CN104911640A - Electroplating liquid for electroplating treatment - Google Patents
Electroplating liquid for electroplating treatment Download PDFInfo
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- CN104911640A CN104911640A CN201510333911.0A CN201510333911A CN104911640A CN 104911640 A CN104911640 A CN 104911640A CN 201510333911 A CN201510333911 A CN 201510333911A CN 104911640 A CN104911640 A CN 104911640A
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Abstract
The invention discloses an electroplating liquid for an electroplating treatment. The electroplating liquid is prepared from the following raw material components in parts: 20-25 parts of nickel oxide, 15-20 parts of zinc sulphate, 10-12 parts of aluminium sulphate, 13-15 parts of stannous sulphate, 10-12 parts of manganese sulphate, 3-5 parts of 1,4-bis(phenylacetenyl) benzene, 3-4 parts of dipolyphenyl propargyl ether, 2-3 parts of sodium benzoate, 10-20 parts of oxalic acid, 8-10 parts of potassium fluoborate, 6-8 parts of potassium fluotitanate, 5-6 parts of hydrofluoric acid, 5-8 parts of sodium fluosilicate, 3-5 parts of lead acetate, 10-15 parts of cobalt acetate, 10-12 parts of zinc acetate, 10-15 parts of ethylene glycol monomethyl ether, 3-5 parts of triethylene glycol, 2-4 parts of sodium tripolyphosphate, 3-5 parts of sodium hexametaphosphate, 3-5 parts of sodium pyrophosphate and 8-10 parts of silicone oil. The electroplating liquid for the electroplating treatment is good in corrosion resistance and wear resistance, capable of effectively preventing copper atoms from diffusing to an electrolyte during a use process and reducing waste, fast in precipitation speed, wide in current density range, low in electric energy consumption, good in electroplating quality, and capable of prolonging the service lives of metal copper wires.
Description
Technical field
The present invention relates to a kind of technical field of electroplate liquid, particularly relate to a kind of electroplating processes electroplate liquid.
Background technology
Plating is exactly the process utilizing electrolysis principle to plate other metal or alloy of skim on some metallic surface, be utilize electrolytic action to make the technique of the surface attachment layer of metal film of metal or other materials making thus play to prevent corrosion, improve the effects such as wear resistance, electroconductibility, reflective and having improved aesthetic appearance.
At present, when carrying out silver-plated process, although silver layer has stronger corrosion resistance, but long-term exposure is in air, silver-coated copper wire surface is easy to work with the sulfide in air, halogenide etc., causes surface variable color comprehensively, not only destroys outward appearance, with contact resistance increase constantly, brazing property degenerates.The essence of silvered film variable color is surface ionizing, if coating purity is inadequate, the impurity such as zinc, iron, copper containing trace, forms corrosion microbattery, accelerate the ionization process of silver on surface; If silvered film surface irregularity porous, more easily condense moisture and enter corrosive medium and cause silvered film variable color.
Summary of the invention
The object of the invention is to overcome the upper existing shortcoming stating prior art, a kind of electroplating processes electroplate liquid is provided, this electroplating processes electroplate liquid has good erosion resistance, wear resistance, in use effectively prevent copper atom from spreading to electrolytic solution, cut the waste, sedimentation speed is fast simultaneously, current density range is wide, power consumption is low, and electroplating quality is good, improves the work-ing life of copper lines.
The technical solution adopted for the present invention to solve the technical problems is: a kind of electroplating processes electroplate liquid, be made up of the feed composition of following number: 20-25 part nickel oxide, 15-20 part zinc sulfate, 10-12 part Tai-Ace S 150, 13-15 part stannous sulfate, 10-12 part manganous sulfate, 3-5 part 1, two (phenylene-ethynylene) benzene of 4-, 3-4 part two polyphenylene propargyl ether, 2-3 part Sodium Benzoate, 10-20 part oxalic acid, 8-10 part potassium fluoborate, 6-8 part potassium fluotitanate, 5-6 part hydrofluoric acid, 5-8 part Sodium Silicofluoride, 3-5 part plumbic acetate, 10-15 part cobaltous acetate, 10-12 part zinc acetate, 10-15 part ethylene glycol monomethyl ether, 3-5 part triglycol, 2-4 part tripoly phosphate sodium STPP, 3-5 part Sodium hexametaphosphate 99, 3-5 part trisodium phosphate, 8-10 part silicone oil.
