CN104626039A - Loading and unloading jig - Google Patents
Loading and unloading jig Download PDFInfo
- Publication number
- CN104626039A CN104626039A CN201310571688.4A CN201310571688A CN104626039A CN 104626039 A CN104626039 A CN 104626039A CN 201310571688 A CN201310571688 A CN 201310571688A CN 104626039 A CN104626039 A CN 104626039A
- Authority
- CN
- China
- Prior art keywords
- bearing seat
- load bearing
- handle
- handling tool
- fixing holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
Abstract
The invention discloses a loading and unloading jig used for loading and unloading a carrying seat in a cavity of a semiconductor rack. The carrying seat is provided with multiple first fixing holes. The loading and unloading jig comprises a combination device, multiple fixing pieces and at least one handle. The combination device is provided with multiple second fixing holes aligned with the first fixing holes. The fixing pieces are used for penetrating into the second fixing holes and the first fixing holes which are aligned, so that the combination device and the carrying seat are combined. The handles are connected to the combination device.
Description
Technical field
The invention relates to a kind of handling tool, and relate to a kind of handling tool of semiconductor board especially.
Background technology
The load bearing seat carrying wafer is provided with, as electrostatic chuck (electrostatic chuck, E-chuck) or wafer block (chuck) in the chamber of semiconductor board.Need change when load bearing seat ability is weak, but load bearing seat is not quick detachable and unloading process is quite consuming time, operating personnel must be free-hand or pull open with bottle opener and just can pull down, and operating personnel easily cause damage to load bearing seat during the disassembling section performing load bearing seat.Particularly when load bearing seat has O type ring (O-ring), produce stickiness because O type ring can be heated when semiconductor board operates, the dismounting of load bearing seat therefore can be made more difficult.
On the other hand, expensive due to load bearing seat, if damage in the process of the disassembling section of load bearing seat, will produce expensive replacement cost.
Summary of the invention
The invention provides a kind of handling tool, it can reduce the time of handling needed for load bearing seat significantly, and does not have the replacement cost produced because handling cause load bearing seat to damage.
The present invention proposes a kind of handling tool, and for the load bearing seat in the chamber of handling semiconductor board, wherein load bearing seat has multiple first fixing hole, and handling tool comprises coupling apparatus, multiple fixture and at least one handle.Coupling apparatus has multiple second fixing holes of aligning first fixing hole.Fixture for being located in the second fixing hole and the first fixing hole that align, so that coupling apparatus and load bearing seat are combined.Handle is connected to coupling apparatus.
The present invention proposes another kind of handling tool, and for the load bearing seat in the chamber of handling semiconductor board, wherein load bearing seat has multiple first fixing hole, and handling tool comprises at least one handle, coupling apparatus and multiple fixture.Coupling apparatus is connected to handle, and has multiple second fixing holes of aligning first fixing hole.Fixture for being located in the second fixing hole and the first fixing hole that align, handle and load bearing seat are combined by coupling apparatus.
Described in one embodiment of the invention, in above-mentioned handling tool, the quantity of the second fixing hole is such as the quantity being less than or equal to the first fixing hole.
Described in one embodiment of the invention, in above-mentioned handling tool, the center of the line that the second fixing hole is formed or the geometric center of figure formed are such as aim at the central point of load bearing seat.
Described in one embodiment of the invention, in above-mentioned handling tool, the profile at the profile of coupling apparatus and the first fixing hole place of load bearing seat such as matches.
Described in one embodiment of the invention, in above-mentioned handling tool, coupling apparatus is such as integrated conjunction or multiple conjunctions separated from one another.
Described in one embodiment of the invention, in above-mentioned handling tool, fixture is such as screw.
Described in one embodiment of the invention, in above-mentioned handling tool, handle is such as across the handle of load bearing seat, multiple handle separated from one another or the handle around load bearing seat.
Described in one embodiment of the invention, in above-mentioned handling tool, the connected mode of handle and coupling apparatus is such as welding or integral forming method.
Described in one embodiment of the invention, in above-mentioned handling tool, load bearing seat is such as electrostatic chuck or wafer block.
Described in one embodiment of the invention, in above-mentioned handling tool, load bearing seat can have seal, and seal is arranged on the sealing surface of load bearing seat.
