CN104879684A - Living room lamp - Google Patents

Abstract

The present invention relates to a living room lamp, comprising: a mounting body and a plurality of light strips, wherein the plurality of light strips are mounted on the mounting body, the light strips comprise: a plurality of LED lamps and connectors for connecting the LED lamps, the LED lamp comprises: a heat sink, a heat sink, a plurality of circuit boards and a plurality of LED chips, the heat sink comprises: a housing, a heat conductor and a plurality of heat conducting parts, the housing is provided with a plurality of heat conducting ports, the heat conductor is arranged in the housing, a plurality of heat conducting parts are arranged on the heat conductor, and a heat conducting part corresponds to a heat conducting port; the heat sink is arranged on the side of the heat conducting part opposite to the heat conducting port, a heat sink is arranged correspondingly to a heat conducting part; a heat sink is arranged correspondingly with at least one circuit board; a circuit board is arranged with at least one LED chip; each housing is provided with a connector, and the LED lamps are sequentially connected through a connector. The above-mentioned living room lamp can improve the heat dissipation efficiency of the living room lamp by arranging the heat conductor on the housing and, under the heat conduction effect of the plurality of heat conducting parts, the heat on the housing can be quickly transferred to the surroundings.

Description

Living room lights

technical field

The invention relates to the technical field of heat dissipation, in particular to living room lamps.

Background technique

The living room lamp is a lamp installed on the ceiling of the living room for lighting and decoration. The light source used in the living room lights is basically LED lights. Therefore, the quality of living room lights is closely related to the quality of LED lights, and the quality of LED lights is often related to the high-end heat dissipation technology.

At present, the heat dissipation of LED lamps on the market often adopts natural heat dissipation, and the effect is not ideal; Less than 10,000 hours.

Therefore, how to improve the heat dissipation performance is a technical problem that needs to be solved.

Contents of the invention

Based on this, it is necessary to provide a living room lamp aiming at the problem of how to improve heat dissipation efficiency.

A living room lamp, comprising: an installation body and a plurality of light bars, the plurality of light bars are installed on the installation body, the light bar includes: a plurality of LED lights and connectors connecting each of the LED lights, the LED lights Including: radiator, radiator, several circuit boards and several LED chips. In the casing, several heat conducting parts are arranged on the heat conducting body, and one heat conducting part corresponds to one heat conducting port; the heat sink is arranged on the side of the heat conducting part facing away from the heat conducting port, One of the heat sinks is correspondingly arranged on one of the heat conducting parts; one of the heat sinks is correspondingly provided with at least one of the circuit boards; one of the circuit boards is provided with at least one of the LED chips; each of the housings is provided with There is a connecting piece, and each of the LED lamps is sequentially connected through a connecting piece.

In one of the embodiments, the installation body is provided with several installation grooves, and one of the light bars is installed in one of the installation grooves.

In one of the embodiments, a fastening position is provided in the installation groove, the light bar is provided with a fastening part, and the fastening position is fastened with the fastening part.

In one of the embodiments, four light bars are included, and the installation body is correspondingly provided with four installation grooves.

In one of the embodiments, the mounting body is provided with a diffusion plate matching the mounting groove.

In one of the embodiments, the diffuser plate is installed on the periphery of the installation groove, so as to cover the installation groove.

In one of the embodiments, the notch of the installation groove is circular, and the diffusion plate is circular.

In one embodiment, the area of the diffusion plate is 1.5 times the cross-sectional area of the notch of the installation slot.

In one of the embodiments, the edge of the diffusion plate is provided with a buckle position, the notch of the installation groove is provided with a buckle part, and the buckle position is fastened and connected with the buckle part.

In one of the embodiments, the diffusion plate is a polycarbonate plate.

In the living room lamp, the heat conductor is arranged on the housing, and under the heat conduction action of several heat conducting parts, the heat on the housing can be quickly transferred to the surroundings, thereby improving the heat dissipation efficiency of the living room lamp.

Description of drawings

Fig. 1 is a schematic structural view of a radiator of a living room lamp according to an embodiment of the present invention;

Fig. 2 is another structural schematic diagram of a radiator of a living room lamp according to an embodiment of the present invention;

Fig. 3 is a structural schematic diagram of the connection between the heat conduction bump and the accommodating groove of the living room lamp according to an embodiment of the present invention;

Fig. 4 is another structural schematic diagram of a radiator of a living room lamp according to an embodiment of the present invention;

Fig. 5 is a schematic structural view of the heat sink shown in Fig. 4;

Fig. 6 is a schematic structural diagram of an LED lamp of a living room lamp according to an embodiment of the present invention;

Fig. 7 is a schematic structural diagram of a light bar of a living room light according to an embodiment of the present invention;

Fig. 8 is a structural schematic diagram of the connector of the embodiment shown in Fig. 7;

Fig. 9 is a schematic structural diagram of a living room lamp according to an embodiment of the present invention;

Fig. 10 is a schematic structural diagram of the sensing device.

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

Please refer to FIG. 1, FIG. 7 and FIG. 9 together. The living room lamp 40 includes: an installation body 401 and a plurality of light bars 30, a plurality of the light bars 30 are installed on the installation body 401, and the light bars 30 include: a plurality of LEDs The lamp 20 and the connector 301 connecting each of the LED lamps 20. The LED lamp 20 includes: a heat sink 10, a heat sink 201, a number of circuit boards 202 and a number of LED chips 203. The heat sink 10 includes: a housing 101 1. Heat conduction body 102 and several heat conduction parts 103, the housing 101 is provided with several heat conduction ports 104, the heat conduction body 102 is set in the housing 101, and several heat conduction parts 103 are set on the heat conduction body 102 , and, one of the heat conduction parts 103 corresponds to one of the heat conduction openings 104; the heat dissipation element 201 is arranged on the side of the heat conduction part 103 facing away from the heat conduction opening 104, and one of the heat dissipation elements 201 is correspondingly arranged on a The heat conduction portion 103; one heat sink 201 is provided with at least one circuit board 202; one circuit board 202 is provided with at least one LED chip 203; each housing 101 is provided with a said Connecting piece 301 , each of the LED lights 20 is sequentially connected through one of the connecting pieces 301 . For example, each of the LED lights 20 is connected into a strip shape through one of the connecting pieces 301 . For example, the installation body 401 is provided with several installation grooves, and one of the light bars 30 is installed in one of the installation grooves. For example, a fastening position is provided in the installation groove, and the light bar 30 is provided with a fastening part, and the fastening position is fastened with the fastening part. For example, four light bars 30 are included, and the installation body 401 is correspondingly provided with four installation grooves. For example, the mounting body 401 is provided with a diffusion plate matching the mounting groove. For example, the diffuser plate is installed on the periphery of the installation groove for covering the installation groove. For example, the notch of the installation groove is circular, and the diffusion plate is circular. For example, the area of the diffusion plate is 1.5 times the cross-sectional area of the notch of the installation groove. For example, a buckle position is provided at the edge of the diffusion plate, a buckle portion is disposed at a notch of the installation groove, and the buckle position is fastened and connected with the buckle portion. For example, the diffuser plate is made of polycarbonate. For example, the diffuser plate is a polycarbonate plate.

In order to facilitate the installation of the living room lamp 40 to the outside, for example, the installation body 401 is a block-shaped cuboid. For example, the middle area on one side of the installation body 401 is provided with a hanging position. For example, the mounting position is a hook. As another example, the mounting position is a suction cup. In this way, the entire living room lamp 40 can be conveniently hoisted to the outside through the hanging position. For example, the entire living room lamp 40 can be conveniently hoisted to the ceiling of the living room through the hanging position.

