CN104617212A - LED packaging module - Google Patents
LED packaging module Download PDFInfo
- Publication number
- CN104617212A CN104617212A CN201410804385.7A CN201410804385A CN104617212A CN 104617212 A CN104617212 A CN 104617212A CN 201410804385 A CN201410804385 A CN 201410804385A CN 104617212 A CN104617212 A CN 104617212A
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- CN
- China
- Prior art keywords
- diamond
- substrate
- sealing layer
- led assembly
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Abstract
The invention provides an LED packaging module. The LED packaging module comprises a substrate and an LED chip arranged on the substrate; a groove is formed in the bottom of a diamond solid encapsulation layer and matched with the LED chip in size; an encapsulating adhesive is arranged on the substrate at the position opposite to the edge of the groove formed in the bottom of the diamond solid encapsulation layer; the diamond solid encapsulation layer is used for receiving the LED chip and solid-encapsulated on the substrate by use of the encapsulating adhesive. In the technical field of LED chip packaging, the diamond material is firstly adopted as the solid encapsulation layer for the LED packaging module; the heat conductivity of the diamond material is far higher than that of such materials as silicone; in other words, the LED packaging module is excellent in heat dissipation effect.
Description
Technical field
The present invention relates to LED technical field, particularly relate to a kind of LED assembly.
Background technology
LED (Light Emitting Diode), light-emitting diode is a kind of can be the solid-state semiconductor device of visible ray by electric energy conversion.Therefore, LED is widely used in display unit, field of illuminating lamps, and LED is applied to various technical field widely as a kind of novel light source.
At present, traditional LED device, is generally LED chip and mounting bracket are cooperatively used, then they is fixed on together on substrate, substrate is carrying out hot link with enthusiasm.But the thermal resistance that the design of this structure can produce is higher, radiating effect is not good.Or, the silica gel that sealing LED chip adopts, but the thermal conductivity of silica gel is on the low side, and radiating effect is not good yet.As can be seen here, the heat dissipation problem of LED device is technological difficulties always.
Summary of the invention
Based on this, provide a kind of radiating effect preferably LED assembly.
A kind of LED assembly, comprising: substrate, and arrange LED chip on the substrate, groove is offered in the bottom of described diamond sealing layer, and described groove and described LED chip size match; Be provided with packaging plastic with the described substrate of the recess edge relative position bottom described diamond, described diamond sealing layer accommodates described LED chip, and by described packaging plastic sealing on the substrate.
Wherein in an embodiment, the top of described diamond sealing layer is circular arc.
Wherein in an embodiment, the edge of the groove bottom described diamond sealing layer arranges projection.
Wherein in an embodiment, the position that described substrate is relative with the recess edge bottom described diamond sealing layer arranges projection.
Wherein in an embodiment, described projection and described projection are crisscross arranged.
Wherein in an embodiment, patterned process is carried out on the described top surface of diamond sealing layer or the surface of groove.
Wherein in an embodiment, described in be patterned as the rectangle, rhombus, circle or the regular hexagon that are alternately arranged.
Wherein in an embodiment, in the middle of the patterning of described circle, cylinder is set.
Wherein in an embodiment, the surrounding of the patterning of described circle concaves formation reflection groove.
Wherein in an embodiment, in described groove, smear thermal conductive insulation glue.
In LED chip encapsulation technology field, this programme adopts diamond as sealing layer first, and diamond thermal conductivity is high a lot of than the thermal conductivity of the materials such as silica gel, that is adopts the excellent in heat dissipation effect of the LED assembly of this programme.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED assembly of an execution mode;
Fig. 2 is that the diamond sealing layer of the LED assembly of an execution mode is provided with protruding schematic diagram;
Fig. 3 is the schematic diagram that the substrate of the LED assembly of an execution mode is provided with projection;
Fig. 4 is the schematic diagram that the projection of the LED assembly of an execution mode and projection are crisscross arranged;
Fig. 5 is the vertical view that the projection of the LED assembly of an execution mode and projection are crisscross arranged;
Fig. 6 is projection and another schematic diagram of projection of the LED assembly of an execution mode;
Fig. 7 is the structural representation of the LED assembly of another execution mode;
Fig. 8 is the histogram patterning schematic diagram of an execution mode;
Fig. 9 is the diamond-shaped pattern patterning schematic diagram of an execution mode;
Figure 10 is the circular diagram patterning schematic diagram of an execution mode;
Figure 11 is that the circle of an execution mode arranges cylinder patterning schematic diagram;
Figure 12 is that the circle of an execution mode concaves and forms the patterning schematic diagram of reflection groove;
Figure 13 is the structural representation that the LED assembly of another execution mode is provided with heat conductive insulating glue-line.
