CN104932194A - Mask plate, manufacturing method thereof, and recycling method of mask plate - Google Patents
Mask plate, manufacturing method thereof, and recycling method of mask plate Download PDFInfo
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- CN104932194A CN104932194A CN201510434545.8A CN201510434545A CN104932194A CN 104932194 A CN104932194 A CN 104932194A CN 201510434545 A CN201510434545 A CN 201510434545A CN 104932194 A CN104932194 A CN 104932194A
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- Prior art keywords
- sacrifice layer
- substrate
- mask plate
- mask pattern
- mask
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
Abstract
The invention provides a mask plate, a manufacturing method thereof, and a recycling method of the mask plate, and belongs to the technical field of display. The mask plate, the manufacturing method thereof, and the recycling method of the mask plate can solve the problems that the phenomenon of the ghost can happen on an existing substrate on which a mask pattern is removed, and the recovery cost is high. The mask plate comprises a substrate and a mask pattern arranged on the substrate. A sacrificial layer is arranged between the substrate and the mask pattern, and used for isolating the mask pattern from the substrate.
Description
Technical field
The invention belongs to display technique field, be specifically related to the recovery method of a kind of mask plate and preparation method thereof, mask plate.
Background technology
As shown in Figure 1, the structure of mask plate generally includes one deck mask graph 2 (being generally chromium (Cr) layer) arranged on substrate 1, and the framework 3 of mask graph 2 surrounding and be arranged on the film 4 on its surface.And just based on this structure, causing mask plate after Long-Time Service, the material of mask graph 2 can be diffused on substrate 1, therefore, there are problems when mask plate reclaims.
Existing mask plate recovery method mainly contains two kinds, the first is normal absorption method, first the framework 3 of mask graph 2 surrounding is removed with the film 4 being arranged on its surface, make mask graph 2 exposed out (as Fig. 2), then etching technics is carried out, mask graph 2 on substrate 1 is removed (as Fig. 3), due to the diffusion of mask graph 2 material, after carrying out etching technics, substrate 1 upper surface has mask graph 2 material residual 5, this situation can not observe different shape under microcosmic, but in macroscopical, human eye can faintly be seen the residual of figure, be referred to as " ghost ", this can affect the use of mask plate, thus reduce the yield of product, the second is polishing absorption method, namely on the basis of first method, carry out stock removal polishing technique again, the aspect of the substrate 1 extended influence by masked figure 2 material removes (as Fig. 4), adopt the method, the aspect of the substrate 1 that masked figure 2 material extends influence by glossing (namely, the substrate 11 that glossing is removed) remove, not only glossing is with high costs, and the lower thickness that can make substrate 1 (namely, residual substrate 12 after glossing process), the specification of general substrate 1 is 10 ± 0.2, and each polishing can make it at least reduce 0.1.
Therefore, at least there is following problem in prior art:
The first, because mask pattern 2 is set directly on substrate 1, mask plate is after Long-Time Service, and the material of mask graph 2 can be diffused on substrate 1, and cause after removal mask pattern 2, " ghost " phenomenon appears in substrate 1 surface;
The second, the mask plate of above-mentioned appearance " ghost " phenomenon in removal process, there will be " ghost " phenomenon cannot remove or through glossing metacoxal plate 1 thickness reduce thus the problem causing cost to increase.
Summary of the invention
The substrate that the present invention is directed to after existing removal mask graph material can produce " ghost " phenomenon, and the problem of cost recovery costliness, there is provided a kind of can overcome the substrate after removing mask graph material and can produce " ghost " phenomenon, and with low cost, do not need the recovery method of mask plate reducing substrate thickness and preparation method thereof, mask plate.
The technical scheme that solution the technology of the present invention problem adopts is a kind of mask plate, the mask pattern comprising substrate and arrange on the substrate, wherein, between described substrate and described mask pattern, be also provided with sacrifice layer, described sacrifice layer be used for by described mask pattern and described substrate isolated.
Preferably, described sacrifice layer covers whole substrate or described sacrifice layer is identical with the figure of described mask pattern.
Preferably, the material of described sacrifice layer comprises transparent material.
Further preferably, when described sacrifice layer is identical with the figure of described mask pattern, the material of described sacrifice layer comprises nonmetallic materials.
Preferably, the refractive index of described sacrifice layer is 1 ~ 1.5.
As another technical scheme, the present invention also provides a kind of preparation method of mask plate, comprising:
On substrate, form sacrifice layer and mask pattern, described sacrifice layer between described substrate and described mask pattern, described sacrifice layer be used for by described mask pattern and described substrate isolated.
