CN104646828A - Integrated circuit (IC) chip laser welding device - Google Patents

Integrated circuit (IC) chip laser welding device Download PDF

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Publication number
CN104646828A
CN104646828A CN201510012194.1A CN201510012194A CN104646828A CN 104646828 A CN104646828 A CN 104646828A CN 201510012194 A CN201510012194 A CN 201510012194A CN 104646828 A CN104646828 A CN 104646828A
Authority
CN
China
Prior art keywords
screw thread
servomotor
mount pad
mobile
center
Prior art date
Application number
CN201510012194.1A
Other languages
Chinese (zh)
Inventor
徐和平
陈友兵
宋越
Original Assignee
池州睿成微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 池州睿成微电子有限公司 filed Critical 池州睿成微电子有限公司
Priority to CN201510012194.1A priority Critical patent/CN104646828A/en
Publication of CN104646828A publication Critical patent/CN104646828A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding

Abstract

The invention discloses an integrated circuit (IC) chip laser welding device, comprising a rack, an IC chip, a fixing seat, a first servo motor, a first screw rod, a mobile mounting seat, a laser welding head, an electronic microscope, a mobile seat, a location die, a second servo motor, a second screw rod, and a control calculator. Compared with the prior art, the first servo motor drives the first screw to move the mobile mounting seat front and back; the second servo motor drives the second screw rod to move left and right; the laser welding head emits relatively high-energy electron beams to complete the welding of the IC chip; by electron beam welding, the temperature at the welding position is consistent, so that the quality of a welding product is ensured.

Description

A kind of IC chip laser welder

Technical field

The present invention relates to a kind of welding equipment, particularly relate to a kind of IC chip laser welder.

Background technology

Along with the development of science and technology, electronic product is more and more advanced, volume is more and more less, and a large amount of uses being at all IC chip of electronic product development, current IC chip needs to be formed by welding with other circuit, and existing welding equipment is welded by flame, and the bad control of flame welding jointing temp, cause product rejection, in view of above-mentioned defect, be necessary to design a kind of IC chip laser welder in fact.

Summary of the invention

Technical problem to be solved by this invention is: provide a kind of IC chip laser welder, solve the problem of product rejection.

For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of IC chip laser welder, comprise frame, comprise holder, first servomotor, the first screw mandrel, mobile mount pad, laser welding system, electron microscope, Mobile base, positioning module, the second servomotor, the second screw mandrel, controlling calculation device, IC chip, described fixed seating is in frame top center right-hand member, and the two screw thread is connected.The first described servomotor is positioned at holder right-hand member center, the two screw thread is connected, the first described screw mandrel is positioned at the first servomotor left end center, itself and holder are movably connected, be connected with the first servomotor screw thread, described mobile mount pad is positioned at holder top, the two is movably connected, described laser welding system is positioned at place of mobile mount pad left end bottom centre, the two screw thread is connected, described electron microscope is positioned at place of laser welding system bottom centre, the two screw thread is connected, described sliding seats is in framework soleplate center left, the two is movably connected, described positioning module is arranged in mobile top center place, the two screw thread is connected, the second described servomotor is positioned on the upside of center, the frame back side, the two screw thread is connected, the second described screw mandrel is positioned at the second center, servomotor front end, itself and frame are movably connected, be connected with the second servomotor screw thread, described computer for controlling is positioned at frame top hub head end, the two screw thread is connected.

Further, described holder top is also provided with guide rail, and itself and mobile mount pad are movably connected, and are connected with holder screw thread.

Further, be also provided with the first feed nut bottom described mobile mount pad right-hand member, it engages with the first screw mandrel, is connected with mobile mount pad screw thread.

Further, be also provided with illuminating lamp on the right side of described electron microscope bottom centre, the two screw thread is connected.

Further, described place of Mobile base bottom centre is also provided with nut mount pad, and the two is weldingly connected.

Further, described nut mount pad inside center place is also provided with the second feed nut, and it engages with the second screw mandrel, is connected with nut mount pad screw thread.