Based on above-mentioned, handling tool proposed by the invention easily and rapidly handling can be arranged in the load bearing seat of the chamber of semiconductor board, therefore can reduce the time of handling needed for load bearing seat significantly.In addition, by handling tool proposed by the invention, can prevent load bearing seat from producing when loading and unloading and damage, therefore not have the replacement cost produced because handling cause load bearing seat to damage.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate institute's accompanying drawings to be described in detail below.
Accompanying drawing explanation
Fig. 1 illustrate the explosive view of load bearing seat when loading and unloading of handling tool for one embodiment of the invention and semiconductor board.
Fig. 2 illustrate the explosive view of load bearing seat when loading and unloading of handling tool for another embodiment of the present invention and semiconductor board.
Fig. 3 illustrate the explosive view of load bearing seat when loading and unloading of handling tool for another embodiment of the present invention and semiconductor board.
[symbol description]
100: semiconductor board
102: chamber
104: load bearing seat
106,108,208,408: fixing hole
110: seal
112: sealing surface
200,300,400: handling tool
202,402: coupling apparatus
204,404: fixture
206,306,406: handle
210: conjunction
Detailed description of the invention
Fig. 1 illustrate the explosive view of load bearing seat when loading and unloading of handling tool for one embodiment of the invention and semiconductor board.
Please refer to Fig. 1, handling tool 200, for the load bearing seat 104 in the chamber 102 of handling semiconductor board 100.Wherein, load bearing seat 104 has multiple fixing hole 106, fixing hole 106 can be used for load bearing seat 104 to be fixed in this chamber 102 of semiconductor board 100, such as, be to utilize the conjunctions such as screw (not illustrating) to be arranged in the fixing hole 106 and the fixing hole 108 in chamber 102 that align.Load bearing seat 104 is such as electrostatic chuck or wafer block.Load bearing seat 104 can have seal 110, and seal 110 is arranged on the sealing surface 112 of load bearing seat 104.Seal 110 is such as O type ring or metal seal (metal seal).Semiconductor board 100 is such as deposition machine, and as the deposition machine of the Novellus Speed type of Novellus Inc., but the semiconductor board that the present invention is suitable for is not as limit.
Handling tool 200 comprises coupling apparatus 202, multiple fixture 204 and at least one handle 206.Coupling apparatus 202 has the multiple fixing holes 208 aiming at fixing hole 106.The quantity of fixing hole 208 is such as the quantity being less than or equal to fixing hole 106.In this embodiment, the quantity of fixing hole 208 is such as 2, and the quantity of fixing hole 106 is such as 8, but the quantity of the quantity of fixing hole 208 and fixing hole 106 is not as limit, has in this technical field and usually know that the knowledgeable can adjust according to the quantity of product design demand to the quantity of fixing hole 208 and fixing hole 106.
In this embodiment, the quantity of fixing hole 208 is two, and the center of the line that fixing hole 208 is formed is such as the central point aiming at load bearing seat 104.In another embodiment, when the quantity of fixing hole 208 is more than three, the geometric center of the figure that fixing hole 208 is formed is such as aim at the central point of load bearing seat 104.In addition, geometric center according to the center of line formed by fixing hole 208 or the figure formed aims at the design of the central point of load bearing seat 104, can make the force balance when using handling tool 200 to load and unload load bearing seat 104, and Absorbable organic halogens ground loads and unloads to load bearing seat 104.
In this embodiment, coupling apparatus 202 comprises multiple conjunctions 210 separated from one another for example to be described, but the kenel of coupling apparatus 202 is not as limit.In other embodiments, coupling apparatus 202 also can be integrated conjunction.In this embodiment, the quantity of conjunction 210 is described for two, but the quantity of conjunction of the present invention 210 is not as limit.The profile at the profile of coupling apparatus 202 and fixing hole 106 place of load bearing seat 104 such as matches.The material of coupling apparatus is such as stainless steel, aluminium or Teflon (teflon).
Fixture 204 for being located in the fixing hole 208 that aligns with fixing hole 106, so that coupling apparatus 202 and load bearing seat 104 are combined.Fixture 204 is such as screw.
Handle 206 is connected to coupling apparatus 202, handle 206 and load bearing seat 104 is combined by coupling apparatus 202.Handle 206 is such as welding or integral forming method with the connected mode of coupling apparatus.In this embodiment, handle 206 is handles of striding across load bearing seat 104 for example is described, but the kenel of handle of the present invention 206 is not as limit.In other embodiments, when the quantity of conjunction 210 is more than three, has in this technical field and usually know that the knowledgeable may correspond to the quantity of conjunction 210 and adjusts according to product design demand the kenel that handle 206 strides across load bearing seat 104.In other embodiments, handle 206 also can be multiple handle separated from one another or the handle around load bearing seat 104.The material of handle 206 is such as stainless steel, aluminium or Teflon.
