CN104658947B - Wafer cleaning apparatus - Google Patents

Wafer cleaning apparatus Download PDF

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Publication number
CN104658947B
CN104658947B CN 201410853888 CN201410853888A CN104658947B CN 104658947 B CN104658947 B CN 104658947B CN 201410853888 CN201410853888 CN 201410853888 CN 201410853888 A CN201410853888 A CN 201410853888A CN 104658947 B CN104658947 B CN 104658947B
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wafer
means
cleaning
sleeve
drive means
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CN 201410853888
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Chinese (zh)
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CN104658947A (en )
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王振荣
刘红兵
陈概礼
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上海新阳半导体材料股份有限公司
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Abstract

本发明公开了一种晶圆清洗装置,其特征在于,包括:清洗槽;所述清洗槽设有容腔;晶圆支撑装置;所述晶圆支撑装置设置在所述容腔内,用于支撑晶圆;喷头;所述喷头可朝向晶圆喷射液体或气体地设置。 The present invention discloses a wafer cleaning apparatus, characterized by comprising: a cleaning tank; the cleaning bath is provided with the cavity; wafer support means; said wafer support means disposed within the cavity of, for supporting a wafer; head; the ejection nozzle can be liquid or gas toward the wafer is provided. 本发明提供晶圆清洗装置,可对晶圆进行清洗处理,自动化程度大,生产效率高,对晶圆的清洗效果好、清洗良品率高。 The present invention provides a wafer cleaning apparatus for cleaning the wafer may be processed, a large degree of automation, high efficiency, good cleaning effect of the wafer, cleaning yield rate.

Description

晶圆清洗装置 Wafer cleaning apparatus

技术领域 FIELD

[0001]本发明涉及晶圆制造领域,特别涉及一种晶圆清洗装置。 [0001] The present invention relates to the field of wafer fabrication, particularly to a wafer cleaning apparatus.

背景技术 Background technique

[0002] 晶圆(Wafer)是指硅半导体集成电路制作所用的硅晶片,由于其形状为圆形,故称为晶圆。 [0002] wafer (Wafer) refers to a silicon wafer a silicon semiconductor integrated circuit fabrication used, since it is circular in shape, it is called a wafer. 晶圆加工过程中,需根据需要去除晶圆表面的有机物、颗粒、金属杂质、自然氧化层、石英、塑料等污染物,且不破坏晶片表面特性。 Wafer processing is necessary, the wafer surface is necessary to remove organic contaminants, particles, metal impurities, native oxide, quartz, plastic or the like, and does not damage the surface properties of the wafer. 如晶圆电镀后,需对晶圆进行清洗以去除晶圆表面残留的电镀液,避免电镀液对晶圆产生影响,降低晶圆品质,同时也避免电镀液对下一道工序产生污染。 The wafer after the plating, the wafer needs to be cleaned to remove the plating solution remaining on the surface of the wafer, to avoid affecting the plating solution to the wafer, the wafer quality reduction, but also to avoid contamination of the plating solution next step.

发明内容 SUMMARY

[0003] 本发明的目的是为了克服现有技术中的不足,提供一种可对晶圆进行清洗的晶圆清洗装置。 [0003] The object of the present invention is to overcome the deficiencies of the prior art, wafer cleaning apparatus may be provided for cleaning the wafers.

[0004] 为实现以上目的,本发明通过以下技术方案实现: [0004] To achieve the above object, the present invention is achieved by the following technical solution:

[0005] 晶圆清洗装置,其特征在于,包括: [0005] Wafer cleaning apparatus, characterized by comprising:

[0006] 清洗槽;所述清洗槽设有容腔; [0006] The cleaning tank; the cleaning bath is provided with the cavity;

[0007] 晶圆支撑装置;所述晶圆支撑装置设置在所述容腔内,用于夹持晶圆; [0007] wafer support apparatus; said wafer support means disposed within said receiving cavity for holding the wafer;

[0008] 喷头;所述喷头可朝向晶圆喷射液体或气体。 [0008] head; the ejection nozzle can be a liquid or gas toward the wafer.

[0009] 优选地是,所述喷头与所述晶圆支撑装置可相对移动地设置。 [0009] Preferably, the head and the wafer support means disposed relatively movable.

[0010] 优选地是,还包括第一驱动装置;所述第一驱动装置驱动所述晶圆支撑装置做升降运动或通过第一传动装置驱动所述晶圆支撑装置做升降运动。 [0010] Preferably, further comprising a first drive means; a first driving means for driving said wafer support means do or do lifting movement by the lifting movement of the first drive means for driving said wafer support means.

[0011] 优选地是,所述第一驱动装置为第一气缸或第一伺服电机。 [0011] Preferably, said first drive means to a first or a first cylinder servo motor.

[0012] 优选地是,还包括第二驱动装置;所述第二驱动装置驱动所述晶圆支撑装置转动或通过第二传动装置驱动所述晶圆支撑装置转动。 [0012] Preferably, further comprising a second drive means; the second drive means for driving said support means for rotating the wafer or wafer support means rotatably driven by said second transmission means.

[0013] 优选地是,所述第二驱动装置为第二气缸或第二伺服电机;所述第二伺服电机的第二电机主轴与所述晶圆支撑装置连接。 [0013] Preferably, the second drive means is a second air cylinder or a second servo motor; a second servomotor and the second motor spindle means connected to said wafer support.

[0014] 优选地是,还包括第二驱动装置;所述第二驱动装置为第二气缸或第二伺服电机; 所述第二伺服电机与所述第一气缸的第一活塞杆连接,随所述第一活塞杆伸缩做升降运动;所述第二伺服电机的第二电机主轴与所述晶圆支撑装置连接,驱动所述晶圆支撑装置转动。 [0014] Preferably, further comprising a second drive means; the second drive means is a second air cylinder or a second servo motor; first piston rod connected to said second servomotor and the first cylinder, with the first piston rod made telescopic lifting movement; second motor shaft of the second servo motor means connected to said wafer support, the rotation drive of the wafer support device.

