CN104914373A - SLD device reliability evaluation method - Google Patents

SLD device reliability evaluation method Download PDF

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Publication number
CN104914373A
CN104914373A CN201510330182.3A CN201510330182A CN104914373A CN 104914373 A CN104914373 A CN 104914373A CN 201510330182 A CN201510330182 A CN 201510330182A CN 104914373 A CN104914373 A CN 104914373A
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sld device
failure
sld
thermistor
parameter
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CN104914373B (en
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史典阳
李海军
聂国建
任艳
周军连
于迪
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Fifth Electronics Research Institute of Ministry of Industry and Information Technology
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Fifth Electronics Research Institute of Ministry of Industry and Information Technology
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Abstract

The invention relates to an SLD device reliability evaluation method which comprises the following steps: obtaining basic failure rate and temperature coefficient of a die in an SLD device, and converting the product of the basic failure rate and the temperature coefficient of the die into failure parameters of the die; obtaining coupling failure rate of an optical fiber welding spot in the SLD device and generating failure parameters of the optical fiber welding spot; obtaining basic failure rate of a refrigerator in the SLD device and generating failure parameters of the refrigerator; obtaining basic failure rate and temperature coefficient of a thermistor in the SLD device and converting twice of the product of the basic failure rate and the temperature coefficient of the thermistor into the failure parameters of the thermistor; converting the failure parameters of the die, the failure parameters of the optical fiber welding spot, the failure parameters of the refrigerator and the failure parameters of the thermistor into the failure parameters of the SLD device; and carrying out reliability evaluation according to the failure parameters of the SLD device. According to the SLD device reliability evaluation method, the reliability of the SLD device can be evaluated precisely.