Further, the number of each feed composition is: 20 parts of nickel oxide, 15 parts of zinc sulfate, 10 parts of Tai-Ace S 150,13 parts of stannous sulfates, 10 parts of manganous sulfates, 3 parts of Isosorbide-5-Nitrae-bis-(phenylene-ethynylene) benzene, 3 part of two polyphenylene propargyl ether, 2 parts of Sodium Benzoates, 10 parts of oxalic acid, 8 parts of potassium fluoborates, 6 parts of potassium fluotitanates, 5 parts of hydrofluoric acid, 5 parts of Sodium Silicofluorides, 3 parts of plumbic acetates, 10 parts of cobaltous acetates, 10 parts of zinc acetates, 10 parts of ethylene glycol monomethyl ethers, 3 parts of triglycols, 2 parts of tripoly phosphate sodium STPPs, 3 parts of Sodium hexametaphosphate 99s, 3 parts of trisodium phosphates, 8 parts of silicone oil.
Or, the number of each feed composition is: 25 parts of nickel oxide, 20 parts of zinc sulfate, 12 parts of Tai-Ace S 150,15 parts of stannous sulfates, 12 parts of manganous sulfates, 5 parts of Isosorbide-5-Nitrae-bis-(phenylene-ethynylene) benzene, 4 part of two polyphenylene propargyl ether, 3 parts of Sodium Benzoates, 20 parts of oxalic acid, 10 parts of potassium fluoborates, 8 parts of potassium fluotitanates, 6 parts of hydrofluoric acid, 8 parts of Sodium Silicofluorides, 5 parts of plumbic acetates, 15 parts of cobaltous acetates, 12 parts of zinc acetates, 15 parts of ethylene glycol monomethyl ethers, 5 parts of triglycols, 4 parts of tripoly phosphate sodium STPPs, 5 parts of Sodium hexametaphosphate 99s, 5 parts of trisodium phosphates, 10 parts of silicone oil.
In sum, electroplating processes electroplate liquid of the present invention has good erosion resistance, wear resistance, in use effectively prevent copper atom from spreading to electrolytic solution, cut the waste, sedimentation speed is fast simultaneously, and current density range is wide, and power consumption is low, electroplating quality is good, improves the work-ing life of copper lines.
Embodiment
Embodiment 1
A kind of electroplating processes electroplate liquid described by the present embodiment 1, be made up of the feed composition of following number: 20 parts of nickel oxide, 15 parts of zinc sulfate, 10 parts of Tai-Ace S 150, 13 parts of stannous sulfates, 10 parts of manganous sulfates, 3 part 1, two (phenylene-ethynylene) benzene of 4-, 3 part of two polyphenylene propargyl ether, 2 parts of Sodium Benzoates, 10 parts of oxalic acid, 8 parts of potassium fluoborates, 6 parts of potassium fluotitanates, 5 parts of hydrofluoric acid, 5 parts of Sodium Silicofluorides, 3 parts of plumbic acetates, 10 parts of cobaltous acetates, 10 parts of zinc acetates, 10 parts of ethylene glycol monomethyl ethers, 3 parts of triglycols, 2 parts of tripoly phosphate sodium STPPs, 3 parts of Sodium hexametaphosphate 99s, 3 parts of trisodium phosphates, 8 parts of silicone oil.
Embodiment 2
A kind of electroplating processes electroplate liquid described by the present embodiment 2, be made up of the feed composition of following number: 25 parts of nickel oxide, 20 parts of zinc sulfate, 12 parts of Tai-Ace S 150, 15 parts of stannous sulfates, 12 parts of manganous sulfates, 5 part 1, two (phenylene-ethynylene) benzene of 4-, 4 part of two polyphenylene propargyl ether, 3 parts of Sodium Benzoates, 20 parts of oxalic acid, 10 parts of potassium fluoborates, 8 parts of potassium fluotitanates, 6 parts of hydrofluoric acid, 8 parts of Sodium Silicofluorides, 5 parts of plumbic acetates, 15 parts of cobaltous acetates, 12 parts of zinc acetates, 15 parts of ethylene glycol monomethyl ethers, 5 parts of triglycols, 4 parts of tripoly phosphate sodium STPPs, 5 parts of Sodium hexametaphosphate 99s, 5 parts of trisodium phosphates, 10 parts of silicone oil.
The above is only preferred embodiment of the present invention, not does any pro forma restriction to technical scheme of the present invention.Every above embodiment is done according to technical spirit of the present invention any simple modification, equivalent variations and modification, all still belong in the scope of technical scheme of the present invention.
