CN104613349A - LED (light emitting diode) integrated module with heat sink - Google Patents

LED (light emitting diode) integrated module with heat sink Download PDF

Info

Publication number
CN104613349A
CN104613349A CN201510074750.8A CN201510074750A CN104613349A CN 104613349 A CN104613349 A CN 104613349A CN 201510074750 A CN201510074750 A CN 201510074750A CN 104613349 A CN104613349 A CN 104613349A
Authority
CN
China
Prior art keywords
led
radiator
integrated module
substrate
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510074750.8A
Other languages
Chinese (zh)
Inventor
代明生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEYANG HENGDA LUMINAIRE MANUFACTURING Co Ltd
Original Assignee
DEYANG HENGDA LUMINAIRE MANUFACTURING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEYANG HENGDA LUMINAIRE MANUFACTURING Co Ltd filed Critical DEYANG HENGDA LUMINAIRE MANUFACTURING Co Ltd
Priority to CN201510074750.8A priority Critical patent/CN104613349A/en
Publication of CN104613349A publication Critical patent/CN104613349A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention relates to the technical field of LED (light emitting diode) integrated packaging, in particular to an LED integrated module with a heat sink. The LED integrated module with the heat sink comprises an LED integrated module body and the heat sink, wherein the LED integrated module body consists of a substrate and a plurality of LED crystalline grains arranged on the substrate; the heat sink comprises a heat sink main body with an upper smooth surface; vertical heat dissipation fins are arranged on the heat sink main body; and the substrate is adhered to the upper surface of the heat sink main body through heat-conduction silicone grease. Heat on the substrate is guided out through the heat sink and is dissipated uniformly; and contact surfaces of the substrate and the heat sink have quite high planeness, a gap between the substrate and the heat sink can be ignored, the substrate and the heat sink can be integrated to form a whole body basically, junction temperatures of the substrate and the heat sink can be controlled in a quite low range, so that heat exchange of the substrate and the heat sink is accelerated, and the heat generated by the LED crystalline grains can be quickly guided out.