[0015] 优选地是,所述晶圆支撑装置包括真空吸盘;所述真空吸盘上开设有吸孔;所述吸孔与抽真空装置连通。 [0015] Preferably, the apparatus includes a vacuum chuck supporting the wafer; defines the upper vacuum chuck suction hole; a suction hole communicating with a vacuum device.

[0016] 优选地是,所述第二伺服电机的第二电机主轴为空心轴,沿轴向开设有第一通孔; 所述第一通孔与所述吸孔连通。 [0016] Preferably, the second motor spindle of the second servo motor as a hollow shaft, defines a first through hole axially; the first through hole communicates with the suction hole.

[0017] 优选地是,所述晶圆支撑装置还包括套筒;所述套筒设有第二通孔;所述套筒与所述真空吸盘连接,且所述第二通孔与所述吸孔连通;所述第二伺服电机安装在所述容腔的外侧;所述套筒贯穿所述清洗槽的槽底套设在所述第二电机主轴上,或所述套筒套攻在贝穿清洗槽槽底的第二电机主轴上;所述第二通孔与所述第一通孔连通;销轴贯穿所述套筒的侧壁后插入所述第二电机主轴内,阻止所述套筒和所述第二电机主轴分离,并阻止所述套筒和所述第二电机主轴相对转动。 [0017] Preferably, said wafer support means further comprises a sleeve; said sleeve is provided with a second through hole; a sleeve connected to said vacuum chuck, and the second through-hole and the communicating the suction holes; said second servo motor mounted outside said cavity; said sleeve through said cleaning tank bottom sleeved on the second motor spindle, the sleeve or sleeve in attack the second motor shaft is inserted into the pin through the sidewall of the sleeve, to prevent the; second spindle motor shell bottom through a cleaning tank; the second through hole communicating with the first through hole said sleeve and separated from said second motor spindle, and prevents the sleeve and the second relative rotation of the motor spindle.

[0018] 优选地是,所述清洗槽的槽底设有至少一个出液口。 [0018] Preferably, the bottom of the cleaning tank is provided with at least one fluid outlet.

[0019] 优选地是,所述清洗槽的槽底倾斜;所述清洗槽的槽底的高度自所述套筒或所述第二电机主轴的贯穿处向所述出液口方向逐渐降低。 [0019] Preferably, the inclined groove bottom cleaning; through the sleeve at a height from the groove bottom of the cleaning tank or the second motor shaft to the opening direction of the liquid decreases.

[0020] 优选地是,还包括挡板;所述挡板设置在所述清洗槽的槽底且高出所述槽底;所述挡板环绕所述套筒或第二电机主轴;晶圆的下表面可盖住所述挡板;所述挡板上还开设有至少一个导流孔;所述导流孔将所述挡板两侧区域导通地设置。 [0020] Preferably, further comprising a baffle plate; the bottom of the baffle plate is disposed above the washing tank and said bottom; the shutter or the second sleeve surrounding the motor shaft; Wafer the lower surface of the shutter cover; said further defines at least one flow baffle plate aperture; said guiding holes on both sides of the region of the guide baffle is disposed on.

[0021] 优选地是,还包括至少一个支架;所述支架设置在所述清洗槽的一侧,且可相对所述晶圆支撑装置转动、升降;所述支架上设有至少一个所述喷头。 [0021] Preferably, further comprising at least one bracket; the bracket is provided at a side of the washing tub, and movable relative to the wafer supporting means is rotated, the lift; provided at least one of said head on said holder .

[0022] 优选地是,还包括至少一个第三驱动装置;每个所述第三驱动装置驱动一个所述支架做升降运动或通过一个第三传动装置驱动一个所述支撑臂做升降运动。 [0022] Preferably, further comprising at least one third drive means; each of said third drive means drives one of said drive bracket to make a lifting movement or the lifting movement of the support arm is made by a third transmission means. _ _

[0023] 优选地是,所述第三驱动装置为第三气缸或第三伺服电机;所述第三气缸的第三活塞杆与支架可转动连接。 [0023] Preferably, the third drive means is a third or a third cylinder servo motor; the third piston and third cylinder bracket rotatably connected.

[0024] 优选地是,还包括至少一个第四驱动装置;每个所述第四驱动装置驱动一个所述支架转动或通过一个第四传动装置驱动一个所述支架转动。 [0024] Preferably, further comprising at least one fourth drive means; each of said fourth drive means driving one or a rotation of the stent the stent is rotated by a fourth driving gear.

[0025] 优选地是,所述第四驱动装置为第四气缸或第四伺服电机;所述第四传动装置包括传动带;所述传动带环绕所述第四伺服电机的第四电机主轴和所述支架上;每个所述第四伺服电机与一个所述第三气缸的第三活塞杆连接,随所述第三活塞杆伸缩做升降运动。 [0025] Preferably, said fourth drive means is a fourth or fourth cylinder servo motor; said fourth means comprises a drive belt; said belt around said fourth servo motor and a fourth motor the spindle bracket; each of the said fourth servo motor and a third connecting rod of the third cylinder, the third piston rod with telescopic lifting movement do.

[0026] 优选地是,还包括至少一个接液槽;所述接液槽设置在所述清洗槽的一侧,用于收集所述喷头喷射在所述容腔以外区域的液体。 [0026] Preferably, further comprising at least one tank connected; tank disposed on the ground side of the cleaning tank for collecting the liquid ejection head in the region other than the receiving chamber.

