CN104640374A - Method for transplanting circuit board - Google Patents

Method for transplanting circuit board Download PDF

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Publication number
CN104640374A
CN104640374A CN201310548186.XA CN201310548186A CN104640374A CN 104640374 A CN104640374 A CN 104640374A CN 201310548186 A CN201310548186 A CN 201310548186A CN 104640374 A CN104640374 A CN 104640374A
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CN
China
Prior art keywords
circuit board
framework
those
holding section
sub
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Granted
Application number
CN201310548186.XA
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Chinese (zh)
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CN104640374B (en
Inventor
林哲永
张阿松
杨伟雄
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TRIPOD (WUXI) ELECTRONIC CO Ltd
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TRIPOD (WUXI) ELECTRONIC CO Ltd
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Priority to CN201310548186.XA priority Critical patent/CN104640374B/en
Publication of CN104640374A publication Critical patent/CN104640374A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits

Abstract

The invention discloses a method for transplanting a circuit board. The method comprises the following steps: a plurality of sub circuit boards which are confirmed as qualified ones through layer offset test and electrical test are provided, wherein each sub circuit board is composed of a body, a plurality of foldable connecting rods, a plurality of clamping parts and a plurality of first alignment points, and each foldable connecting rod protrudes from the body and is connected with the corresponding clamping part; a framework is provided, wherein the framework is composed of an upper frame, a lower frame, two side frames, a plurality of clamping openings and a plurality of second alignment points, the clamping openings are disposed in the inner edges of the upper frame and the lower frame, the second alignment points are arranged on the upper frame and the lower frame, and the side frames are connected with the upper frame and the lower frame to jointly define a plurality of transplanting gaps; and the first alignment points and the second alignment points are aligned with each other to arrange the sub circuit boards in the transplanting gaps, and the clamping parts are embedded into the corresponding clamping openings to fix the sub circuit boards to the framework.

