CN104918470B - A kind of heat abstractor - Google Patents
A kind of heat abstractor Download PDFInfo
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- CN104918470B CN104918470B CN201510388505.4A CN201510388505A CN104918470B CN 104918470 B CN104918470 B CN 104918470B CN 201510388505 A CN201510388505 A CN 201510388505A CN 104918470 B CN104918470 B CN 104918470B
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- face
- heat sink
- bottom plate
- heat
- radiating bottom
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Abstract
The invention provides a kind of heat abstractor, belong to radiating device technical field, including a radiating bottom plate, radiating bottom plate includes upper surface, lower surface, the first face, the second face, the 3rd face, fourth face, the 5th face, the 6th face, the 7th face and octahedral, first face be arranged in parallel with the 5th face, and the 3rd face be arranged in parallel with the 7th face；The upper surface of radiating bottom plate is provided with a groove, and groove runs through the upper surface of radiating bottom plate；The first otch and the second otch are provided with the intermediate layer of radiating bottom plate；The lower surface of radiating bottom plate is parallel to be provided with the first heat sink and the second heat sink, the width of first heat sink and the equal length in the 3rd face, the width of second heat sink and the equal length in the 7th face, the longer side face of the first heat sink is oppositely arranged with the longer side face of the second heat sink.The present invention is simple in construction, reasonable in design, and installation, convenient disassembly, rate of heat dissipation are high, can distribute the heat of reflecting silicon surface in time, and rate of heat dissipation is high, can extend the service life of reflection silicon.
Description
Technical field
The present invention relates to radiating device technical field, specifically a kind of heat abstractor.
Background technology
It is well known that being all frangible, such as silicon for the material for making infrared optical element.No matter they are monocrystal
Or polycrystal, it is small greatly that no matter crystal grain, which is, and their intensity is not so good as glass, bears logical from high-energy throughput light without long-term method
Irradiation.Because high-energy throughput light has very high heat, for reflect the reflecting silicon surface of the infrared light will certainly accumulate it is very high
Heat, if heat can not be distributed in time, it is easy to cause reflection silicon rupture.Accordingly, it would be desirable to which developing one kind is used for
The heat of reflecting silicon surface is distributed in time, rate of heat dissipation is high, the heat abstractor of the service life of reflection silicon can be extended.
The content of the invention
The problem to be solved in the present invention is：The deficiencies in the prior art are overcome there is provided one kind is simple in construction, reasonable in design, peace
Dress, convenient disassembly, rate of heat dissipation are high, can distribute the heat of reflecting silicon surface in time, and rate of heat dissipation is high, can extend reflection
The heat abstractor of silicon service life.
In order to solve the above technical problems, the technical solution adopted by the present invention is：A kind of heat abstractor, including a radiating bottom
Plate, the radiating bottom plate includes upper surface, lower surface and the first face around upper and lower surface, the second face, the 3rd
Face, fourth face, the 5th face, the 6th face, the 7th face and octahedral, first face be arranged in parallel with the 5th face, the 3rd face
It is be arranged in parallel with the 7th face；
The upper surface of the radiating bottom plate is provided with a groove, and the groove runs through the upper surface of radiating bottom plate；
The first otch and the second otch are provided with the intermediate layer of the radiating bottom plate, first otch is by radiating bottom plate
The first face, the second face and octahedral are extended in intermediate layer, second otch extends to the 4th by the intermediate layer of radiating bottom plate
Face, the 5th face and the 6th face；
The lower surface of the radiating bottom plate is parallel to be provided with the first heat sink and the second heat sink, the one of first heat sink
Hold as vertical plane one, the other end is scarf one, and one end of the vertical plane one of first heat sink is located on the 3rd face, described
One end of second heat sink is vertical plane two, and the other end is scarf two, one end position of the vertical plane two of second heat sink
In on the 7th face.