[0027] 优选地是,还包括控制主机和至少一个位置检测装置;每个所述位置检测装置用于检测一个所述支架的位置,并向所述控制主机发送信号;所述控制主机控制所述第四驱动装置工作,并根据所述位置检测装置的信号决定所述第四驱动装置启动或停止。 [0027] Preferably, further comprising a control panel and at least one position detecting means; each of said position detecting means for detecting a position of the bracket, and the host sends a control signal; and the control of the host control said fourth drive means work, according to a signal detecting means determines the position of said fourth driving means start or stop.

[0028] 优选地是,所述位置检测装置包括接近开关和凸片;所述凸片与所述支撑杆同步转动;所述接近开关位于所述凸片的行进路线上;所述接近开关根据所述凸片是否位于所述接近开关的检测范围内,向所述控制主机发出不同的信号;所述控制主机根据所述接近开关的信号,决定所述第四驱动装置的工作。 [0028] Preferably, said position detecting means comprises a proximity switch and a tab; the tab rotate synchronously with the support rod; proximity switch is located on the traveling path of the tabs; the proximity switches the tab is located within the detection range of the proximity switch, emits a different signal to the control master; said master control signals according to the proximity switch, determines the working fourth drive means.

[0029]优选地是,所述支撑臂的数量为两个;每个所述支撑臂上均设有所述喷头。 [0029] Preferably, the number of the support arm is two; each said support arm has the spray head.

[0030]优选地是,所述清洗槽的槽底设有至少一个抽气口;所述抽气口与抽气装置连通; 所述抽气装置用于对所述容腔抽气,使所述容腔内形成负压。 [0030] Preferably, the bottom of the cleaning tank is provided with at least one suction opening; exhaust ports communicating with said suction means; means for the evacuation of the suction chamber, the capacity a negative pressure cavity.

[0031] 本发明提供晶圆清洗装置,可对晶圆进行清洗处理,自动化程度大,生产效率高, 对晶圆的清洗效果好、清洗良品率高。 [0031] The present invention provides a wafer cleaning apparatus for cleaning the wafer may be processed, a large degree of automation, high efficiency, good cleaning effect of the wafer, cleaning yield rate.

附图说明 BRIEF DESCRIPTION

[0032] 图1为本发明中的晶圆清洗装置的使用示意图; [0032] Figure 1 is a schematic view used in wafer cleaning apparatus of the present invention;

[0033]图2为本发明中的晶圆清洗装置的结构示意图; [0033] FIG. 2 is a schematic structural diagram of a wafer cleaning apparatus of the invention;

[0034]图3为本发明中的晶圆清洗装置的局部示意图; [0034] FIG. 3 is a partially schematic view of the wafer cleaning apparatus of the invention;

[0035]图4为本发明中的槽底的结构示意图; [0035] The structure of the present invention, FIG 4 is a schematic bottom;

[0036]图5为本发明中的晶圆清洗装置的结构主视图; [0036] FIG. 5 is a front view of the structure of the wafer cleaning apparatus of the present invention;

[0037]图6为图5中的晶圆清洗装置的另一角度结构示意图; [0037] FIG. 6 is a schematic view of another aspect of the structure of FIG. 5 wafer cleaning apparatus;

[0038]图7为图5中的晶圆清洗装置的另一角度结构示意图; [0038] FIG. 7 is a schematic diagram of FIG. 5 wafer cleaning apparatus of the structure from another angle;

[0039]图8为本发明中的晶圆支撑装置的结构示意图; [0039] FIG. 8 is a schematic diagram of the structure of the wafer support device of the invention;

[0040]图9为图8所示结构的剖视图; [0040] FIG. 9 is a cross-sectional view of the structure shown in Figure 8;

[0041]图10为本发明中的晶圆清洗装置的局部示意图。 [0041] FIG. 10 is a partial schematic view of a wafer cleaning apparatus of the invention.

具体实施方式 detailed description

[0042]下面结合附图对本发明进行详细的描述: DRAWINGS The invention is described in detail [0042] below with:

[0043]如图1和2所示,晶圆清洗装置,包括底座1,底座1上设有清洗槽11,清洗槽11设有容腔110。 [0043] FIGS. 1 and 2, the wafer cleaning apparatus 1 comprises a base, the base is provided with a washing tank 11, tank 11 is provided with the chamber 110. 还包括晶圆支撑装置2,晶圆支撑装置2设置在容腔110内,用于支撑晶圆01。 Further comprising a wafer support means 2, the wafer supporting means 2 arranged inside the chamber 110, for supporting the wafer 01. 还包括三个喷头,分别为两个第一喷头3和第二喷头8。 Further comprising three heads, respectively, two first head and the second head 3 8. 喷头可朝向晶圆01喷射液体或气体。 The ejection nozzle 01 toward the wafer may be a liquid or a gas. 喷头与晶圆支撑装置2可相对移动地设置。 Head 2 and the wafer supporting means disposed relatively movable. 清洗槽11的两侧分别设置有一个接液槽9,接液槽9用于收集第一喷头3滴在或泄漏在容腔110以外区域的液体,防止液体对其他部件造成污染。 Both sides of the cleaning tank 11 are provided with a tank connection 9, connected to the first head tank 9 for collecting or 3 drops of the liquid chamber 110 in a region other than the leak, to prevent the liquid to other parts pollution. [0044]如图3所示,晶圆支撑装置2包括真空吸盘21和套筒22。 [0044] As shown, the wafer support apparatus 32 includes a vacuum chuck in FIG. 21 and the sleeve 22. 真空吸盘21上设有吸孔210,吸孔在真空吸盘21的上表面开设有开口211。 Vacuum chuck 21 is provided with suction holes 210, the suction holes 211 defines an opening on the surface of the vacuum chuck 21. 套筒22设有第二通孔221。 The second sleeve 22 is provided with a through hole 221. 套筒22与真空吸盘21连接,第二通孔221和吸孔210连通。 Sleeve 22 connected to a vacuum chuck 21, and the suction hole 210 communicating through a second hole 221. 套筒22贯穿清洗槽11的槽底121,可相对清洗槽11做升降运动,且可绕套筒22的中心轴线转动。 Sleeve 22 through bottom 121 cleaning tank 11, tank 11 can be made relative lifting movement, and rotatable about the central axis 22 of rotation of the sleeve.