Preferably, describedly on substrate, sacrifice layer is formed and mask pattern comprises:
On described substrate, form sacrifice layer, described sacrifice layer covers whole substrate;
On described sacrifice layer, form mask pattern material layer, patterning processes is carried out to mask pattern material layer and forms mask pattern;
Or,
Sacrificial layer material layer and mask pattern material layer is formed continuously on described substrate;
Patterning processes is carried out to sacrificial layer material layer and mask pattern material layer and forms sacrifice layer and mask pattern.
Preferably, the material of described sacrifice layer comprises transparent material.
Further preferably, on substrate, sacrifice layer is formed and mask pattern comprises when described:
Sacrificial layer material layer and mask pattern material layer is formed continuously on described substrate;
When carrying out patterning processes formation sacrifice layer and mask pattern to sacrificial layer material layer and mask pattern material layer, the material of described sacrifice layer comprises nonmetallic materials.
As another technical scheme, the present invention also provides a kind of recovery method of mask plate, the mask plate described in the above-mentioned any one of described mask plate, and described recovery method comprises:
Remove described mask pattern and described sacrifice layer.
In mask plate of the present invention and preparation method thereof, by the sacrifice layer between substrate and mask pattern, isolated mask figure and substrate, thus improve mask plate after long-term use, " ghost " phenomenon produced after removing mask pattern, thus improve product yield.And mask plate of the present invention is compared to the mask plate of prior art, the cost of increase is not high, and technological process is also very simple, effectively can also increase the transmitance of mask plate.
The recovery method of mask plate of the present invention, reclaims mask plate of the present invention, removes mask pattern and sacrifice layer, because mask pattern and substrate are not directly contact, and phenomenon that therefore, substrate surface does not exist " ghost "; In addition, recovery method of the present invention, does not need glossing, does not also need the thickness reducing substrate, effectively can save cost recovery, can realize the repeatedly recycling of mask plate.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing mask plate;
Fig. 2 is the structural representation of the mask plate after the step 1 of the first mask plate recovery method existing processes;
Fig. 3 is the structural representation of the mask plate after the step 2 of the first mask plate recovery method existing processes;
Fig. 4 is the structural representation of the mask plate after the glossing process of existing the second mask plate recovery method;
The structural representation of a kind of mask plate that Fig. 5 provides for the embodiment of the present invention 2;
The structural representation of a kind of mask plate that Fig. 6 provides for the embodiment of the present invention 3;
The process chart of the preparation method of a kind of mask plate that Fig. 7 provides for the embodiment of the present invention 4;
Fig. 8 A is the schematic diagram forming sacrifice layer in the embodiment of the present invention 4;
Fig. 8 B is the schematic diagram forming mask graph in the embodiment of the present invention 4;
The process chart of the preparation method of a kind of mask plate that Fig. 9 provides for the embodiment of the present invention 5;
Figure 10 A is the schematic diagram forming sacrifice layer and mask graph in the embodiment of the present invention 5;
Figure 10 B is the schematic diagram of sacrifice layer and mask graph after patterning processes in the embodiment of the present invention 5;
Wherein, Reference numeral is: 1, substrate; 2, mask graph; 3, framework; 4, film; 5, mask graph material remains; 11, the substrate of glossing removal; 12, remaining substrate after glossing process; 8, sacrifice layer.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Embodiment 1:
The present embodiment provides a kind of mask plate, comprises substrate and is arranged on the mask pattern on substrate, wherein, between substrate and mask pattern, be also provided with sacrifice layer, sacrifice layer be used for by mask pattern and substrate isolated.
The mask plate of the present embodiment, by the sacrifice layer between substrate and mask pattern, described sacrifice layer adopts the material easily removed, utilize described sacrifice layer isolated mask figure and substrate like this, thus improve mask plate after long-term use, " ghost " phenomenon produced after removing mask pattern, improves product yield.And mask plate of the present invention is compared to the mask plate of prior art, the cost of increase is not high, and technological process is also very simple, effectively can also increase the transmitance of mask plate.
Embodiment 2:
As shown in Figure 5, the present embodiment provides a kind of mask plate, and this mask plate comprises substrate 1 and arranges mask pattern 2 on substrate 1, wherein, between substrate 1 and mask pattern 2, is also provided with sacrifice layer 8, sacrifice layer 8 for by mask pattern 2 and substrate 1 isolated.
Further, this mask plate also comprises framework 3 and film 4.Framework 3, the isostructural method to set up of film 4 are same as the prior art, do not repeat them here.
In the present embodiment, the material of substrate 1 is described for glass, and certainly, the material of the substrate 1 of mask plate of the present invention is not limited thereto.