Description

Transplant the method for circuit board
Technical field
The present invention relates to a kind of transplanting method for semiconductor, and particularly relate to a kind of method of transplanting circuit board.
Background technology
One piece of circuit substrate is normally made into multiple sub-circuit board by the manufacture method of current circuit board, forms a multi-connection circuit board to make circuit substrate.But, the sub-circuit board with flaw slightly can be produced in process of production unavoidably, if defective products is scrapped process, waste resource.In view of this, the manufacturer of part multi-connection circuit board first can carry out testing electrical property to the sub-circuit board of multi-connection circuit board, again the multiple sub-circuit boards being defined as non-defective unit after testing electrical property are reassembled into new multi-connection circuit board, are all available non-defective unit to make the sub-circuit board on these multi-connection circuit boards after restructuring.
But sub-circuit board is normally embedded in two edges opposing upper and lower by the technology of transplanting at present circuit board respectively, places with frame multiple sub-circuit board of stating and being defined as non-defective unit and form new multi-connection circuit board.But because the rigidity of the two edges up and down in order to frame defensive wall circuit board is not enough, easily in manufacturing process, or being subject to bending in the assembling process of sub-circuit board even causes damaging.In addition, because two edges is independent two components separately made, therefore, easily produce between the two edges of same multi-connection circuit board and make tolerance, add bending distortion and harmomegathus difference that two edges may cause because rigidity is not enough, above-mentioned various reasons all can affect the reliability of precision when multi-connection circuit board assembling engages and subsequent manufacturing processes.
Summary of the invention
The object of the present invention is to provide a kind of method of transplanting circuit board, it can improve the precision that the assembling between sub-circuit board with framework engages and the space utilization degree improved in circuit board implantation structure.
For reaching above-mentioned purpose, a kind of method of transplanting circuit board of the present invention, it comprises the following steps.First, layer bias testing and testing electrical property are carried out to multiple sub-circuit board.Then, multiple sub-circuit board confirming as non-defective unit through layer bias testing and testing electrical property is filtered out.Each sub-circuit board comprises a body, multiplely rolls over connecting rod, multiple holding section and multiple first loci.Respectively can roll over connecting rod protrude from body and connect corresponding holding section.One framework is provided.Framework comprises a upper side frame, a lower frame, both sides frame, multiple snap openings and multiple second loci.Snap openings lays respectively at the inner edge of upper side frame and lower frame.Second loci is arranged on upper side frame and lower frame respectively.Each side frame connects upper side frame and lower frame, jointly to define multiple transplanting breach.Then, the first loci and the second loci are carried out contraposition, transplant in breach so that sub-circuit board is arranged at respectively, and each holding section is fitted together to corresponding snap openings, with stator circuit board on framework.
In one embodiment of this invention, the method of above-mentioned transplanting circuit board, the step of its middle level bias testing comprises and forms two patterned line layer respectively in two surfaces up and down of each sub-circuit board with laser direct imaging or direct imaging technology, and the layer detected between two patterned line layer is inclined.
In one embodiment of this invention, above-mentioned holding section is circular, and the first loci is positioned at the center of circle of corresponding holding section.
In one embodiment of this invention, the method for above-mentioned transplanting circuit board be more included in stator circuit board on framework after, remove both sides frame.
In one embodiment of this invention, above-mentioned framework is pair of lamina plate structure.
In one embodiment of this invention, a circuit number of plies of above-mentioned framework equals a circuit number of plies of each sub-circuit board.
In one embodiment of this invention, above-mentioned framework is formed in one.
In one embodiment of this invention, the above-mentioned method of framework that provides more comprises the following steps.First, form multiple accurate snap openings on the inner edge of upper side frame and lower frame, the size of each accurate snap openings is less than the size of each holding section.Then, an outline of each holding section and each outline distance to the first corresponding loci is detected.The relative position of the distance that foundation detects and the first loci and the second loci, obtain the region multiple to be removed framework corresponding to holding section, region to be removed lays respectively at around those accurate snap openings.Then, the region to be removed be positioned at around accurate snap openings is removed, to form snap openings.One size of each snap openings is more than or equal in fact a size of each holding section.
In one embodiment of this invention, the beeline that the method for above-mentioned transplanting circuit board more comprises an edge to the edge of corresponding snap openings controlling each holding section is less than in fact between 400 microns.
In one embodiment of this invention, the method for above-mentioned transplanting circuit board be more included in each holding section is chimeric with corresponding snap openings after, fill colloid between each holding section and corresponding snap openings.Then, colloid is solidified.
