CN104601796A - Bluetooth intelligent telephone set - Google Patents

Bluetooth intelligent telephone set Download PDF

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Publication number
CN104601796A
CN104601796A CN201410681128.9A CN201410681128A CN104601796A CN 104601796 A CN104601796 A CN 104601796A CN 201410681128 A CN201410681128 A CN 201410681128A CN 104601796 A CN104601796 A CN 104601796A
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CN
China
Prior art keywords
module
pin
chip
telephone
blue
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CN201410681128.9A
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Chinese (zh)
Inventor
毛勇
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SHENZHEN MOFEIFAN TECHNOLOGY Co Ltd
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SHENZHEN MOFEIFAN TECHNOLOGY Co Ltd
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Priority to CN201410681128.9A priority Critical patent/CN104601796A/en
Publication of CN104601796A publication Critical patent/CN104601796A/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00Reducing energy consumption in communication networks
    • Y02D30/70Reducing energy consumption in communication networks in wireless communication networks

Abstract

The invention discloses a Bluetooth intelligent telephone set. The Bluetooth intelligent telephone set comprises a casing and a main circuit. The main circuit comprises a power amplification module, a Bluetooth module, an infrared module, a voice communication module, a power supply module, a public switched telephone network call module, a call ring module and a key module. The infrared module and the key module are connected with the Bluetooth module respectively, the Bluetooth module is connected with the public switched telephone network call module which is connected with the call ring module and the voice communication module respectively, the voice communication module is connected with the power amplification module, and the power supply module is connected with the power amplification module, the voice communication module and the call ring module respectively. By means of the Bluetooth intelligent telephone set, low-cost, short-distance and interoperable Bluetooth low-energy-consumption technology and an intelligent technological means, the power consumption is reduced to the largest extent, the telephone set can operate in a permission-free 2.4 GHz ISM radio frequency band, and the telephone set is particularly applicable to data transmission through micro wireless sensors or using other external equipment such as completely asynchronous communication remote control units and the like.

Description

Blue-tooth intelligence telephone set
Technical field
The present invention relates to a kind of telephone set, specifically a kind of blue-tooth intelligence telephone set.
Background technology
At present, common fixed telephone have call, caller identification, CRBT, message and a small amount of storage connect, do not connect, the function such as to have dialed the number, existing fixed telephone can not and mobile phone between directly carry out information mutual communication, although even if there is minority intelligent telephone set to achieve above-mentioned functions, but the energy consumption of these intelligent telephone sets is large, need user often to its charging, the continuation that guarantee uses.How while the function of extension telephones machine, the energy consumption reducing telephone set is one of important means improving its scope of application.
Summary of the invention
The object of the present invention is to provide a kind of blue-tooth intelligence telephone set, the interaction effect of telephone set and mobile phone can be reached, the energy consumption of telephone set can be reduced again.
For achieving the above object, the invention provides following technical scheme:
A kind of blue-tooth intelligence telephone set, comprises shell, main circuit; Described main circuit comprises power amplifier module, bluetooth module, infrared module, voice call module, power module, PSTN incoming call module, incoming call jingle bell module and key-press module; Described infrared module, key-press module are connected with bluetooth module respectively, described bluetooth module and PSTN are sent a telegram here model calling, described PSTN incoming call module respectively with incoming call jingle bell module, voice call model calling, described voice call module is connected with power amplifier module, described power module respectively with power amplifier module, voice call module, jingle bell model calling of sending a telegram here.
The method of operation of described blue-tooth intelligence telephone set, step is as follows:
1) during incoming call:
PSTN incoming call module detects incoming telephone signal, and incoming information is passed to bluetooth module, and bluetooth module is uploaded to the mobile phone that relevant APP is housed again after receiving incoming information; If user wants to connect this phone, just send instructions to bluetooth module by mobile phone A PP, bluetooth module sends instructions to PSTN incoming call module again, and PSTN incoming call module allows voice call module connect again; User is talked by the microphone MIC in voice call module, voice call module transfers out after the speech signal analysis of user, simultaneously, voice call module also receives the signal of the dependent voice transmitted from incoming call the other side there, and played back delivering to power amplifier module after this signal transacting by external speaker, allow user can hear the speech of the other side.