Known based on above-described embodiment, the handling tool 200 that above-described embodiment proposes is for loading and unloading load bearing seat 104, after handling tool 200 is combined with load bearing seat 104, can load bearing seat 104 in the chamber 102 of easily and rapidly handling semiconductor board 100, therefore can reduce the time of handling needed for load bearing seat 104 significantly.In addition, the handling tool 200 proposed by above-described embodiment, can be prevented load bearing seat 104 from producing when loading and unloading and damage, therefore not have the replacement cost produced because handling cause load bearing seat 104 to damage.
Fig. 2 illustrate the explosive view of load bearing seat when loading and unloading of handling tool for another embodiment of the present invention and semiconductor board.
Handling tool 300 referring to Fig. 2 and Fig. 1, Fig. 2 is with the difference of the handling tool 200 of Fig. 1: the handle 306 of the handling tool 300 of Fig. 2 is multiple handles separated from one another.In this embodiment, the quantity of conjunction 210 and the quantity of handle 306 are described for two, but the quantity of the quantity of conjunction of the present invention 210 and handle 306 is not as limit.Similar to the handling tool 200 of Fig. 1 to effect etc. about the material of each component of the handling tool 300 in Fig. 2, connected mode, design, and at large describe in the embodiment of Fig. 1, therefore repeat no more in this.
Known based on above-described embodiment, the handling tool 300 that above-described embodiment proposes can reduce the time of handling needed for load bearing seat 104 significantly.In addition, the handling tool 300 proposed by above-described embodiment does not have the replacement cost produced because handling cause load bearing seat 104 to damage.
Fig. 3 illustrate the explosive view of load bearing seat when loading and unloading of handling tool for another embodiment of the present invention and semiconductor board.
Be referring to the difference of the handling tool 400 of Fig. 3 and Fig. 1, Fig. 3 from the handling tool 200 of Fig. 1: the kenel of the coupling apparatus 402 in the handling tool 400 of Fig. 3, fixture 404 and handle 406 or the handling tool 200 of quantity and Fig. 1 different.The conjunction that coupling apparatus 402 is formed in one, the profile of coupling apparatus 402 can be ring-type, and matches with the profile at fixing hole 106 place of load bearing seat 104.Coupling apparatus 402 is such as have four fixing holes 408, but the quantity of the fixing hole 408 of coupling apparatus of the present invention 402 is not as limit.The quantity of fixture 404 is such as four, and corresponding with the quantity of coupling apparatus 402.Handle 406 is the handle around load bearing seat 104.Similar to the handling tool 200 of Fig. 1 to effect etc. about the material of each component of the handling tool 400 in Fig. 3, connected mode, design, and at large describe in the embodiment of Fig. 1, therefore repeat no more in this.
Known based on above-described embodiment, the handling tool 400 that above-described embodiment proposes can reduce the time of handling needed for load bearing seat 104 significantly.In addition, the handling tool 400 proposed by above-described embodiment does not have the replacement cost produced because handling cause load bearing seat 104 to damage.
In addition, the handling tool 200,300 of Fig. 1 and Fig. 2 also can adopt the coupling apparatus 402 of Fig. 4, and the handling tool 400 of Fig. 3 also can adopt the coupling apparatus 202 of Fig. 1 and Fig. 2.
In sum, the handling tool that above-described embodiment proposes at least has following characteristics.The handling tool that above-described embodiment proposes can reduce the time of handling needed for load bearing seat significantly.In addition, the handling tool proposed by above-described embodiment does not have the replacement cost produced because handling cause load bearing seat to damage.
Although the present invention discloses as above with embodiment; so itself and be not used to limit the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on the right of enclosing.
Claims (10)
1. load and unload a tool, for loading and unloading the load bearing seat in a chamber of semiconductor board, wherein this load bearing seat has multiple first fixing hole, and this handling tool comprises:
One coupling apparatus, has multiple second fixing holes aiming at these the first fixing holes;
Multiple fixture, for being located in these second fixing holes and these the first fixing holes of aligning, to combine this coupling apparatus and this load bearing seat; And
At least one handle, is connected to this coupling apparatus.
