CN104795341B - A kind of chip thermal pressure detection method, system and packaging by hot pressing control system - Google Patents
A kind of chip thermal pressure detection method, system and packaging by hot pressing control system Download PDFInfo
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- CN104795341B CN104795341B CN201510179525.0A CN201510179525A CN104795341B CN 104795341 B CN104795341 B CN 104795341B CN 201510179525 A CN201510179525 A CN 201510179525A CN 104795341 B CN104795341 B CN 104795341B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0028—Force sensors associated with force applying means
- G01L5/0038—Force sensors associated with force applying means applying a pushing force
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Abstract
The invention discloses a kind of chip thermal pressure detection method, comprise the following steps：(1) the annular indentation image that the circular salient point of chip is caused on antenna after collection hot pressing；(2) profile and centre point of annular impression are extracted in indentation image；(3) profile is circumferentially evenly dividing as multiple arc sections；(4) width of each arc section is asked for；(5) the width weighed summation to each arc section obtains indentation width.Present invention also offers the hot pressing force detection system based on the above method and chip packaging by hot pressing control system, corresponding Stress control instruction is produced according to the deviation between the indentation width and target indentation width detected, to adjust thermal pressure of the thermal head device to chip.The present invention characterizes pressure size by indentation width, according to indentation width deviation adjusting air pressure size, so as to ensure that pressure is consistent, improves hot pressing precision and end properties.
Description
Technical field
The invention belongs to technical field of electronic encapsulation, it is related to a kind of chip thermal pressure detection method, system and packaging by hot pressing
Control system.
Background technology
Heat pressing process is an important ring for RFID tag packaging technology, and the function of hot-pressing system is real by temperature and pressure
Existing chip and substrate are reliably connected, and hot pressing effect directly influences end properties parameter.Suitable temperature and pressure can be with
Ensure package quality, improve end properties.
It is suitable to the hot-pressing system with RFID tag sealed in unit at present, it is most of all to realize hot pressing temperature closed-loop control,
But the control for hot pressing pressure is general by the way of open loop or semiclosed loop.The U of Publication No. CN 202695395 China
Patent proposes that a kind of RFID tag that is used for encapsulates hot-press arrangement, the device using constant pressure cylinder action on heating head, the program
It only ensure that the pressure acted on heating head keeps constant, it is impossible to ensure that the pressure that heating head is acted on chip keeps permanent
It is fixed, thus cause hot pressing control accuracy not high, the homogeneity of product produced is poor, the problem of yield is low.
The content of the invention
The stable defect of hot pressing pressure can not be realized for the existing hot-pressing system for RFID tag sealed in unit, this
Invention proposes a kind of chip thermal pressure detection method, system and packaging by hot pressing control system, it is intended that passing through indentation width
Characterize pressure size, according to indentation width deviation adjusting air pressure size, so as to ensure that pressure is consistent, improve hot pressing precision and into
Moral character energy.
A kind of chip thermal pressure detection method, comprises the following steps：
(1) the annular indentation image that the circular salient point of chip is caused on antenna after collection hot pressing；
(2) profile of annular impression is extracted in indentation image；
(3) profile is circumferentially evenly dividing as multiple arc sections；
(4) width of each arc section is asked for；
(5) the width weighed summation to each arc section obtains indentation widthIn formula, niRepresent to constitute i-th
The pixel number of individual arc section, M represents the pixel number of composition profile, and N represents the number of arc section, hiRepresent i-th
The width of arc section；
(6) according to indentation width, with reference to the indentation width demarcated in advance and thermal pressure relation, conversion obtains thermal pressure.
Further, the step (2) is specially：The edge point set A and circle of annular impression are extracted in indentation image
Heart point O1；By the point in point set A relative to centre point O1Do polar coordinate transform and obtain the point set B under polar coordinate system r- θ, calculate
In point set B r coordinates a little average valueBy r coordinates and average value in point set BDifference absolute value be more than predetermined threshold
Value Y point is rejected；
The step (3) is specially：θ coordinates are divided into distribution of the point in N number of region, statistics point set B in each region,
Obtain N number of subset B for representing to constitute N number of arc section1,B2…BN；
The step (4) is specially：The width of i-th of arc sectionThe outline of i-th of arc section to circle
The distance of heart pointFor i-th subset BiIn outline point to the average value of centre point distance, the lubrication groove of i-th of arc section
Exterior feature arrives the distance of centre pointFor i-th subset BiIn Internal periphery point to centre point distance average value；
In the step (5), the pixel number n for constituting i-th of arc sectioniFor i-th subset BiAt midpoint
Number, constitutes the pixel number M of profile to complete the number at point set B midpoints after rejecting processing.