[0045] 如图3和4所示,清洗槽11的槽底设有出液口112。 As shown in [0045] FIGS. 3 and 4, the groove bottom tank 11 is provided with a liquid outlet 112. 槽底121的高度自套筒22的贯穿处向出液口112的方向逐渐降低。 Height gradually decreases from the groove bottom 121 through the sleeve 22 in the direction of the outlet port 112. 晶圆清洗装置还包括挡板122,挡板122设置在槽底121且高出槽底121。 Wafer cleaning apparatus further comprises a baffle 122, the baffle 122 is disposed above the bottom 121 and bottom 121. 挡板122环绕套筒22,真空吸盘21下降后,其下表面可盖住挡板122。 Baffles 122 surrounding the sleeve 22, the vacuum chuck 21 drops, which can cover the lower surface of the baffle plate 122. 挡板U2 上还开设有四个导流孔123,导流孔123将挡板122两侧区域导通地设置。 U2 upper baffle further defines four guide holes 123, the shutter 122 diversion hole 123 is provided on both sides of the region of the guide.

[0046] 如图5-9所示,晶圆清洗装置还包括第一驱动装置和第二驱动装置。 As shown in [0046] FIG. 5-9, the wafer cleaning apparatus further comprises a first drive means and second drive means. 第一驱动装置选用第一气缸41,第一气缸41设置在底座1的下方,位于容腔110的外部。 First drive means a first selection of the cylinder 41, the first cylinder 41 is disposed below the base 1, located outside the chamber 110. 第二驱动装置选用第二伺服电机42。 Second drive means selected second servomotor 42. 第二伺服电机42与第一气缸41的第一活塞杆(图中未示出)连接,位于容腔110的外部。 Second servo motor 42 is connected to the first piston rod (not shown) of the first cylinder 41, located outside the chamber 110. 第二伺服电机42随第一活塞杆的伸缩做升降运动。 With the second servo motor 42 to make the first piston rod telescopic lifting movement. 套筒22贯穿清洗槽11的槽底121后套设在第二伺服电机42的第一电机主轴421上,通过第二伺服电机42驱动套筒22转动,进一步带动真空吸盘21转动。 After the sleeve 22 through the washing tank bottom 12 111 sleeved on the first motor shaft 421 of the second servo motor 42, the second servomotor 22 is rotated by the drive sleeve 42, the vacuum chuck 21 is further driven in rotation. 销轴23贯穿套筒22的侧壁后插入第二电机主轴似1内,阻止套筒22和第二电机主轴421分离,并阻止套筒22和第二电机主轴421相对转动,确保套筒22在第二电机主轴421的驱动下同步转动。 After the pin 23 is inserted through the sidewall of the second sleeve 22 like the motor shaft 1, and the second sleeve 22 to prevent the motor spindle 421 separated, and the second sleeve 22 and prevents the motor shaft 421 rotates relatively, ensuring that the sleeve 22 in the synchronous rotation of the second spindle 421 of the motor drive.

[0047] 第二伺服电机42的第二电机主轴421为空心轴,沿轴向开设有第一通孔422。 [0047] The second servomotor 42 of the second motor spindle as a hollow shaft 421 axially defines a first through hole 422. 第一通孔422与第二通孔221连通。 The first through hole 422 communicating with the second through hole 221. 第一通孔422与抽真空装置(图中未示出)连通,通过抽真空装置对第一通孔422抽真空,从而使吸孔210内形成负压,通过负压将晶圆〇1吸附在真空吸盘21的上表面。 The first through hole 422 and the evacuation means (not shown) in communication, via evacuation means for evacuating the first through hole 422, so that the negative pressure suction hole 210, the wafer by vacuum suction 〇1 the upper surface of the vacuum chuck 21.

[0048] 清洗槽11的槽底121设有抽气口111。 [0048] 12111 washing tank bottom suction port 111 is provided. 抽气口111与抽气装置(图中未示出)连通。 Extraction opening 111 and the suction means (not shown) in communication. 抽气装置用于对容腔110抽气,使容腔110内形成负压。 Pumping means for pumping chamber 110, the negative pressure within the forming chamber 110.

[0049] 如图1和2所示,底座1上设有两个支架,支架包括支撑杆5丨。 [0049] FIG. 1 and is provided with two brackets, the base 12, the holder comprising a support rod 5 Shu. 两个支撑杆51分别位于清洗槽11的两侧。 Two support rods 51 are located on both sides of the cleaning tank 11. 支撑杆5丨可相对底座1做升降运动地设置,且支撑杆51可绕其中心轴转动。 Shu support rod 5 relative to the base 1 may be provided to make the lifting movement, the support rod 51 and rotatable about its central axis. 每个支撑杆51上均设有一个支撑臂52,支撑臂52与支撑杆51同步转动。 Each support rod 51 has a support arm 52, the support arm 52 and the support bar 51 rotate synchronously. 每个支撑臂52上均设有一个第一喷头3。 Each supporting arm 52 has a first head 3. 第二喷头8固定安装在清洗槽11的一侧。 Second head 8 fixedly mounted at one side of the cleaning tank 11.