In order to ensure the brightness of the light output by the living room lamp 40 , for example, the installation body 401 is provided with several installation slots, and one of the light bars 30 is installed in one of the installation slots. For example, the installation body 401 is in a rectangular shape, and four installation grooves are provided in the edge regions around it. That is to say, the four installation slots are perpendicular to each other and form a rectangular shape as a whole. As another example, the mounting body 401 is hexagonal, and six mounting grooves are provided in the edge regions around it. That is, the six mounting grooves are connected to each other to form a hexagonal shape as a whole. As another example, each installation slot is also provided with a separate power control switch, which is used to individually turn off the light bar 30 in the corresponding installation slot. Therefore, the brightness of the living room lamp 40 can be flexibly adjusted while ensuring the output brightness of the living room lamp 40 . In this way, there are installation grooves around the living room lamp 40 , and the light bars 30 on the installation grooves can radiate to the surroundings of the living room lamp 40 , thereby ensuring the brightness of the light output by the living room lamp 40 .

In order to facilitate the installation of the light bar 30 in the installation groove, for example, a fastening position is provided in the installation groove, and the light bar 30 is provided with a fastening part, and the fastening position is fastened with the fastening part. . For example, a fastening position is provided at the bottom of the installation groove. For example, each of the housings 101 of the light bar 30 is provided with one buckling portion, and each of the buckling portions is connected to the buckling position through an intermediate piece. For example, a fastening position is provided in the middle area of the bottom of the installation groove, and the fastening position is a hollow cylinder, and two symmetrical fastening holes are opened on both side walls of the hollow cylinder. In another example, the intermediate piece includes a cylindrical head and a connecting rod. For example, two limiting blocks are symmetrically arranged on the outer side walls of the cylindrical head. For example, several buckling positions are provided on the same side of the connecting rod, and the buckling part on each housing 101 of the light bar 30 is connected to the buckle on the connecting rod. Closed and fastened connection, the cylindrical head is accommodated in the hollow cylinder of the installation groove, and the two limiting blocks are correspondingly set in the two fastening holes, that is, one of the limiting blocks passes through the two fastening holes. Set in one of the fastening holes. In this way, the light bar 30 can be installed on the middle piece first, and then the whole light bar 30 can be installed in the installation groove through the middle piece. Therefore, the assembly of the light bar 30 and the installation groove can be realized without borrowing other complicated tools, which is convenient and quick.

In order to disperse the luminous flux of the LED lights, for example, the installation body 401 is provided with a diffusion plate matching the installation groove, and the diffusion plate is used to cover the installation groove, so that the light bar 30 is accommodated in the installation groove and the diffuser plate. For example, the diffusion plate is installed on the periphery of the installation groove. For example, the notch of the installation groove is circular, and the diffusion plate is circular. For example, a dark groove is provided on the side wall of the installation groove close to the notch, for example, the depth of the dark groove is 0.5 cm, and the height is 0.3 cm. For example, the thickness of the diffusion plate is 0.3 cm, and the periphery of the diffusion plate is embedded in the dark groove. In this way, under the effect of the diffusion plate, the light emitted by the LED lamps 20 can be evenly irradiated to the outside after passing through the diffusion plate. On the other hand, the diffusion plate can also protect the optical components in the installation slot, preventing external objects from entering the installation slot and damaging the light bar 30 .

In order to intelligently control the state or parameters of the light bar 30 in each installation slot of the living room light 40 , as shown in FIG. 10 , for example, the living room light 40 further includes a sensing device 400 . For example, the mounting body 401 is provided with a fixing position, and the sensing device 400 is installed on the fixing position. For example, the sensing device 400 is also connected to each light bar 30 through wires. That is to say, the induction device 400 integrates the power lines of each light bar 30 , and each light bar 30 is connected in parallel. The sensing device 400 includes sequentially connected: a power supply module 411 , a receiving module 412 , a delay module 413 , a processing unit 414 and an allocation module 415 . For example, the power module 411 is directly connected to an external power supply, and is used to convert the external 220V voltage into the driving voltage required by the LED. For example, the receiving module 412 is connected to the output terminal of the power module 411, and the receiving module 412 is used for receiving the on-off frequency of the power module 411 and the external power supply and generating a frequency signal. For example, the frequency signal uses p/s (times per second) as a unit. For example, the delay module 413 is used to receive the frequency signal to generate and compare the frequency signal value. For example, the delay module 413 presets several frequency comparison values, and compares the several frequency comparison values to determine the actually received frequency signal value and generates a relative processing signal. For example, the frequency ratio value uses p/s (times per second) as a unit. For example, several frequency contrast values include: 1p/s, 2p/s, 3p/s, and 4p/s. For example, when the value of the frequency signal received by the delay module 413 is 1p/s, the value of the frequency signal matches the frequency comparison value of 1p/s and generates a normally enabled processing signal. For example, when the frequency signal value received by the delay module 413 is 2p/s, the frequency signal value matches the frequency comparison value of 2p/s and generates a processing signal to turn off all light bars 30 . For example, when the frequency signal value received by the delay module 413 is 3p/s, the frequency signal value matches the frequency comparison value of 3p/s and generates a processing signal for turning on 1/2 light bar 30 . For example, when the frequency signal value received by the delay module 413 is 4p/s, the frequency signal value matches the frequency contrast value of 4p/s and generates a processing signal for changing the parameters of the light bar 30 . For example, the processing unit 414 is configured to receive the processed signals, and distribute each processed signal to the allocation module 415 . For example, the adjustment module 415 is configured to receive a processing signal from the processing unit 414, and change the state of the light bar 30 or adjust the parameters of the light bar 30 according to the processing signal. For example, when the processing unit 414 receives a normally enabled processing signal, the processing unit 414 distributes the normally enabled processing signal to the allocation module 415, and the allocation module 415 normally receives the normally enabled processing signal. Each light bar 30 is turned on. For example, when the processing unit 414 receives a processing signal for changing the parameters of the light bar 30, the processing unit 414 distributes the processing signal for changing the parameters of the light bar 30 to the adjustment module 415, and the adjustment module 415 receives the change The parameter of each light bar 30 is changed after processing the signal of the parameter of the light bar 30 . It should be noted that the working principles and hardware configurations of the power supply module 411, receiving module 412, delay module 413, processing unit 414, and allocation module 415 are all prior art, and those skilled in the art can write The control program of each unit module is drawn out, and the control program can be flexibly changed according to actual production needs. Therefore, the present invention does not repeat the working principle, hardware configuration and control program of each unit module. In this way, the beneficial effect of intelligently controlling the status or parameters of the light bar 30 in each installation slot of the living room light 40 can be realized through the above-mentioned sensing device 400 .