A kind of chip hot pressing force detection system, including：
XY motion platforms, the linear motion for performing plane X and Y-direction；
Back light, is fixed on XY motion platforms, for providing light source for indentation image collection；
Image collecting device, is fixed on XY motion platforms, for gathering the circular salient point of chip after hot pressing in antenna
The annular indentation image caused；
Impression detection unit, its input connects the output end of image collecting device, including：
Profile extraction module, profile and centre point for extracting annular impression in indentation image；
Profile division module, for being circumferentially evenly dividing profile for multiple arc sections；
Arc section width calculation module, the width for asking for each arc section；
Indentation width computing module, indentation width is obtained for the width weighed summation to each arc section
In formula, niThe pixel number of i-th of arc section of composition is represented, M represents to constitute the pixel number of profile, and N represents arc section
Number, hiRepresent the width of i-th of arc section；
Thermal pressure conversion module, for according to indentation width, with reference to the indentation width demarcated in advance and thermal pressure relation, changing
Calculation obtains thermal pressure.
Further,
The profile extraction module includes extracting sub-module and noise spot rejects submodule；Extracting sub-module is used in impression
Edge the point set A and centre point O of annular impression are extracted in image1；Noise spot, which rejects submodule, to be used for the point phase in point set A
For centre point O1Do polar coordinate transform and obtain the point set B under polar coordinate system r- θ, calculate in point set B r coordinates a little
Average valueBy r coordinates and average value in point set BDifference absolute value be more than predetermined threshold Y point rejected；
The profile division module includes region division submodule and distribution statisticses submodule, and region division submodule is used for
θ coordinates are divided into N number of region, the point that distribution statisticses submodule is used to count in point set B is represented in the distribution in each region
Constitute N number of subset B of N number of arc section1,B2…BN；
The arc section width calculation module, the width for calculating i-th of arc sectionI-th of arc section
Outline to centre point distanceFor i-th subset BiIn outline point to centre point distance average value, i-th
Distance of the Internal periphery of arc section to centre pointFor i-th subset BiIn Internal periphery point to centre point distance average value；
The indentation width computing module, indentation width is obtained for the width weighed summation to each arc sectionWherein, the pixel number n of i-th of arc section is constitutediFor i-th subset BiThe number at midpoint, constitutes wheel
The number at point set B midpoints after wide pixel number M is handled for completion rejecting.
A kind of chip packaging by hot pressing control system, including：
XY motion platforms, the linear motion for performing plane X and Y-direction；
Back light, is fixed on XY motion platforms, for providing light source for indentation image collection；
Image collecting device, is fixed on XY motion platforms, for gathering the circular salient point of chip after hot pressing in antenna
The annular indentation image caused；
Impression detection unit, its input connects the output end of image collecting device, for from annular indentation image
Detect indentation width；
Impression assessment unit, for calculating the deviation between the indentation width detected and target indentation width；
Hot pressing control system, for producing corresponding Stress control instruction according to impression deviation, to adjust thermal head device
To the thermal pressure of chip；
Thermal head device, for performing the hot pressing to chip；
The impression detection unit includes：
Profile extraction module, profile and centre point for extracting annular impression in indentation image；
Profile division module, for being circumferentially evenly dividing profile for multiple arc sections；
Arc section width calculation module, the width for asking for each arc section；
Indentation width computing module, indentation width is obtained for the width weighed summation to each arc section
In formula, niThe pixel number of i-th of arc section of composition is represented, M represents to constitute the pixel number of profile, and N represents arc section
Number, hiRepresent the width of i-th of arc section.