2) when pulling out phone:
If user wants to phone certain number, the mobile phone that relevant APP is housed sends instructions to bluetooth module, bluetooth module sends instructions to PSTN incoming call module again, and PSTN incoming call module allows voice call module connect again, and transfers to this number; After the other side connects phone, user and the other side start to converse; If the other side does not connect this phone, then after a period of time, voice call module receives relevant receipt signal, hangs up the telephone.
As the further scheme of the present invention: described in the process that the mobile phone of relevant APP and this blue-tooth intelligence telephone set match be housed be:
Open the APP on mobile phone, matched by the bluetooth module in the bluetooth on mobile phone and this blue-tooth intelligence telephone set, after successful matching, bluetooth module on mobile phone and blue-tooth intelligence telephone set all stores relevant identifying information, when being used for determining to dial phone with mobile phone, be which blue-tooth intelligence telephone set to dial phone by, or be used for determining when a call comes, blue-tooth intelligence telephone set is which mobile phone is relevant information passed to.
As the further scheme of the present invention: the operating process of described mobile phone A PP is as follows: open APP relevant on mobile phone, blue-tooth intelligence telephone set whether is had near first searching, if there is one or more blue-tooth intelligence telephone set, then select one to match, after successful matching, dialing or receiving calls of the task of being correlated with can be carried out; When a call comes, on mobile phone, APP selects whether answer this phone.
As the further scheme of the present invention: the bluetooth module being sent instructions to blue-tooth intelligence telephone set by the mobile phone that relevant APP is housed, bluetooth module sends dependent instruction again to infrared module, and then the electrical equipment of control cincture remote controller.
Compared with prior art, the invention has the beneficial effects as follows: the present invention passes through low cost, short distance, bluetooth low energy consumption technologies and the intellectual technology means of interoperable reduce power consumption to greatest extent, the 2.4GHz ISM radio frequency band of exempting to permit can be operated in, be suitable for very much transmitting data from micro wireless sensor (every half second exchange a secondary data) or other peripheral hardwares such as remote controller of using full asynchronous communication, the data volume that these equipment sends is considerably less, usual several byte, and transmission times is also little, such as per second arrive several times once per minute, even less.
Accompanying drawing explanation
Fig. 1 is the structural representation of blue-tooth intelligence telephone set.
Fig. 2 is the power amplifier modular circuit figure of blue-tooth intelligence telephone set.
Fig. 3 is the bluetooth module circuit diagram of blue-tooth intelligence telephone set.
Fig. 4 is the infrared module module circuit diagram of blue-tooth intelligence telephone set.
Fig. 5 is the voice call module circuit diagram of blue-tooth intelligence telephone set.
Fig. 6 is the power module circuitry figure of blue-tooth intelligence telephone set.
Fig. 7 is the PSTN incoming call module circuit diagram of blue-tooth intelligence telephone set.
Fig. 8 is the incoming call jingle bell module circuit diagram of blue-tooth intelligence telephone set.
Fig. 9 is the key-press module circuit diagram of blue-tooth intelligence telephone set.
Embodiment
Below in conjunction with the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, in the embodiment of the present invention, a kind of blue-tooth intelligence telephone set, comprises shell, main circuit; Described main circuit comprises power amplifier module, bluetooth module, infrared module, voice call module, power module, PSTN incoming call module, incoming call jingle bell module and key-press module; Described infrared module, key-press module are connected with bluetooth module respectively, described bluetooth module and PSTN are sent a telegram here model calling, described PSTN incoming call module respectively with incoming call jingle bell module, voice call model calling, described voice call module is connected with power amplifier module, described power module respectively with power amplifier module, voice call module, jingle bell model calling of sending a telegram here.