Description

SLD device reliability appraisal procedure
Technical field
The present invention relates to electron device detection technique field, particularly relate to a kind of SLD device reliability appraisal procedure.
Background technology
Super-radiance light emitting diode (SLD) is a kind of semiconductor light sources between laser diode (LD) and light emitting diode (LED), meets the high-output power required by optical fibre gyro and short-phase dry length.
Along with weaponry develops to high reliability, super-radiance light emitting diode (SLD) is novel as the one of weaponry, critical electronic components and parts, the safe handling of its reliability level to weaponry has material impact, current SLD reliability is relatively weak in weaponry, therefore carries out reliability prediction research to it very necessary.At present still not for the Reliability Evaluation Model of SLD device, in a particular application, generally directly apply mechanically the Reliability Evaluation Model of laser diode (LD).
Consider the significant impact of reliability to weaponry of SLD device, the reliability prediction model of SLD effectively must reflect its real reliability level, and SLD is as the components and parts of a component-level, its inside comprises various composition device, and existing LD reliability prediction model by device as a whole, give a basic failure rate, cannot reflect that the composition device of different model in SLD device is on the impact of SLD device reliability like this, therefore, there is relatively large deviation in the true and reliable property of Reliability Evaluation Model to assessment result and SLD device that SLD device carries out reliability assessment of directly applying mechanically laser diode LD.
Summary of the invention
Based on this, be necessary the problem that there is relatively large deviation for the true and reliable property of Reliability Evaluation Model to assessment result and SLD device that SLD device carries out reliability assessment of directly applying mechanically laser diode LD, a kind of SLD device reliability appraisal procedure is provided.
A kind of SLD device reliability appraisal procedure, comprises the following steps:
Obtain basic failure rate and the temperature coefficient of tube core in SLD device, and the product of the temperature coefficient of the basic failure rate of described tube core and described tube core is converted to the failure parameter of described tube core;
Obtain the coupling crash rate of described SLD device inner fiber solder joint, generate the failure parameter of described optical fiber solder joint;
Obtain the basic failure rate of refrigerator in described SLD device, generate the failure parameter of described refrigerator;
Obtain basic failure rate and the temperature coefficient of thermistor in described SLD device, and be converted to the failure parameter of described thermistor by 2 times of the product of the temperature coefficient of the basic failure rate of described thermistor and described thermistor;
The failure parameter of the failure parameter of described tube core, the failure parameter of described optical fiber solder joint, the failure parameter of described refrigerator and described thermistor is converted to the failure parameter of described SLD device;
The reliability of failure parameter to described SLD device according to described SLD device is assessed.
Above-mentioned SLD device reliability appraisal procedure, obtain the failure parameter of the failure parameter of tube core in SLD device, the failure parameter of optical fiber solder joint, the failure parameter of refrigerator and thermistor, the failure parameter of the failure parameter of described tube core, the failure parameter of described optical fiber solder joint, the failure parameter of described refrigerator and described thermistor is converted to the failure parameter of described SLD device; The reliability of failure parameter to described SLD device according to described SLD device is assessed, can reflect that the composition device of different model in SLD device is on the impact of SLD device reliability, ensure that integrality and the accuracy of reliability assessment result, and simple and direct efficient, engineering practicability strong, can reflect again the main integrity problem that Present Domestic SLD device exists simultaneously.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of SLD device reliability appraisal procedure first embodiment of the present invention;
Fig. 2 is the schematic flow sheet of SLD device reliability appraisal procedure second embodiment of the present invention.
Embodiment
Although the step in the present invention arranges with label, and be not used in and limit the precedence of step, the order of step or the execution of certain step need based on other steps unless expressly stated, otherwise the relative rank of step is adjustable.
Refer to Fig. 1, Fig. 1 is the schematic flow sheet of SLD device reliability appraisal procedure first embodiment of the present invention.
SLD device reliability appraisal procedure described in present embodiment, can comprise the following steps:
Step S101, obtains basic failure rate and the temperature coefficient of tube core in SLD device, and the product of the temperature coefficient of the basic failure rate of described tube core and described tube core is converted to the failure parameter of described tube core.
Step S102, obtains the coupling crash rate of described SLD device inner fiber solder joint, generates the failure parameter of described optical fiber solder joint.
Step S103, obtains the basic failure rate of refrigerator in described SLD device, generates the failure parameter of described refrigerator.
Step S104, obtains basic failure rate and the temperature coefficient of thermistor in described SLD device, and is converted to the failure parameter of described thermistor by 2 times of the product of the temperature coefficient of the basic failure rate of described thermistor and described thermistor.
Step S105, is converted to the failure parameter of described SLD device by the failure parameter of the failure parameter of described tube core, the failure parameter of described optical fiber solder joint, the failure parameter of described refrigerator and described thermistor.
Step S106, the reliability of failure parameter to described SLD device according to described SLD device is assessed.