Based on above-mentioned, the present invention utilizes a framework next accommodating and fixing multiple sub-circuit board, to form the multi-connection circuit board comprising multiple sub-circuit board, wherein, framework has upper side frame, lower frame and both sides frame, be sticked in this framework by the multiple sub-circuit boards being defined as non-defective unit after layer bias testing and testing electrical property again, to be assembled into multi-connection circuit board, and the sub-circuit board on this multi-connection circuit board is all available non-defective unit.Because framework of the present invention is made up of upper side frame, lower frame and both sides frame, therefore structural rigidity is comparatively strong, is not easy to arrange in the process of sub-circuit board on framework bent or damage, and then can increase the yield of manufacture craft.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is a kind of flow process block schematic diagram transplanting the method for circuit board according to one embodiment of the invention;
Fig. 2 is the schematic diagram of a kind of framework according to one embodiment of the invention and sub-circuit board;
Fig. 3 is the assembling schematic diagram of a kind of framework according to one embodiment of the invention and sub-circuit board;
Fig. 4 is a kind of schematic diagram transplanting the method for circuit board according to one embodiment of the invention;
Fig. 5 is the partial cutaway schematic of a kind of sub-circuit board according to one embodiment of the invention.
Symbol description
10: multi-connection circuit board
100: framework
110: upper side frame
112: inner edge
120: lower frame
130: side frame
140: snap openings
142: accurate snap openings
150: the second loci
160: transplant breach
170: region to be removed
200: sub-circuit board
210: body
220: holding section
230: the first loci
240: base material
250a, 250b: patterned line layer
260: can connecting rod be rolled over
Embodiment
Aforementioned and other technology contents, feature and effect for the present invention, in the following detailed description coordinated with reference to each embodiment of accompanying drawing, can clearly present.The direction term mentioned in following examples, such as: " on ", D score, "front", "rear", "left", "right" etc., be only the direction with reference to attached drawings.Therefore, the direction term of use is used to illustrate, and is not used for limiting the present invention.Further, in following each embodiment, same or analogous element will adopt same or analogous label.
Fig. 1 is a kind of flow process block schematic diagram transplanting the method for circuit board according to one embodiment of the invention.Fig. 2 is the schematic diagram of a kind of framework according to one embodiment of the invention and sub-circuit board.Referring to Fig. 1 and Fig. 2, first the method for the transplanting circuit board of the present embodiment can comprise the following steps:, provides the multiple sub-circuit board 200(step S110 being defined as non-defective unit after bias testing and testing electrical property).In the present embodiment, first can carry out layer bias testing and testing electrical property to multiple sub-circuit board, to be defined as multiple sub-circuit boards 200 of non-defective unit after filtering out layer bias testing and testing electrical property.Specifically, each sub-circuit board 200 comprises a body 210, multiplely rolls over connecting rod 260, multiple holding section 220 and multiple first loci 230.Respectively can roll over connecting rod 260 protruding from body 210 and being fitted together to corresponding holding section 220 as shown in Figure 2.
Then, provide a framework 100, it comprises upper side frame 110, lower frame 120 and a both sides frame 130, and to define multiple transplanting breach 160, and framework 100 more comprises multiple second loci 150(step S120).In the present embodiment, sub-circuit board first can carry out layer bias testing and testing electrical property by foregoing batch, to be defined as multiple sub-circuit boards 200 of non-defective unit after filtering out layer bias testing and testing electrical property.Afterwards, then the sub-circuit board 200 these being defined as non-defective unit be assembled to framework 100 respectively transplanting breach 160 in and form multi-connection circuit board, in order to shipment.So, the sub-circuit board 200 on these multi-connection circuit boards after having assembled is all available non-defective unit.Specifically, framework 100 comprises upper side frame 110, lower frame 120, both sides frame 130, multiple snap openings 140 and multiple second loci 150, wherein, snap openings 140 lays respectively at the inner edge of upper side frame 110 and lower frame 120, second loci 150 is arranged at upper side frame 110 and this lower frame 120 outermost respectively and arranges in diagonal angle, contains whole multi-connection circuit board 10 to make contraposition region.Each side frame 130 connects upper side frame 110 and lower frame 120 as shown in Figure 1, makes upper side frame 110, lower frame 120 and both sides frame 130 jointly define multiple transplanting breach 160.In the present embodiment, framework 100 can be formed in one.Therefore, the framework 100 of the present embodiment has more excellent structural rigidity, and, because frame 110,120,130 is for make simultaneously, therefore more not easily produce making tolerance between the frame 110,120,130 of each framework 100, thus can increase the making yield of framework 100, and then the reliability of subsequent manufacturing processes can be increased.