Preferably, sacrifice layer 8 covers whole substrate 1.Why so arrange, being due to when sacrifice layer 8 is for covering whole substrate 1, only needing primary depositing technique, not needing to etch this sacrifice layer 8, can preparation process be made to a great extent simple and easy.
Further preferably, the material of sacrifice layer 8 comprises transparent material.Why so arranging, is because transparent material effectively can improve transmittance, and such as, this transparent material can be polyurethane or polymethylmethacrylate etc.
Preferably, the refractive index of sacrifice layer 8 is 1 ~ 1.5.Why so arrange, be that the material being 1 ~ 1.5 due to refractive index has certain antireflective effect, circular is as follows:
Reflectivity r=(n
1-n
2)
2/ (n
1+ n
2)
2, n is the refractive index of material, and the refractive index of air is 1.0, and the refractive index of glass is about 1.5, supposes that the refractive index of sacrifice layer 8 material is 1.3, and so, the substrate 1 of existing mask plate with the reflectivity of air is: r=(1.5-1.0)
2/ (1.5+1.0)
2=4%, therefore, existing mask plate finally through rate be; T=1-4%-4%=92%.
In like manner, mask plate of the present invention:
(1) reflectivity of substrate 1 and sacrifice layer 8 is: r=(1.5-1.3)
2/ (1.5+1.3)
2=0.5%;
(2) reflectivity of sacrifice layer 8 and air is: r=(1.3-1.0)
2/ (1.3+1.0)
2=1.7%;
Therefore, mask plate of the present invention finally through rate is; T=1-1.7%-0.5%-4%=93.2%.
That is, when the refractive index of sacrifice layer 8 material is 1.3, the transmittance of mask plate of the present invention adds 1.2% compared to the transmittance of mask plate of the prior art, namely has antireflective effect.
Certainly, sacrifice layer 8 material of the present embodiment is not unique, also can carry out many changes; As long as the refractive index of the material of this sacrifice layer 8 is 1 ~ 1.5, the transmitance of mask plate can be improved.
Certainly, be understandable that, the material of sacrifice layer 8 at least should have the advantage easily removed, and to make mask plate of the present invention when reclaiming, sacrifice layer 8 is easily etched removing.
The mask plate of the present embodiment, by the sacrifice layer 8 between substrate 1 and mask pattern 2, isolated mask figure 2 and substrate 1, thus improve mask plate after long-term use, in " ghost " phenomenon that substrate 1 surface produces after removing mask pattern 2, improve product yield; Because sacrifice layer 8 is set to cover whole substrate 1, therefore, only need to carry out primary depositing technique, do not need to etch this sacrifice layer 8, preparation process can be simplified to a great extent; And mask plate of the present invention is compared to the mask plate of prior art, the cost of increase is not high, and technological process is also very simple, effectively can also increase the transmitance of mask plate.
Embodiment 3:
As shown in Figure 6, the present embodiment provides a kind of mask plate, and this mask plate comprises substrate 1 and arranges mask pattern 2 on substrate 1, wherein, between substrate 1 and mask pattern 2, is also provided with sacrifice layer 8, sacrifice layer 8 for by mask pattern 2 and substrate 1 isolated.
In the present embodiment, the material of substrate 1 is described for glass, and certainly, the material of the substrate 1 of mask plate of the present invention is not limited thereto.
Preferably, sacrifice layer 8 is identical with the figure of mask pattern 2.
Preferably, the material of sacrifice layer 8 comprises transparent material or nonmetallic materials.
The mask plate that the present embodiment provides, the existence of the sacrifice layer 8 made owing to having transparent material or nonmetallic materials, when reclaiming, can not retain " ghost " figure on the position of substrate 1; Meanwhile, because sacrifice layer 8 is identical with the figure of mask pattern 2, only unifiedly after having deposited sacrifice layer 8 and mask graph 2 successively need carry out etching, do not need secondarily etched, therefore, sacrifice layer 8 need not be removed separately, decrease technological process.
Preferably, the refractive index of sacrifice layer 8 is 1 ~ 1.5.Why so arrange, be that the material being 1 ~ 1.5 due to refractive index has certain antireflective effect, circular is as follows:
Reflectivity r=(n
1-n
2)
2/ (n
1+ n
2)
2, n is the refractive index of material, and the refractive index of air is 1.0, and the refractive index of glass is about 1.5, supposes that the refractive index of sacrifice layer 8 material is 1.3, and so, the substrate 1 of existing mask plate with the reflectivity of air is: r=(1.5-1.0)
2/ (1.5+1.0)
2=4%, therefore, existing mask plate finally through rate be; T=1-4%-4%=92%.