Compared with prior art, mobile mount pad is driven to move forward and backward by the first driven by servomotor first screw mandrel, second driven by servomotor second screw mandrel drives Mobile base to move left and right, laser welding system is launched high energy electron beam and is completed IC chips welding, consistent by electron beam welding weld temperature, thus the quality of the welding product ensured.

Accompanying drawing explanation

Fig. 1 is the front view of device

Fig. 2 is the left view of device

Frame 1 holder 2

First servomotor 3 first screw mandrel 4

Mobile mount pad 5 laser welding system 6

Electron microscope 7 Mobile base 8

Positioning module 9 second servomotor 10

Second screw mandrel 11 computer for controlling 12

IC chip 13 guide rail 201

First feed nut 501 lighting lamp 701

Nut mount pad 801 second feed nut 802

Following detailed description of the invention will further illustrate in conjunction with above-mentioned accompanying drawing.

Detailed description of the invention

Hereinafter, set forth multiple specific detail, to provide the thorough understanding to the concept forming described embodiment basis.But to one skilled in the art, embodiment described obviously can be put into practice when not have in these specific detail some or all.In other cases, well-known treatment step is not specifically described.

As Fig. 1, shown in Fig. 2, comprise frame 1, comprise holder 2, first servomotor 3, first screw mandrel 4, mobile mount pad 5, laser welding system 6, electron microscope 7, Mobile base 8, positioning module 9, second servomotor 10, second screw mandrel 11, computer for controlling 12, IC chip 13, described holder 2 is positioned at frame 1 top center right-hand member, the two screw thread is connected, the first described servomotor 3 is positioned at holder 2 right-hand member center, the two screw thread is connected, the first described screw mandrel 4 is positioned at the first servomotor 3 left end center, itself and holder 2 are movably connected, be connected with the first servomotor 3 screw thread, described mobile mount pad 5 is positioned at holder 2 top, the two is movably connected, described laser welding system 6 is positioned at place of mobile mount pad 5 left end bottom centre, the two screw thread is connected, described electron microscope 7 is positioned at place of laser welding system 6 bottom centre, the two screw thread is connected, described Mobile base 8 is positioned at frame 1 base plate center left, the two is movably connected, described positioning module 9 is positioned at Mobile base 8 top center place, the two screw thread is connected, the second described servomotor 10 is positioned on the upside of center, frame 1 back side, the two screw thread is connected, the second described screw mandrel 11 is positioned at the second center, servomotor 10 front end, itself and frame 1 are movably connected, be connected with the second servomotor 10 screw thread.Described computer for controlling 12 is positioned at frame 1 top center front end, the two screw thread is connected, described holder 2 top is also provided with guide rail 201, itself and mobile mount pad 5 are movably connected, be connected with holder 2 screw thread, the first feed nut 501 is also provided with bottom described mobile installation 5 right-hand members, it engages with the first screw mandrel 4, be connected with mobile mount pad 5 screw thread, illuminating lamp 701 is also provided with on the right side of described electron microscope 7 bottom centre, the two screw thread is connected, and described place of Mobile base 8 bottom centre is also provided with nut mount pad 801, and the two is weldingly connected.Described nut mount pad 801 inside center place is also provided with the second feed nut 802, it engages with the second screw mandrel 11, be connected with nut mount pad 801 screw thread, this device drives the first screw mandrel 4 to rotate by the first servomotor 3, utilize the first screw mandrel 4 to engage with the first feed nut 501 and drive mobile installation 5 to move forward and backward, second servomotor 9 drives the second screw mandrel 10 to rotate, Mobile base 8 is driven to move left and right by the second screw mandrel 10 and the second feed nut 802, laser welding system 6 is launched high energy electron beam and is completed IC chip 13 and weld, consistent by electron beam welding weld temperature, thus the quality of the welding product ensured, its mid frame 1, holder 2, mobile mount pad 5, Mobile base 8 is support fixed mechanisms of this device of composition, computer for controlling 13 is control systems of this device, electron microscope 7 to process amplification, handled easily, lighting lamp 701 makes electron microscope 7 bright and clear.

The present invention is not limited to above-mentioned concrete embodiment, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion made, all drop within protection scope of the present invention.

