CN104793080A - Method for testing single event effect of on-chip system - Google Patents

Method for testing single event effect of on-chip system Download PDF

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CN104793080A
CN104793080A CN201510182629.7A CN201510182629A CN104793080A CN 104793080 A CN104793080 A CN 104793080A CN 201510182629 A CN201510182629 A CN 201510182629A CN 104793080 A CN104793080 A CN 104793080A
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chip
test
particle effect
soc
single particle
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杜雪成
刘书焕
贺朝会
张瑶
杜欣
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Xian Jiaotong University
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Xian Jiaotong University
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Abstract

The invention discloses a method for testing single event effect of an on-chip system. The method includes: dynamically testing single event effect of a register, a high-speed data cache D-cache, an integer operation unit ALU, a floating-point operation unit FPU, direct memory access DMA, an off-chip memory, an on-chip memory and a peripheral unit in a microprocessor of the on-chip system; mainly testing the above function modules dynamically, namely testing occurrence number of single event effect, error data and working current changing condition of the function modules in irradiation environment. By the method, single event effect of different function modules inside the on-chip system can be tested online accurately.

Description

A kind of SOC (system on a chip) single particle effect test method
Technical field
The invention belongs to single particle effect field tests, be specifically related to a kind of SOC (system on a chip) single particle effect test method.
Background technology
Digital circuitry, in space radiation environment, due to the effect of irradiation of cosmic rays and high energy particle, likely causes the semiconductor devices of system to produce single particle effect, has a strong impact on the reliability of digital circuitry, validity and serviceable life.The functional requirement that SOC (system on a chip) (SoC) is different according to it contains the bus system of different digital circuits, mimic channel, Peripheral Interface and complexity, and volume is little, quality is light, frequency is high, functional, therefore it has certain using value at aerospace field.But dimensions of semiconductor devices is more and more less and operating voltage is more and more lower, and all mean and more easily produce single particle effect, and SOC (system on a chip) is by a single die integrated for multiple functional module, type of error will be more complicated, and measuring method is also more complicated.Therefore, unified method of testing is not yet had for the test of SOC (system on a chip) (SoC) single particle effect.
For the SOC (system on a chip) of space application, the sensitive blocks of its inside should be specified, adopt certain method to carry out nuclear hardening, make its meeting spatial application demand.Therefore, the functional module on-line testing different to SOC (system on a chip) inside is needed, based on ground single particle effect simulated experiment.
Summary of the invention
In order to solve above-mentioned prior art Problems existing, the object of the present invention is to provide a kind of SOC (system on a chip) single particle effect test method, the single particle effect of the inner difference in functionality module of online accurately testing on-chip system can be carried out.
For reaching above object, the present invention adopts following technical scheme:
A kind of SOC (system on a chip) single particle effect test method, comprises and on-chip memory outer to the register in SOC (system on a chip) microprocessor, data cache D-cache, integer arithmetic unit ALU, Float Point Unit FPU, direct memory access DMA, sheet and peripheral unit carries out single particle effect dynamic test;
Described method of testing comprises the steps:
Step 1: put up test macro before irradiation test, comprise the functional test template being arranged on host computer in master-control room and testing current module and being arranged between irradiation, described testing current module comprises MSP430, amplifying circuit and sampling resistor R, and described functional test template comprises SoC test board and chip; ; Described testing current module, mainly by being amplified through amplifying circuit by the voltage on sampling resistor R, then becomes current value through AD conversion and corresponding reduction of operation; Described host computer is connected with the USB-UART line of test board by USB extended line, sampling resistor R is connected on the power lead of+5V of host computer USB extended line inside, amplifying circuit by the voltage on sampling resistor through amplification after, by MAP430 single-chip microcomputer through AD conversion and related operation, current value exports on upper computer software the most at last;
Step 2: by the number of times of upper computer selecting test module and test, described test module comprises the outer and on-chip memory of register in SOC (system on a chip) microprocessor, data cache D-cache, integer arithmetic unit ALU, Float Point Unit FPU, direct memory access DMA, sheet and peripheral unit; One or more above-mentioned test module in loop test SOC (system on a chip) in irradiation process;
Step 3: whether the function detecting test module is normal, and all test results are kept in daily record, comprise current value;
Step 4: stop test when irradiation fluence or accumulative single particle effect frequency reach requirement;
Step 5: open daily record, mistake of statistics result.
Describedly single particle effect dynamic test is carried out to the register in SOC (system on a chip) microprocessor comprise the steps:
1) initial value of tested register is preserved in external memory storage;
2) carry out assignment operation when irradiation to tested register, after assignment completes, the currency of save register is in external memory storage;
3) register value tested in external memory storage and the value composed are compared, if two values are not identical, then illustrate and there occurs single particle effect;
4) test terminates, and tested register returns initial value;
5) host computer record particle effect occur number of times and misdata.
Describedly single particle effect dynamic test is carried out to the data cache D-cache in SOC (system on a chip) microprocessor comprise the steps:
1) during irradiation, assignment is carried out to data cache D-Cache, by the data write external memory storage in D-Cache after assignment completes;
2) new value is write to data cache D-Cache, then make the value of new write invalid, value known in external memory storage is re-write in data cache D-Cache;
3) whether be value in external memory storage, if not identical, illustrate that data cache D-Cache inside there occurs single particle effect if comparing value in data cache D-Cache;
The number of times that host computer record particle occurs and misdata.
Describedly single particle effect dynamic test is carried out to the integer arithmetic unit ALU in SOC (system on a chip) microprocessor comprise the steps:
1) during irradiation, integer arithmetic unit ALU performs mathematical operation, logical operation and shift operation;
2) result of above-mentioned computing and result correct during non-irradiation are compared, if result is inconsistent, illustrate that integer arithmetic unit (ALU) there occurs single particle effect;
3) host computer record particle effect occur number of times and misdata.
Describedly single particle effect dynamic test is carried out to the Float Point Unit FPU in SOC (system on a chip) microprocessor comprise the steps:
1) during irradiation, system performs fast Fourier change (FFT) computing;
2) operation result during above-mentioned irradiation and operation result correct during non-irradiation are compared, if result is inconsistent, illustrate that Float Point Unit FPU there occurs single particle effect;
3) host computer record particle effect occur number of times and misdata.
Describedly single particle effect dynamic test is carried out to the direct memory access DMA in SOC (system on a chip) microprocessor comprise the steps:
1) all passages in initialization direct memory access DMA;
2) external memory storage is divided into the data storage area of two formed objects, full given data is write in one of them memory block;
3) open direct memory access DMA during irradiation, the data of a memory block are delivered to another one memory block;
4) contrast the data of two memory blocks, if find, data are different, then illustrate and there occurs single event;
5) host computer record particle effect occur number of times and misdata.
It is described that to the sheet in SOC (system on a chip) microprocessor, outer and on-chip memory carries out single particle effect dynamic test and comprises the steps:
1) memory data within the scope of initialization known address;
2) continuous writing and reading data outside sheet and in on-chip memory during irradiation;
3) compare write data and sense data, if different, illustrate that sheet is outer and on-chip memory is inner and there occurs single particle effect;
4) number of times of host computer record particle effect generation, the data of mistake and misaddress.
Describedly single particle effect dynamic test is carried out to the peripheral unit in SOC (system on a chip) microprocessor comprise the steps:
1) assignment is carried out to the control register of peripheral hardware part, then read rreturn value and compare, if rreturn value is different from composed value, then this peripheral unit generation single particle effect is described;
2) host computer record make mistakes peripheral unit, error status and single particle effect occur number of times.
Opening WatchDog Timer during test, automatically reseting when there is program determination or system crash in SOC (system on a chip) test process, restart test.
Compared to the prior art comparatively, the present invention possesses following advantage:
(1) SOC (system on a chip) (SoC) inner structure is complicated, functional module is more, therefore current less about SOC (system on a chip) single particle effect test method, compared to existing technology, the present invention can the testing functional module multiple on sheet of system, to the element of SOC (system on a chip) test more comprehensive.The single particle effect of disparate modules is tested, the disparate modules susceptibility of SOC (system on a chip) can be evaluated objectively, for SOC (system on a chip) capability of resistance to radiation is assessed.
(2) the present invention is easy to connect, automaticity is higher, can detect the operating mode of test board under radiation environment quickly and easily, and convenient data processing, host computer has carried out mathematical statistics to the result of test, tester directly can obtain the result and concrete test duration information of repeatedly testing, can reduce in a large number experiment carry out before preliminary work, and time of data processing after off-test.
Accompanying drawing explanation
Fig. 1 is a kind of SOC (system on a chip) single particle effect test method of the present invention ingredient.
Fig. 2 is a kind of SOC (system on a chip) single particle effect test method of the present invention host computer management software functional diagram
Fig. 3 is a kind of SOC (system on a chip) single particle effect test method of the present invention control flow chart
Fig. 4 is a kind of SOC (system on a chip) single particle effect test method of the present invention slave computer test procedure functional diagram.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is described in further detail.
As shown in Figure 1, describe several ingredients of method of testing of the present invention, comprise PC control unit, testing current module and slave computer SoC test board.Computer run PC control software in figure in master-control room, current detecting unit, mainly by amplifying through amplifying circuit the voltage on sampling resistor R, then by after the conversion of MSP430 Chip Microcomputer A/D, draws working current value through converting.Test board is positioned between irradiation, and during test, irradiation bomb is perpendicular to SoC chip.
As shown in Figure 2, be several major functions of host computer management software.Comprise serial ports configuration, test mode configures, and test-types configures, and testing process controls, log management, serial communication, protocal analysis and detecting information statistics.By upper computer software configuration slave computer test board, select test mode, comprise test module and testing time.The whole testing process of PC control, after test terminates, test result is kept in daily record automatically.
As shown in Figure 3, be the control flow of SOC (system on a chip) single particle effect test method of the present invention:
Step 1: put up test macro before irradiation test, comprise the functional test template being arranged on host computer in master-control room and testing current module and being arranged between irradiation, described testing current module comprises MSP430, amplifying circuit and sampling resistor R, and described functional test template comprises SoC test board and chip; Described testing current module, mainly by being amplified through amplifying circuit by the voltage on sampling resistor R, then becomes current value through AD conversion and corresponding reduction of operation; Host computer is connected with the USB-UART line of test board by USB extended line, sampling resistor R is connected on the power lead of+5V of USB extended line inside, amplifying circuit by the voltage on sampling resistor through amplification after, by MAP430 single-chip microcomputer through AD conversion and related operation, current value exports on upper computer software the most at last;
Step 2: by the number of times of upper computer selecting test module and test, described test module comprises the outer and on-chip memory of register in SOC (system on a chip) microprocessor, data cache D-cache, integer arithmetic unit ALU, Float Point Unit FPU, direct memory access DMA, sheet and peripheral unit; One or more above-mentioned test module in loop test SOC (system on a chip) in irradiation process;
Step 3: whether the function detecting test module is normal, and all test results are kept in daily record, comprise current value;
Step 4: stop when the number of times that irradiation fluence or accumulative single particle effect occur reaches requirement test (until errors number more than 100 or irradiation fluence more than 1 × 10 7individual/cm 2);
Step 5: open daily record, mistake of statistics result.
As shown in Figure 4, for the function of the testing software of slave computer test board, a mainly content measurement for SOC (system on a chip) single particle effect test method, comprises comprising outside register, data cache (D-Cache), integer arithmetic unit (ALU), Float Point Unit (FPU), direct memory access (DMA), sheet and on-chip memory, FPGA (Field Programmable Gate Array) and peripheral unit.As shown in Figure 1, the ingredient of whole test macro.Dynamic test is realized to wherein each module.
The single particle effect test of register is dynamic test, comprises the following steps: preserve the initial value of tested register in test process in external memory storage; Carry out assignment operation to tested register during irradiation, after assignment completes, the currency of save register is in external memory storage; The value of register tested in external memory storage and the value composed are compared; If be worth inconsistent, then illustrate and single event occurs; After once having tested, return register initial value.Circulation performs test, until stop test when error number or irradiation fluence reach requirement.The method is such as utilized to test general-purpose registers such as R0, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12 and the R14 in ARM core in Xilinx Zynq-7010SoC.Test process is: the initial value of this register in save routine operational process; 0xFF is loaded to these registers, namely writes numerical value; The value of scratchpad register being read is kept in external memory storage; The value contrasting register in external memory storage and the value composed; Test terminates the initial value of rear return register, logging test results.
Data cache (D-Cache) single particle effect test in SOC (system on a chip), during irradiation, assignment is carried out to data cache D-Cache, after assignment completes, the data in data cache D-Cache are saved in external memory storage, then the data in data cache D-Cache are changed, make the current data in data cache D-Cache invalid, then the data be kept in external memory storage are turned back in data cache D-Cache.The major function of this test to data cache D-Cache detects, and judges that whether data cache D-cache is normal.Such as, when Xilinx Zynq SoC high speed data buffer storage D-cache being tested, Cache Flush and Cache Invalid instruction can be used, the write of data cache D-cache and read out function are detected.
Integer arithmetic unit (ALU) single particle effect is tested, in irradiation process, mathematical operation, logical operation, shift operation etc. are performed to integer arithmetic unit (ALU), the operation result of the integer arithmetic unit (ALU) after contrast predose, records the data of makeing mistakes and the number of times of makeing mistakes.
Float Point Unit (FPU) single particle effect is tested, and performs fast Fourier change (FFT) test, test result after inspection predose, record error data and number of times of makeing mistakes.
In sheet and the test of chip external memory single particle effect, to the storer assignment operation within the scope of specified address during irradiation, can carry out part storage space assignment for on-chip memory, chip external memory can whole assignment; Value in readout memory contrasts; Add up the data and fault address of makeing mistakes.Such as XilinxZynq-7010SoC chip, can test 256KB storer center 64KB in sheet, and the outer 1G storer of sheet is tested, and each address assignment 0xFFFFFFFF or 0xAAAAAAAA during test, write reads contrast, statistics.
Direct memory access (DMA) single particle effect is tested, and comprises the following steps: all passages in initialization direct memory access DMA, are divided into the data storage area of 2 formed objects by external memory storage; Full given data is write in one of them memory block; Open DMA to realize data and be transported to another one memory block; Numerical value relatively in two memory blocks, statistics error data.Such as Xilinx Zynq-7010SoC chip, opens 8 passages of wherein DMA, realizes data from the carrying between memory to memory, checks the data of makeing mistakes in irradiation process.
Whether peripheral hardware single particle effect is tested, mainly by after the control register assignment operation of different peripheral, read rreturn value, detect peripheral hardware and normally work.
Opening WatchDog Timer in test macro, can automatically reset when there is program determination or system crash in system testing process, restart test.
Above embodiment is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to scope, and scope of patent protection proper right of the present invention requires to limit.