Claims (3)
1. an electroplating processes electroplate liquid, it is characterized in that, be made up of the feed composition of following number: 20-25 part nickel oxide, 15-20 part zinc sulfate, 10-12 part Tai-Ace S 150, 13-15 part stannous sulfate, 10-12 part manganous sulfate, 3-5 part 1, two (phenylene-ethynylene) benzene of 4-, 3-4 part two polyphenylene propargyl ether, 2-3 part Sodium Benzoate, 10-20 part oxalic acid, 8-10 part potassium fluoborate, 6-8 part potassium fluotitanate, 5-6 part hydrofluoric acid, 5-8 part Sodium Silicofluoride, 3-5 part plumbic acetate, 10-15 part cobaltous acetate, 10-12 part zinc acetate, 10-15 part ethylene glycol monomethyl ether, 3-5 part triglycol, 2-4 part tripoly phosphate sodium STPP, 3-5 part Sodium hexametaphosphate 99, 3-5 part trisodium phosphate, 8-10 part silicone oil.
2. a kind of electroplating processes electroplate liquid according to claim 1, it is characterized in that, the number of each feed composition is: 20 parts of nickel oxide, 15 parts of zinc sulfate, 10 parts of Tai-Ace S 150, 13 parts of stannous sulfates, 10 parts of manganous sulfates, 3 part 1, two (phenylene-ethynylene) benzene of 4-, 3 part of two polyphenylene propargyl ether, 2 parts of Sodium Benzoates, 10 parts of oxalic acid, 8 parts of potassium fluoborates, 6 parts of potassium fluotitanates, 5 parts of hydrofluoric acid, 5 parts of Sodium Silicofluorides, 3 parts of plumbic acetates, 10 parts of cobaltous acetates, 10 parts of zinc acetates, 10 parts of ethylene glycol monomethyl ethers, 3 parts of triglycols, 2 parts of tripoly phosphate sodium STPPs, 3 parts of Sodium hexametaphosphate 99s, 3 parts of trisodium phosphates, 8 parts of silicone oil.
3. a kind of electroplating processes electroplate liquid according to claim 1, it is characterized in that, the number of each feed composition is: 25 parts of nickel oxide, 20 parts of zinc sulfate, 12 parts of Tai-Ace S 150, 15 parts of stannous sulfates, 12 parts of manganous sulfates, 5 part 1, two (phenylene-ethynylene) benzene of 4-, 4 part of two polyphenylene propargyl ether, 3 parts of Sodium Benzoates, 20 parts of oxalic acid, 10 parts of potassium fluoborates, 8 parts of potassium fluotitanates, 6 parts of hydrofluoric acid, 8 parts of Sodium Silicofluorides, 5 parts of plumbic acetates, 15 parts of cobaltous acetates, 12 parts of zinc acetates, 15 parts of ethylene glycol monomethyl ethers, 5 parts of triglycols, 4 parts of tripoly phosphate sodium STPPs, 5 parts of Sodium hexametaphosphate 99s, 5 parts of trisodium phosphates, 10 parts of silicone oil.
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| CN201510333911.0A CN104911640A (en) | 2015-06-17 | 2015-06-17 | Electroplating liquid for electroplating treatment |
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| CN201510333911.0A CN104911640A (en) | 2015-06-17 | 2015-06-17 | Electroplating liquid for electroplating treatment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105350056A (en) * | 2015-11-24 | 2016-02-24 | 安徽天思朴超精密模具股份有限公司 | Anti-abrasion electroplating liquid material combination and manufacturing method and application of anti-abrasion electroplating liquid |
| CN105369302A (en) * | 2015-12-23 | 2016-03-02 | 苏州市金星工艺镀饰有限公司 | Preparation method for electroplating solution for inhibiting copper exposure of tinned copper wire |
| CN110117803A (en) * | 2019-05-14 | 2019-08-13 | 广州超邦化工有限公司 | Potassium chloride is without cyanogen cadmium titanium alloy plating solution, preparation method and electroplating technology |
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| CN105369302A (en) * | 2015-12-23 | 2016-03-02 | 苏州市金星工艺镀饰有限公司 | Preparation method for electroplating solution for inhibiting copper exposure of tinned copper wire |
| CN110117803A (en) * | 2019-05-14 | 2019-08-13 | 广州超邦化工有限公司 | Potassium chloride is without cyanogen cadmium titanium alloy plating solution, preparation method and electroplating technology |
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