Embodiment
Below in conjunction with execution mode and accompanying drawing, the structure of LED assembly is described in further detail.
The LED assembly of 1, one execution mode, comprises substrate by reference to the accompanying drawings, is arranged on the LED chip on substrate, and accommodates LED chip and the diamond sealing layer of sealing on substrate.
Substrate is the carrier of LED chip, can be aluminium base, ceramic substrate etc.
LED chip, can flip-chip or positive cartridge chip.
Diamond sealing layer, groove is offered in bottom, and this groove and LED chip size match, and be able to accommodate LED chip.Packaging plastic is provided with, diamond sealing layer collecting LED chip with the substrate of the recess edge relative position bottom diamond, and by packaging plastic sealing on substrate.This packaging plastic mainly selects the packaging plastic that light transmission is better, bonding strength is high, such as epoxy resin, silica gel, glue cake or silicones etc.
In other embodiments, by reference to the accompanying drawings 2 ~ 3, the edge of the groove bottom diamond sealing layer arranges projection, the position that substrate is relative with the edge of the groove bottom diamond sealing layer arranges projection, owing to smearing packaging plastic in this position, diamond sealing layer covers on substrate, protruding mistake mutually interactive with projection, mutual squeezing action is carried out to packaging plastic, bubble in packaging plastic is squeezed away, reduces cavity, reduce thermal resistance, improve the heat dispersion of glass substrate, and then extend the useful life of LED chip.Further, by reference to the accompanying drawings 4 ~ 5, to be protrudingly crisscross arranged with projection, as far as possible many crowded walk bubble in packaging plastic, improve radiating efficiency further.In addition, by reference to the accompanying drawings 6, shape the best that be protruding and projection is wedge shape, and both agree with each other, can also play the effect that diamond sealing layer is located, and prevents from misplacing.
In LED chip encapsulation technology field, this programme adopts diamond as sealing layer first, and diamond thermal conductivity is high a lot of than the thermal conductivity of the materials such as silica gel, that is adopts the excellent in heat dissipation effect of the LED assembly of this programme.
In one embodiment, by reference to the accompanying drawings 7, the top of diamond sealing layer is circular arc, and LED chip is housed in groove, and this groove the best is circular arc, and radian is identical with the outer surface radian of diamond sealing layer.Position residing for LED chip is just the circle centre position of diamond sealing layer, the best is the circle centre position that the luminescent layer of LED chip is in diamond sealing layer, the now outer surface of the most of smooth perpendicular grooves surface that sends of LED chip and diamond sealing layer, therefore light is not easy to reflect at diamond sealing layer.Adopt this design, the light emission rate of LED chip is higher.
In one embodiment, patterned process is carried out at the top surface of diamond sealing layer or the surface of groove.Because the light that LED chip sends is by diamond sealing layer injection extraneous (in air), and namely light is from optically denser medium directive optically thinner medium, and this time is easily in diamond sealing layer inner surface generation total reflection.Therefore, for the top surface of diamond sealing layer, carry out patterned process on this surface, to increase exiting surface, and then improve light extraction efficiency.Patterning arrange can be alternately arranged rectangle (see Fig. 8), rhombus (see Fig. 9), circular (see Figure 10) or regular hexagon.Can also further design, such as in the middle of the patterning of circle, arrange cylinder (see Figure 11), this cylinder can reverberation as side; Such as concave in the surrounding of the patterning of circle and form reflection groove (see Figure 12), increase the side of reflection further, namely increase the probability that light projects sidewall, improve light extraction efficiency.In like manner, carry out similar patterning schemes on the surface of groove, further will increase exiting surface, improve light extraction efficiency.
