对应区域的出线孔5将出线部分引出，从而使出线部分工作在IP54以上防护等级的要求下，而电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，使散热性能良好。At this time, the electromagnetic device stored in the mounting hole can lead out the outlet part through the outlet hole 5 in the corresponding area of the platform 1 and the semi-encapsulated shell 2, so that the outlet part works under the requirements of the protection level above IP54, and the electromagnetic device can be It is placed in a cooling air duct space that does not require a protection level above IP54, so that the cooling performance is good.
具体的，所述安装孔可以为圆形安装孔。Specifically, the mounting hole may be a circular mounting hole.
此时，电磁器件可贴合放置于圆形安装孔中，增加了稳固性。At this time, the electromagnetic device can be fitly placed in the circular mounting hole, which increases the stability.
本发明的具体实施例中，所述平台1上设置有一与所述半封装壳体2的底面形状一致的密封凹槽4，所述半封装壳体2设置于所述密封凹槽4中。In a specific embodiment of the present invention, the platform 1 is provided with a sealing groove 4 conforming to the shape of the bottom surface of the semi-encapsulating casing 2 , and the semi-encapsulating casing 2 is arranged in the sealing groove 4 .
此时，通过在密封凹槽4中安装密封圈，可使出线部分放置于一密闭空间时封闭的更加严密，从而使出线部分满足IP54以上防护等级的要求。At this time, by installing a sealing ring in the sealing groove 4, the outgoing line part can be sealed more tightly when placed in a closed space, so that the outgoing line part can meet the requirements of protection level above IP54.
其中，所述平台1还具有第一固定孔11。Wherein, the platform 1 also has a first fixing hole 11 .
此时，可通过平台1的第一固定孔11将本发明的电磁器件安装装置固定于该装置的应用环境中，结构简单，且安装方便，增加了装置的实用性。At this time, the electromagnetic device installation device of the present invention can be fixed in the application environment of the device through the first fixing hole 11 of the platform 1 , the structure is simple, and the installation is convenient, which increases the practicability of the device.
进一步的，所述半封装壳体2的未封装一面上具有第二固定孔22，所述固定板3通过所述第二固定孔22与所述半封装壳体2固定连接。Further, the non-encapsulated side of the half-encapsulation shell 2 has a second fixing hole 22 , and the fixing plate 3 is fixedly connected to the half-encapsulation shell 2 through the second fixing hole 22 .
此时，固定板3可通过第二固定孔22与半封装壳体2固定连接，结构简单，且拆卸方便，增加了装置的实用性。At this time, the fixing plate 3 can be fixedly connected to the semi-encapsulating casing 2 through the second fixing hole 22, which has a simple structure and is easy to disassemble, which increases the practicability of the device.
具体的，所述第一固定孔11及第二固定孔22均可为螺栓固定孔。Specifically, both the first fixing hole 11 and the second fixing hole 22 can be bolt fixing holes.
此时，可通过螺栓实现装置的固定，使拆卸方便，增加了装置的实用性。At this time, the fixing of the device can be realized by bolts, which facilitates disassembly and increases the practicability of the device.
优选的，所述平台1、所述半封装壳体2及所述固定板3均可采用铝合金材料制成。Preferably, the platform 1 , the semi-encapsulated casing 2 and the fixing plate 3 can all be made of aluminum alloy.
下面对本发明的具体实施例举例说明如下。The specific embodiments of the present invention are illustrated as follows below.
如图1-5所示，本发明实施例的电磁器件安装装置包括一平台1，及安装于平台1上的半封装壳体2，且半封装壳体2的未封装一面设置有固定板3。固定板3与半封装壳体2的底面之间形成有用于安装电磁器件的3个圆形安装孔。其中，半封装壳体2的底面上设置有3个第一弧形凹槽21，固定板具有3个第二弧形凹槽31，第一弧形凹槽21与第二弧形凹槽31形成了安装孔。且每个安装孔在平台1以及半封装壳体2对应的区域分别具有2个出线孔5。可以将电磁器件安装于半封装壳体2中，同时将电磁器件的出线部分通过出线孔5引出。在出线部分满足IP54以上防护等级的要求下，使电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，避免了使用导热硅脂和散热片等散热材料，结构简单，且安装方便，大大降低了材料和加工成本。As shown in Figures 1-5, the electromagnetic device installation device of the embodiment of the present invention includes a platform 1, and a semi-encapsulated shell 2 installed on the platform 1, and the unencapsulated side of the semi-encapsulated shell 2 is provided with a fixing plate 3 . Three circular mounting holes for mounting electromagnetic devices are formed between the fixing plate 3 and the bottom surface of the semi-encapsulating casing 2 . Wherein, three first arc-shaped grooves 21 are arranged on the bottom surface of the semi-encapsulated shell 2, and the fixing plate has three second arc-shaped grooves 31, and the first arc-shaped groove 21 and the second arc-shaped groove 31 Mounting holes are formed. And each mounting hole has two outlet holes 5 in the corresponding areas of the platform 1 and the semi-encapsulated casing 2 . The electromagnetic device can be installed in the semi-encapsulated casing 2 , and the outlet part of the electromagnetic device is led out through the outlet hole 5 . When the outlet part meets the requirements of protection level above IP54, the electromagnetic device can be placed in the cooling air duct space without the requirement of protection level above IP54, avoiding the use of heat dissipation materials such as thermal conductive silicone grease and heat sink, the structure is simple, and the installation Convenient, greatly reducing material and processing costs.