Present embodiment, obtain the failure parameter of the failure parameter of tube core in SLD device, the failure parameter of optical fiber solder joint, the failure parameter of refrigerator and thermistor, the failure parameter of the failure parameter of described tube core, the failure parameter of described optical fiber solder joint, the failure parameter of described refrigerator and described thermistor is converted to the failure parameter of described SLD device; The reliability of failure parameter to described SLD device according to described SLD device is assessed, can reflect that the composition device of different model in SLD device is on the impact of SLD device reliability, ensure that integrality and the accuracy of reliability assessment result, and simple and direct efficient, engineering practicability strong, can reflect again the main integrity problem that Present Domestic SLD device exists simultaneously.
Wherein, for step S101, preferably, the basic failure rate of tube core is 3.3x10 -7, the temperature coefficient of tube core is the Thermal Stress Coefficient of tube core, changes with the change of environment temperature.
In one embodiment, obtain the basic failure rate of tube core and the step of temperature coefficient in SLD device to comprise the following steps:
Detect the environment temperature of described tube core.
According to the corresponding relation between the Thermal Stress Coefficient of the environment temperature preset and tube core, generating with the Thermal Stress Coefficient corresponding to environment temperature of detection is the temperature coefficient of described tube core.
Preferably, the scope of the environment temperature of detection is 0 degree Celsius to 125 degrees Celsius.
Further, the Thermal Stress Coefficient of tube core is as shown in table 1:
The Thermal Stress Coefficient of table 1 tube core:
Environment temperature (DEG C) π T1 Environment temperature (DEG C) π T1
0 0.09847 65 19.99672
5 0.161856 70 27.68495
10 0.261413 75 37.97246
15 0.415236 80 51.61861
20 0.649239 85 69.56958
25 1 90 92.99548
30 1.518463 95 123.333
35 2.274673 100 162.3339
40 3.363768 105 212.1204
45 4.91349 110 275.2469
50 7.093479 115 354.7696
55 10.12667 120 454.324
60 14.30313 125 578.2106
Wherein, π t1for Thermal Stress Coefficient.
For step S102, preferably, the coupling crash rate of optical fiber solder joint is relevant to solder joint technique, can be 5x10 -8.
For step S103, preferably, the basic failure rate of refrigerator can be 4.9x10 -9.
For step S104, preferably, the basic failure rate of thermistor is 4.5x10 -8, the temperature coefficient of thermistor is the Thermal Stress Coefficient of tube core, changes with the change of environment temperature.
In one embodiment, obtain the basic failure rate of thermistor and the step of temperature coefficient in described SLD device to comprise the following steps:
Detect the environment temperature of described thermistor.
According to the corresponding relation between the Thermal Stress Coefficient of the environment temperature preset and thermistor, generating with the Thermal Stress Coefficient corresponding to environment temperature of detection is the temperature coefficient of described thermistor.
Preferably, the scope of the environment temperature of detection can be 25 degrees Celsius to 125 degrees Celsius.
Further, the temperature coefficient of thermistor is as shown in table 2:
The temperature coefficient of table 2 thermistor:
For step S105, preferably, directly the summation of the failure parameter of the failure parameter of described tube core, the failure parameter of described optical fiber solder joint, the failure parameter of described refrigerator and described thermistor can be converted to the failure parameter of described SLD device, in other embodiments, the failure parameter of described SLD device also can be converted to by the other technologies means that those skilled in the art are usual.
In one embodiment, the failure parameter of the failure parameter of described tube core, the failure parameter of described optical fiber solder joint, the failure parameter of described refrigerator and described thermistor can be substituted into following Reliability Evaluation Model formula, be converted to the failure parameter of described SLD device:
λ ptube core+ λ coupling+ λ tEC+ 2 λ r;
λ tube core01π t1;
λ R=λ 04λ T4
Wherein, λ 01for the basic failure rate of tube core, π t1for the temperature coefficient of tube core, λ tube corefor the failure parameter of tube core, λ couplingfor the failure parameter of optical fiber solder joint, λ tECfor the failure parameter of refrigerator, λ 04for the basic failure rate of thermistor, π t4for the temperature coefficient of thermistor, 2 λ rfor the failure parameter of thermistor, λ pfor the failure parameter of SLD device.
For step S106, preferably, can the failure parameter of described SLD device less, the reliability of described SLD device is higher.The height of the reliability of described SLD device can be assessed according to the size of the failure parameter of described SLD device.
Refer to Fig. 2, Fig. 2 is the schematic flow sheet of SLD device reliability appraisal procedure second embodiment of the present invention.
SLD device reliability appraisal procedure described in present embodiment and the difference of the first embodiment are: comprise the following steps according to the step that the reliability of failure parameter to described SLD device of described SLD device is assessed:
Step S201, according to the corresponding relation between the failure parameter preset and dependability parameter, obtains the dependability parameter corresponding with the failure parameter of described SLD device.
Step S202, assesses the reliability class of described SLD device according to described dependability parameter.
Present embodiment, according to the corresponding relation between the failure parameter preset and dependability parameter, obtain the dependability parameter corresponding with the failure parameter of described SLD device, carry out the reliability class assessment of described SLD device, accurately directly can provide the assessment result of SLD device further.
Preferably, can by the failure parameter normalization of described SLD device, using 1 with the difference of normalization result as described dependability parameter.Reliability class can comprise high, medium and low three ranks.
SLD device reliability appraisal procedure of the present invention, can reflect the reliability level of domestic SLD device truly, meanwhile, because appraisal procedure is succinct, has good applicability and practicality.Can be China SLD component failure rate level and reliability prediction provides foundation, also for determining its reliability index, reliability assessment and the expectation of carrying out weapon electronics of new generation provide foundation, solve the difficult problem estimated domestic SLD device reliability, have filled up domestic blank.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this instructions is recorded.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (10)