In one embodiment, by reference to the accompanying drawings 13, in order to better promote sealing in diamond sealing layer and baseplate-laminating tightness and groove, thermal conductive insulation glue was smeared before diamond sealing layer sealing LED chip, when diamond sealing layer collecting LED chip and sealing on substrate time, fill out between groove and LED chip and be filled with thermal conductive insulation glue, namely ensure that completely cutting off of LED chip and air, turn increase the area of diamond sealing layer and base plate bonding, improve the intensity of sealing.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a LED assembly, is characterized in that, comprising: substrate, and arrange LED chip on the substrate, groove is offered in the bottom of described diamond sealing layer, and described groove and described LED chip size match; Be provided with packaging plastic with the described substrate of the recess edge relative position bottom described diamond, described diamond sealing layer accommodates described LED chip, and by described packaging plastic sealing on the substrate.
2. LED assembly according to claim 1, is characterized in that, the top of described diamond sealing layer is circular arc.
3. LED assembly according to claim 1 and 2, is characterized in that, the edge of the groove bottom described diamond sealing layer arranges projection.
4. LED assembly according to claim 3, is characterized in that, the position that described substrate is relative with the recess edge bottom described diamond sealing layer arranges projection.
5. LED assembly according to claim 3, is characterized in that, described projection and described projection are crisscross arranged.
6. LED assembly according to claim 1 and 2, is characterized in that, patterned process is carried out on the described top surface of diamond sealing layer or the surface of groove.
7. LED assembly according to claim 6, is characterized in that, described in be patterned as the rectangle, rhombus, circle or the regular hexagon that are alternately arranged.
8. LED assembly according to claim 7, is characterized in that, arranges cylinder in the middle of the patterning of described circle.
9. LED assembly according to claim 7, is characterized in that, the surrounding of the patterning of described circle concaves formation reflection groove.
10. LED assembly according to claim 1, is characterized in that, smears thermal conductive insulation glue in described groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410804385.7A CN104617212A (en) | 2014-12-18 | 2014-12-18 | LED packaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410804385.7A CN104617212A (en) | 2014-12-18 | 2014-12-18 | LED packaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104617212A true CN104617212A (en) | 2015-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410804385.7A Pending CN104617212A (en) | 2014-12-18 | 2014-12-18 | LED packaging module |
Country Status (1)
| Country | Link |
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| CN (1) | CN104617212A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504231A (en) * | 2019-09-18 | 2019-11-26 | 北京大学东莞光电研究院 | A kind of semiconductor power device and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100102697A1 (en) * | 2008-10-24 | 2010-04-29 | Cree Led Lighting Solutions, Inc. | Lighting device which includes one or more solid state light emitting device |
| CN203339217U (en) * | 2013-06-26 | 2013-12-11 | 深圳雷曼光电科技股份有限公司 | Led flip-chip structure |
| CN103972370A (en) * | 2013-01-31 | 2014-08-06 | 三菱电机株式会社 | Semiconductor optical device |
-
2014
- 2014-12-18 CN CN201410804385.7A patent/CN104617212A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100102697A1 (en) * | 2008-10-24 | 2010-04-29 | Cree Led Lighting Solutions, Inc. | Lighting device which includes one or more solid state light emitting device |
| CN103972370A (en) * | 2013-01-31 | 2014-08-06 | 三菱电机株式会社 | Semiconductor optical device |
| CN203339217U (en) * | 2013-06-26 | 2013-12-11 | 深圳雷曼光电科技股份有限公司 | Led flip-chip structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504231A (en) * | 2019-09-18 | 2019-11-26 | 北京大学东莞光电研究院 | A kind of semiconductor power device and preparation method thereof |
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Application publication date: 20150513 |