CN104883818B - The alignment method of printed wiring board - Google Patents
The alignment method of printed wiring board Download PDFInfo
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- CN104883818B CN104883818B CN201410075152.8A CN201410075152A CN104883818B CN 104883818 B CN104883818 B CN 104883818B CN 201410075152 A CN201410075152 A CN 201410075152A CN 104883818 B CN104883818 B CN 104883818B
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- contraposition
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- wiring board
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Abstract
The present invention is suitable for the technical field of printed wiring board, there is provided a kind of alignment method of printed wiring board, it is intended to solve the problems, such as that welding resistance exposure aligning precision can not ensure three times in the prior art.The alignment method of the printed wiring board comprises the following steps：Make contraposition target, make catch point region, contraposition and silk-screen green oil and last time contraposition and silk-screen green oil at least once, during using each exposure-processed, reflectance every time at the first contraposition target is identical, ensure that the Aligning degree of exposure, the first solder mask after i.e. each contraposition and silk-screen green oil at the first contraposition target does not all remain, on the one hand it is not easy the thickness that increase forms green oil after repeatedly contraposition and silk-screen green oil, on the other hand being also beneficial to exposure machine accurately captures the first contraposition target, prevent deviation, so as to ensure the distance of center circle deviation of the first contraposition target after repeatedly contraposition and silk-screen green oil within claimed range, meet contraposition precision requirement.
Description
Technical field
The invention belongs to the technical field of printed wiring board, more particularly to a kind of alignment method of printed wiring board.
Background technology
Printed wiring board mainly includes the part such as pad, via, solder mask, silk-screen layer, green, palm fibre on printed wiring board
Color, red or yellow etc. are generally the color of welding resistance paint, this layer is the protective layer of insulation, is known as solder mask.
With the development of electronics industry, the requirement to printed wiring board is also higher and higher, the high density of printed wiring board, thin
Conducting wire, small-bore tend to be getting faster, also higher and higher to the manufacturing technique requirent of printed wiring board solder mask.At present, to print
Wiring board processed is carried out in welding resistance manufacturing process, and the mode that generally use has local welding resistance three times is made, and specific steps are such as
Under：Catch point twine is printed into welding resistance and welding resistance contraposition pad is grabbed in exposure, welding resistance contraposition pad needs to cover oil exposure for the first time；By catch point net
Welding resistance contraposition pad is grabbed in silk-screen welding resistance and exposure, and welding resistance contraposition pad needs to cover oil exposure second；By catch point twine print welding resistance and
Welding resistance contraposition pad is grabbed in exposure, and welding resistance contraposition pad needs third time to cover oil exposure.
However, in the welding resistance manufacturing process of above-mentioned printed wiring board, since each stamp-pad ink all can in welding resistance contraposition pad
Increase a green oil thickness, cause exposure machine that deviation occurs every time, causes welding resistance exposure three times when grabbing contraposition pad contraposition
Light contraposition precision can not ensure.
The content of the invention
It is an object of the invention to provide a kind of alignment method of printed wiring board, at multiple contraposition and silk-screen green oil
Manage and finally by the way of exposure-processed, it is intended to which welding resistance exposure aligning precision can not ensure three times in the prior art for solution
Problem.
The present invention is achieved in that a kind of alignment method of printed wiring board comprises the following steps：
Make contraposition target, there is provided printed wiring board simultaneously makes outer-layer circuit figure on the printed wiring board, described
Printed wiring board includes the land with the outer-layer circuit figure and is surrounded on the edges of boards region of the land,
The edges of boards region forms the first contraposition target；
Make catch point region, there is provided catch point halftone simultaneously corresponds to the described first contraposition target and described in the catch point halftone
The position of land forms catch point region, and the catch point halftone is arranged above the printed wiring board；
Contraposition and silk-screen green oil at least once, including：There is provided the first exposure film and in first exposure film
The second contraposition target is formed corresponding to the region of the described first contraposition target, first exposure film corresponds to described second pair
The position of position target is equipped with shading rubber belt；Screen printing ink and formed on the catch point halftone on the printed wiring board
One layer of first solder mask；First exposure film is arranged at the catch point overlying regions, and makes second register guide
The center of target is overlapped with the center of the described first contraposition target to be set and the shading rubber belt shelters from and described the
The corresponding catch point region of one contraposition target；Exposure and local development, first time exposure is carried out to first exposure film
Processing, removes the shading rubber belt for blocking the catch point region, to carrying out local development treatment at the described first contraposition target and going
Except the first solder mask at the described first contraposition target；And
Last time contraposition and silk-screen green oil, including：There is provided the second exposure film and in second exposure film
The 3rd contraposition target is formed corresponding to the region of the described first contraposition target；On the catch point halftone screen printing ink and
One layer of second solder mask is formed on the printed wiring board；Second exposure film is arranged on the catch point region
Side, and the center of the 3rd contraposition target is overlapped setting with the center of the described first contraposition target；To described
Second exposure film carries out second of exposure-processed.