For example, please refer to FIG. 1 , which is a schematic structural diagram of a radiator for a living room lamp according to an embodiment of the present invention. The radiator 10 includes: a housing 101 , a heat conductor 102 and several heat conductors 103 , and the housing 101 is hollow. , the casing 101 is provided with a plurality of heat conducting ports 104, the heat conducting body 102 is arranged in the casing 101, and a plurality of the heat conducting parts 103 are arranged on the heat conducting body 102, and one of the heat conducting parts 103 Corresponding to one of the heat conduction openings 104 ; for example, the heat conduction opening 104 penetrates through the heat conduction portion 103 . For example, each of the heat conducting parts 103 is evenly distributed on the heat conducting body 102 . In another example, each of the heat conducting parts 103 is evenly distributed on the heat conducting body 102 . For example, the housing 101 is aluminum alloy. For example, the heat conductor 102 is a graphite rod. For example, as shown in FIG. 2, the housing 101 includes a first housing 101a and a second housing 101b, and the heat conductor 102 is disposed between the first housing 101a and the second housing 101b. . For example, the heat conductor 102 is in close contact with the first housing 101a and the second housing 101b. For example, a heat-conducting silica gel is disposed between the first casing and the heat-conducting body 102 , and a heat-conducting silica gel is disposed between the second housing 101 b and the heat-conducting body 102 . For example, the same heat-conducting silica gel is also disposed between the second housing 101 b and the heat-conducting body 102 . For example, the heat conductor is aluminum alloy, which is integrally formed with the shell. For example, the heat conducting body 102 is extended with a heat conducting bump at the heat conducting port 104 , and the heat conducting part 103 defines a receiving groove, and the heat conducting bump is accommodated in the receiving groove. For example, the heat conduction part 103 is provided with a mounting position, and the mounting position faces away from the receiving groove.

In order to improve the heat dissipation efficiency of the radiator, for example, the housing 101 adopts a frame structure. The shell 101 of the frame structure can increase the contact area between itself and the air, and improve the convection between the shell 101 and the air. Preferably, the housing 101 is made of aluminum alloy. In other embodiments, a metal or a metal alloy with a higher thermal conductivity may be selected according to the actual application environment, for example, copper-aluminum alloy may be used, and pure copper metal may be used for another example. The heat removal efficiency of the heat source by the housing 101 can be increased, and the heat dissipation efficiency of the entire radiator can be accelerated on the basis of the increased air convection rate.

In order to facilitate the assembly and combination of the heat sinks, in one embodiment, the housing 101 of the frame structure is cylindrical, that is, it is in the shape of a cylinder. For example, the height of the housing 101 is 2-10 cm, and the radius of the bottom surface is 1-5 cm. In one embodiment, the height of the housing 101 is 5 cm, and the radius of the bottom surface is 2 cm. The volume of the housing 101 can be confirmed as a final production size according to actual production requirements. For example, when the heat sink needs to be applied to high-power LED lamp chips, the volume of the housing 101 needs to adapt to the heat generated by the high-power LED lamp chips. As another example, when the power of the LED lamp chip is relatively small, several heat sinks can be assembled and combined to form a larger LED lamp.

In order to further improve the heat dissipation efficiency of the radiator, for example, the housing 101 includes a first side wall and two connecting walls perpendicular to the first side wall, and the connecting walls perpendicular to the first side wall are arranged on the first side wall two ends, so that the first side wall and the two connecting walls are combined into a cylinder. For example, the height of the first side wall is 3 cm, and the radius of the two connecting walls is 1 cm. Both the first side wall and the two connecting walls are made of aluminum alloy. The first sidewall defines a plurality of heat conduction openings 104 . For example, the heat conduction ports 104 are arranged in a matrix. In this embodiment, the first side wall is provided with 12 heat conduction openings 104 , for example, the heat conduction openings 104 are circular openings with a radius equal to 0.6 cm. For example, an interlayer groove is provided on the first side wall of the periphery of the heat conduction port 104. For example, the interlayer groove is set through the first side wall to improve the convection effect; Alloy materials, for example, are filled with graphene materials to fine-tune the conduction performance locally, so as to realize the wave heat conduction effect and avoid excessive heat concentration. In this embodiment, a 0.01 cm interlayer groove is opened on the first side wall within 0.1 cm of the periphery of the heat conduction port 104 , and the interlayer groove is filled with graphene material. For example, the interlayer tank is further provided with a film of aluminum alloy, which is used to seal the interlayer tank. In this way, when the heat conduction part 103 corresponds to the heat conduction opening 104 and is arranged on the heat conduction body 102, the interlayer groove radiates in a ring shape along the heat conduction opening 104 to the heat conduction body 102 away from the heat conduction opening 104. It can be seen that the The filling material on the heat conduction opening 104 can quickly conduct heat to the heat conduction body 102 away from the heat conduction opening 104 , so as to rapidly realize heat dissipation on the heat conduction portion 103 .

In order to further improve the heat dissipation efficiency of the radiator, as another example, the housing 101 is hollow. It should be noted that the hollow arrangement and the frame structure referred to in the present invention are two approximate structures. For example, the thickness of the shell provided in the hollow is greater than that of the shell provided in the frame structure, that is, the shell of the frame structure adopts a plate-shaped structure, and the shell disposed in the hollow adopts a block-shaped structure. For example, the hollow part of the housing 101 is used for placing the heat conductor 102 . The heat conductor 102 is in close contact with the casing 101 . It can be understood that the close fit is to prevent heat from being interrupted during the conduction process between the housing 101 and the heat conductor 102 , causing heat to accumulate in the housing 101 and reducing heat dissipation efficiency. In order to achieve the close fit, for example, the heat conductor 102 is connected to the housing 101 in an interference fit manner. In another example, the heat conductor 102 is connected to the housing 101 in a clearance fit manner. For example, the gap between the heat conductor 102 and the housing 101 is filled with thermal silica gel after the clearance fit. As another example, graphite powder is filled in the gap between the heat conductor 102 and the housing 101 after the clearance fit, so as to ensure continuous conduction of heat between the housing 101 and the heat conductor 102 . For example, the heat conductor 102 and the housing 101 are made of materials with different thermal conductivity, for example, the heat conductor 102 is made of graphite material. As another example, the heat conductor 102 runs through the entire housing 101 , so that the heat conductor 102 quickly conducts heat to various parts of the housing 101 . Since the heat conduction coefficient of the heat conductor 102 is greater than that of the housing 101 , when the heat on the housing 101 gathers in a certain area, the heat conductor 102 can play a balanced role, and quickly conduct the heat in this area to the area of the housing 101 . In this way, the heat dissipation efficiency of the radiator can be improved.

In order to facilitate the installation of the heat conductor 102 in the housing 101, as shown in FIG. Between the first casing 101a and the second casing 101b. That is to say, the first housing 101a and the second housing 101b are symmetrically provided with a first groove for accommodating the heat conductor 102, and the heat conductor 102 is clamped between the first housing 101a and the second housing 101b. between. In this embodiment, the cross sections of the first housing 101a and the second housing 101b are semicircular, and the two are combined into a hollow cylinder. The heat conductor 102 is a cylinder, and its outer diameter is equal to the inner diameter of the semi-circular first shell 101a, so that the heat conductor 102 is in close contact with the first shell 101a and the second shell 101b. In this way, the installation of the heat conductor 102 and the first shell 101a and the second shell 101b can be simplified, and the production efficiency can be improved.