2. handling tool according to claim 1, wherein the center of line that forms of these second fixing holes or the geometric center of figure that forms aim at the central point of this load bearing seat.
3. handling tool according to claim 1, wherein this at least one handle comprises the handle striding across this load bearing seat, multiple handle separated from one another or the handle around this load bearing seat.
4. handling tool according to claim 1, wherein this load bearing seat comprises electrostatic chuck (electrostatic chuck, E-chuck) or wafer block (chuck).
5. handling tool according to claim 1, wherein this load bearing seat has a seal, the seal is arranged on the sealing surface of this load bearing seat.
6. load and unload a tool, for loading and unloading the load bearing seat in a chamber of semiconductor board, wherein this load bearing seat has multiple first fixing hole, and this handling tool comprises:
At least one handle;
One coupling apparatus, is connected to this at least one handle, and has multiple second fixing holes aiming at these the first fixing holes;
Multiple fixture, for being located in these second fixing holes and these the first fixing holes of aligning, to combine this at least one handle and this load bearing seat by this coupling apparatus.
7. handling tool according to claim 6, wherein the center of line that forms of these second fixing holes or the geometric center of figure that forms aim at the central point of this load bearing seat.
8. handling tool according to claim 6, wherein this at least one handle comprises the handle striding across this load bearing seat, multiple handle separated from one another or the handle around this load bearing seat.
9. handling tool according to claim 6, wherein this load bearing seat comprises electrostatic chuck (electrostatic chuck, E-chuck) or wafer block (chuck).
10. handling tool according to claim 6, wherein this load bearing seat has a seal, the seal is arranged on the sealing surface of this load bearing seat.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310571688.4A CN104626039A (en) | 2013-11-13 | 2013-11-13 | Loading and unloading jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310571688.4A CN104626039A (en) | 2013-11-13 | 2013-11-13 | Loading and unloading jig |
Publications (1)
Publication Number | Publication Date |
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CN104626039A true CN104626039A (en) | 2015-05-20 |
Family
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Family Applications (1)
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CN201310571688.4A Pending CN104626039A (en) | 2013-11-13 | 2013-11-13 | Loading and unloading jig |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113414737A (en) * | 2021-07-09 | 2021-09-21 | 长鑫存储技术有限公司 | Thimble installation jig and method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0696817B1 (en) * | 1994-07-16 | 2000-07-12 | JENOPTIK Technologie GmbH | Device for coupling loading and unloading apparatus to semiconductor treatment machines |
CN2447103Y (en) * | 2000-11-08 | 2001-09-12 | 陈水源 | Locating ring for grinding semiconductor chip |
US20050085171A1 (en) * | 2001-10-18 | 2005-04-21 | Yuzo Shimobeppu | Flat-object holder and method of using the same |
CN201436680U (en) * | 2006-10-13 | 2010-04-07 | 应用材料股份有限公司 | Detachable electrostatic chuck with seal assembly |
CN102747341A (en) * | 2012-08-01 | 2012-10-24 | 沈阳拓荆科技有限公司 | Special tool for installing wafer bracket and method for installing special tool |
CN203254356U (en) * | 2013-05-23 | 2013-10-30 | 赵静 | Handle type installation sleeve |
-
2013
- 2013-11-13 CN CN201310571688.4A patent/CN104626039A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0696817B1 (en) * | 1994-07-16 | 2000-07-12 | JENOPTIK Technologie GmbH | Device for coupling loading and unloading apparatus to semiconductor treatment machines |
CN2447103Y (en) * | 2000-11-08 | 2001-09-12 | 陈水源 | Locating ring for grinding semiconductor chip |
US20050085171A1 (en) * | 2001-10-18 | 2005-04-21 | Yuzo Shimobeppu | Flat-object holder and method of using the same |
CN201436680U (en) * | 2006-10-13 | 2010-04-07 | 应用材料股份有限公司 | Detachable electrostatic chuck with seal assembly |
CN102747341A (en) * | 2012-08-01 | 2012-10-24 | 沈阳拓荆科技有限公司 | Special tool for installing wafer bracket and method for installing special tool |
CN203254356U (en) * | 2013-05-23 | 2013-10-30 | 赵静 | Handle type installation sleeve |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113414737A (en) * | 2021-07-09 | 2021-09-21 | 长鑫存储技术有限公司 | Thimble installation jig and method |
CN113414737B (en) * | 2021-07-09 | 2022-05-17 | 长鑫存储技术有限公司 | Thimble installation jig and method |
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