1. a SLD device reliability appraisal procedure, is characterized in that, comprises the following steps:
Obtain basic failure rate and the temperature coefficient of tube core in SLD device, and the product of the temperature coefficient of the basic failure rate of described tube core and described tube core is converted to the failure parameter of described tube core;
Obtain the coupling crash rate of described SLD device inner fiber solder joint, generate the failure parameter of described optical fiber solder joint;
Obtain the basic failure rate of refrigerator in described SLD device, generate the failure parameter of described refrigerator;
Obtain basic failure rate and the temperature coefficient of thermistor in described SLD device, and be converted to the failure parameter of described thermistor by 2 times of the product of the temperature coefficient of the basic failure rate of described thermistor and described thermistor;
The failure parameter of the failure parameter of described tube core, the failure parameter of described optical fiber solder joint, the failure parameter of described refrigerator and described thermistor is converted to the failure parameter of described SLD device;
The reliability of failure parameter to described SLD device according to described SLD device is assessed.
2. SLD device reliability appraisal procedure according to claim 1, is characterized in that, obtains the basic failure rate of tube core and the step of temperature coefficient in SLD device and comprises the following steps:
Detect the environment temperature of described tube core;
According to the corresponding relation between the Thermal Stress Coefficient of the environment temperature preset and tube core, generating with the Thermal Stress Coefficient corresponding to environment temperature of detection is the temperature coefficient of described tube core.
3. SLD device reliability appraisal procedure according to claim 2, is characterized in that, the scope of the environment temperature of detection is 0 degree Celsius to 125 degrees Celsius.
4. SLD device reliability appraisal procedure according to claim 1, is characterized in that, obtains the basic failure rate of thermistor and the step of temperature coefficient in described SLD device and comprises the following steps:
Detect the environment temperature of described thermistor;
According to the corresponding relation between the Thermal Stress Coefficient of the environment temperature preset and thermistor, generating with the Thermal Stress Coefficient corresponding to environment temperature of detection is the temperature coefficient of described thermistor.
5. SLD device reliability appraisal procedure according to claim 4, is characterized in that, the scope of the environment temperature of detection is 25 degrees Celsius to 125 degrees Celsius.
6. SLD device reliability appraisal procedure according to claim 1, is characterized in that, the basic failure rate of described tube core is 3.3x10 -7.
7. SLD device reliability appraisal procedure according to claim 1, is characterized in that, the coupling crash rate of described optical fiber solder joint is 5x10 -8.
8. SLD device reliability appraisal procedure according to claim 1, is characterized in that, the basic failure rate of described refrigerator is 4.9x10 -9.
9. SLD device reliability appraisal procedure according to claim 1, is characterized in that, the crash rate of described thermistor is 4.5x10 -8.
10. SLD device reliability appraisal procedure as claimed in any of claims 1 to 9, is characterized in that, comprises the following steps according to the step that the reliability of failure parameter to described SLD device of described SLD device is assessed:
According to the corresponding relation between the failure parameter preset and dependability parameter, obtain the dependability parameter corresponding with the failure parameter of described SLD device;
The reliability class of described SLD device is assessed according to described dependability parameter.
CN201510330182.3A 2015-06-15 2015-06-15 SLD device reliability appraisal procedures Active CN104914373B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020753A (en) * 1993-05-13 2000-02-01 Mitsubishi Denki Kabushiki Kaisha TFT and reliability evaluation method thereof
JP2001308156A (en) * 2000-04-25 2001-11-02 Fujitsu Ltd Method for testing semiconductor device
JP3626161B2 (en) * 2002-09-12 2005-03-02 ダイトロンテクノロジー株式会社 Device for measuring operating characteristics of electronic elements
CN201853943U (en) * 2010-11-04 2011-06-01 美泰普斯光电科技(大连)有限公司 Aging test control system for semiconductor lasers
CN204008908U (en) * 2014-07-23 2014-12-10 北京光电技术研究所 Semiconductor laser detection device, system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020753A (en) * 1993-05-13 2000-02-01 Mitsubishi Denki Kabushiki Kaisha TFT and reliability evaluation method thereof
JP2001308156A (en) * 2000-04-25 2001-11-02 Fujitsu Ltd Method for testing semiconductor device
JP3626161B2 (en) * 2002-09-12 2005-03-02 ダイトロンテクノロジー株式会社 Device for measuring operating characteristics of electronic elements
CN201853943U (en) * 2010-11-04 2011-06-01 美泰普斯光电科技(大连)有限公司 Aging test control system for semiconductor lasers
CN204008908U (en) * 2014-07-23 2014-12-10 北京光电技术研究所 Semiconductor laser detection device, system

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