In order to further improve the heat dissipation efficiency of the radiator, referring to FIG. 2 and FIG. 3 , for example, the heat conductor 102 is provided with a heat conduction bump 104a extending from the heat conduction opening 104, and the heat conduction part 103 is provided with a receiving groove 103a, The heat conduction bump 104a passes through the heat conduction opening 104 and is accommodated in the accommodating groove 103a. For example, the heat conduction bump 104 a is made of graphite material, and its heat conduction system is higher than the housing 101 . For example, the heat conduction bump 104a is integrally formed with the heat conduction body 102 . The distribution of the heat conduction bumps 104a matches the heat conduction openings 104, that is, the position of the heat conduction bumps 104a is determined according to the heat conduction openings after the heat conduction body 102 is arranged in the housing 101 The position distribution of the heat conducting bump 104 a relative to the heat conducting body 102 is determined by the position distribution of the heat conducting bump 104 a. For example, the heat conduction bump 104a passes through the heat conduction port 104 and protrudes from the casing 101, so that the part of the heat conduction bump 104a away from the casing 101 is accommodated in the accommodating groove 103a, and the heat conduction bump 104a is away from the shell Part of the body 101 is fully in contact with the accommodating groove 103a. For example, the heat conduction bump 104a is in contact with the opening of the interlayer groove. For example, the heat conduction bump 104a is closely attached to the interlayer groove and is in contact with the filling material. For example, the heat conducting part 103 is used for installing an LED lamp assembly. For example, the heat conduction portion 103 is provided with a mounting position, and the mounting position is facing away from the accommodating groove 103a. The LED lamp assembly is installed on the installation position. In this way, part of the heat generated by the LED lamp assembly can be conducted to the heat-conducting bump 104 a through the heat-conducting portion 103 and then to the heat-conducting body 102 through the heat-conducting bump 104 a. Since the heat of the LED lamp assembly is mainly concentrated in the area facing away from the accommodating groove 103 a , the heat conduction bump 104 a can quickly conduct the heat to the heat conductor 102 . Moreover, since the heat conduction bump 104a is also in contact with the filling material of the interlayer groove, the accumulated heat can also be conducted to the filling material, and then to the housing 101 through the filling material, so that the heat of the LED lamp assembly can be quickly The thermal conduction bump 104a and the filling material are conducted to the housing 101, thereby preventing performance degradation of the LED chip due to excessive temperature, improving product quality, and improving heat dissipation efficiency of the radiator.

In order to facilitate the installation of the heat conducting part 103 on the housing 101, for example, the housing 101 is provided with a mating position on the periphery of the heat conducting port 104, and the side of the heat conducting part 103 facing away from the mounting position is provided with a mating part. , the mating position is fastened and connected with the mating part. For example, the insertion position forms a ring shape along the heat conduction opening 104 , and the insertion portion protrudes from the heat conduction portion 103 . For example, the inserting portion protrudes in an annular shape along the heat conducting portion 103 , and a circular groove is formed in the middle of the inserting portion, and the circular inserting position is accommodated in the circular groove. It can be understood that after the mating position and the mating portion are fastened and connected, the heat conducting portion 103 can rotate relative to the housing 101 . In this way, the heat conducting part 103 is fastened and connected with the inserting part through the insertion position, the heat conducting part 103 can be installed on the housing 101 very conveniently, and the heat conducting part 103 can be properly adjusted by rotating the heat conducting part 103 Location.

In order to maintain the electrical connection between the heat conduction portion 103 and the wires on the housing 101 , for example, the mating position is provided with several first conductive sheets. For example, a side of the mating position facing the mating portion is provided with a plurality of first patch slots, and one conductive sheet is accommodated in one of the first patch slots. For example, three first conductive sheets are provided on the surface of the mating position, and the three first conductive sheets are respectively a first positive conductive sheet, a first negative conductive sheet and a first ground conductive sheet. For example, the insertion portion is provided with several second conductive sheets. For example, a side of the insertion part facing the insertion position is provided with a plurality of second patch slots, and one of the second conductive sheets is accommodated in one of the second patch slots. The insertion part is provided with three second conductive sheets, and the three second conductive sheets are respectively a second positive conductive sheet, a second negative conductive sheet and a second ground conductive sheet. After the insertion position is fastened and connected to the insertion portion, the first conductive sheet abuts against the second conductive sheet and is electrically connected. Preferably, the first positive conductive sheet, the first negative conductive sheet and the first ground conductive sheet are sequentially arranged at intervals, and the second positive conductive sheet, the second negative conductive sheet and the second ground conductive sheet are sequentially arranged at intervals. For example, the plug-in position is provided with a first flag in the vicinity of the first positive-stage conductive sheet, and a second flag is provided in the vicinity of the plug-in portion and the second positive-stage conductive sheet. The joint part and the second positive-stage conductive sheet are provided with a second mark, so that when the plug-in position and the plug-in part are fastened and connected, through proper rotation adjustment, the first mark and the second mark The positions coincide, so that the first positive conductive sheet and the second positive conductive sheet are fully abutted and electrically connected, the first negative conductive sheet and the second negative conductive sheet are fully abutted and electrically connected, and the first ground conductive sheet It fully abuts and electrically connects with the second grounding conductive piece. In this way, the heat conduction part 103 can be kept electrically connected to the wires on the casing 101 .

In order to further improve the heat dissipation efficiency of the radiator, referring to FIG. 4 and FIG. 5 , for example, several first heat dissipation fins 105 are arranged on the housing 101 between every two rows of the heat conduction openings 104 . For example, several first cooling fins 105 are distributed in a row. For example, one end of the first heat sink 105 is disposed on the casing 101 , and the other end is suspended in the air. For example, the first heat sink 105 includes a rotating end and a free end. The rotating end is rotatably connected with the housing 101, and the free end is suspended. For example, several rotating slots are opened on the housing 101 between every two rows of the heat conducting ports 104 . One of the first cooling fins 105 is correspondingly arranged in one of the rotating slots. For example, two symmetrical sides of the rotating groove are provided with rotating holes, and one end of the first cooling fin 105 is symmetrically provided with two rotating protrusions, and the rotating protrusions are accommodated in the rotating holes, so that the first cooling fin 105 can rotate on the rotating protrusions. It can rotate relative to the casing 101 under the action. For example, a ferromagnetic material structure 105 a is disposed on the first heat sink 105 , and a magnetic body 105 b is disposed on a region of the housing 101 opposite to the first heat sink 105 . In this embodiment, an iron sheet is disposed on the first heat sink 105 , and a magnetic block is disposed on the area of the housing 101 opposite to the first heat sink 105 . For example, the magnetic block adopts a ferromagnetic material with a Curie point of 50-70°C, so that the magnetic block shows paramagnetism after the temperature of the housing 101 is higher than the temperature of the Curie point, that is to say, the temperature of the housing 101 After the temperature is higher than the Curie point, the magnetic force between the iron sheet and the magnetic block disappears. For example, the first heat sink 105 is also connected to the housing 101 through an elastic member, and the elastic force generated by the elastic member is smaller than the magnetic force generated by the magnetic body 105b on the ferromagnetic body. For example, the elastic member is a spring. For example, the elastic member is a torsion spring, for example, the torsion spring is sleeved on the rotating protrusion, and one end of the torsion spring is fixed on the rotating protrusion, and the other end is fixed in the rotating groove, so that the first cooling fin 105 is elastically rotatably connected to the housing 101 under the action of the torsion spring. In this way, when the heat of the housing 101 accumulates and the temperature of the housing 101 rises above 70° C., the magnetic force between the ferromagnetic material structure 105 a of the first heat sink 105 and the magnetic body 105 b of the housing 101 disappears, and the elasticity Under the action of the elastic force of the component, one end of the first heat sink 105 rotates away from the housing 101, thereby increasing the heat dissipation area of the heat sink and improving the heat dissipation efficiency of the heat sink. When the temperature of the casing 101 drops, the magnetic force between the ferromagnetic material structure 105a of the first cooling fin 105 and the magnetic body 105b of the casing 101 recovers, and under the action of the magnetic force, one end of the first cooling fin 105 approaches the casing 101 Rotate and fit the housing 101 to ensure that the first heat sink 105 is not damaged by external force, so as to improve the product quality of the heat sink.

