CN104593843A - Normal temperature pretreatment method for electroplating chip multilayer ceramic capacitor - Google Patents
Normal temperature pretreatment method for electroplating chip multilayer ceramic capacitor Download PDFInfo
- Publication number
- CN104593843A CN104593843A CN201510081684.7A CN201510081684A CN104593843A CN 104593843 A CN104593843 A CN 104593843A CN 201510081684 A CN201510081684 A CN 201510081684A CN 104593843 A CN104593843 A CN 104593843A
- Authority
- CN
- China
- Prior art keywords
- multilayer ceramic
- ceramic capacitor
- chip multilayer
- normal temperature
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 32
- 238000002203 pretreatment Methods 0.000 title abstract description 11
- 238000009713 electroplating Methods 0.000 title abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000002253 acid Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 abstract description 4
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 abstract 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 3
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 2
- 235000019799 monosodium phosphate Nutrition 0.000 description 2
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The invention discloses a normal temperature pretreatment method for electroplating a chip multilayer ceramic capacitor. The pretreatment method comprises the following steps: before entering into an electro-nickeling procedure, under a normal temperature condition, using sulfamic acid to treat the chip multilayer ceramic capacitor. According to the normal temperature pretreatment method disclosed by the invention, a novel pretreatment formula is used to pretreat the chip multilayer ceramic capacitor, so that the technological process of the pretreatment for electroplating the chip multilayer ceramic capacitor can be simplified, a heating device is not required to be used, and the pretreatment working procedure for electroplating the chip multilayer ceramic capacitor can be more convenient and faster.
Description
Technical field
The present invention relates to field of electroplating, be specifically related to a kind of chip multilayer ceramic capacitor plating normal temperature pre-treating process.
Background technology
Present chip multilayer ceramic capacitor (MLCC) electroplating technology generally comprises: pre-treatment, electronickelling, eleetrotinplate, aftertreatment.And now general electronic devices and components pre-treatment comprises oil removing and activation 2 steps, wherein oil removing is under the condition of 50 DEG C-55 DEG C, uses the sodium dihydrogen phosphate cleaning chip multilayer ceramic capacitor 3-5 minute of 30g/L; Activation is the ammonium chloride solution cleaning chip multilayer ceramic capacitor 2-3 minute using 30Gg/L when normal temperature, then enters electro-nickel process.Not only technique is loaded down with trivial details in existing chip multilayer ceramic capacitor pre-treatment, and operation easier is large, equipment requirements is high.
Summary of the invention
The object of this invention is to provide a kind of chip multilayer ceramic capacitor plating normal temperature pre-treating process, which simplify the pre-treating technology of chip multilayer ceramic capacitor, pre-treatment does not need 2 steps, does not need heating, convenient and swift.
The object of the present invention is achieved like this: a kind of chip multilayer ceramic capacitor plating normal temperature pre-treating process, is characterized in that: before the flow process entering electronickelling, under normal temperature condition, use thionamic acid to chip multilayer ceramic capacitor process.
The concentration of described thionamic acid is 4-6wt%.
The described treatment time is 1-3 minute.
The present invention uses a kind of novel pre-treatment formula to carry out pre-treatment to chip multilayer ceramic capacitor, simplify the technical process of chip multilayer ceramic capacitor pre-electroplating treatment, do not need to use heating installation, make chip multilayer ceramic capacitor pre-electroplating treatment operation more convenient and quicker.
Embodiment
The present invention is a kind of chip multilayer ceramic capacitor plating normal temperature pre-treating process, and it is before the flow process entering electronickelling, under normal temperature condition, uses thionamic acid to chip multilayer ceramic capacitor process.Preferably, the concentration of described thionamic acid is 4-6wt%.Preferably, the described treatment time is 1-3 minute.
Embodiment 1
Before the flow process entering electronickelling, under normal temperature condition, use 4wt% thionamic acid to chip multilayer ceramic capacitor process 3 minutes.
Embodiment 2
Before the flow process entering electronickelling, under normal temperature condition, use 5wt% thionamic acid to chip multilayer ceramic capacitor process 2 minutes.
Embodiment 3
Before the flow process entering electronickelling, under normal temperature condition, use 6wt% thionamic acid to chip multilayer ceramic capacitor process 2 minutes.
Comparative example
Electronic devices and components pre-treatment comprises oil removing and activation 2 steps, and wherein oil removing is under the condition of 50 DEG C-55 DEG C, uses the sodium dihydrogen phosphate cleaning chip multilayer ceramic capacitor 3-5 minute of 30g/L; Activation is the ammonium chloride solution cleaning chip multilayer ceramic capacitor 2-3 minute using 30Gg/L when normal temperature, then enters electro-nickel process.