[0050]如图5-7所示,晶圆清洗装置还包括两个第三驱动装置和两个第四驱动装置。 As shown in [0050] FIG. 5-7, the wafer cleaning apparatus further comprises two third and two fourth drive means drive means. 第三驱动装置选用第三气缸43。 The third drive means 43 of the third cylinder selection. 第三气缸43设置在底座1的下方。 Third cylinder 43 is disposed below the base 1. 每个第三气缸43的第三活塞杆(图中未示出)均与一个支撑杆51可转动连接,第三活塞杆伸缩即可带动支撑杆51做升降运动,从而带动支撑臂52支撑臂52上的第一喷头3做升降运动。 Each third rod of the third cylinder (not shown) 43 are rotatably connected to a support rod 51, a third drive rod support bar 51 can be made telescopic lifting movement, the support arm 52 so as to drive the support arm the first head on the 523 do lifting movement. 第四驱动装置选用第四伺服电机44。 The fourth selection of the fourth servo motor driving device 44. 每个第四伺服电机44与一个第三气缸43的第三活塞杆连接,随第三气缸43的第三活塞杆的伸缩做升降运动。 Each fourth servo motor 44 is connected to a piston rod 43 of the third third cylinder, a third cylinder with a piston rod 43 of the third telescoping do lifting movement. 第四伺服电机44通过第四传动装置驱动支撑杆51转动。 The fourth servo motor 44 through a fourth supporting rod 51 rotatably driven gear. 第四传动装置包括传动带6,传动带6环绕第四伺服电机44的第四电机主轴441和支撑杆51。 Fourth transfer means comprises a belt 6, a fourth belt 6 around the fourth servo motor 44 of the spindle motor 441 and the support bar 51.

[0051]如图10所示,晶圆清洗装置还包括控制主机(图中未示出)和两个位置检测装置。 , Wafer cleaning apparatus further comprises a control panel (not shown) and two position detecting means [0051] 10 shown in FIG. 每个位置检测装置用于检测一个支撑杆51的位置,并向控制主机发送信号。 Each position detecting means for detecting a position of the support rod 51, and the host sends a control signal. 控制主机控制第二伺服电机44工作,并根据位置检测装置的信号决定第四伺服电机44启动或停止。 Second servo control panel 44 controls operation of the motor, and the position signal detecting means is determined according to a fourth servo motor 44 is started or stopped. 位置检测装置包括接近开关71和凸片72。 Position detecting means comprises a proximity switch 71 and the tabs 72. 凸片72与支撑杆51同步转动,接近开关71位于凸片72 的行进路线上。 Tabs 72 and the support bar 51 rotate synchronously, the proximity switch 71 is located on the traveling path of the tabs 72. 接近开关71根据凸片72是否位于接近开关71的检测范围内,向控制主机发出不同的信号。 The proximity switch 71 within the detection range of the proximity switch 71, emits a different signal to the control host computer in accordance with the tabs 72 is located. 控制主机根据接近开关71的信号,决定第四伺服电机44的工作凸片72移动至接近开关71的检测范围内,接近开关71发送信号至控制主机,控制主机根据信号控制第四伺服电机44停止工作,使第一喷头3移动至接液槽9的上方,或控制第二伺服电机44反转驱动支撑臂52向反方向转动指定角度后停止工作,使支撑臂52转动至晶圆01的上方。 The proximity switch control panel 71 signals, determines a fourth servo motor 44 working tabs 72 to move within the detection range proximity switch 71, the proximity switch 71 sends a signal to the control panel, the control panel stops the control signal in accordance with a fourth servo motor 44 work, the first bonding head 3 is moved to the top of tank 9, the servomotor 44 controls the second or reverse drive support arm 52 is rotated a prescribed angle in the reverse direction after stopping the rotation of the support arm 52 to the top of the wafer 01 . .

[0052]本发明的晶圆清洗装置的使用方法如下: [0052] The wafer cleaning method using the apparatus of the present invention is as follows:

[0053]如图1所示,启动第一气缸41,驱动晶圆支撑装置2上升,使真空吸盘21的上表面高出清洗槽11的侧壁。 [0053] As shown, the first cylinder 41 starts, the driving of the wafer supporting means 1 2 rises, the upper surface of the vacuum chuck 21 is higher than the side walls of the cleaning tank 11. 将晶圆01放置在真空吸盘21上,通过抽真空装置对第一通孔422抽真空,使吸孔210内形成负压,通过负压将晶圆01吸附在真空吸盘21的上表面。 The wafer 01 is placed on the vacuum chuck 21, by evacuation means for evacuating the first through hole 422, so that negative pressure suction hole 210, the wafer 01 by vacuum adsorbed on the surface of the vacuum chuck 21.

[0054]启动第一气缸41,驱动晶圆支撑装置2下降,通过晶圆支撑装置带动晶圆01下降至容腔110内,晶圆01的下表面盖住挡板122。 [0054] The first cylinder 41 starts, the driving of the wafer supporting means 2 is lowered down into the chamber 110 by the wafer support means to drive the wafer 01, covering the lower surface of the wafer 01 of the baffle 122.

[0055]启动第二伺服电机42,驱动晶圆支撑装置2转动,通过晶圆支撑装置带动晶圆01转动。 [0055] The second servo motor 42 starts, the driving support device 2 rotates the wafer, the wafer supporting means is rotated by driving the wafer 01. 晶圆支撑装置2带动晶圆01转动的过程中,晶圆01上的电镀液等污染物在离心力的作用下,可部分脱离晶圆01。 Wafer support means 2 driven by rotation of the wafer 01 in the process, a plating solution or the like contaminants on the wafer 01 by the centrifugal force, the wafer 01 may be partially disengaged.