Description

The integrated module of LED with radiator
Technical field
The present invention relates to LED integration packaging technical field, particularly the integrated module of a kind of LED with radiator.
Background technology
Along with science and technology constantly progress, the development in city illumination field, especially the LED street lamp newly emerged in street lamp industry is with its environmental protection, energy-efficient feature progressively will replace the conventional street lamps such as the Halogen lamp LED that generally uses now and sodium vapor lamp, outside the environment for use of street lamp in actual environment is exposed to for a long time, generally all take totally enclosed structure, prevent the penetration of sleet etc., existing LED street lamp also adopts this to design, but the luminescence heat of high-power LED lamp is larger, LED street lamp can shorten the service life of whole LED street lamp greatly under being in the condition of high temperature for a long time, the LED lamp of high power work is when temperature is more than 74 DEG C after tested, it is 2 years that light output decays to 50% required time, when lamp temperatures is 63 DEG C, this time can extend to 6 years, therefore the service life of operating temperature to LED street lamp is very huge.At present for the integrated module of LED of luminescence, mainly comprise substrate and be attached to the plurality of LEDs crystal grain on substrate, first the heat that LED grain luminescence produces passes to substrate, the structure of substrate and size limit its radiating effect, can not meet the heat radiation of the integrated module of LED.
Summary of the invention
The object of the invention is to the above-mentioned deficiency overcoming prior art, provide the integrated module of a kind of LED with radiator, radiator cleverly structure well can meet the cooling requirements of the integrated module of LED.
For achieving the above object, the invention provides following technical scheme:
The integrated module of LED with radiator, comprise the integrated module of LED, the integrated module of described LED is made up of substrate and the plurality of LEDs crystal grain be arranged on substrate, described substrate is followed successively by conductive metal layer from top to bottom, thermal insulation layer, albronze plate, plurality of LEDs crystal grain is fixed on conductive metal layer and also can be electrically connected with described conductive metal layer, the integrated module of the described LED with radiator also comprises radiator, described radiator comprises the radiator body with smooth upper surface, radiator body is provided with the radiating fin of dressing, described substrate is fitted in the upper surface of radiator body by heat-conducting silicone grease.
In the integrated module of the above-mentioned LED with radiator, described substrate is also anchored on radiator upper surface further by screw, utilizes screw to make substrate contact tightr with radiator upper surface, is conducive to the heat trnasfer of substrate and radiator.
In the integrated module of the above-mentioned LED with radiator, heat-conducting silicone grease is filled with the contact gap between substrate and radiator body, makes substrate and radiator reach better heat trnasfer.
In the integrated module of the above-mentioned LED with radiator, the contact with each other flatness in face of described substrate and radiator is 20 ~ 30um, this makes the contact surface of substrate and radiator all very smooth, both almost combine together, the junction temperature of substrate and radiator can be controlled in 1 ~ 5 DEG C, the heat exchange of substrate and radiator is accelerated, can fast the heat that integrated for LED module produces be derived.
In the integrated module of the above-mentioned LED with radiator, the albronze plate in described substrate extrudes laminating forming by upper strata copper coin and lower floor's aluminium sheet, and described substrate is directly contacted with the upper surface of radiator body by lower floor's aluminium sheet.The albronze plate of substrate carries out first time uniform heat radiation to heat, then is derived by the heat on substrate by radiator, carries out the uniform heat radiation of second time.
In the integrated module of the above-mentioned LED with radiator, described radiator body is greater than the thickness of edge for the middle part thickness of the integrated module of the LED that fits.Radiator body leaves larger thickness for the middle part of the integrated module of the LED that fits, and mainly because this region is just to LED grain, thickness can play better thermolysis greatly; Substrate is anchored on the middle part of radiator body further by screw, and middle part thickness is comparatively large, can be screw and reserves enough lower embedding degree of depth; The middle part of radiator body is the main region that integrated module carries out heat exchange with LED, and this area thickness is large, can reduce radiator body deformation in the horizontal, ensures combining closely of radiator body and substrate, is more conducive to dispelling the heat.
In the integrated module of the above-mentioned LED with radiator, the radiating fin of described dressing has multi-disc, radiating fin the same side at radiator body arranged in parallel of multi-disc dressing, the both sides of described radiating fin are provided with multiple fin tooth, form radiating groove with between the adjacent fin tooth on radiating fin described in a slice.Owing to being provided with the radiating fin of pectination on radiator body, and multiple fin tooth is provided with in the both sides of radiating fin, like this, when air flows between radiating fin time, flow in the groove that more than meeting is formed between radiating fin, flow in the radiating groove that also can be formed between adjacent fin tooth, reduce the resistance to air by radiating fin, the covert speed adding air and flow between radiating fin, radiating efficiency is higher.Radiator when mounted, the space formed between radiating fin upward, in order to prevent birds droppings, foreign material crash into space between radiating fin, and triangle fin tooth set on radiating fin just in time can stop crashing into of birds droppings, foreign material, ensures the air flowing between radiating fin.