In like manner, mask plate of the present invention:
(1) reflectivity of substrate 1 and sacrifice layer 8 is: r=(1.5-1.3)
2/ (1.5+1.3)
2=0.5%;
(2) reflectivity of sacrifice layer 8 and air is: r=(1.3-1.0)
2/ (1.3+1.0)
2=1.7%;
Therefore, mask plate of the present invention finally through rate is; T=1-1.7%-0.5%-4%=93.2%.
That is, when the refractive index of sacrifice layer 8 material is 1.3, the transmittance of mask plate of the present invention adds 1.2% compared to the transmittance of mask plate of the prior art, namely has antireflective effect.
Certainly, sacrifice layer 8 material of the present embodiment is not unique, also can carry out many changes; As long as the refractive index of the material of this sacrifice layer 8 is 1 ~ 1.5, the transmitance of mask plate can be improved.
Obviously, the mask plate of above-described embodiment 2 or 3 also can carry out many changes; Such as: the material of sacrifice layer 8 is not limited in transparent material and nonmetallic materials, as long as the refractive index of the material of this sacrifice layer 8 is 1 ~ 1.5, and there is certain transmitance.
Embodiment 4:
As shown in Figure 7, as another embodiment, the present embodiment also provides a kind of preparation method of mask plate, and the method comprises: on substrate 1, form sacrifice layer 8 and mask pattern 2, sacrifice layer 8 between substrate 1 and mask pattern 2, sacrifice layer 8 for by mask pattern 2 and substrate 1 isolated.
Particularly, on substrate 1, sacrifice layer 8 is formed and mask pattern 2 comprises:
Step 101, on substrate 1, form sacrifice layer 8, sacrifice layer 8 covers whole substrate 1, as shown in Figure 8 A.
Step 102, on sacrifice layer 8, form mask pattern material layer, patterning processes is carried out to mask pattern material layer and forms mask pattern 2, as shown in Figure 8 B.
Why so arrange, being due to when sacrifice layer 8 is for covering whole substrate 1, only needing primary depositing technique, not needing to etch this sacrifice layer 8, can preparation process be made to a great extent simple and easy.
Certainly, as shown in Figure 7, also should comprise the step 103 forming framework 3 and film 4 in the preparation method of this mask plate, the structure of framework 3 and film 4 as shown in Figure 5, does not repeat them here.
Preferably, the material of sacrifice layer 8 comprises transparent material.Why so arranging, is because transparent material effectively can improve transmittance, and such as, this transparent material can be polyurethane or polymethylmethacrylate etc.
The preparation method of the mask plate that the present embodiment provides can be used for the mask plate preparing embodiment 2, see embodiment 2, can repeat no more the description of mask plate herein.
The preparation method of the mask plate that the present embodiment provides, owing to having prepared the sacrifice layer 8 of the easy removal of being made up of transparent material on substrate 1, when reclaiming, can not retain " ghost " figure on the position of substrate 1; Due to when sacrifice layer 8 is for covering whole substrate 1, only needs primary depositing technique, not needing to etch this sacrifice layer 8, can preparation process be made to a great extent simple and easy.Also assures that the transmitance of the mask plate prepared with the present embodiment method simultaneously.
Embodiment 5:
As shown in Figure 9, the present embodiment also provides a kind of preparation method of mask plate, the method comprises: on substrate 1, form sacrifice layer 8 and mask pattern 2, sacrifice layer 8 between substrate 1 and mask pattern 2, sacrifice layer 8 for by mask pattern 2 and substrate 1 isolated.Particularly, on substrate 1, sacrifice layer 8 is formed and mask pattern 2 comprises:
Step 201, on substrate 1, continuously form sacrifice layer 8 material layer and mask pattern material layer, as shown in Figure 10 A;
Step 202, sacrifice layer 8 material layer and mask pattern material layer carried out to patterning processes and form sacrifice layer 8 and mask pattern 2, as shown in Figure 10 B.
Why so arranging, is due to when sacrifice layer 8 is identical with the figure of mask pattern 2, only unifiedly after having deposited sacrifice layer 8 and mask graph 2 successively need carry out etching, does not need secondarily etched, preparation technology can be made easier.
Certainly, as shown in Figure 9, also should comprise the step 203 forming framework 3 and film 4 in the preparation method of this mask plate, the structure of framework 3 and film 4 as shown in Figure 6, does not repeat them here.
Preferably, the material of sacrifice layer 8 comprises transparent material or nonmetallic materials.
The preparation method of the mask plate that the present embodiment provides can be used for the mask plate preparing embodiment 3, see embodiment 3, can repeat no more the description of mask plate herein.