[0056]启动第四伺服电机44,驱动设有第一喷头3的支撑臂52转动,使第一喷头3移动至晶圆01的上方。 [0056] The fourth servo motor 44 to start driving the support arm 52 is provided with a first head 3 is rotated, the first head 3 is moved upward to the wafer 01. 根据晶圆01的高度,通过第三气缸43驱动支撑臂52上升或下降,使第一喷头3与晶圆01保持适当的距离。 The height of the wafer 01, the support arm 52 by a third air cylinder 43 drives the rise or fall of the first head 01 holding the wafer 3 and an appropriate distance. 通过第一喷头3向晶圆01喷射清洗液,对晶圆01进行清洗。 The first cleaning liquid ejection head 3 of the wafer 01, the wafer 01 is cleaned. 第一喷头3向晶圆01喷射清洗液以对晶圆01进行清洗的过程中,可通过抽气装置经抽气口m向容腔110内抽气,在容腔110内形成负压。 A first cleaning liquid ejection head 3 to the wafer 01 on the wafer 01 during the cleaning, by suction means into the suction chamber through the suction port 110 m, a negative pressure in the chamber 110. 清洗过程中的水雾在负压的作用下向下流动,避免水雾向上挥发导致晶圆01的二次污染,提高了清洗效果。 During cleaning mist flow downward under the action of a negative pressure to prevent secondary pollution caused by volatilization mist up the wafer 01 and improve the cleaning effect. 还可通过第二喷头8向晶圆01喷射清洗液对晶圆01进行清洗,补充清洗液的消耗,提高清洗效果。 Wafer 01 may be cleaned by the second cleaning liquid ejection head 8 to the wafer 01, further consumption of the cleaning liquid, improve the cleaning effect. 第一喷头3和第二喷头8喷出的液体可以相同,也可以不同。 A first head 3 and a second liquid ejecting head 8 may be the same or different.

[0057]待清洗完毕后,第一喷头3停止对晶圆〇1喷液。 [0057] The items to be cleaned has been completed, the first wafer head 3 is stopped 〇1 liquid jet. 残留在晶圆〇1上的清洗液可在离心力的作用下脱离晶圆01。 〇1 remaining on the wafer the wafer cleaning solution 01 may be disengaged under the effect of centrifugal force. 即在停止喷液后,通过晶圆支撑装置2带动晶圆01转动,对晶圆01 起到甩千的作用。 That is, after liquid ejection is stopped, the wafer 01 is rotated by the drive of the wafer support device 2, functions to effect rejection of the wafer 01 thousand. 还可通过第一喷头3向晶圆01喷射气体,将晶圆〇1上残留的清洗液吹离晶圆01。 3 also through the first head 01 toward the wafer a gas injection, the residual cleaning solution on the wafer 〇1 blow off the wafer 01. 从晶圆01上脱离的清洗液经倾斜的槽底121导向经出液口112流出清洗槽11。 Detached from the wafer 01 by the cleaning solution inclined guide 121 bottom effluent outlet port 112 via the tank 11. 挡板122 可避免清洗液从套筒22与槽底U1之间的缝隙流出清洗槽11,流入第一伺服电机42内,使第一伺服电机42损坏,同时可避免对加工环境的污染。 Shutter 122 may prevent the cleaning liquid from the gap between the sleeve 22 and the bottom outflow U1 washing tank 11, flows into the first servomotor 42, the first servo motor 42 is damaged, while avoiding contamination of the processing environment. 即便清洗液溅入挡板丨22以内区域,由于槽底121的高度自套筒22的贯穿处向出液口II2的方向逐渐降低,清洗液也会顺着槽底从挡板122的内侧经导流孔123流向挡板122的外层,继而流向出液口112,不会在挡板122内蓄积。 Even if the cleaning liquid splashing into the area within the bezel 22 Shu, gradually decreases toward the liquid outlet at the bottom II2 through 121 due to the height from the sleeve 22, will follow the washing liquid from the bottom through the inside of the bezel 122 the outer flow guide holes 123 of the baffle 122, and then flows to outlet port 112, shutter 122 will not accumulate within.

[0058] 待晶圆01上无清洗液残留时,停止第二伺服电机42,晶圆01停转。 [0058] None of the wafer 01 to be the residual cleaning solution, the second servo motor 42 is stopped, the wafer 01 is stopped. 启动第四伺服电机44,驱动支撑臂52转动,使第一喷头3偏离晶圆01的上升路径。 The fourth servo motor 44 starts, the drive support arm 52 is rotated, the first head 01 3 of the wafer deviates from rising path. 当凸片72移动至接近开关71的检测范围内,接近开关71发送信号至控制主机,控制主机根据信号控制第四伺服电机44停止工作,此时,支撑臂52上的第一喷头3位于接液槽9的上方,通过接液槽9收集第一喷头3流出的残液,避免残液洒落在容腔110以外区域而污染环境。 When the tab 72 is moved into the detection range of the proximity switch 71, the proximity switch 71 sends a signal to the control panel, the control panel stops the control signal in accordance with a fourth servo motor 44, this time, the first head 3 is located on the support arm 52 connected 9 above the tank for collecting the first raffinate head tank 3 flows through the connection 9, to avoid spill residue in a region other than the cavity 110 and pollute the environment.

[0059] 启动第一气缸41,驱动晶圆支撑装置2上升,使晶圆01移出容腔110,再通过操作人员或机械手将晶圆〇1转移至下一道工序。 [0059] The first cylinder 41 starts, the driving of the wafer supporting means 2 rises, the wafer 01 out of chamber 110, and then by an operator or robot 〇1 the wafer is transferred to the next process. 至此即完成对一个晶圆〇1的清洗。 This completes the cleaning of a wafer 〇1.

[0060] 本发明中的上、下、升、降均以图5为参考,为清楚地描述本发明而使用的相对概念,并不构成对权利要求范围的限制。 In the present invention, [0060], lower, ascending, descending FIG. 5 are referenced as a relative concept and clearly describe the present invention is used, not to limit the scope of the claims.