Refer to Fig. 2, the circuit of described power amplifier module comprises chip U1 and external speaker LS1, 1 pin of described chip U1 passes through the resistance R1 of 0R, the electric capacity C6 of 10 μ F is connected with 8 pin of chip U1, 2 pin of described chip U1, 4 pin of chip U1 are all connected with GND_OP, 3 pin of described chip U1 are connected by resistance R3 and the SPKO of 1K, 3 pin of described chip U1 are connected by resistance R5 and the GND_OP of 10K, 5 pin of described chip U1 pass through the electric capacity C4 of 10pF, the resistance R 2 of 100R is connected with GND_OP, 5 pin of described chip U1 are connected with one end of external speaker LS1 by the electrochemical capacitor C3 of 100 μ F, one end of described external speaker LS1 is connected with SPK1, one end of described external speaker LS1 is also connected with the other end of external speaker LS1 by the electric capacity C78 of 100nF, the other end of described external speaker LS1 is connected with 7 pin of chip U1 by the electrochemical capacitor C5 of 10 μ F, 7 pin of described chip U1 are connected by electrochemical capacitor C5 and GND_OP, 6 pin of described chip U1 pass through the electric capacity C21 of 100nF, electrochemical capacitor C26 and the GND_OP of 10 μ F connects, described electric capacity C21 is in parallel with electrochemical capacitor C26, 7 pin of described chip U1 are connected by resistance R4 and the VBAT of 1R, obtain the electrochemical capacitor of resistance R4 by 10 μ F, electrochemical capacitor C28 and the GND_OP of 100 μ F connects, described electrochemical capacitor C27 is in parallel with electrochemical capacitor C28, described SPKO is connected by resistance R71 and the SPK1 of 22R.
Refer to Fig. 3, described bluetooth module comprises chip U2, buzzer Y1 and buzzer Y2, 1 pin of described chip U2 passes through the electric capacity C32 of 10 μ F, electric capacity C16 and the GND_RF of 100nF connects, 1 pin of described chip U2 is connected with VCC_RF, 1 pin of described chip U2 is connected by resistance R10 and the PSTN_VDD of 0R, 2 pin of described chip U2 pass through the inductance L 4 of 10 μ H/NC, the inductance L 5 of 15 μ H/NC is connected with PSTN_VDD, the other end of described inductance L 5 is connected by electric capacity C31 and the GND_RF of 10 μ F, 12 pin of described chip U2 are connected with VCC_RF, 12 pin of described chip U2 are connected by electric capacity C17 and the GND_RF of 100nF, 13 pin of described chip U2 are connected with GND_RF, 14 pin of described chip U2 are connected with LING, 15 pin of described chip U2 are connected with SDA, 16 pin of described chip U2 are connected with BUSY, 17 pin of described chip U2 are connected with SCL, 21 pin of described chip U2 are connected with LED, 23 pin of described chip U2 are connected with DIO, 24 pin of described chip U2 are connected with CLK, 29 pin of described chip U2 are connected by electric capacity C14 and the GND_RF of 47nF, 30 pin of described chip U2 are connected by electric capacity C15 and the GND_RF of 2.2nF, 30 pin of described chip U2 are connected with 31 pin of chip U2 by the inductance L 2 of 10nH, 31 pin of described chip U2 are connected with 32 pin of chip U2 by the inductance L 1 of 4.7nH, 32 pin of described chip U2 pass through the electric capacity C11 of 2.2pF, the inductance L 3 of 3.3nH is connected with ANT, the other end of described electric capacity C11 is connected by electric capacity C12 and the GND_RF of 1pF, the other end of described inductance L 3 is connected by electric capacity C13 and the GND_RF of 1.5pF, 33 pin of described chip U2, 34 pin of chip U2 are connected with GND_RF, 33 pin of described chip U2, 34 pin of chip U2 are all connected by electric capacity C10 and the PSTN_VDD of 1nF, 35 pin of described chip U2, 36 pin of chip U2 are all connected with PSTN_VDD, 37 pin of described chip U2 are connected by electric capacity C7 and the GND_RF of 12pF, 37 pin of described chip U2 are connected with 3 pin of the buzzer Y1 of 16MHz, 2 pin of described buzzer Y1 are connected with GND_RF, 4 pin of described buzzer Y1 are connected with GND_RF, 1 pin of described buzzer Y1 is connected with 38 pin of chip U2, 38 pin of described chip U2 are connected by electric capacity C8 and the GND_RF of 12pF, 39 pin of described chip U2 are connected by electric capacity C9 and the GND_RF of 100nF, 43 pin of described chip U2 are connected with P1, 45 pin of described chip U2 are connected with 46 pin of chip U2 by the buzzer Y2 of 32KHz, 45 pin of described chip U2 are connected by electric capacity C30 and the GND_RF of 12pF, 46 pin of described chip U2 are connected by electric capacity C29 and the GND_RF of 12pF, 47 pin of described chip U2 are connected with PSTN_RXD, 48 pin of described chip U2 are connected with PSTN_TXD, 49 pin of described chip U2 are connected with GND_RF, described PSTN_VDD and VDD connects, described GND_RF and GND connects.