In the integrated module of the above-mentioned LED with radiator, the fin tooth that described radiating fin both sides are arranged is triangular in shape, and the top of triangle fin tooth and the angle of horizontal plane are 30 °, and the angle that is following and horizontal plane of triangle fin tooth is 15 °.The top gradient of triangle fin tooth is greater than the following gradient, is conducive to hot-air between radiating fin towards radiator flows outside, strengthens radiating effect.
In the integrated module of the above-mentioned LED with radiator, described radiator is formed by Al squeezing material manufacture, easy to process.
compared with prior art, beneficial effect of the present invention:the present invention is directed to the integrated module of the LED of the large feature of high-power LED street lamp caloric value to lamp body inside to transform, by radiator, the heat on substrate is derived, carry out uniform heat radiation; The contact surface of substrate and radiator all has very high flatness, intermediate gap between the two can be ignored, substantially melt as a whole, in the scope that the junction temperature controllable poles of substrate and radiator is low, the heat exchange of substrate and radiator is accelerated, can fast the heat that LED grain produces be derived.Radiator provided by the present invention is than existing radiator, and radiating efficiency is higher; The triangle fin tooth that radiating fin is arranged can also stop birds droppings, foreign material crash into, and ensures the stable operation of radiator.If LED street lamp uses design of the present invention effectively the operating temperature of high-power LED street lamp can be down to less than 50% further, greatly improve the service life of high-power LED street lamp.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the sectional view of substrate in Fig. 1;
Fig. 3 is the fractionation structural representation of Fig. 1;
Fig. 4 is the side view of radiator in Fig. 3;
Fig. 5 prevents foreign material from crashing into the principle schematic of radiating groove after the present invention installs;
Fig. 6 is the partial enlarged drawing of part B in Fig. 4;
Fig. 7 is the effect schematic diagram outwardly of hot-air because of fin tooth.
Mark in figure: 1-substrate, 11-thermal insulation layer, 12-conductive metal layer, 111-ceramics polymer, 112-aluminium sheet, 2-LED crystal grain, 3-radiator, 31-radiator body, 32-radiating fin, 33-fin tooth, the top of 331-fin tooth, 332-fin tooth following, 4-screw.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is further illustrated.
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
embodiment 1
As shown in Figure 1, the present embodiment comprises the integrated module of LED, the integrated module of described LED is made up of substrate 1 and the plurality of LEDs crystal grain 2 arranged on substrate 1, as shown in Figure 2, described substrate 1 is followed successively by conductive metal layer 11 from top to bottom, thermal insulation layer 12, albronze plate 13, plurality of LEDs crystal grain 2 is fixed on conductive metal layer 11 and also can be electrically connected with described conductive metal layer 11, the present embodiment also comprises radiator 3, as shown in Figure 3, described radiator 3 comprises the radiator body 31 with smooth upper surface, radiator body 31 is provided with the radiating fin 32 of dressing, described substrate 1 is fitted in the upper surface of radiator body 31 by heat-conducting silicone grease, described substrate 1 is also anchored on radiator 3 upper surface further by screw 4, albronze plate in substrate 1 13 pairs of heats carry out first time uniform heat radiation, by radiator 3, the heat on substrate 1 is derived again, carry out the uniform heat radiation of second time.The contact with each other flatness in face of substrate 1 and radiator 3 is 20um, this makes substrate 1 all very smooth with the contact surface of radiator 3, both almost combine together, substrate 1 can be controlled in 1 DEG C with the junction temperature of radiator 3, substrate 1 is accelerated with the heat exchange of radiator 3, can fast the heat that LED grain produces be derived.
As shown in Figure 4, radiator body 31 is greater than the thickness (D2) of edge for middle part (a-quadrant) thickness (D1) of the integrated module of the LED that fits.Radiator body 31 leaves larger thickness for the middle part (a-quadrant) of the integrated module of the LED that fits, and mainly because this region is just to LED grain 2, thickness can play better thermolysis greatly; Substrate 1 is anchored on the middle part of radiator body 31 further by screw 4, and middle part (a-quadrant) thickness is comparatively large, can be screw 4 and reserves enough lower embedding degree of depth; The middle part (a-quadrant) of radiator body 31 is main region that integrated module carries out heat exchange with LED, this area thickness is large, can reduce radiator body 31 deformation in the horizontal, guarantee radiator body 31 is combined closely with substrate 1, is more conducive to heat radiation.
As shown in Figure 4, the radiating fin 32 of dressing has multi-disc, radiating fin 32 the same side at radiator body 31 arranged in parallel of multi-disc dressing, the both sides of described radiating fin 32 are provided with multiple fin tooth 33, form radiating groove with between the adjacent fin tooth 33 on radiating fin described in a slice 32.Owing to being provided with the radiating fin 32 of pectination on radiator body 31, and multiple fin tooth 33 is provided with in the both sides of radiating fin 32, like this, when air flows between radiating fin 32 time, flow in the groove that more than meeting is formed between radiating fin 32, flow in the radiating groove that also can be formed between adjacent fin tooth 33, reduce the resistance to air by radiating fin 32, the covert speed adding air and flow between radiating fin 32, radiating efficiency is higher.As shown in Figure 5, radiator 1 when mounted, due to the space that formed between radiating fin 32 upward, in order to prevent birds droppings, foreign material crash into space between radiating fin 32, triangle fin tooth 33 set on radiating fin 32 just in time can stop crashing into of birds droppings, foreign material, ensures the air flowing between radiating fin 32.As shown in Figure 6, the top 331 of triangle fin tooth is 30 ° with the angle of horizontal plane, following 332 of triangle fin tooth with the angle of horizontal plane be 15 °, as shown in Figure 7, top 331 gradient of triangle fin tooth is greater than following 332 gradients of fin tooth, be conducive to hot-air between radiating fin 32 towards radiator flows outside, strengthen radiating effect.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (8)