Claims (9)

1. a SOC (system on a chip) single particle effect test method, is characterized in that: comprise and on-chip memory outer to the register in SOC (system on a chip) microprocessor, data cache D-cache, integer arithmetic unit ALU, Float Point Unit FPU, direct memory access DMA, sheet and peripheral unit carries out single particle effect dynamic test;
Described method of testing comprises the steps:
Step 1: put up test macro before irradiation test, comprise the functional test template being arranged on host computer in master-control room and testing current module and being arranged between irradiation, described testing current module comprises MSP430, amplifying circuit and sampling resistor R, and described functional test template comprises SoC test board and chip; Described testing current module, mainly by being amplified through amplifying circuit by the voltage on sampling resistor R, then becomes current value through AD conversion and corresponding reduction of operation; Described host computer is connected with the USB-UART line of SoC test board by USB extended line, sampling resistor R is connected on the power lead of+5V of host computer USB extended line inside, amplifying circuit by the voltage on sampling resistor through amplification after, by MAP430 single-chip microcomputer through AD conversion and corresponding computing, current value exports on upper computer software the most at last;
Step 2: by the number of times of upper computer selecting test module and test, described test module comprises the outer and on-chip memory of register in SOC (system on a chip) microprocessor, data cache D-cache, integer arithmetic unit ALU, Float Point Unit FPU, direct memory access DMA, sheet and peripheral unit; One or more above-mentioned test module in loop test SOC (system on a chip) in irradiation process;
Step 3: whether the function detecting test module is normal, and all test results are kept in daily record, comprise current value;
Step 4: stop test when the number of times that irradiation fluence or accumulative single particle effect occur reaches requirement;
Step 5: open daily record, mistake of statistics result.
2. a kind of SOC (system on a chip) single particle effect test method according to claim 1, is characterized in that: describedly carry out single particle effect dynamic test to the register in SOC (system on a chip) microprocessor and comprise the steps:
1) initial value of tested register is preserved in external memory storage;
2) carry out assignment operation to tested register during irradiation, after assignment completes, the currency of save register is in external memory storage;
3) register value tested in external memory storage and the value composed are compared, if two values are not identical, then illustrate and there occurs single particle effect;
4) test terminates, and tested register returns initial value;
5) host computer record particle effect occur number of times and misdata.
3. a kind of SOC (system on a chip) single particle effect test method according to claim 1, is characterized in that: describedly carry out single particle effect dynamic test to the data cache D-cache in SOC (system on a chip) microprocessor and comprise the steps:
1) during irradiation, assignment is carried out to data cache D-Cache, by the data write external memory storage in data cache D-Cache after assignment completes;
2) new value is write to data cache D-Cache, then make the value of new write invalid, value known in external memory storage is re-write in data cache D-Cache;
3) whether be value in external memory storage, if not identical, illustrate that data cache D-Cache inside there occurs single particle effect if comparing value in data cache D-Cache;
Host computer record particle effect frequency and misdata.
4. a kind of SOC (system on a chip) single particle effect test method according to claim 1, is characterized in that: describedly carry out single particle effect dynamic test to the integer arithmetic unit ALU in SOC (system on a chip) microprocessor and comprise the steps:
1) during irradiation, integer arithmetic unit ALU performs mathematical operation, logical operation and shift operation;
2) result of above-mentioned computing and correct result are compared, if result is inconsistent, illustrate that integer arithmetic unit (ALU) there occurs single particle effect;
3) host computer record particle effect frequency and misdata.
5. a kind of SOC (system on a chip) single particle effect test method according to claim 1, is characterized in that: describedly carry out single particle effect dynamic test to the Float Point Unit FPU in SOC (system on a chip) microprocessor and comprise the steps:
1) during irradiation, system performs fast Fourier change FFT computing;
2) operation result during above-mentioned irradiation and operation result correct during non-irradiation are compared, if result is inconsistent, illustrate that Float Point Unit FPU there occurs single particle effect;
3) host computer record particle effect frequency and misdata.
6. a kind of SOC (system on a chip) single particle effect test method according to claim 1, is characterized in that: describedly carry out single particle effect dynamic test to the direct memory access DMA in SOC (system on a chip) microprocessor and comprise the steps:
1) all passages in initialization direct memory access DMA;
2) external memory storage is divided into the data storage area of two formed objects, full given data is write in one of them memory block;
3) open direct memory access DMA during irradiation, the data of a memory block are delivered to another one memory block;
4) contrast the data of two memory blocks, if find, data are different, then illustrate and there occurs single particle effect;
5) host computer record particle effect occur number of times and misdata.
7. a kind of SOC (system on a chip) single particle effect test method according to claim 1, is characterized in that: described to the sheet in SOC (system on a chip) microprocessor, outer and on-chip memory carries out single particle effect dynamic test and comprises the steps:
1) memory data within the scope of initialization known address;
2) continuous writing and reading data outside sheet and in on-chip memory during irradiation;
3) compare write data and sense data, if different, illustrate that sheet is outer and on-chip memory is inner and there occurs single particle effect;
4) data of host computer record particle effect frequency, mistake and misaddress.
8. a kind of SOC (system on a chip) single particle effect test method according to claim 1, is characterized in that: describedly carry out single particle effect dynamic test to the peripheral unit in SOC (system on a chip) microprocessor and comprise the steps:
1) assignment is carried out to the control register of peripheral hardware part, then read rreturn value and compare, if rreturn value is different from composed value, then this peripheral unit generation single particle effect is described;
2) host computer record make mistakes peripheral unit, error status and single particle effect occur number of times.
9. a kind of SOC (system on a chip) single particle effect test method according to claim 1, is characterized in that: open WatchDog Timer during test, automatically resets when there is program determination or system crash in SOC (system on a chip) test process, restarts test.
CN201510182629.7A 2015-04-16 2015-04-16 Method for testing single event effect of on-chip system Pending CN104793080A (en)