[0061] 本发明中的实施例仅用于对本发明进行说明,并不构成对权利要求范围的限制, 本领域内技术人员可以想到的其他实质上等同的替代,均在本发明保护范围内。 Other substantially equivalent alternative embodiments of the [0061] present invention is merely to illustrate the present invention, not to limit the scope of the claims, may occur to persons skilled in the art, and are within the scope of the invention.

Claims (12)

  1. 1. 晶圆清洗装置,其特征在于,包括: 清洗槽;所述清洗槽设有容腔; 晶圆支撑装置;所述晶圆支撑装置设置在所述容腔内,用于支撑晶圆; 至少一个喷头;所述喷头可朝向晶圆喷射液体或气体; 还包括至少一个支架;所述支架可旋转、可升降地设置;所述支架上设有至少一个所述喷头晶圆清洗装置;还包括至少一个第三驱动装置;每个所述第三驱动装置驱动一个所述支架做升降运动或通过一个第三传动装置驱动一个所述支架做升降运动;还包括至少一个第四驱动装置;每个所述第四驱动装置驱动一个所述支架转动或通过一个第四传动装置驱动一个所述支架转动; 还包括至少一个接液槽;所述接液槽设置在所述清洗槽的一侧,用于收集所述喷头喷射在所述容腔以外区域的液体; 还包括控制主机和至少一个位置检测装置;每个所述位置检测装置用于检测一个所 1. The wafer cleaning apparatus, characterized by comprising: a cleaning tank; the cleaning bath is provided with the cavity; wafer support means; said wafer support means disposed within said receiving cavity for supporting the wafer; at least one spray nozzle; said injection nozzle can be a liquid or a gas toward the wafer; further comprising at least one bracket; said rotatable holder, elevating provided; provided at least one of said wafer cleaning head on the support means; further a third drive means comprise at least one; and each of said third drive means drives one of said drive bracket to make a lifting movement or the lifting movement by a bracket do third transmission; further comprising at least one fourth drive means; per of said fourth drive means driving one or a rotation of the stent the stent is rotated by a fourth driving gear; further comprising at least one tank connected; tank provided on the ground side of the washing tub, for collecting the liquid ejection head region other than said cavity; further comprising a control panel and at least one position detecting means; each of said position detecting means for detecting one of 支架的位置,并向所述控制主机发送信号;所述控制主机控制所述第四驱动装置工作,并根据所述位置检测装置的信号决定所述第四驱动装置启动或停止; 所述位置检测装置包括接近开关和凸片;所述凸片与所述支架同步转动;所述接近开关位于所述凸片的行进路线上;所述接近开关根据所述凸片是否位于所述接近开关的检测范围内,向所述控制主机发出不同的信号;所述控制主机根据所述接近开关的信号,决定所述第四驱动装置的工作。 The position of the holder, and the host sends a control signal; said fourth driving control means controls said master work, and determines the position detecting signal in accordance with said fourth driving means start or stop means; a position detecting and means comprising a proximity switch tab; the tab rotate synchronously with the bracket; proximity switch is located on the traveling path of the tabs; the proximity of the proximity switch according to switch the tab is located is detected the range, emits a different signal to the control panel; said master control signals according to the proximity switch, determines the working fourth drive means.
  2. 2. 根据权利要求1所述的晶圆清洗装置,其特征在于,还包括第一驱动装置;所述第一驱动装置驱动所述晶圆支撑装置做升降运动或通过第一传动装置驱动所述晶圆支撑装置做升降运动晶圆清洗装置;所述第一驱动装置为第一气缸或第一伺服电机。 The said wafer cleaning apparatus according to claim 1, characterized by further comprising a first drive means; a first driving means for driving said wafer support means do or lifting movement by the first drive means for driving said wafer support means do lifting movement of the wafer cleaning apparatus; said first drive means to a first or a first cylinder servo motor.
  3. 3. 根据权利要求1所述的晶圆清洗装置,其特征在于,还包括第二驱动装置;所述第二驱动装置驱动所述晶圆支撑装置转动或通过第二传动装置驱动所述晶圆支撑装置转动晶圆清洗装置;所述第二驱动装置为第二气缸或第二伺服电机;所述第二伺服电机的第二电机主轴与所述晶圆支撑装置连接。 3. The wafer cleaning apparatus according to claim 1, characterized by further comprising a second drive means; the second drive means driving means for rotating said wafer support or by a second transmission means for driving said wafer support means for rotating the wafer cleaning apparatus; the second drive means is a second air cylinder or a second servo motor; a second servomotor and the second motor spindle means connected to said wafer support.
  4. 4. 根据权利要求2所述的晶圆清洗装置,其特征在于,坯包括第二驱动装置;所述第二驱动装置为第二气缸或第二伺服电机;所述第二驱动装置与所述第一气缸的第一活塞杆连接,随所述第一活塞杆伸缩做升降运动;所述第二伺服电机的第二电机主轴与所述晶圆支撑装置连接,驱动所述晶圆支撑装置转动。 4. The wafer cleaning device according to claim 2, characterized in that the blank comprises a second drive means; the second drive means is a servo motor or a second second cylinder; the second drive means and said a first piston rod connected to the first cylinder, the first piston rod with telescopic lifting movement do; second motor shaft of the second servo motor means connected to said wafer support, the wafer support rotation of the drive means .
  5. 5. 根据权利要求3或4所述的晶圆清洗装置,其特征在于,所述晶圆支撑装置包括真空吸盘;所述真空吸盘上开设有吸孔;所述吸孔与抽真空装置连通。 The wafers 3 or 4, wherein the cleaning apparatus according to claim, characterized in that said means comprises a vacuum chuck supporting the wafer; defines a suction hole on the vacuum chuck; a suction hole communicating with a vacuum device.