Experimental data:
Adopt 6 batches of chip multilayer ceramic capacitors, adopt embodiment 2 and comparative example method to process respectively, then adopt same process to carry out nickel plating, the step such as zinc-plated, each experimental data of products obtained therefrom is in table 1.
Table 1.
This invention simplifies the technical process of chip multilayer ceramic capacitor pre-electroplating treatment, do not need to use heating installation, but the performance of plated item coating can reach technical requirements equally.
Claims (3)
1. a chip multilayer ceramic capacitor plating normal temperature pre-treating process, is characterized in that: before the flow process entering electronickelling, under normal temperature condition, uses thionamic acid to chip multilayer ceramic capacitor process.
2. chip multilayer ceramic capacitor plating normal temperature pre-treating process according to claim 1, is characterized in that: the concentration of described thionamic acid is 4-6wt%.
3. chip multilayer ceramic capacitor plating normal temperature pre-treating process according to claim 1, is characterized in that: the described treatment time is 1-3 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510081684.7A CN104593843B (en) | 2015-02-04 | 2015-02-04 | Chip multilayer ceramic capacitor electroplates normal temperature pre-treating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510081684.7A CN104593843B (en) | 2015-02-04 | 2015-02-04 | Chip multilayer ceramic capacitor electroplates normal temperature pre-treating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104593843A true CN104593843A (en) | 2015-05-06 |
| CN104593843B CN104593843B (en) | 2017-06-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510081684.7A Active CN104593843B (en) | 2015-02-04 | 2015-02-04 | Chip multilayer ceramic capacitor electroplates normal temperature pre-treating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104593843B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111041531A (en) * | 2019-11-28 | 2020-04-21 | 广东羚光新材料股份有限公司 | Capacitor nickel electroplating solution, electroplating method and application |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040226671A1 (en) * | 2003-05-14 | 2004-11-18 | Nguyen Xuan Truong | Surface treatment with texturized microcrystalline cellulose microfibrils for improved paper and paper board |
| CN101906635A (en) * | 2010-07-23 | 2010-12-08 | 上海电力学院 | Carbon steel sulfamic acid pickling compound corrosion inhibitor and preparation method thereof |
| CN103484909A (en) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | Pretreatment method for iron-based hardware electroplating |
| CN103540969A (en) * | 2012-07-12 | 2014-01-29 | 上海中劢磁业有限公司 | Method for improving surface of iron-boron permanent magnet material |
| US20140119978A1 (en) * | 2012-10-29 | 2014-05-01 | Samsung Electro-Mechanics Co., Ltd. | Metal nano particle and method for surface treating the same |
-
2015
- 2015-02-04 CN CN201510081684.7A patent/CN104593843B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040226671A1 (en) * | 2003-05-14 | 2004-11-18 | Nguyen Xuan Truong | Surface treatment with texturized microcrystalline cellulose microfibrils for improved paper and paper board |
| CN101906635A (en) * | 2010-07-23 | 2010-12-08 | 上海电力学院 | Carbon steel sulfamic acid pickling compound corrosion inhibitor and preparation method thereof |
| CN103540969A (en) * | 2012-07-12 | 2014-01-29 | 上海中劢磁业有限公司 | Method for improving surface of iron-boron permanent magnet material |
| US20140119978A1 (en) * | 2012-10-29 | 2014-05-01 | Samsung Electro-Mechanics Co., Ltd. | Metal nano particle and method for surface treating the same |
| CN103484909A (en) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | Pretreatment method for iron-based hardware electroplating |
Non-Patent Citations (4)
| Title |
|---|
| 吴水清: "氨基磺酸盐在电镀工业中的应用", 《表面技术》 * |
| 娄红涛: "片式叠层陶瓷电容器（MLCC）中纯锡可焊镀层的研究", 《广东技术师范学院学报（自然科学）》 * |
| 焦宝祥 等: "《功能与信息材料》", 31 May 2011, 上海：华东理工大学出版社 * |
| 王尚义: "《电镀故障分析与处理问答》", 1 October 2007 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111041531A (en) * | 2019-11-28 | 2020-04-21 | 广东羚光新材料股份有限公司 | Capacitor nickel electroplating solution, electroplating method and application |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104593843B (en) | 2017-06-30 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Normal temperature pretreatment method for electroplating chip multilayer ceramic capacitor Effective date of registration: 20200426 Granted publication date: 20170630 Pledgee: China Co. truction Bank Corp Zhaoqing branch Pledgor: GUANGDONG LINGGUANG NEW MATERIAL Co.,Ltd. Registration number: Y2020440000098 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20170630 Pledgee: China Co. truction Bank Corp Zhaoqing branch Pledgor: GUANGDONG LINGGUANG NEW MATERIAL Co.,Ltd. Registration number: Y2020440000098 |