Refer to Fig. 4, described infrared module comprises chip U3 and infrared connection stand CON1, 1 pin of described chip U3 is connected with 2 pin of chip U3, 1 pin of described chip U3 passes through the electric capacity C23 of 0.1 μ F, electrochemical capacitor C22 and the GND_IC of 10 μ F connects, 1 pin of described chip U3 is connected with IR1+, 1 pin of described chip U3 is connected by resistance R7 and the PSTN_VDD of 1R, described resistance R7 is connected by electrochemical capacitor C20 and the GND_IC of 1 μ F, 3 pin of described chip U3 are connected with GND_IC, 4 pin of described chip U3 are connected with SCL, 5 pin of described chip U3 are connected with SDA, 6 pin of described chip U3 are connected with BUSY, 7 pin of described chip U3 are connected with 8 pin of chip U3, 7 pin of described chip U3 are connected with IR1+, 7 pin of described chip U3 are held with the N of triode Q1 by the resistance R8 of 1R and are connected, the one P end of described triode Q1 is connected with IR2+, another P end of described triode Q1 is connected by resistance R9 and the IR1+ of 2R, 1 pin of described infrared connection stand CON1 is IR1+, 2 pin of described infrared connection stand CON1 are IR1-, 3 pin of described infrared connection stand CON1 are IR2+, 4 pin of described infrared connection stand CON1 are connected with GND_IC, 5 pin of described infrared connection stand CON1 are LED, 6 pin of described infrared connection stand CON1 are connected by resistance R72 and the IR1+ of 10K, 7 pin of described infrared connection stand CON1 connect with infrared 8 pin being connected stand CON1, and 7 pin of described infrared connection stand CON1 are connected with GND_IC.
Refer to Fig. 5, described voice call module comprises chip U4, power supply and telephony interface J1 and microphone MIC, 1 pin of described chip U4 passes through the resistance R39 ground connection of 47K/NC, 1 pin of described chip U4 passes through the electrochemical capacitor C57 ground connection of 33 μ F, 3 pin of described chip U4 are connected with 4 pin of chip U4 by the electric capacity C56 of 10nF, 5 pin of described chip U4 are connected with 7 pin of chip U4 by the electric capacity C34 of 33nF, 2 pin of described chip U4 pass through the electric capacity C55 ground connection of 1 μ F, 19 pin of described chip U4 pass through the electrochemical capacitor C54 ground connection of 22 μ F, 18 pin of described chip U4 pass through the electrochemical capacitor C77 ground connection of 100 μ F, resistance R11 and the PSTN_VDD of the 27 pin cylinder 10K of described chip U4 connects, 26 pin of described chip U4 are connected by resistance R37 and the PSTN_VDD of 10K, 23 pin of described chip U4 are connected by electrochemical capacitor C53 and the SPKO of 100 μ F, 21 pin of described chip U4 pass through the electric capacity C50 of 22nF, the resistance R36 ground connection of 12K, 21 pin of described chip U4 are by electric capacity C50, the electric capacity C52 ground connection of 22nF, 21 pin of described chip U4 are by electric capacity C50, the resistance R35 of 12K is connected with 17 pin of chip U4, 17 pin of described chip U4 are connected with 20 pin of chip U4 by the electric capacity C49 of 100nF, 17 pin of described chip U4 pass through the electrochemical capacitor C1 of 22 μ F, resistance R34 and the RECI of 200R connects, the other end of described resistance R34 passes through the electrochemical capacitor C2 ground connection of 3.3 μ F, 6 pin of described chip U4 are connected with 8 pin of chip U4 by the electric capacity C45 of 15nF, 6 pin of described chip U4 pass through the electric capacity C46 of 15nF, the resistance R32 ground connection of 2.2K, 6 pin of described chip U4 are by electric capacity C46, the resistance R26 of NC, the electric capacity C43 of 15nF is connected with 8 pin of chip U4, 8 pin of described chip U4 are by electric capacity C43, the resistance R24 of 2.2K, the resistance R20 of 2.2K holds with a P of triode Q8 and is connected, described resistance R24 is by the electrochemical capacitor C33 ground connection of 100 μ F, described resistance R24 is connected with 2 pin of microphone MIC by the resistance R18 of 1.1K, 2 pin of described microphone MIC pass through the resistance R16 of NC, the resistance R21 ground connection of 1.1K, the N end of described triode Q8 is connected with 14 pin of chip U4, another P end of described