CN104942171B - The lower mold clamping package assembling of cylindrical battery packaging machine - Google Patents

The lower mold clamping package assembling of cylindrical battery packaging machine Download PDF

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Publication number
CN104942171B
CN104942171B CN201510383886.7A CN201510383886A CN104942171B CN 104942171 B CN104942171 B CN 104942171B CN 201510383886 A CN201510383886 A CN 201510383886A CN 104942171 B CN104942171 B CN 104942171B
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Prior art keywords
lower mold
encapsulation
block
push
clamping
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CN201510383886.7A
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CN104942171A (en
Inventor
陈飞彪
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GAOTANG Rongzhi Rongzhi Technology Service Co.,Ltd.
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Suzhou Changfei Automation Equipment Factory
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D41/00Application of procedures in order to alter the diameter of tube ends
    • B21D41/04Reducing; Closing
    • B21D41/045Closing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00Tools as parts of machines covered by this subclass
    • B21D37/10Die sets; Pillar guides
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/04Construction or manufacture in general
    • H01M10/0404Machines for assembling batteries
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00Primary cells; Manufacture thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses the lower mold clamping package assembling of a kind of cylindrical battery packaging machine, the lower mold clamping package assembling of this cylindrical battery packaging machine includes lower mold clamp assemblies and lower mold package assembling, described lower mold clamp assemblies upper end is provided with lower mold package assembling, described lower mold clamp assemblies includes that lower mold clamps rotating disk, lower mold clamping push-pull device at fixed, limited block, lower mold grips block, lower mold clamping sliding shoe, lower mold pressure die, pressure die mounting ring, lower mold base, first spacing ring, second spacing ring, positioning sliding block and lower mold pin, first connector of lower mold clamping push-pull device at fixed is connected to lower mold clamping rotating disk by pin, limited block is all connected to lower mold by bearing pin and grips block, lower mold clamping sliding shoe is connected to positioning sliding block by lower mold pin, positioning sliding block is positioned at the involute groove clockwise of lower mold clamping rotating disk.By the way, automaticity of the present invention is high, it is possible to substitutes artificial automatic impaction encapsulation battery, reduces production cost.

Description

The lower mold clamping package assembling of cylindrical battery packaging machine
Technical field
The present invention relates to plastic rubber shaping mould, particularly relate to the lower mold clamping package assembling of a kind of cylindrical battery packaging machine.
Background technology
In the manufacture and production process of battery, needing to seal battery, the packaging machine to cylindrical battery has two kinds at present: one is added sealed piece by punch press and forms, and another kind is added sealed piece by cylinder or pneumatic pressure cylinder and forms.Two kinds of equipment work qualities are the highest, frame strength causes positioning inaccurate not, and sealing flexural deformation is too fast, easily rushes inclined battery, sealing part easily goes out burr or scratch, battery seal quality is unstable, and the technique of two kinds of equipment is more complicated, inefficient, additionally the cylindrical battery of different model more mold exchange is more complicated, the debugging time is longer, in view of this, it is necessary to improved the lower mold clamping package assembling of existing cylindrical battery packaging machine.
Summary of the invention
The technical problem that present invention mainly solves is to provide the lower mold clamping package assembling of a kind of cylindrical battery packaging machine, and automaticity of the present invention is high, it is possible to substitutes artificial automatic impaction encapsulation battery, saves labour, reduce production cost.