Further, the size of the shading rubber belt is more than or equal to the size of the described first contraposition target.
Further, the shape phase of the first contraposition target, the second contraposition target and the 3rd contraposition target
Together, and it is circle.
Further, first solder mask and second solder mask are ink of the same race, and are liquid photosensitive
Type solder mask.
When the alignment method of printed wiring board provided by the invention utilizes each exposure-processed, every time at the first contraposition target
Reflectance it is identical, ensure that the Aligning degree of exposure, i.e., every time after contraposition and silk-screen green oil at the first contraposition target the
One solder mask does not all remain, and is on the one hand not easy the thickness that increase forms green oil after repeatedly contraposition and silk-screen green oil, separately
On the one hand be also beneficial to exposure machine and accurately capture the first contraposition target, prevent deviation, thus ensure through repeatedly contraposition and
The distance of center circle deviation of the first contraposition target meets contraposition precision requirement within claimed range after silk-screen green oil.
Brief description of the drawings
Fig. 1 is the flow chart of the alignment method of printed wiring board provided in an embodiment of the present invention.
Fig. 2 is the aligning structure schematic diagram of contraposition target provided in an embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Referring to Fig.1 and 2, the alignment method of printed wiring board provided in an embodiment of the present invention comprises the following steps：
S1：Make contraposition target, there is provided printed wiring board simultaneously makes outer-layer circuit figure, institute on the printed wiring board
Stating printed wiring board includes the land with the outer-layer circuit figure and is surrounded on the edges of boards region of the land,
The first contraposition target 11 is formed in the edges of boards region；It is to be appreciated that by being pasted on the external copper surface of printed wiring board
Dry film, covering have with the first corresponding circuit exposure film of contraposition target 11, exposure, development, etch and take off film process with
Form outer-layer circuit figure.
S2：Make catch point region, there is provided catch point halftone simultaneously corresponds to the described first contraposition target 11 in the catch point halftone
Catch point region is formed with the position of the land, the catch point halftone is arranged above the printed wiring board；Can be with
Understand ground, kept off using the halftone egative film for forming catch point region by halftone die, exposure, halftone development and halftone drying to be formed
Point halftone.
S3：Contraposition and silk-screen green oil at least once, including：There is provided the first exposure film and in the described first exposure phenanthrene
The region that woods corresponds to the described first contraposition target 11 forms the second contraposition target, and first exposure film corresponds to described the
The position of two contraposition targets is equipped with shading rubber belt；The screen printing ink and on the printed wiring board on the catch point halftone
Form one layer of first solder mask；First exposure film is arranged at the catch point overlying regions, and makes described second pair
Position target center with described first contraposition target 11 center overlaps set and the shading rubber belt shelter from and
Described first aligns the corresponding catch point region of target 11；Exposure and local development, carry out first exposure film the
Single exposure processing, removes the shading rubber belt for blocking the catch point region, local aobvious to being carried out at the described first contraposition target 11
Shadow handles and removes the first solder mask at the first contraposition target 11；It is to be appreciated that utilize the first exposure film
Shading rubber belt blocks first solder mask in 11 region of the first contraposition target, and first time exposure is being carried out to first exposure film
During light processing, being protected by the shading rubber belt makes the first solder mask at the first contraposition target 11 at the first exposure
Remained during reason, i.e., processing is not exposed to the first solder mask at the described first contraposition target 11, and pass through
Local development treatment with remove it is described first contraposition target 11 at the first solder mask, that is to say, that by for the first time contraposition and
After silk-screen green oil step, the first solder mask is not remained at the first contraposition target 11；In other embodiments, can pass through twice
Or more contraposition and silk-screen green oil step, align every time and silk-screen green oil process repeats the above steps, and it is right every time
Behind position and silk-screen green oil, the first solder mask is not remained at the first contraposition target 11.Preferably, second pair is captured using exposure machine
The center of position target is overlapped with the center with the first contraposition target 11.At contraposition and silk-screen green oil by the step
After reason, the first border circular areas 12 aligned with the described first contraposition target 11 is formed at the first contraposition target 11, i.e., with first
Border circular areas 12 and first aligns what target 11 was aligned.