triode Q8 is connected with 22 pin of chip U4, 22 pin of described chip U4 are connected with 11 pin of chip U4 by the electric capacity C51 of 100 μ F, 11 pin of described chip U4 are connected with 24 pin of chip U4, the 24 pin ground connection of described chip U4, 25 pin of described chip U4 are connected by resistance R38 and the MUTE of 100 OHM, 5 pin of described chip U4 are connected with 1 pin of microphone MIC by the electric capacity C41 of 100nF, 7 pin of described chip U4 are connected with 2 pin of microphone MIC by the electric capacity C39 of 100nF, 28 pin of described chip U4 are connected with DTMF_IN, 15 pin of described chip U4 are connected with 13 pin of chip U4 by the electrochemical capacitor C38 of 10 μ F, 15 pin of described chip U4 are connected with 12 pin of chip U4 by the resistance R15 of 30R, 15 pin of described chip U4 pass through the voltage stabilizing didoe D2 ground connection of 10V, 15 pin of described chip U4 pass through the resistance R14 of 1.5K, the electrochemical capacitor C36 ground connection of 10 μ F, 15 pin of described chip U4 are held with a P of triode Q4 and are connected, 15 pin of described chip U4 are held with a P of triode Q5 and are connected, the N end of described triode Q4 is held with another P of triode Q5 and is connected, the resistance R13 of another P end throwing advertisement 33K of described triode Q4 holds with another P of triode Q5 and is connected, another P of described triode Q4 is held to be held with the N of triode Q5 by the resistance R12 of 100K and is connected, the N end of described triode Q5 to be held with a N of triode Q7 by the resistance R23 of 3.3K and is connected, another N of described triode Q7 holds ground connection, the P end of described triode Q7 is connected by resistance R30 and the DP of 3.3K, the P of described triode Q7 holds the resistance R28 by 1M, diode D3, the resistance R29 of 470K, the resistance R33 ground connection of 820K, the other end of described resistance R29 is connected with PSTN_HKS, the other end of described resistance R29 passes through the electric capacity C48 ground connection of 1nF, another P of described triode Q4 holds the resistance R19 by 100K, diode D1 is connected with triode D3, another P of described triode Q4 holds the resistance R22 by 10M, the resistance R27 ground connection of 1M, the other end of described resistance R22 is connected with LINE_DET, the other end of described resistance R22 passes through the electric capacity C44 ground connection of 100nF, another P of described triode Q4 holds the resistance R68 by 0OHM, diode D4, the resistance R66 of 0OHM is connected with 3 pin of telephony interface J1 with power supply, described diode D4 is by diode D6 ground connection, another P of described triode Q4 holds by resistance R68, diode D5, the resistance R67 of 0OHM is connected with 4 pin of telephony interface J1 with power supply, described diode D5 is by diode D7 ground connection, described diode D4 is by the electric capacity C37 ground connection of 102/250V, described triode D5 is by the electric capacity C40 ground connection of 102/250V, described diode D4 and R connects, described triode D5 and T connects, described power supply is connected with 4 pin of telephony interface J1 with power supply by the electric capacity C35 of 102/500V with 3 pin of telephony interface J1, described power supply is connected with VBAT with 1 pin of telephony interface J1, described power supply is connected with GND_IC with 2 pin of telephony interface J1, described T is by the electric capacity C60 of 2U2/100V, the resistance R40 of 1K 1206, diode D8, resistance R41 and RING_DET connects, described resistance R40 is by diode D10 ground connection, described R is by the electric capacity C61 of 2U2/100V, the resistance R44 of 1K 1206, diode D9, resistance R41 and RING_DET connects, described resistance R44 is by diode D11 ground connection, described RING_DET is by the electric capacity C62 ground connection of 100nF, described RING_DET is by the resistance R43 ground connection of 47K, described RING_DET is by resistance R41, the resistance R42 ground connection of 47K, described T is by the electric capacity C63 of 103/250V, resistance R45 and the TIP of 100K connects, described R is by the electric capacity C66 of 103/250V, resistance R50 and the RING of 100K connects, described TIP is connected by resistance R47 and the RING of 33K.