nullFor solving above-mentioned technical problem,The technical scheme that the present invention uses is: provide the lower mold clamping package assembling of a kind of cylindrical battery packaging machine,The lower mold clamping package assembling of this cylindrical battery packaging machine includes lower mold clamp assemblies and lower mold package assembling,Described lower mold clamp assemblies upper end is provided with lower mold package assembling,Described lower mold clamp assemblies includes that lower mold clamps rotating disk、Lower mold clamping push-pull device at fixed、Limited block、Lower mold grips block、Lower mold clamping sliding shoe、Lower mold pressure die、Pressure die mounting ring、Lower mold base、First spacing ring、Second spacing ring、Positioning sliding block and lower mold pin,First connector of lower mold clamping push-pull device at fixed is connected to lower mold clamping rotating disk by pin,Axis decile along lower mold clamping rotating disk has eight groups of limited block groups,Often group limited block group is provided with two limited blocks,Limited block is close to lower mold clamping rotating disk lateral surface,Limited block is all connected to lower mold by bearing pin and grips block,Six lower molds grip block upper end projection and are close to the first spacing ring medial surface,Described lower mold grips and is provided with lubrication channel inside block,Lower mold grips block and is both secured to lower mold base,Lower mold base is by being connected to lower mold clamping rotating disk in the second spacing ring,Lower mold base medial surface is close to pressure die mounting ring,Lower mold grips and is provided with lower mold clamping sliding shoe between block,Lower mold clamping sliding shoe is connected to positioning sliding block by lower mold pin,Positioning sliding block is positioned at the involute groove clockwise of lower mold clamping rotating disk,Lower mold clamping sliding shoe is all connected with lower mold pressure die,Lower mold base is close in six lower mold pressure die lower ends in the form of a ring;Described lower mold package assembling includes that lower mold encapsulates rotating disk, lower mold encapsulation push-pull device at fixed, encapsulation positioning sliding block, encapsulation pin, connecting rod, lower mold encapsulation bar, encapsulation bar positioning disk and encapsulation fixed block, second connector of lower mold encapsulation push-pull device at fixed is connected to lower mold encapsulation rotating disk by pin, the medial surface of lower mold encapsulation rotating disk is close to the first spacing ring, it is provided with encapsulation positioning sliding block in the involute groove counterclockwise of lower mold encapsulation rotating disk, encapsulation positioning sliding block is connected to one end of connecting rod by encapsulation pin, the other end of connecting rod is connected to lower mold encapsulation bar, lower mold encapsulation bar is stuck in the gathering sill of encapsulation bar positioning disk, encapsulation bar positioning disk is connected to lower mold by encapsulation fixed block and grips block;
Preferably, described lower mold clamping push-pull device at fixed also includes clamping push-and-pull cylinder, clamping push-and-pull cylinder mounting plate, clamping push-and-pull cylinder mounting block, primary importance inductor, first inductor support, second place inductor, second inductor support, support cushion block and bolt, clamping push-and-pull cylinder is fixed on clamping push-and-pull cylinder mounting plate, clamping push-and-pull cylinder mounting plate is fixed on clamping push-and-pull cylinder mounting block, the piston rod of clamping push-and-pull cylinder is connected to the first connector, first connector side is provided with primary importance inductor, primary importance inductor is fixed on the first inductor support, it is provided with bolt on front side of first connector, bolt is screwed into support cushion block, support cushion block upper end is connected to second place inductor by the second inductor support, second place inductor faces toward bolt;
nullPreferably,Described lower mold encapsulation push-pull device at fixed also includes encapsulating push-and-pull cylinder、Encapsulation push-and-pull cylinder mounting plate、Encapsulation push-and-pull cylinder mounting block、Encapsulation cushion block、3rd position sensor、3rd inductor support、4th position sensor、4th inductor support、Encapsulation mounting blocks and encapsulation bolt,Encapsulation push-and-pull cylinder it is provided with between encapsulation push-and-pull cylinder mounting plate and encapsulation cushion block,Encapsulation push-and-pull cylinder mounting plate and encapsulation cushion block are connected by encapsulation push-and-pull cylinder mounting block,The piston rod of encapsulation push-and-pull cylinder is connected to the second connector,The 3rd position sensor it is provided with on the left of second connector,3rd position sensor is fixed on the 3rd inductor support,Encapsulation mounting blocks it is provided with on front side of second connector,On encapsulation mounting blocks, encapsulation bolt is installed,Encapsulation bolt is facing to the second connector,Encapsulation bolt side is provided with the 4th position sensor,4th position sensor is fixed on the 4th inductor support.
The invention has the beneficial effects as follows: the lower mold clamping package assembling of a kind of cylindrical battery packaging machine of the present invention, automaticity is high, it is possible to substitutes artificial automatic impaction encapsulation battery, saves labour, reduce production cost.