Afterwards, the first loci 230 and the second loci 150 are carried out contraposition, transplant in breach 160 (step S140) so that sub-circuit board 200 is arranged at respectively.Specifically, in the present embodiment, the first loci 230 be arranged on sub-circuit board 200 can such as be positioned on body 210, also can be positioned on holding section 220, and contraposition can be carried out according to the first loci 230 and the second loci 150, transplant in breach 160 so that sub-circuit board 200 is arranged at respectively, and each holding section 220 is fitted together to corresponding snap openings 140, on framework 100, form the multi-connection circuit board be made up of multiple sub-circuit board 200 with stator circuit board 200.Specifically, the holding section 220 of the present embodiment is rounded, and the first loci 230 is positioned on the center of circle of corresponding holding section 220.The alignment method of the present embodiment such as can carry out Auto-Sensing by one optics/image positioning apparatus and be arranged at the second loci 150 on framework 100, to orient the position of transplanting breach 160, and Auto-Sensing is arranged at the first loci 230 on sub-circuit board 200 to orient the setting position of sub-circuit board 200, transplant in breach 160 so that sub-circuit board 200 is arranged at exactly.In the present embodiment, optics/image positioning apparatus is such as a charge coupled cell (charge-coupled device, CCD).
Fig. 3 is the assembling schematic diagram of a kind of framework according to one embodiment of the invention and sub-circuit board.Please refer to Fig. 2 and Fig. 3, after sub-circuit board 200 is fixed on framework 100, optionally remove both sides frame 130 as shown in Figure 2, to form multi-connection circuit board 10 as shown in Figure 3.Certainly, the accompanying drawing of the present embodiment is only in order to illustrate, in other embodiments of the invention, multi-connection circuit board 10 also can not remove both sides frame 130, namely maintains complete frame 100 as shown in Figure 2.Further, the transplanting breach 160 of the present invention also not in limiting frame 100 and the quantity of open ended sub-circuit board 200 thereof.In addition, framework 100 can be staggeredly stacked by multiple base material and line layer equally with sub-circuit board and form, and wherein, the circuit number of plies of framework 100 can be identical with the circuit number of plies of each sub-circuit board 200.But the framework 100 due to the present embodiment can separate with sub-circuit board and formed, and therefore, the circuit number of plies of framework 100 can be not identical with the circuit number of plies of each sub-circuit board 200 yet.More particularly, the circuit number of plies of framework 100 can be less than the circuit number of plies of each sub-circuit board 200, to save material cost.In the present embodiment, sub-circuit board 200 can be Multilayer Structure, and framework 100 then can be double panel structure.
Fig. 4 is a kind of schematic diagram transplanting the method for circuit board according to one embodiment of the invention.Referring to Fig. 2 and Fig. 4, specifically, in the present embodiment, the method of the framework 100 with snap openings 140 is provided to comprise the following steps: first, first form multiple accurate snap openings 142 as shown in Figure 4 on the inner edge 112 of upper side frame 110 and lower frame 120, and the size of each accurate snap openings 142 is less than the size of each holding section 220.Specifically, as shown in Figure 4, the orthographic projection scope of each accurate snap openings 142 on a datum level is about less than the orthographic projection scope of each holding section 220 at same datum level, that is the orthographic projection of accurate snap openings 142 on a datum level can drop on holding section 220 in the scope of the orthographic projection of same datum level.It should be noted that at this, in order to simplified form, Fig. 4 only illustrates the holding section 220 of sub-circuit board 200 and the close-up schematic view of upper side frame 110 to present the relation between accurate snap openings 142 and holding section 220.
Afterwards, according to the first loci 150 and the second loci 230, holding section 220 is corresponded on framework 100, to obtain region 170 multiple to be removed as shown in Figure 4, wherein, region 170 to be removed is corresponding holding section 220 respectively, and is positioned at accurate snap openings 142 around.Specifically, the present embodiment such as can detect the position of the first loci 230 by optics/image positioning apparatus, and detect an outline of each holding section 220 and outline respectively to the distance of the first corresponding loci 230, and according to this distance and the relative position of the first loci 230 and the second loci 150, this outline can be corresponded respectively to accurate snap openings 142 place of upper side frame 110 and lower frame 120, to obtain the position that holding section 220 should be arranged at upper side frame 110 and lower frame 120 respectively.Now, size due to accurate snap openings 142 is about less than the size of holding section 220, therefore the outline of holding section 220 can contain a peripheral region of accurate snap openings 142 as shown in phantom in figure 4, and the region that the outline of holding section 220 is overlapping with the surrounding of accurate snap openings 142 (hatched example areas as shown in Figure 4) is the district to be removed 170 described in the present embodiment.In the present embodiment, optics/image positioning apparatus is such as a charge coupled cell, and the method removing region 170 to be removed comprises ultraviolet laser (UV laser) cutting.In addition, if holding section 220 is circular, and the first loci 230 is positioned at the center of circle of corresponding holding section 220, the circular radius value of the holding section 220 namely can preset as " outline is respectively to the distance of the first corresponding loci 230 ", and can make contraposition more accurate.
Then, i.e. the removable region to be removed 170 be positioned at around accurate snap openings 142, to form snap openings 140 as shown in Figure 2, wherein, a size of each snap openings 140 can be more than or equal in fact a size of each holding section 220.So, can form framework 100 as shown in Figure 2, it has the snap openings 140 chimeric with holding section 220, and sub-circuit board 200 is fixed on framework 100 by holding section 220 and the Qian He of snap openings 140.In the present embodiment, if the size of snap openings 140 is slightly larger than a size of holding section 220, the beeline that can control an edge a to edge of corresponding snap openings 140 of each holding section 220 is less than in fact 400 microns.In more detail, the beeline at edge to the edge of corresponding snap openings 140 of each holding section 220 in fact can between 50 microns to 400 microns.