S4：Last time contraposition and silk-screen green oil, including：There is provided the second exposure film and in the described second exposure phenanthrene
The region that woods corresponds to the described first contraposition target 11 forms the 3rd contraposition target；The screen printing ink on the catch point halftone
And one layer of second solder mask is formed on the printed wiring board；Second exposure film is arranged at the catch point region
Top, and the center of the 3rd contraposition target is overlapped setting with the center of the described first contraposition target 11；It is right
Second exposure film carries out second of exposure-processed.It is to be appreciated that the formed in second exposure film the 3rd
It is corresponding with the described second contraposition target to align target, and by carrying out second of exposure-processed to second exposure film,
The second solder mask at the first contraposition target 11 remains.Preferably, the 3rd contraposition target of exposure machine crawl is utilized
Center with first contraposition target 11 center overlap.More preferably, the center of the 3rd contraposition target
Overlapped with the center of the described second contraposition target.After contraposition and the processing of silk-screen green oil by the step, in the first contraposition
The second border circular areas 13 aligned with the described first contraposition target 11 is formed at target 11, i.e., with the second border circular areas 13 and first
Contraposition target 11 is aligned.
The alignment method of printed wiring board provided in an embodiment of the present invention by aligning the step with ink for screen printing at least once
The rapid S3 and step S4 of last time contraposition and silk-screen green oil, ensure that and be only formed with one layer second at the first contraposition target 11
Solder mask, ensure that the thickness that ink is formed at the first contraposition target 11, in addition, during each exposure-processed, every time first
The reflectance aligned at target 11 is identical, ensures that the Aligning degree of exposure, i.e., aligns every time and first pair after silk-screen green oil
The first solder mask at the target 11 of position does not all remain, and is on the one hand not easy increase and is formed after repeatedly contraposition and silk-screen green oil
The thickness of green oil, is on the other hand also beneficial to exposure machine and accurately captures the first contraposition target 11, deviation is prevented, so as to protect
The distance of center circle deviation A of the first contraposition target 11 after repeatedly contraposition and silk-screen green oil is demonstrate,proved within claimed range, meets contraposition essence
Accuracy requirement.
Referring to Fig.1 and 2, preferably, when the alignment method of printed wiring board is using contraposition three times and silk-screen green oil
When mode realizes contraposition precision requirement, specific method is as follows：
First, complete to make the step S1 for aligning target, referring in particular to the specific descriptions in the above method, do not go to live in the household of one's in-laws on getting married herein
State；
Secondly, the step S2 in making catch point region is completed, referring in particular to the specific descriptions in the above method, is not gone to live in the household of one's in-laws on getting married herein
State；
Again, contraposition and silk-screen green oil S3 for the first time are carried out, is included in the step of first time contraposition and silk-screen green oil：Carry
The region for corresponding to the described first contraposition target 11 for the first exposure film and in first exposure film forms the second contraposition
Target, the position that first exposure film corresponds to the described second contraposition target are equipped with shading rubber belt；In the catch point halftone
Upper screen printing ink simultaneously forms one layer of first solder mask on the printed wiring board；First exposure film is set
In the catch point overlying regions, and make center and the centre bit of the described first contraposition target 11 of the second contraposition target
Put coincidence setting and the shading rubber belt shelters from the catch point region corresponding with the described first contraposition target 11；Expose drawn game
Portion develops, and is exposed processing to first exposure film, removes the shading rubber belt for blocking the catch point region, to described the
Local development treatment is carried out at one contraposition target 11 and removes the first solder mask at the first contraposition target 11.