Further,
The profile extraction module includes extracting sub-module and noise spot rejects submodule；Extracting sub-module is used in impression
Edge the point set A and centre point O of annular impression are extracted in image1；Noise spot, which rejects submodule, to be used for the point phase in point set A
For centre point O1Do polar coordinate transform and obtain the point set B under polar coordinate system r- θ, calculate in point set B r coordinates a little
Average valueBy r coordinates and average value in point set BDifference absolute value be more than predetermined threshold Y point rejected；
The profile division module includes region division submodule and distribution statisticses submodule, and region division submodule is used for
θ coordinates are divided into N number of region, the point that distribution statisticses submodule is used to count in point set B is represented in the distribution in each region
Constitute N number of subset B of N number of arc section1,B2…BN；
The arc section width calculation module, the width for calculating i-th of arc sectionI-th of arc section
Outline to centre point distanceFor i-th subset BiIn outline point to centre point distance average value, i-th
Distance of the Internal periphery of arc section to centre pointFor i-th subset BiIn Internal periphery point to centre point distance average value；
The indentation width computing module, indentation width is obtained for the width weighed summation to each arc sectionWherein, the pixel number n of i-th of arc section is constitutediFor i-th subset BiThe number at midpoint, constitutes wheel
The number at point set B midpoints after wide pixel number M is handled for completion rejecting.
Further, in addition to parallelism evaluation module, for calculating the difference in height Δ g between two impressionsmn=
γ(Hm-Hn), if Δ gmnMore than predetermined value, then judge that working face needs to carry out depth of parallelism adjustment；In formula, Hm、HnIs represented respectively
The m width with n-th of impression, γ represents the proportionality coefficient between indentation width and the hot press working face depth of parallelism.
The advantageous effects of the present invention are embodied in：
The present invention characterizes pressure size using indentation width, compared to directly gathering thermal pressure size, it is to avoid the pressure of complexity
Force acquisition device, more convenient operation, reliability is high.Subsequently can be according to indentation width deviation adjusting air pressure size, so as to ensure pressure
Power is consistent, improves hot pressing precision and end properties.This method treatment effeciency is high, and hardware cost is low, can be widely applied to RFID
Tag Packaging equipment.
Brief description of the drawings
Fig. 1 is the overall flow figure of chip packaging by hot pressing control method of the present invention；
Fig. 2 is the general structure schematic diagram of chip packaging by hot pressing control system of the present invention；
Fig. 3 is that the indentation feature of the present invention extracts the method flow diagram with evaluating；
Fig. 4 is that the indentation feature of the present invention extracts the effect diagram with evaluating；
Fig. 5 is the indentation image that image collecting device of the invention is collected.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with accompanying drawing, the present invention is entered
Row is further described.If it is described herein as when being related to instantiation only to explain the present invention, do not limit the present invention.
As shown in figure 1, the overall flow of chip packaging by hot pressing control method of the present invention is：The image of impression is gathered first,
Next to that extracting the feature of impression, the deviation of indentation feature and desired value is then calculated according to impression appraisal procedure, impression is assessed
It is whether suitable by evaluating hot pressing pressure to indentation width deviation：Impression in image is in annular, and the width of annulus reflects
The size of hot pressing pressure, but the width of annulus everywhere may be inconsistent；Impression evaluation model along the circumferential direction divides impression
Several circular arcs are segmented into, the arc section width characteristics are obtained by asking for the difference between the arc section inside and outside contour and Internal periphery
Value.The weighted average of the width characteristics value of each section of circular arc sector is asked for, in this, as the width of impression；It will finally detect
Deviation between indentation width and target indentation width feeds back to hot-pressing system and carries out pressure adjustment.
Fig. 2 is a kind of general structure schematic diagram of chip packaging by hot pressing control system detected based on impression of the present invention.
The system mainly includes image collecting device 1, back light 2, XY motion platforms 4, impression detecting system 5, hot pressing control system
6th, thermal head device.3 represent chip.Image collecting device 1 is arranged on XY motion platforms 4 with back light 2, the figure collected
As being handled by impression detecting system 5, result feeds back to Pneumatic controller 6, by hot pressing control system 6 to thermal head
The cylinder air pressure of lower thermal head 7 is adjusted in device, realizes hot pressing pressure adjust automatically.Impression detecting system 5 includes impression
Detection unit and impression assessment unit, impression detection unit are used to detect indentation width, impression from annular indentation image
Assessment unit is used to calculate the deviation between the indentation width detected and target indentation width.