Hold above-mentioned, after each holding section 220 is chimeric with corresponding snap openings 140, optionally can fill colloid again between each holding section 220 and corresponding snap openings 140.Then, a solidification manufacture craft can be carried out again to solidify this colloid, to be more firmly fixed on framework 100 by sub-circuit board 200.At this, the kind of colloid can be different according to its solidified forming mode difference, and its curing mode has the modes such as photocuring, hot curing and quick-dry type solidification.Certainly, the present invention is not as limit.Should be noted that, the snap openings 140 that the circuit board implantation method due to the present embodiment is formed can be closely chimeric with holding section 220, and therefore, filling colloid and solidification colloid is not steps necessary and optionally implementing.
Fig. 5 is the partial cutaway schematic of a kind of sub-circuit board according to one embodiment of the invention.Should be noted that at this, in the present embodiment, each sub-circuit board 200 can comprise base material 240 and two patterned line layer 250a, a 250b, and wherein, patterned line layer 250a, 250b lay respectively at two surfaces up and down of corresponding base material 240 as shown in Figure 5.In the present embodiment, method in two surface formation patterned line layer 250a, the 250b up and down of base material 240 can comprise laser direct imaging (Laser Direct Image, or direct imaging (Direct Image LDI), DI) technology, and the step of aforesaid layer bias testing such as first can form patterned line layer 250a, 250b in two surfaces up and down of the base material 240 of each sub-circuit board 200 with above-mentioned laser direct imaging or direct imaging technology respectively, then the layer detected between two patterned line layer 250a, 250b is inclined.Specifically, laser direct imaging technology is such as the figure copper-clad plate face that adopts laser straight to be connected on to apply photoresist oxidant layer scanned for imaging, and photographic negative need not be applied through exposure transition diagram picture, the problem that the distortion thus egative film being avoided to bring is lost shape.Therefore, this kind of technology is utilized to form patterned line layer 250a, 250b in two surfaces up and down of base material 240, layer between patterned line layer 250a, 250b can be effectively reduced inclined, and then sub-circuit board 200 is regarded as defective products situation because the layer between patterned line layer 250a, 250b on its corresponding upper and lower two surfaces is partially excessive can be reduced.In the present embodiment, adopt patterned line layer 250a, 250b that laser direct imaging or direct imaging technology are formed, its layer between the two partially about can be less than 10 microns.Certainly; have in any art and usually know that the knowledgeable should be appreciated that; the accompanying drawing of the present embodiment is only in order to illustrate; the present embodiment does not limit the base material of sub-circuit board 200 and the number of plies of patterned line layer; as long as the patterned line layer be positioned on relative two surfaces of sub-circuit board 200 formed by laser direct imaging or direct imaging technology, be the present embodiment for protection scope.
In sum, the present invention utilizes a framework next accommodating and fixing multiple sub-circuit board, to form the multi-connection circuit board comprising multiple sub-circuit board, wherein, framework has upper side frame, lower frame and both sides frame, jointly to define multiple transplanting breach, then is sticked in this framework by the multiple sub-circuit boards being defined as non-defective unit after layer bias testing and testing electrical property, to be assembled into multi-connection circuit board, and the sub-circuit board on this multi-connection circuit board is all available non-defective unit.Because framework of the present invention is made up of upper side frame, lower frame and both sides frame, therefore structural rigidity is comparatively strong, is not easy to arrange in the process of sub-circuit board on framework bent or damage.Further, because framework can be formed in one, therefore more not easily produce making tolerance between the frame of each framework, thus can increase the making yield of framework, and then the reliability of the precision that can increase when sub-circuit board engages with framework and subsequent manufacturing processes.
Moreover, the present invention is more used on framework and forms snap openings surely, its size is less than the size of holding section, holding section is oriented corresponding to the setting position on framework again according to the loci on framework and sub-circuit board, size again according to holding section carefully repaiies accurate snap openings, to form the snap openings overlapped with the outline of holding section.The snap openings that Using such method is formed can be closely chimeric with holding section, thus can increase the adhesion between sub-circuit board and framework.In addition, method provided by the present invention more can form the snap openings chimeric with holding section by batch on framework, thus can simplify production process and promote production efficiency.
Although disclose the present invention in conjunction with above embodiment; but itself and be not used to limit the present invention; this operator is familiar with in any art; without departing from the spirit and scope of the present invention; a little change and retouching can be done, therefore being as the criterion of should defining with the claim of enclosing of protection scope of the present invention.