For example, a heat dissipation area is set on the first heat sink, and the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer are stacked in sequence, that is, the first film layer, the second film layer layer, the third film layer, the fourth film layer and the fifth film layer are successively superimposed and attached on the first heat sink as a heat dissipation area, that is to say, the first film layer is attached to the first heat sink, and the second film layer is attached to the first heat sink. The second film layer is attached to the first film layer, the third film layer is attached to the second film layer, the fourth film layer is attached to the third film layer, and the fifth film layer is attached to the fourth film layer . In another example, the heat dissipation area is disposed on one or both sides of the first heat dissipation fin; in another example, the heat dissipation area is disposed on the entire surface of the first heat dissipation fin.

For example, the first film layer includes the following components by mass: 40-70 parts of silicon carbide, 13-55 parts of aluminum oxide, 2-15 parts of silicon dioxide, and 3-25 parts of binder , 2-20 parts of kaolin, 0.5-2 parts of magnesium oxide, 0.5-2 parts of Dongyang soil, 0.5-2 parts of light calcium and 0.2-0.5% of rare earth oxides.

The above-mentioned first film layer uses silicon carbide as the main raw material, and mixes the rest of the raw materials that can be used to prepare ceramics, so that the above-mentioned first film layer has high thermal conductivity, good insulation performance, low thermal expansion coefficient and high heat resistance. In addition, the above-mentioned first film layer also has the advantages of easy production and low manufacturing cost.

Preferably, the first film layer includes the following components in parts by mass: 50 to 60 parts of silicon carbide, 30 to 50 parts of aluminum oxide, 10 to 15 parts of silicon dioxide, and 10 to 20 parts of binder 15-20 parts of kaolin, 1-1.5 parts of magnesium oxide, 1-1.5 parts of Dongyang soil, 1-1.5 parts of light calcium and 0.3-0.4% of rare earth oxides. Preferably, the first film layer includes the following components in parts by mass: 55 parts of silicon carbide, 40 parts of aluminum oxide, 13 parts of silicon dioxide, 15 parts of binder, 18 parts of kaolin, 1.5 parts of magnesium oxide, Dongyang 1.5 parts of soil, 1.5 parts of light calcium and 0.3 parts of rare earth oxides.

Preferably, the second film layer includes the following components in parts by mass: 85-90 parts of graphene, 5-15 parts of carbon nanotubes and 5-15 parts of carbon nanofibers. Preferably, 90 parts of graphene, 10 parts of carbon nanotubes and 10 parts of carbon nanofibers.

It should be noted that, after the heat of the first heat sink passes through the first two layers, that is, the first film layer and the second film layer, part of the heat will be lost to the outside air. In addition, due to the high cost of the second film layer, the main reason is that the main raw material of the second film layer is graphene with relatively high production cost. Therefore, based on the heat transfer and When the heat dissipation burden is relatively small, the third film layer can use the most commonly used metal heat dissipation material in the market today, so as to achieve the effect of reducing cost and obtaining better heat transfer performance.

Preferably, the third film layer includes the following components in parts by mass: 94 to 96 parts of copper, 3 to 4 parts of aluminum, 0.2 to 0.3 parts of nickel, 0.5 to 1 part of vanadium, and 0.2 to 0 parts of manganese 0.3 parts, 0.2 to 0.3 parts of titanium, 0.2 to 0.3 parts of chromium, and 0.2 to 0.3 parts of vanadium. Preferably, the third film layer includes the following components by mass: 95 parts copper, 3.5 parts aluminum, 0.3 parts nickel, 0.8 parts vanadium, 0.2-0.3 parts manganese, 0.2-0.3 parts titanium, 0.2 parts chromium 0.3 to 0.3 parts and 0.2 to 0.3 parts of vanadium.

For example, the fourth film layer includes the following components by mass: 47-50 parts of copper, 49-52 parts of aluminum, 0.2-0.7 parts of magnesium, 0.2-0.7 parts of iron, 0.2-0.5 parts of manganese, 0.1-0.3 parts of titanium, 0.05-0.1 parts of chromium and 0.1-0.3 parts of vanadium.

Preferably, the fourth film layer includes the following components by mass: 48-49 parts of copper, 50-52 parts of aluminum, 0.2-0.5 parts of magnesium, 0.2-0.5 parts of iron, 0.3-0.3 parts of manganese 0.5 parts, 0.2 to 0.3 parts of titanium, 0.05 to 0.08 parts of chromium, and 0.2 to 0.3 parts of vanadium. Preferably, the fourth film layer includes the following components by mass: 48 parts copper, 51 parts aluminum, 0.3 parts magnesium, 0.3 parts iron, 0.4 parts manganese, 0.4 parts titanium, 0.08 parts chromium and 0.3 parts vanadium.

In order to further reduce the weight of the fourth film layer and obtain a better heat dissipation effect, for example, the present invention also provides an auxiliary fourth film layer, and the auxiliary fourth film layer is arranged at a distance from the fourth film layer One side of the third film layer.

For example, the auxiliary fourth film layer includes the following components in parts by mass: 88 to 93 parts of aluminum, 5.5 to 10.5 parts of silicon, 0.3 to 0.7 parts of magnesium, 0.05 to 0.3 parts of copper, and 0.2 to 0.8 parts of iron , 0.2-0.5 parts of manganese, 0.05-0.3 parts of titanium, 0.05-0.1 parts of chromium, and 0.05-0.3 parts of vanadium. It should be noted that after the heat of the first heat sink passes through the first four layers, namely the first film layer, the second film layer, the third film layer and the fourth film layer, a large part The heat has been lost to the outside air. Therefore, based on the fact that the heat dissipation burden of the fifth film layer is relatively small, and the temperature itself is low, and the influence caused by a large thermal expansion coefficient is minimal, the third film layer can use the most commonly used film in the market today. Plastic materials to achieve cost and weight reduction, as well as better surface protection performance.

Preferably, the fifth film layer includes the following components by mass: 30-35 parts of graphite, 25-30 parts of carbon fiber, 45-50 parts of polyamide, and 15-20 parts of water-soluble silicate , 4-6 parts of hexagonal boron nitride, 3-4 parts of bismaleimide, 1-1.5 parts of silane coupling agent, 0.5-1 part of antioxidant. Preferably, the fifth film layer includes the following components by mass: 35 parts of graphite, 28 parts of carbon fiber, 45 parts of polyamide, 18 parts of water-soluble silicate, 5 parts of hexagonal boron nitride, bismaleyl 3.5 parts of imine, 1.8 parts of silane coupling agent, and 0.7 parts of antioxidant.

In order to better optimize the heat conduction and heat dissipation pathways of the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer, therefore, comprehensive In consideration of cost, weight, heat conduction and heat dissipation effects, and surface protection performance, the second film layer, the third film layer, the fourth film layer and the fifth film layer according to an embodiment of the present invention The layer thickness ratio is 1-1.5:8-12:5-7:6-10:2-2.5, so that the first film layer, the second film layer, the third film layer, the The heat conduction and heat dissipation paths of the fourth film layer and the fifth film layer are more optimized.