Further, the equal length in the width of first heat sink and the 3rd face, the width of second heat sink
With the equal length in the 7th face.
Further, the longer side face of first heat sink is oppositely arranged with the longer side face of the second heat sink.
Further, the distance between described first heat sink and the second heat sink are 13.4mm.
Further, the height of first heat sink is 20.0mm, the length of the shorter side of first heat sink
For 37.5mm, the length in longer side face is 47.5mm, and the height of second heat sink is 20.0mm, second heat sink
The length of shorter side is 46.0mm, and the length in longer side face is 56.0mm.
Further, the thickness of the radiating bottom plate is 20.0mm, and the length in first face and the 5th face is 51.0mm,
The distance between first face and the 5th face are 47.0mm, and the length in the 3rd face and the 7th face is 6.0mm, the described 3rd
The distance between face and the 7th face are 126.0mm.
Further, the depth of the groove is 2.0mm, and the distance in first face of back gauge of the groove is 10.8mm,
Distance of the another side of the groove away from the 5th face is 10.8mm.
Further, the height of first otch is 2.4mm, and width is 15.0mm, and the height of second otch is
2.4mm, width is 15.0mm.
Further, the distance of first otch and the second otch apart from the upper surface of radiating bottom plate is 8.3mm.
Further, the material of the radiating bottom plate, the first heat sink and the second heat sink is silicon.
The present invention has the advantages and positive effects of：
The present invention is simple in construction, reasonable in design, and installation, convenient disassembly, rate of heat dissipation are high, can be by the heat of reflecting silicon surface
Distribute in time, rate of heat dissipation is high, the service life of reflection silicon can be extended.
Brief description of the drawings
Fig. 1 is the structural representation of heat abstractor of the present invention.
Fig. 2 is the front view of heat abstractor of the present invention.
Fig. 3 is the top view of heat abstractor of the present invention.
In figure：1st, radiating bottom plate；2nd, upper surface；3rd, lower surface；4th, the first face；5th, the second face；6th, the 3rd face；7th, the 4th
Face；8th, the 5th face；9th, the 6th face；10th, the 7th face；11st, octahedral；12nd, groove；13rd, the first otch；14th, the second otch；15、
First heat sink；16th, the second heat sink；17th, vertical plane one；18th, scarf one；19th, vertical plane two；20th, scarf two.
Embodiment
As Figure 1-3, a kind of heat abstractor, including a radiating bottom plate 1, radiating bottom plate 1 include upper surface 2, lower surface 3
And the first face 4 around upper surface 2 and lower surface 3, the second face 5, the 3rd face 6, fourth face 7, the 5th face 8, the 6th face 9,
7th face 10 and octahedral 11, the first face 4 be arranged in parallel with the 5th face 8, and the 3rd face 6 be arranged in parallel with the 7th face 10, bottom of radiating
The thickness of plate 1 is 20.0mm, and the length in the first face 4 and the 5th face 8 is 51.0mm, and the distance between the first face 4 and the 5th face 8 are
The length in 47.0mm, the 3rd face 6 and the 7th face 10 is 6.0mm, and the distance between the 3rd face 6 and the 7th face 10 are 126.0mm；
The upper surface 2 of radiating bottom plate 1 is provided with a groove 12, and groove 12 runs through the upper surface 2 of radiating bottom plate 1, groove 12
Depth is 2.0mm, and the distance in first face of back gauge 4 of groove 12 is 10.8mm, distance of the another side away from the 5th face 8 of groove 12
For 10.8mm；
The first otch 13 and the second otch 14 are provided with the intermediate layer of radiating bottom plate 1, the first otch 13 is by radiating bottom plate 1
The first face 4, the second face 5 and octahedral 11 are extended in intermediate layer, the second otch 14 extends to by the intermediate layer of radiating bottom plate 1
7, the 5th face 8 and the 6th face 9 on four sides, the height of the first otch 13 is 2.4mm, and width is 15.0mm, the height of the second otch 14