Fig. 3 is a kind of embodiment flow chart that impression detection unit of the present invention extracts indentation width feature, and it is wrapped
Include：Image enhaucament improves picture contrast, and (step is not required, and be may be selected when picture quality is poor using to improve image
Contrast)；Extract indentation edge point set；Extract the central coordinate of circle of impression；Indentation edge point is subjected to pole relative to its center of circle
Coordinate transform；Indentation feature extraction is carried out according to the obtained point set after conversion.
Specifically, image enhancement operation is carried out first, and present invention preferably uses the figure based on local mean value and standard deviation
Image intensifying algorithm is handled indentation image, by the pixel (i on indentation image0,j0) gray value x (i0,j0) pass through base
After the algorithm for image enhancement of local mean value and standard deviation is handled, its gray value h (i0,j0) be changed into
In formulaRepresent with point (i0,j0) centered on P × P window areas in have gray value average value, σ
(i0,j0) represent there is the standard deviation of a gray value in the window area.
As shown in figure 4, after image enhancement operation is completed, obtaining after the enhanced image 201 of feature, you can carry out edge
Detection and centre point, which are extracted, obtains indentation feature 202.Rim detection is used can Sobel operators, Canny operators, Prewitt operators
Etc. method；The central coordinate of circle of impression can be using methods such as Hough transform, orthogonal scanning method, Threshold segmentation extraction methods.
Afterwards, the marginal point of impression is subjected to polar coordinate transform relative to the center of circle, obtains one group of point set under polar coordinates
B203, carries out rejecting operation to point set B first：Calculate in point set B r coordinates a little average valueR in point set B is sat
Mark and average valueDifference absolute value be more than threshold value Y point rejected.
Then, θ coordinates are divided into N number of region, count the point in point set B in the distribution in each region, obtain N number of subset
B1,B2…BN.Specifically a kind of embodiment is the present invention：Point set B is arranged by θ coordinate values ascending order, will press θ coordinate values in B
Progress is divided into N number of subset B1,B2…BN, i-th of subset BiIn point θ coordinates θiMeet (i-1) * 2 π/N≤θi＜ i*2 π/
N.Ascending order arrangement is not limited to, descending arrangement also may be used.
Finally, the equivalent width of impression is calculated：
In formula, niRepresent i-th subset BiThe number at midpoint, M represents the number at point set B midpoints after completion rejecting processing,
I-th subset BiWidth characteristics value For i-th subset BiIn outline point to centre point distance
Average value,For i-th subset BiIn Internal periphery point to centre point distance average value.
According to impression equivalent width, the deviation δ of itself and desired width is calculated：
In formula, h is the desired value of indentation width, and the desired value of indentation width is otherwise varied according to different working conditions,
Desired value need to be determined according to the trial production before batch production.
Impression deviation is finally fed back into hot-pressing system and carries out pressure adjustment
As shown in Fig. 2 hot pressing control section includes only showing thermal head in hot pressing control system 6 and thermal head device, figure
Lower thermal head 7 and upper thermal head 8 in device.After the completion of indentation feature is extracted, the deviation δ of result and desired value is fed back into heat
In pressure control system 6, hot pressing control system adjustment gas circuit air pressure realizes the pressure change of lower thermal head 7, the gas circuit of hot-pressing system
Air pressure adjusted value Δ P is：
Δ P=δ Pa
In formula, PaFor gas circuit initialization pressure.
As shown in figure 5, a total of two impressions in the image collected, the equivalent width of two impressions may be unequal,
This is due to that the hot press working face depth of parallelism has deviation, and the hot press working face depth of parallelism can be evaluated according to the feature of two impressions
And adjust in real time.Difference in height between impression is：
Δgmn=γ (Hm-Hn)
In formula, Δ gmnRepresent the difference in height of m-th of impression and n-th of impression, Hm、HnM-th and n-th impression of expression
Equivalent width, γ represents the proportionality coefficient between indentation width and hot press working face height, and γ value can be obtained by demarcation.