Then, second of contraposition and silk-screen green oil S3 are carried out, is included in the step of second of contraposition and silk-screen green oil：Carry
The region for corresponding to the described first contraposition target 11 for the 3rd exposure film and in the 3rd exposure film forms the 4th contraposition
Target, the position that the 3rd exposure film corresponds to the described 4th contraposition target are equipped with shading rubber belt；In the catch point halftone
Upper screen printing ink simultaneously forms one layer of the 3rd solder mask on the printed wiring board；3rd exposure film is set
In the catch point overlying regions, and make center and the centre bit of the described first contraposition target 11 of the 4th contraposition target
Put coincidence setting and the shading rubber belt shelters from the catch point region corresponding with the described first contraposition target 11；Expose drawn game
Portion develops, and is exposed processing to the 3rd exposure film, removes the shading rubber belt for blocking the catch point region, to described the
Local development treatment is carried out at one contraposition target 11 and removes the 3rd solder mask at the first contraposition target 11；Wherein,
The center of the 4th contraposition target is overlapped with the center of the described first contraposition target 11 using exposure machine, the first couple
Position target 11 is after first time contraposition and the processing of silk-screen green oil.More preferably, if carry out four times or more times contraposition and
During silk-screen green oil step, contraposition and silk-screen green oil for the first time or the step of second of contraposition and silk-screen green oil need to be only repeated
Suddenly.
Finally, third time contraposition and silk-screen green oil S4, including：There is provided the second exposure film and in the described second exposure
The region that the film corresponds to the described first contraposition target 11 forms the 3rd contraposition target；The silk-screen printing oil on the catch point halftone
Ink simultaneously forms one layer of second solder mask on the printed wiring board；Second exposure film is arranged at the catch point area
Above domain, and the center of the 3rd contraposition target is set to overlap setting with the center of the described first contraposition target 11；
Second of exposure-processed is carried out to second exposure film；Wherein, the center for aligning target by the 3rd using exposure machine
Overlapped with the center of the described first contraposition target 11, which is by second of contraposition and silk-screen green oil
After step process.
Contraposition three times and silk-screen green oil is utilized to ensure that the contraposition of the first contraposition target 11 is accurate in this embodiment, satisfaction pair
Position precision requirement.
Fig. 2 is refer to, further, the size of the shading rubber belt is more than or equal to the described first contraposition target 11
Size.The first solder mask being printed at the first contraposition target 11 is blocked using shading rubber belt, prevents described first pair
The first solder mask at the target 11 of position is remained at the first contraposition target 11 in exposure and local developing process, so as to keep away
Exempt from increasing the thickness of solder mask at the first contraposition target 11 after multiple silk-screen green oil, and ensure the first contraposition target 11
It is in and does not remain the first solder mask with after silk-screen green oil step by aligning at least once.
Fig. 2 is refer to, further, the first contraposition target 11, the second contraposition target and the 3rd contraposition
The shape of target is identical, and is circle.By aligning target 11, the second contraposition target and the 3rd contraposition by first
Target is shaped to circle in order to obtain each circular distance of center circle deviation A, consequently facilitating ensuring the Aligning degree of exposure.
In the embodiment of the present invention, by aligning three times with after silk-screen green oil step, the deviation A of each distance of center circle is less than 50 microns.At other
In embodiment, the first contraposition target 11, the second contraposition target and the 3rd contraposition target can be direction, ellipse
Shape or other arbitrary shapes.