1. with the integrated module of LED of radiator, comprise the integrated module of LED, the integrated module of described LED is made up of substrate (1) and the plurality of LEDs crystal grain (2) be arranged on substrate, described substrate (1) is followed successively by conductive metal layer (11) from top to bottom, thermal insulation layer (12), albronze plate (13), plurality of LEDs crystal grain (2) is fixed on conductive metal layer (11) and above also can be electrically connected with described conductive metal layer (11), it is characterized in that: the integrated module of the described LED with radiator also comprises radiator (3), described radiator (3) comprises the radiator body (31) with smooth upper surface, radiator body (31) is provided with the radiating fin (32) of dressing, described substrate (1) is fitted in the upper surface of radiator body (31) by heat-conducting silicone grease.
2. the integrated module of the LED with radiator according to claim 1, is characterized in that: described substrate (1) is also anchored on radiator (3) upper surface further by screw (4).
3. the integrated module of the LED with radiator according to claim 1 and 2, is characterized in that: the contact with each other flatness in face of described substrate (1) and radiator (3) is 20 ~ 30um.
4. the integrated module of the LED with radiator according to claim 3, albronze plate (13) in described substrate (1) extrudes laminating forming by upper strata copper coin and lower floor's aluminium sheet, and described substrate is directly contacted with the upper surface of radiator body by lower floor's aluminium sheet.
5. the integrated module of the LED with radiator according to claim 1, is characterized in that: described radiator body (31) is greater than the thickness of edge for the middle part thickness of the integrated module of the LED that fits.
6. the integrated module of the LED with radiator according to claim 1, it is characterized in that: the radiating fin of described dressing has multi-disc, radiating fin (32) the same side in radiator body (31) arranged in parallel of multi-disc dressing, the both sides of described radiating fin (32) are provided with multiple fin tooth (33), form radiating groove with between the adjacent fin tooth (33) on radiating fin described in a slice.
7. the integrated module of the LED with radiator according to claim 6, it is characterized in that: the fin tooth (33) that described radiating fin (32) both sides are arranged is triangular in shape, the top (331) of triangle fin tooth and the angle of horizontal plane are 30 °, and following (332) of triangle fin tooth and the angle of horizontal plane are 15 °.
8. the integrated module of the LED with radiator according to claim 1, is characterized in that: described radiator (3) is formed by Al squeezing material manufacture.
CN201510074750.8A 2015-02-12 2015-02-12 LED (light emitting diode) integrated module with heat sink Pending CN104613349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510074750.8A CN104613349A (en) 2015-02-12 2015-02-12 LED (light emitting diode) integrated module with heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510074750.8A CN104613349A (en) 2015-02-12 2015-02-12 LED (light emitting diode) integrated module with heat sink