Accompanying drawing explanation
Fig. 1 is the lower mold clamping package assembling structural representation of cylindrical battery packaging machine of the present invention;
Fig. 2 is the lower mold clamp assemblies structural representation of the lower mold clamping package assembling of cylindrical battery packaging machine of the present invention;
Fig. 3 is the part-structure schematic diagram of the lower mold clamp assemblies of the lower mold clamping package assembling of cylindrical battery packaging machine of the present invention;
Fig. 4 is the lower mold package assembling structural representation of the lower mold clamping package assembling of cylindrical battery packaging machine of the present invention;
Fig. 5 is the part-structure schematic diagram of the lower mold package assembling of the lower mold clamping package assembling of cylindrical battery packaging machine of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings present pre-ferred embodiments is described in detail, so that the advantage of invention and feature can be easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention is made apparent clear and definite defining.
Referring to Fig. 1 to Fig. 5, the embodiment of the present invention includes:
nullA kind of lower mold clamping package assembling of cylindrical battery packaging machine,The lower mold clamping package assembling of this cylindrical battery packaging machine includes lower mold clamp assemblies 421 and lower mold package assembling 422,Described lower mold clamp assemblies 421 upper end is provided with lower mold package assembling 422,Described lower mold clamp assemblies 421 includes that lower mold clamps rotating disk 4211、Lower mold clamping push-pull device at fixed 4212、Limited block 4213、Lower mold grips block 4214、Lower mold clamping sliding shoe 4215、Lower mold pressure die 4216、Pressure die mounting ring 4217、Lower mold base 4218、First spacing ring 4219、Second spacing ring 42110、Positioning sliding block 42111 and lower mold pin 42112,First connector 42124 of lower mold clamping push-pull device at fixed 4212 is connected to lower mold clamping rotating disk 4211 by pin,Axis decile along lower mold clamping rotating disk 4211 has eight groups of limited block groups,Often group limited block group is provided with two limited blocks 4213,Limited block 4213 is close to lower mold clamping rotating disk 4211 lateral surface,Limited block 4213 is all connected to lower mold by bearing pin and grips block 4214,Six lower molds grip block 4214 upper end projection and are close to the first spacing ring 4219 medial surface,Described lower mold grips block 4214 inside and is provided with lubrication channel,Lower mold grips block 4214 and is both secured to lower mold base 4218,Lower mold base 4218 is by being connected to lower mold clamping rotating disk 4211 in the second spacing ring 42110,Lower mold base 4218 medial surface is close to pressure die mounting ring 4217,Lower mold grips and is provided with lower mold clamping sliding shoe 4215 between block 4214,Lower mold clamping sliding shoe 4215 is connected to positioning sliding block 42111 by lower mold pin 42112,Positioning sliding block 42111 is positioned at the involute groove clockwise of lower mold clamping rotating disk 4211,Lower mold clamping sliding shoe 4215 is all connected with lower mold pressure die 4216,Lower mold base 4218 is close in six lower mold pressure die 4216 lower ends in the form of a ring;