For 2.4mm, width is 15.0mm, and the distance of the first otch 13 and the second otch 14 apart from the upper surface 2 of radiating bottom plate 1 is
8.3mm；
The lower surface 3 of radiating bottom plate 1 is parallel to be provided with the first heat sink 15 and the second heat sink 16, the one of the first heat sink 15
Hold as vertical plane 1, the other end is scarf 1, one end of the vertical plane 1 of the first heat sink 15 is located at the 3rd face 6
On, one end of the second heat sink 16 is vertical plane 2 19, and the other end is scarf 2 20, the vertical plane 2 19 of the second heat sink 16
One end be located at the 7th face 10 on, the longer side face of the first heat sink 15 and the longer side face of the second heat sink 16 are oppositely arranged,
The distance between first heat sink 15 and the second heat sink 16 are 13.4mm, and the height of the first heat sink 15 is 20.0mm, width
For 6.0mm, the length of the shorter side of the first heat sink 15 is 37.5mm, and the length in longer side face is 47.5mm, the second radiating
The height of plate 16 is 20.0mm, and width is 6.0mm, and the length of the shorter side of the second heat sink 16 is 46.0mm, longer side face
Length be 56.0mm；
The material of radiating bottom plate 1, the first heat sink 15 and the second heat sink 16 is silicon.
The course of work of this example：In use, heat abstractor is fixed on reflection silicon, reflection silicon is set to be connect with heat abstractor
Touch, after the reflected silicon face reflection of high-energy throughput light, very high heat will certainly be accumulated, if heat can not be given out in time
Go, it is easy to cause reflection silicon rupture.Heat abstractor can quickly conduct heat, and the heat of reflecting silicon surface is timely
Distribute, rate of heat dissipation is high, the heat abstractor of the service life of reflection silicon can be extended.
Embodiments of the invention are described in detail above, but the content is only the preferred embodiments of the present invention, no
The practical range for limiting the present invention can be considered as.Any changes and modifications in accordance with the scope of the present application,
Within the patent covering scope that the present invention should still be belonged to.
Claims (10)
1. a kind of heat abstractor, it is characterised in that：Including a radiating bottom plate, the radiating bottom plate include upper surface, lower surface and
The first face, the second face, the 3rd face, fourth face, the 5th face, the 6th face, the 7th face around upper and lower surface and
Octahedral, first face be arranged in parallel with the 5th face, and the 3rd face be arranged in parallel with the 7th face；
The upper surface of the radiating bottom plate is provided with a groove, and the groove runs through the upper surface of radiating bottom plate；
The first otch and the second otch are provided with the intermediate layer of the radiating bottom plate, first otch is by the centre of radiating bottom plate
The first face, the second face and octahedral are extended in layer, and second otch extends to fourth face, the by the intermediate layer of radiating bottom plate
Five faces and the 6th face；
The lower surface of the radiating bottom plate is parallel to be provided with the first heat sink and the second heat sink, and one end of first heat sink is
Vertical plane one, the other end is scarf one, and one end of the vertical plane one of first heat sink is located on the 3rd face, described second
One end of heat sink is vertical plane two, and the other end is scarf two, and one end of the vertical plane two of second heat sink is located at the
On seven faces.
2. a kind of heat abstractor according to claim 1, it is characterised in that：The width of first heat sink and the 3rd face
Equal length, the width of second heat sink and the equal length in the 7th face.
3. a kind of heat abstractor according to claim 1, it is characterised in that：The longer side face of first heat sink and the
The longer side face of two heat sinks is oppositely arranged.
4. a kind of heat abstractor according to claim 1, it is characterised in that：First heat sink and the second heat sink it
Between distance be 13.4mm.