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CN107045464A (en) * 2017-04-05 2017-08-15 北京时代民芯科技有限公司 A kind of SPARC frameworks spatial processor neutron effect test test system
CN107045464B (en) * 2017-04-05 2020-03-27 北京时代民芯科技有限公司 Neutron effect test system for SPARC (space-time processor) architecture
CN108226748B (en) * 2017-12-05 2020-01-31 上海精密计量测试研究所 Single event effect test method for SoC system on chip
CN108226748A (en) * 2017-12-05 2018-06-29 上海精密计量测试研究所 For the single particle effect test method of SoC systems on chip
CN108535626A (en) * 2017-12-29 2018-09-14 北京时代民芯科技有限公司 A kind of full-automatic testing device and method of the test of SOC single-particles
CN108535626B (en) * 2017-12-29 2021-06-08 北京时代民芯科技有限公司 Full-automatic test device and method for SOC single particle test
CN110400577A (en) * 2019-06-26 2019-11-01 华南理工大学 Audio analysis method, system and storage medium based on neutron irradiation
CN110361618A (en) * 2019-08-07 2019-10-22 中国科学院新疆理化技术研究所 One kind being used for cmos image sensor single event latch-up effect test method
CN111599402A (en) * 2020-04-15 2020-08-28 深圳市国微电子有限公司 Single event effect test analysis method, device and test system for memory
CN111781445A (en) * 2020-06-22 2020-10-16 西安交通大学 System and method for testing radiation total dose and electromagnetic interference synergistic damage effect
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CN112216336B (en) * 2020-08-28 2024-04-30 珠海欧比特宇航科技股份有限公司 Memory single particle testing method and system
CN112349339A (en) * 2020-11-09 2021-02-09 中国工程物理研究院电子工程研究所 System and method for remotely and dynamically testing instantaneous ionizing radiation effect of memory
CN112349339B (en) * 2020-11-09 2023-07-28 中国工程物理研究院电子工程研究所 System and method for remote dynamic test of instantaneous ionizing radiation effect of memory

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Application publication date: 20150722