Refer to Fig. 6, described power module comprises chip U5, 1 pin of described chip U5 is connected with VBAT, 1 pin of described chip U5 passes through the electric capacity C58 of 10 μ F, , electric capacity C19 and the GND_IC of 100nF connects, described electric capacity C58, electric capacity C19 is in parallel, 2 pin of described chip U5 are connected with GND_IC, 3 pin of described chip U5 are connected with VBAT, 4 pin of described chip U5 are connected by electric capacity C76 and the GND_IC of 100nF, 5 pin of described chip U5 are connected with PSTN_VDD, 5 pin of described chip U5 pass through the electric capacity C18 of 100nF, electric capacity C59 and the GND_IC of 10 μ F connects, described electric capacity C18, electric capacity C59 is in parallel.
Refer to Fig. 7, described PSTN incoming call module comprises chip U6, buzzer Y3 and buzzer Y4, 1 pin of described chip U6 is connected with MUTE, 6 pin of described chip U6 are connected by electric capacity C65 and the GND_IC of 1nF, 6 pin of described chip U6 pass through the resistance R49 of 470K, electric capacity C67 and the RECI of 10nF connects, described RECI is by electric capacity C67, resistance R51 and the GND_IC of 330K connects, described RECI is held with the P of triode Q9 by electric capacity C67 and is connected, the one N end of described triode Q9 is connected by resistance R46 and the PSTN_VDD of 220K, another N end of described triode Q9 is connected by resistance R52 and the GND_IC of 5.6K, 8 pin of described chip U6 are connected with PSTN_VDD, 8 pin of described chip U6 are connected by electric capacity C24 and the GND_IC of 100nF, 8 pin of described chip U6 are connected by electric capacity C17 and the GND_IC of 100nF, 8 pin of described chip U6 are connected by electric capacity C70 and the GND_IC of 33pF, 8 pin of described chip U6 are connected by electrochemical capacitor C25 and the GND_IC of 10 μ F, 14 pin of described chip U6 are LINE_DET, 15 pin of described chip U6 are DP, 16 pin of described chip U6 are connected by resistance R54 and the PSTN_VDD of 100K, 16 pin of described chip U6 are connected by electric capacity C74 and the GND_IC of 100nF, 16 pin of described chip U6 are connected by resistance R59 and the PSTN_VDD of NC, 16 pin of described chip U6 are held with a N of triode Q10 and are connected, another N end of described triode Q10 is connected with GND_IC, the P end of described triode Q10 is connected by resistance R57 and the PSTN_VDD of 470K, the P end of described triode Q10 is held with a N of triode Q3 and is connected, another N end of described triode Q3 is connected with GND_IC, the P end of described triode Q3 is connected by resistance R62 and the GND_IC of 240K, the P end of described triode Q3 is connected by resistance R56 and PSTN_VDD, 17 pin of described chip U6 are connected by resistance R60 and the PSTN_RXD of 100 OHM, 18 pin of described chip U6 are connected by resistance R60 and the PSTN_TXD of 100 OHM, 19 pin of described chip U6 are connected by resistance R65 and the GND_IC of 100K, 19 pin of described chip U6 are connected by resistance R63 and the PSTN_VDD of 22K, 25 pin of described chip U6 are connected with GND_IC, 26 pin of described chip U6 are connected by resistance R58 and the GND_IC of 100K, 26 pin of described chip U6 pass through the electric capacity C75 of 22nF, resistance R55 and the DTMF_IN of 18K connects, 27 pin of described chip U6 are connected by electric capacity C72 and the GND_IC of 10nF, 28 pin of described chip U6 are connected by electric capacity C73 and the GND_IC of 100nF, 28 pin of described chip U6 are connected by resistance R53 and the PSTN_VDD of 470K, 29 pin of described chip U6 are RING_DET, 30 pin of described chip U6 are RING, 31 pin of described chip U6 are TIP, 32 pin of described chip U6 are XIN, 33 pin of described chip U6 are XOUT, 34 pin of described chip U6 are connected with 35 pin of chip U6 by the resistance R48 of 100K, 35 pin of described chip U6 are connected by electric capacity C64 and the PSTN_VDD of 100nF, 36 pin of described chip U6 are PSTN_HKS, described XOUT is by the buzzer Y3 of 32KHz, buzzer Y4 and the XIN of 32KHz connects, described buzzer Y3, buzzer Y4 is in parallel, described XIN is connected by electric capacity C68 and the GND_IC of 30pF, described XOUT is connected by electric capacity C69 and the GND_IC of 30pF, the other end of described buzzer Y4 is connected with GND_IC.