In order to make each layer structure, that is, the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer be better fixed together, to improve Structural stability performance, for example, the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer are arranged between two adjacent interfaces There are cogs and cogs. When two adjacent layers are bonded together, the cogs are embedded in the cogs, so that each layer structure of the first heat sink, that is, the first film layer, the The second film layer, the third film layer, the fourth film layer and the fifth film layer are better fixed together to improve structural stability. As another example, buckles are provided between adjacent interfaces of the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer And the card slot, when the adjacent two-layer structure is bonded, the buckle is embedded in the card slot, so that each layer structure of the first heat sink, that is, the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer are better fixed together to further improve structural stability performance.

In this way, by sequentially stacking the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer, good insulation, low expansion coefficient, large thermal conductivity, good heat dissipation effect and quality can be obtained. Light advantage.

For example, please refer to FIG. 1 and FIG. 6 together. The LED lamp 20 of the living room lamp includes: a radiator 10 , a radiator 201 , several circuit boards 202 and several LED chips 203 . For example, the heat sink 10 includes: a casing 101, a heat conductor 102 and a plurality of heat conduction parts 103. The heat conduction part 103 is disposed on the heat conduction body 102, and one heat conduction part 103 corresponds to one heat conduction port 104; On one side, one heat sink 201 is correspondingly arranged on one of the heat conducting parts 103; one of the heat sink 201 is correspondingly provided with at least one of the circuit boards 202; one of the circuit boards 202 is provided with at least one of the LED chips 203 . For example, the heat conduction part 103 is provided with a conductive part on the side facing away from the heat conduction port 104, and the heat sink 201 is provided with a conduction position, and the conduction part is in contact with the conduction position, and the two are electrically connected, so that The heat conduction part 103 is electrically connected to the heat sink 201 . For example, the heat sink 201 is provided with a bonding position, and the circuit board 202 is disposed at the bonding position. For example, a heat sink 201 is correspondingly provided with a circuit board 202 , and the circuit board 202 is electrically connected to the conductive potential. For example, one heat sink 201 is provided with two circuit boards 202 correspondingly, the two circuit boards 202 are connected in series, and one circuit board 202 is electrically connected to the conductive potential. For example, one said circuit board 202 is provided with one said LED chip 203 . For example, the heat conduction part 103 is provided with a first magnet, the heat sink 201 is provided with a second magnet, and the heat conduction part 103 is magnetically connected to the heat sink 201 . For example, the first magnet is in the shape of a ring. For example, the first magnet is disposed on the heat conduction portion 103 near the periphery of the heat conduction opening 104 . For example, the first magnet is arranged coaxially with the heat conduction port 104 .

In order to facilitate the disassembly and assembly of the heat sink 201 , for example, the side of the heat conduction portion 103 facing away from the heat conduction port 104 is provided with the mounting position, and the heat sink 201 is disposed at the mount position. For example, the heat sink 201 is provided with a mounting portion on a side facing the heat conduction port 104 , and the mounting portion is fixed at the mounting position. For example, the installation part and the installation position are made of aluminum alloy. For example, the installation position is an internal threaded hole, the installation part is a screw cylinder head, and the installation part is screwed and fixed to the installation position. In another example, the installation position is a pin hole, the installation part is a cylindrical pin, and the installation part is pin-connected to the installation position. For example, a third conductive sheet is provided on the mounting position, a fourth conductive sheet is provided on the heat sink 201 , and the third conductive sheet abuts and is electrically connected to the fourth conductive sheet. For example, a thread groove is provided on the installation position, and the two sides of the third conductive piece are concavo-convex to each other to form several parallel curves. The shape of the thread groove is equal to that of the third conductive piece. The depth of the groove is equal to the thickness of the third conductive sheet, and the third conductive sheet is accommodated in the thread groove, and several parallel curves are spliced with the remaining internal threads on the installation position to form a complete thread. For example, a screw groove is provided on the cylindrical head of the screw, and both sides of the fourth conductive sheet are concavo-convex to form several parallel curves. The shape of the screw groove is equal to that of the fourth conductive sheet. The depth of the groove is equal to the thickness of the fourth conductive sheet. For example, the height of the screw cylinder head is equal to the depth of the screw groove, and the third conductive piece is located in the middle of the screw groove, and the fourth conductive piece is located in the middle of the screw cylinder head. When the mounting portion is screwed and fixed to the mounting position, the third conductive piece abuts against and is electrically connected to the fourth conductive piece. For example, the third conductive sheet is connected to an external power source through other wires. It can be understood that the third conductive sheet includes at least positive and negative electrodes insulated from each other. In this way, while it is convenient for users to disassemble or install the heat sink 201 , the electrical connection between the heat sink 201 and the external power supply can be fully ensured.

In order to facilitate the installation of the circuit board 202 to the heat sink 201, for example, the side of the heat sink 201 facing away from the heat conducting part 103 is provided with a bonding position, and the circuit board 202 is installed on the bonding position . For example, the adhesive position is provided with an adhesive layer, and the adhesive layer is used for applying thermally conductive adhesive. The circuit board 202 is bonded to the bonding position by a thermally conductive adhesive. In this way, the circuit board 202 can be conveniently mounted to the heat sink 201 through a thermally conductive adhesive. For example, a matrix is provided with several bonding positions, and each bonding position is protrudingly provided with an adhesive layer, and the protruding end of the adhesive layer is provided with a groove layer, and a heat-conducting adhesive is arranged in the groove layer, for example, the groove layer is smeared to set a heat-conducting adhesive. adhesive.

In order to make the thermally conductive adhesive have better thermal conductivity, for example, the thermally conductive adhesive is carbon fiber reinforced epoxy thermally conductive adhesive. The carbon fiber reinforced epoxy thermally conductive adhesive includes the following components by mass: carbon fiber: 25-38 parts, graphite: 9-13 parts, tin: 10-15 parts, copper: 5-8 parts, aluminum powder: 45-65 parts Parts, polybutadiene-based polyurethane: 25 to 35 parts.

As another example, the carbon fiber reinforced epoxy thermally conductive adhesive includes the following components by mass: carbon fiber: 26-37 parts, graphite: 10-12 parts, tin: 11-14 parts, copper: 6-7 parts, aluminum powder: 46-60 parts, polybutadiene-based polyurethane: 26-30 parts.

As another example, the above-mentioned carbon fiber reinforced epoxy thermally conductive adhesive includes the following components by mass: carbon fiber: 30-32 parts, graphite: 11-12 parts, tin: 12-13 parts, copper: 6-8 parts, aluminum powder: 50-55 parts, polybutadiene-based polyurethane: 28-29 parts.

The above-mentioned combinations are composed of carbon fiber reinforced epoxy thermally conductive adhesive, which has excellent thermal conductivity, and can conduct the heat on the circuit board 202 to the heat sink 201 in time. At the same time, it has high bonding strength, which greatly avoids wiring The phenomenon of cracking and delamination after the board 202 is packaged in the heat sink 201 occurs.

In order to improve the heat dissipation efficiency of the heat sink 201, for example, the heat sink 201 is provided with several second heat sinks. For example, the second heat sink is made of aluminum alloy. For example, the second heat sink is made of thermally conductive graphite material. For example, the second heat sink is copper. For example, several second heat sinks are distributed on the heat sink 201 in a matrix. As another example, one end of several second heat sinks arranged on the heat sink 201 is also coated with heat-conducting silica gel, which can conduct the heat on the heat sink 201 around the second heat sink to the second heat sink, thereby quickly The heat on the heat sink 201 is transferred to the second heat sink efficiently, so as to improve the heat dissipation efficiency of the heat sink 201 .