其中，平台1上设置有密封凹槽4，通过在密封凹槽4中安装密封圈，可使出线部分放置于一密闭空间时封闭的更加严密。且平台1还具有4个第一固定孔11，半封装壳体2的未封装一面上具有2个第二固定孔22，固定板3通过第二固定孔22与半封装壳体2固定连接。第一固定孔11和第二固定孔22可均为螺栓固定孔，使拆卸方便，增加装置的实用性。Wherein, the platform 1 is provided with a sealing groove 4, and by installing a sealing ring in the sealing groove 4, the outlet part can be sealed more tightly when placed in a closed space. And the platform 1 also has 4 first fixing holes 11 , and the unpackaged side of the semi-encapsulating shell 2 has 2 second fixing holes 22 , and the fixing plate 3 is fixedly connected with the semi-encapsulating shell 2 through the second fixing holes 22 . The first fixing hole 11 and the second fixing hole 22 can both be bolt fixing holes, which facilitates disassembly and increases the practicability of the device.
如图6-9所示，为本发明实施例的电磁器件安装装置的安装示意图。其中平台1通过4个螺栓固定孔与一密封装置固定连接。电磁器件安装于固定板3与半封装壳体2形成的安装孔中，同时电磁器件的出线部分通过出线孔5引入到密封装置中。此时，在出线部分满足IP54以上防护等级的要求下，使电磁器件可以被放置到无IP54以上防护等级要求的散热风道空间内，避免了使用导热硅脂和散热片等散热材料，结构简单，且安装方便，大大降低了材料和加工成本。As shown in FIGS. 6-9 , they are installation diagrams of an electromagnetic device installation device according to an embodiment of the present invention. The platform 1 is fixedly connected with a sealing device through four bolt fixing holes. The electromagnetic device is installed in the mounting hole formed by the fixing plate 3 and the semi-encapsulated casing 2 , and the outlet part of the electromagnetic device is introduced into the sealing device through the outlet hole 5 . At this time, when the outlet part meets the requirements of protection level above IP54, the electromagnetic device can be placed in the heat dissipation air duct space without the protection level above IP54, avoiding the use of heat dissipation materials such as thermal conductive silicone grease and heat sink, and the structure is simple , and easy to install, greatly reducing material and processing costs.
本发明实施例的电磁器件安装装置，避免了将电磁器件全部灌封起来放于IP54以上防护等级的工作环境，简化了结构，使安装方便，散热性能好，且降低了材料和加工成本。The electromagnetic device installation device of the embodiment of the present invention avoids potting all electromagnetic devices and placing them in a working environment with a protection level above IP54, simplifies the structure, facilitates installation, has good heat dissipation performance, and reduces material and processing costs.
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。The above description is a preferred embodiment of the present invention, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications can also be made. It should be regarded as the protection scope of the present invention.
Claims (9)
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| CN201410121212.5A CN104955319B (en) | 2014-03-27 | 2014-03-27 | A kind of electromagnetic device erecting device |
| PCT/CN2015/074479 WO2015144006A1 (en) | 2014-03-27 | 2015-03-18 | Electromagnetic device mounting apparatus |
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| CN1913766A (en) * | 2005-08-12 | 2007-02-14 | 鸿富锦精密工业（深圳）有限公司 | Heat sink capable of preventing interference of electromagnetic |
| US20110175134A1 (en) * | 2010-01-20 | 2011-07-21 | Silitek Electronic (Guangzhou) Co., Ltd. | Package structure and led package structure |
| CN202307422U (en) * | 2011-10-24 | 2012-07-04 | 深圳麦格米特电气股份有限公司 | Heat conduction and fixing device of magnetic element |
| CN203934278U (en) * | 2014-03-27 | 2014-11-05 | 特富特科技(深圳)有限公司 | A kind of electromagnetic device erecting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913766A (en) * | 2005-08-12 | 2007-02-14 | 鸿富锦精密工业（深圳）有限公司 | Heat sink capable of preventing interference of electromagnetic |
| US20110175134A1 (en) * | 2010-01-20 | 2011-07-21 | Silitek Electronic (Guangzhou) Co., Ltd. | Package structure and led package structure |
| CN202307422U (en) * | 2011-10-24 | 2012-07-04 | 深圳麦格米特电气股份有限公司 | Heat conduction and fixing device of magnetic element |
| CN203934278U (en) * | 2014-03-27 | 2014-11-05 | 特富特科技(深圳)有限公司 | A kind of electromagnetic device erecting device |
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