Refer to Fig. 8, described incoming call jingle bell module comprises triode Q2, the one P end of described triode Q2 is connected with VBAT, another P end of described triode Q2 is connected by resistance R69 and the SPK1 of 22R, the N end of described triode Q2 is connected by resistance R61 and the LING of 10K, and described LING is connected with GND_OP by the resistance R70 of 100K.
Refer to Fig. 9, described key-press module comprises button KEY, and described button KEY and GND_RF connects, and described button KEY is connected by resistance R6 and the P1 of 10K.Described GND_IC is by B3 ground connection, and described GND_OP is by B1 ground connection, and described GND_RF is connected by B2 and GND_IC.
The model of described chip U1 is LM386, the model of described chip U2 is N51822, and the model of described chip U3 is HXD019M, and the model of described chip U4 is AS2524, the model of described chip U5 is BL9198_3V3 SOT23/5P/SMD, and the model of described chip U6 is PSTN Module.The model of described triode Q1 and triode Q2 is 8550, the model of described triode Q3 and triode Q10 is S9014, the model of described triode Q4 is A94, the model of described triode Q5 is A92, the model of described triode Q7 is A42, the model of described triode Q8 is 9015, and the model of described triode Q9 is 9014.The model of described infrared connection stand CON1 is CON8P_0.5Pitch H6S/P1.0.
The operation principle of described blue-tooth intelligence telephone set is as follows:
1) during incoming call:
PSTN incoming call module detects incoming telephone signal, and incoming information is passed to bluetooth module, and bluetooth module is uploaded to the mobile phone that relevant APP is housed again after receiving incoming information.If user wants to connect this phone, just send instructions to bluetooth module by mobile phone A PP, bluetooth module sends instructions to PSTN incoming call module again, and PSTN incoming call module allows voice call module connect again.User is talked by the microphone MIC in voice call module, voice call module transfers out after the speech signal analysis of user, simultaneously, voice call module also receives the signal of the dependent voice transmitted from incoming call the other side there, and played back delivering to power amplifier module after this signal transacting by external speaker, allow user can hear the speech of the other side.
2) when pulling out phone:
If user wants to phone certain number, the mobile phone that relevant APP is housed sends instructions to bluetooth module, bluetooth module sends instructions to PSTN incoming call module again, and PSTN incoming call module allows voice call module connect again, and transfers to this number.After the other side connects phone, user and the other side start to converse; If the other side does not connect this phone, then after a period of time, voice call module receives relevant receipt signal, hangs up the telephone.
3) process that the mobile phone of relevant APP and this blue-tooth intelligence telephone set match is housed:
Open the APP on mobile phone, matched by the bluetooth module in the bluetooth on mobile phone and this blue-tooth intelligence telephone set, after successful matching, bluetooth module on mobile phone and blue-tooth intelligence telephone set all stores relevant identifying information, when being used for determining to dial phone with mobile phone, be which blue-tooth intelligence telephone set to dial phone by, or be used for determining when a call comes, blue-tooth intelligence telephone set is which mobile phone is relevant information passed to.
4) operating process of mobile phone A PP is as follows:
Open APP relevant on mobile phone, whether have blue-tooth intelligence telephone set near first searching, if there is one or more blue-tooth intelligence telephone set, then selects one and match, after successful matching, dialing or receiving calls of the task of being correlated with can be carried out.