Publications (1)

Publication Number Publication Date
CN104613349A true CN104613349A (en) 2015-05-13

Family

ID=53147933

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510074750.8A Pending CN104613349A (en) 2015-02-12 2015-02-12 LED (light emitting diode) integrated module with heat sink

Country Status (1)

Country Link
CN (1) CN104613349A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101655204A (en) * 2009-09-16 2010-02-24 山东魏仕照明科技有限公司 LED wall lamp
JP2010511971A (en) * 2007-09-14 2010-04-15 エスエムクリエーション リミテッド LED lighting for fluorescent lamps with ballast
CN202048541U (en) * 2011-03-17 2011-11-23 天津杰普森科技有限公司 Circuit board assembly structure for SMT (surface mount technology) distribution constant current LED drive power supply
CN202065745U (en) * 2011-05-30 2011-12-07 四川新力光源有限公司 LED (light-emitting diode) device
CN202452186U (en) * 2012-01-04 2012-09-26 北京科瑞天诚科技有限公司 Light emitting diode (LED) lamp
CN103912807A (en) * 2014-03-14 2014-07-09 苏州晶品光电科技有限公司 High power light emitting diode (LED) light engine
CN204403877U (en) * 2015-02-12 2015-06-17 德阳市恒达灯具制造有限公司 The integrated module of a kind of LED with radiator

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010511971A (en) * 2007-09-14 2010-04-15 エスエムクリエーション リミテッド LED lighting for fluorescent lamps with ballast
CN101655204A (en) * 2009-09-16 2010-02-24 山东魏仕照明科技有限公司 LED wall lamp
CN202048541U (en) * 2011-03-17 2011-11-23 天津杰普森科技有限公司 Circuit board assembly structure for SMT (surface mount technology) distribution constant current LED drive power supply
CN202065745U (en) * 2011-05-30 2011-12-07 四川新力光源有限公司 LED (light-emitting diode) device
CN202452186U (en) * 2012-01-04 2012-09-26 北京科瑞天诚科技有限公司 Light emitting diode (LED) lamp
CN103912807A (en) * 2014-03-14 2014-07-09 苏州晶品光电科技有限公司 High power light emitting diode (LED) light engine
CN204403877U (en) * 2015-02-12 2015-06-17 德阳市恒达灯具制造有限公司 The integrated module of a kind of LED with radiator

Similar Documents

Publication Publication Date Title
CN103453500B (en) A kind of LED radiator
CN202511239U (en) Compound phase change three-dimensional LED (Light-Emitting Diode) radiator
CN204403877U (en) The integrated module of a kind of LED with radiator
CN102588924A (en) Double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator
CN204403875U (en) A kind of be furnished with the fixing integrated module of LED of screw
CN201954506U (en) Light-emitting diode lamps and heat sinks
CN201983233U (en) Heat dissipation and heat insulation device of LED (light-emitting diode) lamp
CN206594448U (en) A kind of efficient radiating apparatus of large area UVLED arrays
CN106678556A (en) LED lamp assembly
CN204005846U (en) A kind of light fixture radiating seat with Graphene bed course
CN202469988U (en) Wing plate type three-dimensional light emitting diode (LED) heat radiator
CN204785723U (en) LED lamp plate of copper cooling is applied in adoption
CN102588926A (en) Combination type three-dimensional light-emitting diode (LED) radiator
CN202469987U (en) Double-layer fin type three-dimensional LED (Light-Emitting Diode) heat radiator
CN202469989U (en) Combined three-dimensional LED (light-emitting diode) radiator
CN202125840U (en) Street lamp
CN201992605U (en) Heat sink for high-power LED (light-emitting diode) lamps
CN201462746U (en) A cooling device for high-power LED lamps
CN205824665U (en) Eliminate the LEDbulb lamp of tropical island effect
CN204404126U (en) A kind of radiator for LED
CN205579203U (en) Radiator, heat dissipation module and LED lighting device
CN104165340A (en) Heat dissipation method of LED light source
CN204573650U (en) A kind of LED culturing lamp of quick heat radiating
CN206724112U (en) A kind of LED radiator
CN202382212U (en) LED radiation device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20150513