In order to package the LED chip 203 on the circuit board 202 conveniently, for example, one circuit board 202 is provided with one LED chip 203 . As another example, one circuit board 202 is provided with three LED chips 203 . For example, three LED chips 203 are distributed on the circuit board 202 in a row. For example, the LED chip 203 and the circuit board 202 are packaged by surface mount, so that the packaged structure is miniaturized, and at the same time, problems such as brightness, viewing angle, flatness, permeability, and consistency are well solved. Also, lighter PCB board and reflective layer materials can be used. This allows for less epoxy to fill the display reflective layer and removes the heavier carbon steel pins. In this way, by reducing the size, the packaging is simple, and the weight can also be reduced. The weight of the product can be easily reduced by half, making the application range wider.

To facilitate the installation of the heat sink 201 , for example, the heat conduction part 103 is provided with a first magnet, the heat sink 201 is provided with a second magnet, and the heat conduction part 103 is magnetically connected to the heat sink 201 . That is to say, through the magnetic connection between the first magnet and the second magnet, the heat sink 201 can be increased or decreased according to actual user requirements. Especially suitable for users who need to change the light intensity from time to time. For example, the first magnet is in the shape of a ring. For example, the first magnet is disposed on the heat conduction portion 103 near the periphery of the heat conduction opening 104 . For example, the first magnet is arranged coaxially with the heat conduction port 104 . For example, the heat sink 201 is provided with a connection groove on the side facing the heat conduction portion 103 , the inner diameter of the connection groove is larger than the outer diameter of the heat conduction portion 103 , and the connection groove is used to accommodate the heat conduction portion 103 , and after the connection groove accommodates the heat conduction part 103 , the edge of the connection groove abuts against the housing 101 . For example, the second magnet is in the shape of a ring. For example, the second magnet is disposed on a side of the heat sink 201 facing the heat conduction portion 103 , for example, the second magnet is disposed on a periphery of the connecting groove. The heat sink 201 is combined with the heat conducting part 103 through the magnetic connection between the first magnet and the second magnet. In this way, the heat sink 201 can be fixed on the heat conduction part 103 under the action of the magnetic force, and when the heat sink 201 needs to be disassembled, it only needs to be greater than the magnetic force, which is convenient for users to disassemble.

In order to maintain the electrical connection between the magnetically connected heat conduction portion 103 and the heat sink 201 , for example, the heat conduction portion 103 is provided with several third conductive sheets. For example, the side of the heat conducting part 103 facing the heat sink 201 is provided with a plurality of third patch slots, and one conductive sheet is accommodated in one of the third patch slots. For example, three third conductive sheets are provided on the surface of the heat conducting part 103 , and the three third conductive sheets are respectively a third positive conductive sheet, a third negative conductive sheet and a third ground conductive sheet. For example, the heat sink 201 is provided with several fourth conductive sheets. For example, the side of the heat sink 201 facing the heat conducting portion 103 is provided with a plurality of fourth patch slots, and one fourth conductive sheet is accommodated in one of the fourth patch slots. The heat sink 201 is provided with three fourth conductive sheets, and the three fourth conductive sheets are respectively a fourth positive conductive sheet, a fourth negative conductive sheet and a fourth ground conductive sheet. After the heat conducting part 103 is connected to the heat sink 201 , the third conductive sheet abuts against the fourth conductive sheet and is electrically connected. Preferably, the third positive conductive sheet, the third negative conductive sheet and the third ground conductive sheet are arranged at intervals in sequence, and the fourth positive conductive sheet, the fourth negative conductive sheet and the fourth ground conductive sheet are arranged at intervals in sequence. For example, the heat conduction part 103 is provided with a third marking position in the vicinity of the third positive conductive sheet, and the heat sink 201 and the fourth positive conductive sheet are provided with a fourth marking position. 201 and the fourth positive-stage conductive sheet are provided with a fourth mark, so that when the heat conduction part 103 and the heat sink 201 are fastened and connected, through proper rotation adjustment, the third mark and the fourth mark overlap, so that the third positive conductive sheet is fully abutted and electrically connected to the fourth positive conductive sheet, the third negative conductive sheet is fully abutted and electrically connected to the fourth negative conductive sheet, the third ground conductive sheet is The fourth ground conductive piece is fully abutted and electrically connected. In this way, the electrical connection between the heat conduction part 103 and the wires on the housing 101 can be fully maintained.

In order to intelligently control the brightness and parameters of the LED lamp 20, for example, one heat sink 201 is correspondingly provided with two circuit boards 202, the two circuit boards 202 are connected in series, one circuit board 202 is connected to the conductive electrical connections. As another example, one heat sink 201 is correspondingly provided with two circuit boards 202 , the two circuit boards 202 are connected in parallel, and one circuit board 202 is electrically connected to the conductive potential. For example, each of the two circuit boards 202 is provided with a control chip. For example, the two control chips are programmed with two control programs for lighting the LED lamp 20 and the color temperature of the LED in a non-erasable manner. Preferably, a constant current drive circuit is used to drive the LED lamp 20 . For example, the lighting procedure includes: turning off all the LED lights 20 , then turning on each LED light 20 in sequence, and finally turning on all the LED lights 20 . For example, the color temperature control program includes: dark red-light red-orange-white-blue etc. gradually changing. It should be noted that the color temperature of the LED lamp 20 is mainly determined by the phosphor powder blending during LED packaging, or the color temperature can be changed by secondary phosphor powder spraying on the light transmission cover of the lamp. In this way, the purpose of intelligently controlling the brightness and parameters of the LED lamp 20 can be achieved.

In order to enable the LED lamp 20 to automatically adjust the color temperature as the ambient temperature changes, for example, the LED lamp 20 includes a first controller, and the first controller includes: a thermistor, a control chip and a constant current module. For example, the thermistor is an NTC negative temperature coefficient thermistor. For example, the control chip is an STC12C5404AD single-chip intelligent control unit. For example, the constant current module is a PT4115 constant current module. For example, the thermistor is connected to the control chip, the control chip is connected to several constant current modules, and the several constant current modules are respectively connected to several LED lamps 20 with different color temperatures. For example, the working principle of automatic color temperature adjustment is as follows: the control chip collects temperature sensing parameters in real time, judges the temperature change of the current environment according to this parameter, and outputs PWM pulse signals with different duty ratios to control the constant current module to output different average currents. Different currents drive lamp beads with different color temperatures, and their brightness will change, and after mixing, lights with corresponding color temperatures will be formed. Therefore, the first controller of the LED lamp 20 can control the color temperature of the LED lamp, so that the LED lamp 20 can be automatically adjusted as the ambient temperature changes.