5. a kind of heat abstractor according to claim 1, it is characterised in that：The height of first heat sink is
20.0mm, the length of the shorter side of first heat sink is 37.5mm, and the length in longer side face is 47.5mm, described second
The height of heat sink is 20.0mm, and the length of the shorter side of second heat sink is 46.0mm, and the length in longer side face is
56.0mm。
6. a kind of heat abstractor according to claim 1, it is characterised in that：The thickness of the radiating bottom plate is 20.0mm,
The length in first face and the 5th face is 51.0mm, and the distance between first face and the 5th face are 47.0mm, described the
The length in three faces and the 7th face is 6.0mm, and the distance between the 3rd face and the 7th face are 126.0mm.
7. a kind of heat abstractor according to claim 1, it is characterised in that：The depth of the groove is 2.0mm, described recessed
The distance in one the first face of back gauge of groove is 10.8mm, and distance of the another side away from the 5th face of the groove is 10.8mm.
8. a kind of heat abstractor according to claim 1, it is characterised in that：The height of first otch is 2.4mm, wide
Spend for 15.0mm, the height of second otch is 2.4mm, and width is 15.0mm.
9. a kind of heat abstractor according to claim 1, it is characterised in that：First otch and the second otch distance dissipates
The distance of the upper surface of hot bottom plate is 8.3mm.
10. a kind of heat abstractor according to claim 1, it is characterised in that：The radiating bottom plate, the first heat sink and
The material of two heat sinks is silicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510388505.4A CN104918470B (en) | 2015-07-03 | 2015-07-03 | A kind of heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510388505.4A CN104918470B (en) | 2015-07-03 | 2015-07-03 | A kind of heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104918470A CN104918470A (en) | 2015-09-16 |
| CN104918470B true CN104918470B (en) | 2017-10-13 |
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ID=54087030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510388505.4A Active CN104918470B (en) | 2015-07-03 | 2015-07-03 | A kind of heat abstractor |
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| Country | Link |
|---|---|
| CN (1) | CN104918470B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202197478U (en) * | 2011-08-25 | 2012-04-18 | 杭州三海电子有限公司 | High-power device installing body |
| CN103094467A (en) * | 2012-12-19 | 2013-05-08 | 中国兵器科学研究院 | Single-plate natural cooling multi-superluminesent diode (SLD) heat dissipation installation plate and test board |
| CN104604353A (en) * | 2012-09-07 | 2015-05-06 | Lg伊诺特有限公司 | Heat radiation member, heat radiation circuit board, and heat emission device package |
| CN204741658U (en) * | 2015-07-03 | 2015-11-04 | 天津众晶半导体材料有限公司 | Radiator part |
-
2015
- 2015-07-03 CN CN201510388505.4A patent/CN104918470B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202197478U (en) * | 2011-08-25 | 2012-04-18 | 杭州三海电子有限公司 | High-power device installing body |
| CN104604353A (en) * | 2012-09-07 | 2015-05-06 | Lg伊诺特有限公司 | Heat radiation member, heat radiation circuit board, and heat emission device package |
| CN103094467A (en) * | 2012-12-19 | 2013-05-08 | 中国兵器科学研究院 | Single-plate natural cooling multi-superluminesent diode (SLD) heat dissipation installation plate and test board |
| CN204741658U (en) * | 2015-07-03 | 2015-11-04 | 天津众晶半导体材料有限公司 | Radiator part |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104918470A (en) | 2015-09-16 |
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Denomination of invention: A heat dissipation device Effective date of registration: 20210908 Granted publication date: 20171013 Pledgee: Tianjin Kerong Financing Guarantee Co.,Ltd. Pledgor: TIANJIN ZHONGJING SEMICONDUCTOR MATERIAL Co.,Ltd. Registration number: Y2021120000042 |
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Date of cancellation: 20221031 Granted publication date: 20171013 Pledgee: Tianjin Kerong Financing Guarantee Co.,Ltd. Pledgor: TIANJIN ZHONGJING SEMICONDUCTOR MATERIAL Co.,Ltd. Registration number: Y2021120000042 |