When a call comes, on mobile phone, can select whether answer this phone by APP.
5) expanded function
Mobile phone by being equipped with relevant APP sends instructions to the bluetooth module of blue-tooth intelligence telephone set, bluetooth module sends dependent instruction again to infrared module, and then controls the electrical equipment of the band remote controllers such as domestic and international each famous brand air-conditioning, TV, DVD, top box of digital machine, subhost, fan.
The present invention reduces power consumption to greatest extent by the bluetooth low energy consumption technologies of low cost, short distance, interoperable and intellectual technology means, the 2.4GHz ISM radio frequency band of exempting to permit can be operated in, be suitable for very much transmitting data from micro wireless sensor (every half second exchange a secondary data) or other peripheral hardwares such as remote controller of using full asynchronous communication, the data volume that these equipment sends is considerably less, usual several byte, and transmission times is also little, such as per second arrive several times once per minute, even less.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.

Claims (5)

1. a blue-tooth intelligence telephone set, is characterized in that, comprises shell, main circuit; Described main circuit comprises power amplifier module, bluetooth module, infrared module, voice call module, power module, PSTN incoming call module, incoming call jingle bell module and key-press module; Described infrared module, key-press module are connected with bluetooth module respectively, described bluetooth module and PSTN are sent a telegram here model calling, described PSTN incoming call module respectively with incoming call jingle bell module, voice call model calling, described voice call module is connected with power amplifier module, described power module respectively with power amplifier module, voice call module, jingle bell model calling of sending a telegram here.
2. the method for operation of blue-tooth intelligence telephone set according to claim 1, it is characterized in that, step is as follows:
1) during incoming call:
PSTN incoming call module detects incoming telephone signal, and incoming information is passed to bluetooth module, and bluetooth module is uploaded to the mobile phone that relevant APP is housed again after receiving incoming information; If user wants to connect this phone, just send instructions to bluetooth module by mobile phone A PP, bluetooth module sends instructions to PSTN incoming call module again, and PSTN incoming call module allows voice call module connect again; User is talked by the microphone MIC in voice call module, voice call module transfers out after the speech signal analysis of user, simultaneously, voice call module also receives the signal of the dependent voice transmitted from incoming call the other side there, and played back delivering to power amplifier module after this signal transacting by external speaker, allow user can hear the speech of the other side;
2) when pulling out phone:
If user wants to phone certain number, the mobile phone that relevant APP is housed sends instructions to bluetooth module, bluetooth module sends instructions to PSTN incoming call module again, and PSTN incoming call module allows voice call module connect again, and transfers to this number; After the other side connects phone, user and the other side start to converse; If the other side does not connect this phone, then after a period of time, voice call module receives relevant receipt signal, hangs up the telephone.
3. the method for operation of blue-tooth intelligence telephone set according to claim 2, is characterized in that, described in the process that the mobile phone of relevant APP and this blue-tooth intelligence telephone set match be housed be:
Open the APP on mobile phone, matched by the bluetooth module in the bluetooth on mobile phone and this blue-tooth intelligence telephone set, after successful matching, bluetooth module on mobile phone and blue-tooth intelligence telephone set all stores relevant identifying information, when being used for determining to dial phone with mobile phone, be which blue-tooth intelligence telephone set to dial phone by, or be used for determining when a call comes, blue-tooth intelligence telephone set is which mobile phone is relevant information passed to.
4. the method for operation of blue-tooth intelligence telephone set according to claim 2, it is characterized in that, the operating process of described mobile phone A PP is as follows: open APP relevant on mobile phone, blue-tooth intelligence telephone set whether is had near first searching, if there is one or more blue-tooth intelligence telephone set, then select one to match, after successful matching, dialing or receiving calls of the task of being correlated with can be carried out; When a call comes, on mobile phone, APP selects whether answer this phone.
5. the method for operation of blue-tooth intelligence telephone set according to claim 2, it is characterized in that, sent instructions to the bluetooth module of blue-tooth intelligence telephone set by the mobile phone that relevant APP is housed, bluetooth module sends dependent instruction again to infrared module, and then the electrical equipment of control cincture remote controller.
CN201410681128.9A 2014-11-25 2014-11-25 Bluetooth intelligent telephone set Pending CN104601796A (en)

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