Claims (10)

1. transplant a method for circuit board, comprising:
Multiple sub-circuit board confirming as non-defective unit through layer bias testing and testing electrical property is provided, respectively this sub-circuit board comprises a body, multiplely rolls over connecting rod, multiple holding section and multiple first loci, and respectively this can be rolled over connecting rod and protrudes from this body and connect corresponding holding section;
One framework is provided, this framework comprises a upper side frame, a lower frame, both sides frame, multiple snap openings and multiple second loci, those snap openings lay respectively at the inner edge of this upper side frame and this lower frame, those second loci are arranged on this upper side frame and this lower frame respectively, respectively this side frame connects this upper side frame and this lower frame, jointly to define multiple transplanting breach; And
Those first loci and those the second loci are carried out contraposition, transplants in breach those sub-circuit boards to be arranged at respectively those, and each this holding section is fitted together to corresponding snap openings and fixes those sub-circuit boards on this framework.
2. method of transplanting circuit board as claimed in claim 1, wherein the step of this layer of bias testing comprises:
Two patterned line layer are formed respectively in two surfaces up and down of each this sub-circuit board with laser direct imaging or direct imaging technology; And
The layer detected between this two patterned line layer is inclined.
3. method of transplanting circuit board as claimed in claim 1, wherein those holding sections are circular, and those first loci are positioned at the center of circle of this corresponding holding section.
4. method of transplanting circuit board as claimed in claim 1, also comprises:
Fix those sub-circuit boards on this framework after, remove this both sides frame.
5. method of transplanting circuit board as claimed in claim 1, wherein this framework is pair of lamina plate structure.
6. method of transplanting circuit board as claimed in claim 1, wherein a circuit number of plies of this framework equals a circuit number of plies of respectively this sub-circuit board.
7. method of transplanting circuit board as claimed in claim 1, wherein this framework is formed in one.
8. method of transplanting circuit board as claimed in claim 1, wherein provides the method for this framework also to comprise:
Form multiple accurate snap openings on the inner edge of this upper side frame and this lower frame, respectively the size of this accurate snap openings is less than the size of respectively this holding section;
Detecting respectively this holding section an outline and respectively this outline to a distance of the first corresponding loci;
According to the relative position of this distance and those the first loci and those the second loci, obtain the region multiple to be removed this framework corresponding to those holding sections, those regions to be removed lay respectively at around those accurate snap openings; And
Remove those regions to be removed be positioned at around those accurate snap openings, to form those snap openings, respectively a size of this snap openings is more than or equal in fact a size of respectively this holding section.
9. method of transplanting circuit board as claimed in claim 8, the step wherein forming those snap openings also comprises:
The beeline controlling an edge a to edge of corresponding snap openings of respectively this holding section is less than in fact 400 microns.
10. method of transplanting circuit board as claimed in claim 1, also comprises:
After each this holding section is chimeric with corresponding snap openings, fill colloid in respectively between this holding section and corresponding snap openings; And
Solidify this colloid.
CN201310548186.XA 2013-11-07 2013-11-07 The method for transplanting circuit board Active CN104640374B (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN110430695A (en) * 2019-07-03 2019-11-08 温州源利智能科技有限公司 A kind of automatic charging device and charging method of pcb board

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CN201063967Y (en) * 2007-04-20 2008-05-21 欣兴电子股份有限公司 Transplant structure of printed circuit board
CN101971719A (en) * 2009-06-04 2011-02-09 揖斐电株式会社 Method for manufacturing multi-piece substrate, and multi-piece substrate

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US7235423B1 (en) * 2004-11-05 2007-06-26 Super Talent Electronics, Inc. Molded memory card production using carrier strip
CN201063967Y (en) * 2007-04-20 2008-05-21 欣兴电子股份有限公司 Transplant structure of printed circuit board
CN101971719A (en) * 2009-06-04 2011-02-09 揖斐电株式会社 Method for manufacturing multi-piece substrate, and multi-piece substrate

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110430695A (en) * 2019-07-03 2019-11-08 温州源利智能科技有限公司 A kind of automatic charging device and charging method of pcb board
CN110430695B (en) * 2019-07-03 2020-07-14 无锡麒龙覆铜板有限公司 Automatic feeding device and method for PCB

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