The preparation method of the mask plate that the present embodiment provides, owing to having prepared the sacrifice layer 8 of the easy removal of being made up of transparent material or nonmetallic materials on substrate 1, when reclaiming, can not retain " ghost " figure on the position of substrate 1; Simultaneously because mask graph 2 and sacrifice layer 8 can a step etch simultaneously, therefore, sacrifice layer 8 need not be removed separately, decrease technological process.Also assures that the transmitance of the mask plate prepared with the present embodiment method simultaneously.
Obviously, the preparation method of the mask plate of above-described embodiment 4,5 also can carry out many changes; Such as: the material of sacrifice layer 8 is not limited in transparent material and nonmetallic materials, or sacrifice layer 8 is not identical with the figure of mask graph 2.
Embodiment 6:
Present embodiments provide a kind of recovery method of mask plate, described mask plate is the arbitrary described mask plate of embodiment 1-3, and this recovery method comprises:
Remove mask pattern 2 and sacrifice layer 8.
The recovery method of the mask plate that the present embodiment provides, reclaims the mask plate of embodiment 1-3, removes mask pattern 2 and sacrifice layer 8.Because mask pattern 2 and substrate 1 are not directly contact, therefore, there is not " ghost " phenomenon in substrate 1 surface, ensure that product yield; In addition, the recovery method of the present embodiment, does not need glossing, does not also need the thickness reducing substrate 1, effectively can save cost recovery, and can realize the repeatedly recycling of mask plate.
Be understandable that, the illustrative embodiments that above embodiment is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a mask plate, is characterized in that, comprises substrate and arranges mask pattern on the substrate, wherein, between described substrate and described mask pattern, being also provided with sacrifice layer, described sacrifice layer be used for by described mask pattern and described substrate isolated.
2. mask plate according to claim 1, is characterized in that, described sacrifice layer covers whole substrate or described sacrifice layer is identical with the figure of described mask pattern.
3. mask plate according to claim 2, is characterized in that, the material of described sacrifice layer comprises transparent material.
4. mask plate according to claim 2, is characterized in that, when described sacrifice layer is identical with the figure of described mask pattern, the material of described sacrifice layer comprises nonmetallic materials.
5., according to the arbitrary described mask plate of Claims 1-4, it is characterized in that, the refractive index of described sacrifice layer is 1 ~ 1.5.
6. a preparation method for mask plate, is characterized in that, comprising:
On substrate, form sacrifice layer and mask pattern, described sacrifice layer between described substrate and described mask pattern, described sacrifice layer be used for by described mask pattern and described substrate isolated.
7. the preparation method of mask plate according to claim 6, is characterized in that, describedly on substrate, forms sacrifice layer and mask pattern comprises:
On described substrate, form sacrifice layer, described sacrifice layer covers whole substrate;
On described sacrifice layer, form mask pattern material layer, patterning processes is carried out to mask pattern material layer and forms mask pattern;
Or,
Sacrificial layer material layer and mask pattern material layer is formed continuously on described substrate;
Patterning processes is carried out to sacrificial layer material layer and mask pattern material layer and forms sacrifice layer and mask pattern.
8. the preparation method of mask plate according to claim 7, is characterized in that, the material of described sacrifice layer comprises transparent material.
9. the preparation method of mask plate according to claim 6, is characterized in that, forms sacrifice layer and mask pattern comprises when described on substrate:
Sacrificial layer material layer and mask pattern material layer is formed continuously on described substrate;
When carrying out patterning processes formation sacrifice layer and mask pattern to sacrificial layer material layer and mask pattern material layer, the material of described sacrifice layer comprises nonmetallic materials.
10. a recovery method for mask plate, is characterized in that, described mask plate is the mask plate described in claim 1 to 5 any one, and described recovery method comprises:
Remove described mask pattern and described sacrifice layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510434545.8A CN104932194A (en) | 2015-07-22 | 2015-07-22 | Mask plate, manufacturing method thereof, and recycling method of mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510434545.8A CN104932194A (en) | 2015-07-22 | 2015-07-22 | Mask plate, manufacturing method thereof, and recycling method of mask plate |
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| CN104932194A true CN104932194A (en) | 2015-09-23 |
Family
ID=54119419
Family Applications (1)
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|---|---|---|---|
| CN201510434545.8A Pending CN104932194A (en) | 2015-07-22 | 2015-07-22 | Mask plate, manufacturing method thereof, and recycling method of mask plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109491198A (en) * | 2018-11-16 | 2019-03-19 | 合肥鑫晟光电科技有限公司 | A kind of mask plate and preparation method thereof, recovery method |
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Application publication date: 20150923 |
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