  6. 6. 根据权利要求5所述的晶圆清洗装置,其特征在于,所述第二伺服电机的第二电机主轴为空心轴,沿轴向开设有第一通孔;所述第一通孔与所述吸孔连通。 The wafer as claimed in claim 5, wherein the cleaning apparatus, characterized in that the second of the second motor spindle as a hollow shaft servo motor, defines a first through hole in the axial direction; and the first through hole said suction hole.
  7. 7. 根据权利要求6所述的晶圆清洗装置,其特征在于,所述晶圆支撑装置还包括套筒; 所述套筒设有第二通孔;所述套筒与所述真空吸盘连接,且所述第二通孔与所述吸孔连通; 所述第二伺服电机安装在所述容腔的外侧;所述套筒贯穿所述清洗槽的槽底套设在所述第二电机主轴上,或所述套筒套设在贯穿清洗槽槽底的第二电机主轴上;所述第二通孔与所述第一通孔连通;销轴贯穿所述套筒的侧壁后插入所述第二电机主轴内,阻止所述套筒和所述第二电机主轴分离,并阻止所述套筒和所述第二电机主轴相对转动。 7. The wafer according to claim 6 cleaning apparatus, characterized in that said wafer supporting means further comprises a sleeve; said sleeve is provided with a second through hole; a sleeve connected to the vacuum cups and the second through hole communicating with the suction hole; the second servo motor mounted outside said cavity; said sleeve through said cleaning tank bottom sleeved on the second motor the spindle, the sleeve or the second sleeve is provided on the motor spindle through a cleaning tank bottom; the second through hole communicating with the first through hole; pin after insertion through the side wall of the sleeve the second motor spindle, to prevent the sleeve and the second separation motor spindle, and prevents the sleeve and the second motor spindle relative rotation.
  8. 8.根据权利要求7所述的晶圆清洗装置,其特征在于,所述清洗槽的槽底设有至少一个出液口;晶圆清洗装置晶圆清洗装置所述清洗槽的槽底的高度自所述套筒或所述第二电机主轴的贯穿处向所述出液口方向逐渐降低。 Height wafer cleaning apparatus cleaning a wafer cleaning apparatus of the bottom groove; 8. The wafer cleaning device according to claim 7, characterized in that the bottom of the washing tank is provided with at least one fluid outlet or through the sleeve from the shaft of the second motor is gradually decreased toward the liquid outlet direction.
  9. 9.根据权利要求7所述的晶圆清洗装置,其特征在于,还包括挡板;所述挡板设置在所述清洗槽的槽底且高出所述槽底;所述挡板环绕所述套筒或所述第二电机主轴;晶圆的下表面可盖住所述挡板;所述挡板还开设有至少一个导流孔;所述导流孔将所述挡板两侧区域导通地设置。 9. The wafer cleaning device according to claim 7, characterized by further comprising a baffle plate; and a baffle disposed above the bottom of the groove bottom of the cleaning bath; surrounded by the baffle said sleeve or said second motor spindle; the lower surface of the wafer can cover the shutter; said baffle further defines at least one flow aperture; said guiding holes on both sides of the baffle region conductively disposed.
  10. 10. 根据权利要求1所述的晶圆清洗装置,其特征在于,所述第三驱动装置为第三气缸或第三伺服电机;所述第三气缸的第三活塞杆与所述支架可转动连接。 10. The wafer of claim cleaning apparatus according to claim 1, wherein said third means is a third drive servomotor or a third cylinder; said third rod of the third cylinder and the rotatable bracket connection.
  11. 11. 根据权利要求10所述的晶圆清洗装置,其特征在于,所述第四驱动装置为第四气缸或第四伺服电机;所述第四传动装置包括传动带;所述传动带环绕所述第四伺服电机的第四电机主轴和所述支架上;每个所述第四伺服电机与一个所述第三气缸的第三活塞杆连接,随所述第三活塞杆伸缩做升降运动。 11. The wafer cleaning device according to claim 10, wherein said fourth drive means is a fourth or fourth cylinder servo motor; said fourth means comprises a drive belt; said belt surrounding the second the four fourth servo motor and the spindle motor bracket; each of the said fourth servo motor and a third connecting rod of the third cylinder, the third piston rod with telescopic lifting movement do.
  12. 12. 根据权利要求1所述的晶圆清洗装置,其特征在于,所述清洗槽的槽底设有至少一个抽气口;所述抽气口与抽气装置连通;所述抽气装置用于对所述容腔抽气,使所述容腔内形成负压。 12. The wafer of the cleaning apparatus according to claim 1, characterized in that the washing tank is provided with at least one bottom suction opening; said suction means in communication with the suction opening; means for the evacuation the chamber was evacuated so that the cavity of negative pressure.
CN 201410853888 2014-12-31 2014-12-31 Wafer cleaning apparatus CN104658947B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102211096A (en) * 2010-04-09 2011-10-12 中国科学院微电子研究所 Supercritical water jet cleaning equipment
CN203760441U (en) * 2014-03-28 2014-08-06 沈阳仪表科学研究院有限公司 Wafer cleaning machine
CN204407301U (en) * 2014-12-31 2015-06-17 上海新阳半导体材料股份有限公司 Wafer cleaning apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005327807A (en) * 2004-05-12 2005-11-24 Sony Corp Sheet type washing apparatus and its washing method
JP5151629B2 (en) * 2008-04-03 2013-02-27 東京エレクトロン株式会社 Substrate cleaning method, a substrate cleaning apparatus, a developing method, a developing device and a storage medium

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102211096A (en) * 2010-04-09 2011-10-12 中国科学院微电子研究所 Supercritical water jet cleaning equipment
CN203760441U (en) * 2014-03-28 2014-08-06 沈阳仪表科学研究院有限公司 Wafer cleaning machine
CN204407301U (en) * 2014-12-31 2015-06-17 上海新阳半导体材料股份有限公司 Wafer cleaning apparatus

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