Claims (6)

1. an IC chip laser welder, comprise frame, it is characterized in that comprising holder, first servomotor, first screw mandrel, mobile mount pad, laser welding system, electron microscope, Mobile base, positioning module, second servomotor, second screw mandrel, controlling calculation device, IC chip, described fixed seating is in frame top center right-hand member, the two screw thread is connected, the first described servomotor is positioned at holder right-hand member center, the two screw thread is connected, the first described screw mandrel is positioned at the first servomotor left end center, itself and holder are movably connected, be connected with the first servomotor screw thread, described mobile mount pad is positioned at holder top, the two is movably connected, described laser welding system is positioned at place of mobile mount pad left end bottom centre, the two screw thread is connected, described electron microscope is positioned at place of laser welding system bottom centre, the two screw thread is connected, described sliding seats is in framework soleplate center left, the two is movably connected.Described positioning module is arranged in mobile top center place, the two screw thread is connected, the second described servomotor is positioned on the upside of center, the frame back side, the two screw thread is connected, the second described screw mandrel is positioned at the second center, servomotor front end, and itself and frame are movably connected, and is connected with the second servomotor screw thread, described computer for controlling is positioned at frame top hub head end, and the two screw thread is connected.
2. a kind of IC chip laser welder as claimed in claim 1, it is characterized in that described holder top is also provided with guide rail, itself and mobile mount pad are movably connected, and are connected with holder screw thread.
3. a kind of IC chip laser welder as claimed in claim 2, it is characterized in that also being provided with the first feed nut bottom described mobile mount pad right-hand member, it engages with the first screw mandrel, is connected with mobile mount pad screw thread.
4. a kind of IC chip laser welder as claimed in claim 3, is characterized in that also being provided with illuminating lamp on the right side of described electron microscope bottom centre, and the two screw thread is connected.
5. a kind of IC chip laser welder as claimed in claim 4, it is characterized in that described place of Mobile base bottom centre is also provided with nut mount pad, the two is weldingly connected.
6. a kind of IC chip laser welder as claimed in claim 5, it is characterized in that described nut mount pad inside center place is also provided with the second feed nut, it engages with the second screw mandrel, is connected with nut mount pad screw thread.
CN201510012194.1A 2015-01-09 2015-01-09 Integrated circuit (IC) chip laser welding device CN104646828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510012194.1A CN104646828A (en) 2015-01-09 2015-01-09 Integrated circuit (IC) chip laser welding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510012194.1A CN104646828A (en) 2015-01-09 2015-01-09 Integrated circuit (IC) chip laser welding device

Publications (1)

Publication Number Publication Date
CN104646828A true CN104646828A (en) 2015-05-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510012194.1A CN104646828A (en) 2015-01-09 2015-01-09 Integrated circuit (IC) chip laser welding device

Country Status (1)

Country Link
CN (1) CN104646828A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202411601U (en) * 2011-12-20 2012-09-05 奥特力合自动化技术(北京)有限公司 Spot welding and carrying device of integral chip
CN202780148U (en) * 2012-08-22 2013-03-13 弘益泰克自动化设备(惠州)有限公司 Welding machine using two soldering irons for welding
CN202861569U (en) * 2012-04-18 2013-04-10 深圳市恒毅兴实业有限公司 Circuit board welding-based welding system
CN203265889U (en) * 2013-04-23 2013-11-06 张珍燕 Self-protection type laser welding machine
CN104084697A (en) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 Laser cutting equipment for stainless steel chip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202411601U (en) * 2011-12-20 2012-09-05 奥特力合自动化技术(北京)有限公司 Spot welding and carrying device of integral chip
CN202861569U (en) * 2012-04-18 2013-04-10 深圳市恒毅兴实业有限公司 Circuit board welding-based welding system
CN202780148U (en) * 2012-08-22 2013-03-13 弘益泰克自动化设备(惠州)有限公司 Welding machine using two soldering irons for welding
CN203265889U (en) * 2013-04-23 2013-11-06 张珍燕 Self-protection type laser welding machine
CN104084697A (en) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 Laser cutting equipment for stainless steel chip

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Application publication date: 20150527