If described above be related to specific example, only to explain the present invention, the present invention is not intended to limit, it is all in the present invention
Spirit and principle within any modifications, equivalent substitutions and improvements for being made etc., should be included in protection scope of the present invention it
It is interior.
Claims (7)
1. a kind of chip thermal pressure detection method, it is characterised in that comprise the following steps：
(1) the annular indentation image that the circular salient point of chip is caused on antenna after collection hot pressing；
(2) profile of annular impression is extracted in indentation image；
(3) profile is circumferentially evenly dividing as multiple arc sections；
(4) width of each arc section is asked for；
(5) the width weighed summation to each arc section obtains indentation widthIn formula, niRepresent to constitute i-th of circle
The pixel number of segmental arc, M represents the pixel number of composition profile, and N represents the number of arc section, hiRepresent i-th of circular arc
The width of section；
(6) according to indentation width, with reference to the indentation width demarcated in advance and thermal pressure relation, conversion obtains thermal pressure.
2. chip thermal pressure detection method according to claim 1, it is characterised in that
The step (2) is specially：Edge the point set A and centre point O of annular impression are extracted in indentation image1；By point set A
In point relative to centre point O1Do polar coordinate transform and obtain the point set B under polar coordinate system r- θ, calculate in point set B institute a little
R coordinates average valueBy r coordinates and average value in point set BDifference absolute value be more than predetermined threshold Y point carry out
Reject；
The step (3) is specially：θ coordinates are divided into N number of region, the point in point set B is counted in the distribution in each region, obtains
Represent N number of subset B of the N number of arc section of composition1,B2…BN；
The step (4) is specially：The width of i-th of arc sectionThe outline of i-th of arc section is to centre point
DistanceFor i-th subset BiIn outline point to the average value of centre point distance, the Internal periphery of i-th of arc section arrives
The distance of centre pointFor i-th subset BiIn Internal periphery point to centre point distance average value；
In the step (5), the pixel number n for constituting i-th of arc sectioniFor i-th subset BiThe number at midpoint,
The pixel number M of profile is constituted to complete the number at point set B midpoints after rejecting processing.
3. a kind of chip hot pressing force detection system, it is characterised in that including：
XY motion platforms, the linear motion for performing plane X and Y-direction；
Back light, is fixed on XY motion platforms, for providing light source for indentation image collection；
Image collecting device, is fixed on XY motion platforms, and the circular salient point for gathering chip after hot pressing is caused on antenna
Annular indentation image；
Impression detection unit, its input connects the output end of image collecting device, including：
Profile extraction module, profile and centre point for extracting annular impression in indentation image；
Profile division module, for being circumferentially evenly dividing profile for multiple arc sections；
Arc section width calculation module, the width for asking for each arc section；
Indentation width computing module, indentation width is obtained for the width weighed summation to each arc sectionIn formula,
niThe pixel number of i-th of arc section of composition is represented, M represents to constitute the pixel number of profile, and N represents of arc section
Number, hiRepresent the width of i-th of arc section；
Thermal pressure conversion module, for according to indentation width, with reference to the indentation width demarcated in advance and thermal pressure relation, converting
To thermal pressure.
4. chip hot pressing force detection system according to claim 3, it is characterised in that
The profile extraction module includes extracting sub-module and noise spot rejects submodule；Extracting sub-module is used in indentation image
Middle edge the point set A and centre point O for extracting annular impression1；Noise spot reject submodule be used for by the point in point set A relative to
Centre point O1Do polar coordinate transform and obtain the point set B under polar coordinate system r- θ, calculate in point set B r coordinates a little be averaged
ValueBy r coordinates and average value in point set BDifference absolute value be more than predetermined threshold Y point rejected；
The profile division module includes region division submodule and distribution statisticses submodule, and region division submodule is used for θ
Coordinate is divided into N number of region, and distribution statisticses submodule is used to count distribution of the point in point set B in each region, obtains representing structure
Into N number of subset B of N number of arc section1,B2…BN；
The arc section width calculation module, the width for calculating i-th of arc sectionI-th arc section it is outer
Distance of the profile to centre pointFor i-th subset BiIn outline point to the average value of centre point distance, i-th of circular arc
Distance of the Internal periphery of section to centre pointFor i-th subset BiIn Internal periphery point to centre point distance average value；
The indentation width computing module, indentation width is obtained for the width weighed summation to each arc section
Wherein, the pixel number n of i-th of arc section is constitutediFor i-th subset BiThe number at midpoint, constitutes the pixel of profile
The number at point set B midpoints after number M is handled for completion rejecting.