For example, please refer to FIG. 6 and FIG. 7 together. The light bar 30 of the living room lamp includes: several LED lamps 20 and connecting pieces 301 connecting each of the LED lamps 20. The LED lamp 20 includes: a radiator 10, Heat sink 201, a number of circuit boards 202 and a number of LED chips 203, the heat sink 10 includes: a housing 101, a heat conductor 102 and a number of heat conduction parts 103, the housing 101 is provided with a number of heat conduction ports 104, the heat conductor 102 is arranged in the housing 101, a plurality of the heat conducting parts 103 are arranged on the heat conducting body 102, and one of the heat conducting parts 103 corresponds to one of the heat conducting ports 104; the heat sink 201 is arranged on the On the side of the heat conduction part 103 facing away from the heat conduction port 104, one of the heat sinks 201 is correspondingly arranged on one of the heat conduction parts 103; one of the heat sink 201 is correspondingly provided with at least one of the circuit boards 202; The circuit board 202 is provided with at least one LED chip 203 ; each of the casings 101 is provided with a connecting piece 301 , and each of the LED lamps 20 is sequentially connected through a connecting piece 301 . For example, each of the LED lamps 20 is sequentially connected into strips through a connecting piece 301 . For example, the connecting element 301 is a magnetic element. For example, the casing 101 is also provided with a through hole, and the heat conductor 102 is accommodated in the through hole. For example, the housing 101 is provided with two covers, and the covers are used to cover the through holes. For example, the cover body is aluminum alloy. For example, the cross-sectional area of the cover is equal to the cross-sectional area of the housing 101 . For example, the connecting member 301 is a ring. For example, the connecting member 301 is arranged coaxially with the through hole. For example, the connecting member 301 is disposed on the cover near the through hole. For example, the cover is in contact with the heat conductor 102 .

In order to facilitate the connection of several LED lamps 20 into the light bar 30 through the connecting piece 301, as shown in FIG. Both sides of the body 301a. For example, the main body 301a and the two joint parts 301b are integrally formed. For example, the joint portion 301b defines a second groove 301c. For example, the housing 101 is a cylinder. For example, the inner diameter of the second groove 301c is equal to the outer diameter of the cylinder. One side of the casing 101 is received in the second groove 301c. For example, a connection portion is provided on one side of the housing 101 . A first connection position is disposed in the second groove 301c. After one side of the casing 101 is accommodated in the second groove 301c, the connecting portion is engaged with the first connecting position. For example, the connecting element 301 is a magnetic element. For example, the second groove 301c is provided with a third magnet, one side of the housing 101 is provided with a fourth magnet, and the second groove 301c is magnetically connected to the housing 101 . That is to say, through the magnetic connection between the third magnet and the fourth magnet, the length of the light bar 30 can be realized by increasing or decreasing the length of the LED lamp 20 according to actual user requirements. For example, the third magnet is in the shape of a ring. For example, the third magnet is disposed on the engaging portion 301b near the periphery of the second groove 301c. For example, the third magnet is arranged coaxially with the second groove 301c. For example, the housing 101 is provided with a connection protrusion on the side facing the joint portion 301b, the outer diameter of the connection protrusion is larger than the outer diameter of the second groove 301c, and the connection protrusion is accommodated in the joint The second groove 301c of the part 301b, and after the connection protrusion is received in the joint part 301b, the edge of the connection protrusion abuts against the inner wall of the second groove 301c. For example, the fourth magnet is in the shape of a ring. For example, the fourth magnet is disposed on a side of the casing 101 facing the joint portion 301b, for example, the fourth magnet is disposed on a peripheral edge of the connecting protrusion. The housing 101 is combined with the joint portion 301b through the magnetic connection between the third magnet and the fourth magnet. In this way, the housing 101 can be fixed on the joint portion 301b under the action of the magnetic force, and when the housing 101 needs to be disassembled, it only needs to have a force greater than the magnetic force, which is convenient for users to disassemble.

In order to maintain the electrical connection between the magnetically connected connector 301 and the housing 101 , for example, the connector 301 is provided with several fifth conductive sheets. For example, a side of the connector 301 facing the housing 101 is provided with a plurality of fifth patch slots, and one conductive sheet is accommodated in one of the fifth patch slots. For example, three fifth conductive sheets are provided on the surface of the connector 301 , and the three fifth conductive sheets are respectively the fifth positive conductive sheet, the fifth negative conductive sheet and the fifth ground conductive sheet. For example, the housing 101 is provided with several sixth conductive sheets. For example, a side of the housing 101 facing the connector 301 is provided with a plurality of sixth patch slots, and one of the sixth conductive sheets is accommodated in one of the sixth patch slots. The casing 101 is provided with three sixth conductive sheets, and the three sixth conductive sheets are respectively the sixth positive conductive sheet, the sixth negative conductive sheet and the sixth ground conductive sheet. After the connecting member 301 is connected to the housing 101 , the fifth conductive sheet abuts against the sixth conductive sheet and is electrically connected. Preferably, the fifth positive conductive sheet, the fifth negative conductive sheet and the fifth ground conductive sheet are arranged at intervals in sequence, and the sixth positive conductive sheet, the sixth negative conductive sheet and the sixth ground conductive sheet are arranged at intervals in sequence. For example, the connector 301 is provided with a fifth marking position in the vicinity of the fifth positive conductive sheet, and the housing 101 and the sixth positive conductive sheet are provided with a sixth marking position, for example, in the housing 101 101 and the sixth positive-stage conductive sheet are provided with a sixth marking position, so that when the connector 301 is snap-fitted with the housing 101, through proper rotation adjustment, the fifth marking position and the sixth marking position overlap, so that the fifth positive conductive sheet is fully abutted and electrically connected to the sixth positive conductive sheet, the fifth negative conductive sheet is fully abutted and electrically connected to the sixth negative conductive sheet, the fifth ground conductive sheet is The sixth ground conductive sheet is fully abutted and electrically connected. In this way, the connecting member 301 can be kept in electrical connection with the wires on the housing 101 .

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A living room lamp, characterized in that it comprises: an installation body and a plurality of light strips, a plurality of the light strips are installed on the installation body, The light bar includes: several LED lights and connectors connecting the LED lights, The LED lamp includes: a radiator, a radiator, several circuit boards and several LED chips, The heat sink includes: a shell, a heat conductor, and a number of heat conduction parts. The shell is provided with a number of heat conduction openings, the heat conductor is arranged in the shell, and the heat conductors are arranged on the heat conductor. And, one of the heat conduction parts corresponds to one of the heat conduction openings; The heat dissipation element is arranged on the side of the heat conduction part facing away from the heat conduction port, and one heat dissipation element is correspondingly arranged on one of the heat conduction parts; one heat dissipation element is correspondingly provided with at least one circuit board; The circuit board is provided with at least one LED chip; Each of the casings is provided with a connecting piece, and each of the LED lamps is sequentially connected through a connecting piece. 2 . The living room lamp according to claim 1 , wherein the installation body is provided with several installation grooves, and one of the light bars is installed in one of the installation grooves. 3. The living room lamp according to claim 2, characterized in that, a buckle position is provided in the installation groove, the light bar is provided with a buckle part, and the buckle position is fastened with the buckle part . 4. The living room lamp according to claim 3, characterized in that it comprises four light bars, and the installation body is correspondingly provided with four installation grooves. 5. The lamp for living room according to claim 1, characterized in that, the installation body is provided with a diffusion plate matched with the installation groove. 6 . The living room lamp according to claim 5 , wherein the diffuser plate is installed on the periphery of the installation groove to cover the installation groove. 7 . 7. The living room lamp according to claim 6, characterized in that, the notch of the installation groove is circular, and the diffusion plate is circular. 8. The living room lamp according to claim 7, wherein the area of the diffusion plate is 1.5 times the cross-sectional area of the notch of the installation groove. 9. The living room lamp according to claim 1, characterized in that, the edge of the diffusion plate is provided with a buckle, and the notch of the installation groove is provided with a buckle, and the buckle is connected to the The buckle part is snap-fit connection. 10. The living room lamp according to claim 9, wherein the diffuser plate is a polycarbonate plate.