nullDescribed lower mold clamping push-pull device at fixed 4212 also includes clamping push-and-pull cylinder 42121、Clamping push-and-pull cylinder mounting plate 42122、Clamping push-and-pull cylinder mounting block 42123、Primary importance inductor 42125、First inductor support 42126、Second place inductor 42127、Second inductor support 42128、Support cushion block 42129 and bolt 421210,Clamping push-and-pull cylinder 42121 is fixed on clamping push-and-pull cylinder mounting plate 42122,Clamping push-and-pull cylinder mounting plate 42122 is fixed on clamping push-and-pull cylinder mounting block 42123,The piston rod of clamping push-and-pull cylinder 42121 is connected to the first connector 42124,First connector 42124 side is provided with primary importance inductor 42125,Primary importance inductor 42125 is fixed on the first inductor support 42126,It is provided with bolt 421210 on front side of first connector 42124,Bolt 421210 is screwed into support cushion block 42129,Support cushion block 42129 upper end is connected to second place inductor 42127 by the second inductor support 42128,Second place inductor 42127 is facing to bolt 421210;
nullDescribed lower mold package assembling 422 includes that lower mold encapsulates rotating disk 4221、Lower mold encapsulation push-pull device at fixed 4222、Encapsulation positioning sliding block 4223、Encapsulation pin 4224、Connecting rod 4225、Lower mold encapsulation bar 4226、Encapsulation bar positioning disk 4227 and encapsulation fixed block 4228,Second connector 42225 of lower mold encapsulation push-pull device at fixed 4222 is connected to lower mold encapsulation rotating disk 4221 by pin,The medial surface of lower mold encapsulation rotating disk 4221 is close to the first spacing ring 4219,It is provided with encapsulation positioning sliding block 4223 in the involute groove counterclockwise of lower mold encapsulation rotating disk 4221,Encapsulation positioning sliding block 4223 is connected to one end of connecting rod 4225 by encapsulation pin 4224,The other end of connecting rod 4225 is connected to lower mold encapsulation bar 4226,Lower mold encapsulation bar 4226 is stuck in the gathering sill of encapsulation bar positioning disk 4227,Encapsulation bar positioning disk 4227 is connected to lower mold by encapsulation fixed block 4228 and grips block 4214;
nullDescribed lower mold encapsulation push-pull device at fixed 4222 also includes encapsulating push-and-pull cylinder 42221、Encapsulation push-and-pull cylinder mounting plate 42222、Encapsulation push-and-pull cylinder mounting block 42223、Encapsulation cushion block 42224、3rd position sensor 42226、3rd inductor support 42227、4th position sensor 42228、4th inductor support 42229、Encapsulation mounting blocks 422210 and encapsulation bolt 422211,Encapsulation push-and-pull cylinder 42221 it is provided with between encapsulation push-and-pull cylinder mounting plate 42222 and encapsulation cushion block 42224,Encapsulation push-and-pull cylinder mounting plate 42222 and encapsulation cushion block 42224 are connected by encapsulation push-and-pull cylinder mounting block 42223,The piston rod of encapsulation push-and-pull cylinder 42221 is connected to the second connector 42225,It is provided with the 3rd position sensor 42226 on the left of second connector 42225,3rd position sensor 42226 is fixed on the 3rd inductor support 42227,Encapsulation mounting blocks 422210 it is provided with on front side of second connector 42225,Encapsulation bolt 422211 is installed on encapsulation mounting blocks 422210,Encapsulation bolt 422211 is facing to the second connector 42225,Encapsulation bolt 422211 side is provided with the 4th position sensor 42228,4th position sensor 42228 is fixed on the 4th inductor support 42229.
The lower mold clamping package assembling of cylindrical battery packaging machine of the present invention, automaticity is high, it is possible to substitutes artificial automatic impaction encapsulation battery, saves labour, reduce production cost.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the invention and accompanying drawing content to be made or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, the most in like manner it is included in the scope of patent protection of the present invention.