Further, first solder mask and second solder mask are ink of the same race, and are liquid photosensitive
Type solder mask.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (4)
1. a kind of alignment method of printed wiring board, it is characterised in that comprise the following steps：
Make contraposition target, there is provided printed wiring board simultaneously makes outer-layer circuit figure, the printing on the printed wiring board
Wiring board includes the land with the outer-layer circuit figure and is surrounded on the edges of boards region of the land, described
Edges of boards region forms the first contraposition target；
Make catch point region, there is provided catch point halftone simultaneously corresponds to the described first contraposition target and the circuit in the catch point halftone
The position in region forms catch point region, and the catch point halftone is arranged above the printed wiring board；
Contraposition and silk-screen green oil at least once, including：First exposure film is provided and is corresponded in first exposure film
The second contraposition target is formed in the region of the described first contraposition target, first exposure film corresponds to second register guide
The position of target is equipped with shading rubber belt；Screen printing ink and one layer of the formation on the printed wiring board on the catch point halftone
First solder mask；First exposure film is arranged at the catch point overlying regions, and makes the second contraposition target
Center overlaps setting with the center of the described first contraposition target and the shading rubber belt shelters from and described first pair
The corresponding catch point region of position target；Exposure and local development, first time exposure-processed is carried out to first exposure film,
The shading rubber belt for blocking the catch point region is removed, to being carried out at the described first contraposition target described in local development treatment and removal
The first solder mask at first contraposition target；And
Last time contraposition and silk-screen green oil, including：Second exposure film is provided and is corresponded in second exposure film
The 3rd contraposition target is formed in the region of the described first contraposition target；The screen printing ink and described on the catch point halftone
One layer of second solder mask is formed on printed wiring board；Second exposure film is arranged at the catch point overlying regions, and
The center of the 3rd contraposition target is set to overlap setting with the center of the described first contraposition target；Exposed to described second
The light film carries out second of exposure-processed.
2. the alignment method of printed wiring board as claimed in claim 1, it is characterised in that the size of the shading rubber belt is more than
Or the size equal to the described first contraposition target.
3. the alignment method of printed wiring board as claimed in claim 1, it is characterised in that the first contraposition target, described
Second contraposition target is identical with the shape of the described 3rd contraposition target, and is circle.
4. the alignment method of the printed wiring board as described in claims 1 to 3 any one, it is characterised in that first resistance
Black and described second solder mask of solder paste is ink of the same race, and is liquid photosensitive type solder mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410075152.8A CN104883818B (en) | 2014-02-28 | 2014-02-28 | The alignment method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410075152.8A CN104883818B (en) | 2014-02-28 | 2014-02-28 | The alignment method of printed wiring board |
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| Publication Number | Publication Date |
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| CN104883818A CN104883818A (en) | 2015-09-02 |
| CN104883818B true CN104883818B (en) | 2018-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410075152.8A Active CN104883818B (en) | 2014-02-28 | 2014-02-28 | The alignment method of printed wiring board |
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| CN (1) | CN104883818B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208788B (en) * | 2015-08-11 | 2018-04-03 | 深圳崇达多层线路板有限公司 | It is a kind of to improve solder mask and the method for solder mask aligning accuracy |
| CN105246264B (en) * | 2015-10-20 | 2018-08-03 | 江门崇达电路技术有限公司 | A kind of production method of the solder mask with welding resistance ladder |
| CN112959814B (en) * | 2021-02-20 | 2022-06-14 | 江西远大保险设备实业集团有限公司 | Manufacturing device of transverse moving target |
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| CN101646304A (en) * | 2008-08-05 | 2010-02-10 | 比亚迪股份有限公司 | Alignment method for printed circuit board |
| CN202335086U (en) * | 2011-12-05 | 2012-07-11 | 佛山市顺德区骏达电子有限公司 | Positioning screen printing plate for circuit boards |
| CN103152989A (en) * | 2013-03-01 | 2013-06-12 | 杭州新三联电子有限公司 | Production process for screen printed circuit board |
| CN103249252A (en) * | 2013-05-13 | 2013-08-14 | 无锡江南计算技术研究所 | Control method for solder resist ink exposure precision |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05251855A (en) * | 1992-03-04 | 1993-09-28 | Nec Corp | Method for manufacturing printed-circuit board |
| JP2001053452A (en) * | 1999-08-16 | 2001-02-23 | Nippon Avionics Co Ltd | Pattern registration system for printed wiring board |
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2014
- 2014-02-28 CN CN201410075152.8A patent/CN104883818B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101646304A (en) * | 2008-08-05 | 2010-02-10 | 比亚迪股份有限公司 | Alignment method for printed circuit board |
| CN202335086U (en) * | 2011-12-05 | 2012-07-11 | 佛山市顺德区骏达电子有限公司 | Positioning screen printing plate for circuit boards |
| CN103152989A (en) * | 2013-03-01 | 2013-06-12 | 杭州新三联电子有限公司 | Production process for screen printed circuit board |
| CN103249252A (en) * | 2013-05-13 | 2013-08-14 | 无锡江南计算技术研究所 | Control method for solder resist ink exposure precision |
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