5. a kind of chip packaging by hot pressing control system, it is characterised in that including：
XY motion platforms, the linear motion for performing plane X and Y-direction；
Back light, is fixed on XY motion platforms, for providing light source for indentation image collection；
Image collecting device, is fixed on XY motion platforms, and the circular salient point for gathering chip after hot pressing is caused on antenna
Annular indentation image；
Impression detection unit, its input connects the output end of image collecting device, for being detected from annular indentation image
Go out indentation width；
Impression assessment unit, for calculating the deviation between the indentation width detected and target indentation width；
Hot pressing control system, for producing corresponding Stress control instruction according to impression deviation, to adjust thermal head device to core
The thermal pressure of piece；
Thermal head device, for performing the hot pressing to chip；
The impression detection unit includes：
Profile extraction module, profile and centre point for extracting annular impression in indentation image；
Profile division module, for being circumferentially evenly dividing profile for multiple arc sections；
Arc section width calculation module, the width for asking for each arc section；
Indentation width computing module, indentation width is obtained for the width weighed summation to each arc sectionIn formula,
niThe pixel number of i-th of arc section of composition is represented, M represents to constitute the pixel number of profile, and N represents of arc section
Number, hiRepresent the width of i-th of arc section.
6. chip packaging by hot pressing control system according to claim 5, it is characterised in that
The profile extraction module includes extracting sub-module and noise spot rejects submodule；Extracting sub-module is used in indentation image
Middle edge the point set A and centre point O for extracting annular impression1；Noise spot reject submodule be used for by the point in point set A relative to
Centre point O1Do polar coordinate transform and obtain the point set B under polar coordinate system r- θ, calculate in point set B r coordinates a little be averaged
ValueBy r coordinates and average value in point set BDifference absolute value be more than predetermined threshold Y point rejected；
The profile division module includes region division submodule and distribution statisticses submodule, and region division submodule is used for θ
Coordinate is divided into N number of region, and distribution statisticses submodule is used to count distribution of the point in point set B in each region, obtains representing structure
Into N number of subset B of N number of arc section1,B2…BN；
The arc section width calculation module, the width for calculating i-th of arc sectionI-th arc section it is outer
Distance of the profile to centre pointFor i-th subset BiIn outline point to the average value of centre point distance, i-th of circular arc
Distance of the Internal periphery of section to centre pointFor i-th subset BiIn Internal periphery point to centre point distance average value；
The indentation width computing module, indentation width is obtained for the width weighed summation to each arc section
Wherein, the pixel number n of i-th of arc section is constitutediFor i-th subset BiThe number at midpoint, constitutes the pixel of profile
The number at point set B midpoints after number M is handled for completion rejecting.
7. the chip packaging by hot pressing control system according to claim 5 or 6, it is characterised in that also parallel including working face
Evaluation module is spent, for calculating the difference in height Δ g between two impressionsmn=γ (Hm-Hn), if Δ gmnMore than predetermined value, then judge
Working face needs to carry out depth of parallelism adjustment；In formula, Hm、HnThe width of m-th and n-th impression is represented respectively, and γ represents that impression is wide
Proportionality coefficient between degree and the hot press working face depth of parallelism.
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2015
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| TW418476B (en) * | 1999-03-02 | 2001-01-11 | Winbond Electronics Corp | Apparatus and method for measuring the pressure distribution on the wafer surface |
| US6477447B1 (en) * | 1999-07-28 | 2002-11-05 | Winbond Electronics, Corp. | Methods to generate numerical pressure distribution data for developing pressure related components |
| CN1383198A (en) * | 2001-04-24 | 2002-12-04 | 华邦电子股份有限公司 | Pressure distribution measuring and feedback method for pressure part acting on surface of chip |
| CN103316954A (en) * | 2013-01-16 | 2013-09-25 | 宝钢不锈钢有限公司 | Cold-strip steel quality improving method using automatic pressure control method to eliminate impressions |
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