Claims (3)

  1. null1. the lower mold clamping package assembling of a cylindrical battery packaging machine,It is characterized in that,The lower mold clamping package assembling of this cylindrical battery packaging machine includes lower mold clamp assemblies and lower mold package assembling,Described lower mold clamp assemblies upper end is provided with lower mold package assembling,Described lower mold clamp assemblies includes that lower mold clamps rotating disk、Lower mold clamping push-pull device at fixed、Limited block、Lower mold grips block、Lower mold clamping sliding shoe、Lower mold pressure die、Pressure die mounting ring、Lower mold base、First spacing ring、Second spacing ring、Positioning sliding block and lower mold pin,First connector of lower mold clamping push-pull device at fixed is connected to lower mold clamping rotating disk by pin,Axis decile along lower mold clamping rotating disk has eight groups of limited block groups,Often group limited block group is provided with two limited blocks,Limited block is close to lower mold clamping rotating disk lateral surface,Limited block is all connected to lower mold by bearing pin and grips block,Six lower molds grip block upper end projection and are close to the first spacing ring medial surface,Described lower mold grips and is provided with lubrication channel inside block,Lower mold grips block and is both secured to lower mold base,Lower mold base is by being connected to lower mold clamping rotating disk in the second spacing ring,Lower mold base medial surface is close to pressure die mounting ring,Lower mold grips and is provided with lower mold clamping sliding shoe between block,Lower mold clamping sliding shoe is connected to positioning sliding block by lower mold pin,Positioning sliding block is positioned at the involute groove clockwise of lower mold clamping rotating disk,Lower mold clamping sliding shoe is all connected with lower mold pressure die,Lower mold base is close in six lower mold pressure die lower ends in the form of a ring;Described lower mold package assembling includes that lower mold encapsulates rotating disk, lower mold encapsulation push-pull device at fixed, encapsulation positioning sliding block, encapsulation pin, connecting rod, lower mold encapsulation bar, encapsulation bar positioning disk and encapsulation fixed block, second connector of lower mold encapsulation push-pull device at fixed is connected to lower mold encapsulation rotating disk by pin, the medial surface of lower mold encapsulation rotating disk is close to the first spacing ring, it is provided with encapsulation positioning sliding block in the involute groove counterclockwise of lower mold encapsulation rotating disk, encapsulation positioning sliding block is connected to one end of connecting rod by encapsulation pin, the other end of connecting rod is connected to lower mold encapsulation bar, lower mold encapsulation bar is stuck in the gathering sill of encapsulation bar positioning disk, encapsulation bar positioning disk is connected to lower mold by encapsulation fixed block and grips block.
  2. nullThe lower mold clamping package assembling of cylindrical battery packaging machine the most according to claim 1,It is characterized in that: described lower mold clamping push-pull device at fixed also includes clamping push-and-pull cylinder、Clamping push-and-pull cylinder mounting plate、Clamping push-and-pull cylinder mounting block、Primary importance inductor、First inductor support、Second place inductor、Second inductor support、Support cushion block and bolt,Clamping push-and-pull cylinder is fixed on clamping push-and-pull cylinder mounting plate,Clamping push-and-pull cylinder mounting plate is fixed on clamping push-and-pull cylinder mounting block,The piston rod of clamping push-and-pull cylinder is connected to the first connector,First connector side is provided with primary importance inductor,Primary importance inductor is fixed on the first inductor support,It is provided with bolt on front side of first connector,Bolt is screwed into support cushion block,Support cushion block upper end is connected to second place inductor by the second inductor support,Second place inductor faces toward bolt.
  3. nullThe lower mold clamping package assembling of cylindrical battery packaging machine the most according to claim 1,It is characterized in that: described lower mold encapsulation push-pull device at fixed also includes encapsulating push-and-pull cylinder、Encapsulation push-and-pull cylinder mounting plate、Encapsulation push-and-pull cylinder mounting block、Encapsulation cushion block、3rd position sensor、3rd inductor support、4th position sensor、4th inductor support、Encapsulation mounting blocks and encapsulation bolt,Encapsulation push-and-pull cylinder it is provided with between encapsulation push-and-pull cylinder mounting plate and encapsulation cushion block,Encapsulation push-and-pull cylinder mounting plate and encapsulation cushion block are connected by encapsulation push-and-pull cylinder mounting block,The piston rod of encapsulation push-and-pull cylinder is connected to the second connector,The 3rd position sensor it is provided with on the left of second connector,3rd position sensor is fixed on the 3rd inductor support,Encapsulation mounting blocks it is provided with on front side of second connector,On encapsulation mounting blocks, encapsulation bolt is installed,Encapsulation bolt is facing to the second connector,Encapsulation bolt side is provided with the 4th position sensor,4th position sensor is fixed on the 4th inductor support.
CN201510383886.7A 2015-07-03 2015-07-03 The lower mold clamping package assembling of cylindrical battery packaging machine Active CN104942171B (en)

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CN104942157A (en) * 2015-07-17 2015-09-30 苏州昌飞自动化设备厂 Lower mould clamping assembly for cylindrical battery packaging machine
CN106363559B (en) * 2016-11-17 2017-12-05 陈安 Clamp assembly of the magnetic valve every magnetic assembly assembly machine

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