CN104582252A - Printed curcuit board and manufacturing method of the same - Google Patents
Printed curcuit board and manufacturing method of the same Download PDFInfo
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- CN104582252A CN104582252A CN201410047979.8A CN201410047979A CN104582252A CN 104582252 A CN104582252 A CN 104582252A CN 201410047979 A CN201410047979 A CN 201410047979A CN 104582252 A CN104582252 A CN 104582252A
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- insulating barrier
- circuit layer
- layer
- pcb
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a printed curcuit board and a manufacturing method of the same. The printed curcuit board comprises a composite material layer having the other surface corresponding to one surface, a first insulation layer formed on one surface the composite material layer, and a second insulation layer formed on the other surface of the first insulation layer. The coefficients of thermal expansion of the first insulation layer, the second insulation layer and the composite material layer are different. The printed curcuit board selectively adjusts the content of insulation layer filler arranged between copper foil layers, so that the insulation layer with different thermal expansion coefficients are formed, and bad situations such as warping and distortion can be prevented.
Description
Technical field
The present invention relates to printed circuit board (PCB) and preparation method thereof.
Background technology
In recent years, along with the development of electronic device, the low weight of printed circuit board (PCB), thin plate, miniaturization and highly integratedly to make progress.In order to meet such requirement, the structure of printed circuit is complicated, densification and multiple stratification further.
In addition, due to production life cycle short-term, the rapid reply to the requirement of client and shortening construction cycle is required.In such a case, due to the trend of the thin plate of printed circuit board (PCB), the warpage (Warpage) consigning to the substrate of client becomes the Key technique problem that ought to solve.
On such printed circuit board (PCB) mounting electronic parts process in, on the printed circuit board (PCB) of thin plate and multiple stratification, thermal expansion that heat causes and warpage can be there is.At this, each key element forming printed circuit board (PCB) has mutually different thermal coefficient of expansion (Coefficient of Thermal Expansion; CTE), in addition, because the form of this inscape, thickness and area are different, the thermal expansion that the heat that in the process through production process, high temperature will inevitably occur causes and warpage.
If illustrational words, the thermal coefficient of expansion (CTE) of copper is 10-20ppm/ DEG C, and in printed circuit board (PCB) (PCB), the thermal coefficient of expansion (CTE) of usual used polymer composite insulating material is 50-80ppm/ DEG C.
Particularly polymer is due to its viscoplasticity, and at the temperature more than vitrification point (Tg), thermal coefficient of expansion (CTE) promotes significantly.This high-temperature heat expansion coefficient (CTE) reaches 150-180ppm/ DEG C, and vitrification point (Tg) has the value of 150-200 DEG C.When the parts such as semiconductor are installed on a printed circuit board (pcb), within 3-5 second, supply the heat of printed circuit board (PCB) (PCB) about 250-280 DEG C rapidly.Now, when thermal coefficient of expansion (CTE) difference of circuit and insulating barrier is larger, the circuit formed by plating likely can crack, the form of substrate can be distorted, when cooling after treatment, because thermal coefficient of expansion (CTE) is poor, the scolding tin (Solder) between installed parts and printed circuit board (PCB) also may crack, and the form of substrate is distorted.
Like this, the substrate producing the structure problems such as warpage finally can make the installation of electronic unit reduce.Like this, the electrical stability required by substrate, thermal stability, mechanical stability, dimensional stability are further used as important key element and play a role.Wherein, particularly the size distortion that causes of heat be when making substrate about one of the key factor of reliability.
In the past used multilayer board, centered by insulating barrier, above and below formed and be used for the layers of copper of distribution, the mutual lamination of insulating barrier that this layers of copper and resin are formed and form multilayer.
With there is upper and lower symmetrical structure like this have nothing to do, any side of printed circuit board (PCB) tilts, and so-called warpage (Warpage) phenomenon occurs.This be due to the center line of printed circuit board (PCB) for benchmark, the difference of the thermal expansion of upper and lower causes.
But have nothing to do with the various methods of thermal coefficient of expansion (CTE) for reducing the polymer substance forming insulating barrier, result can produce the difference with the thermal coefficient of expansion of the copper forming distribution (CTE).
Therefore, even if the insulating barrier of printed circuit board (PCB) has laterally zygomorphic structure, the volume of layers of copper or area are different each other, owing to can not have actual symmetrical structure in thermal expansion face, thus there is printed circuit board (PCB) and can occur in the problem that warping phenomenon occurs in any side.
In order to solve the problem, attempt various method.
As an example, be used in and vertically in the one side of the printed circuit board (PCB) body part larger with percent thermal shrinkage in another side insert the method that several rod that percent thermal shrinkage is less compared with copper wiring layer and solder mask (bar) prevents warpage.
In addition, as other example, the warpage that material little for thermal coefficient of expansion and the large material layers of thermal coefficient of expansion are pressed in top and the bottom is offset means, is present in the inside of printed circuit board (PCB) in laterally zygomorphic mode, is attached to the upper outer lower face surface of printed circuit board (PCB) symmetrically.Thus, even if there is warping phenomenon in upside or downside, while the warpage counteracting means being configured in top tilt to downside, the warpage counteracting means being configured in bottom tilt to upside, can be played the effect that the warping phenomenon of printed circuit board (PCB) is reduced by its negative function.
But such mode in the past, owing to being finally the mode of part of the warpage of additionally adding for preventing printed circuit board (PCB), is realizing slimming and limited in the integrated circuit pattern of densification.
Summary of the invention
The present inventor regulates the content of filler by the residual copper amount of the insulating barrier according to printed circuit board (PCB), forms the insulating barrier with mutually different coefficient of thermal expansion, confirms and can prevent warpage, thus complete the present invention.
Therefore, the object of the present invention is to provide a kind of printed circuit board (PCB), this printed circuit board (PCB) prevents means even without other warpage, also can prevent the warping phenomenon occurred at printed circuit board (PCB), and have dimensional stability.
Other object of the present invention is to provide a kind of printed circuit board (PCB), and because this printed circuit board (PCB) does not have other warpage to prevent means, not only lightweight and slim, also improves integrated level.
Further other object of the present invention is the content of the filler provided by regulating insulating barrier, can prevent the preparation method of the printed circuit board (PCB) of warpage.
Printed circuit board (PCB) (hereinafter referred to as " the first invention ") for realizing the concrete example of the present invention of an above-mentioned object comprising: the composite layer with one side and the another side corresponding with it, be formed at the first insulating barrier in the one side of described composite layer, and be formed at the second insulating barrier on the another side of described composite layer; The thermal coefficient of expansion of described first insulating barrier, described second insulating barrier and composite layer is formed as different.
In the first invention, comprise further: be formed at the first circuit layer between described first insulating barrier and described composite layer, and be formed at the second circuit layer between described second insulating barrier and described composite layer; Described first circuit layer and described second circuit layer have mutually different formation area.
In the first invention, described composite layer or described first insulating barrier, the second insulating barrier and described first circuit layer, second circuit layer mutual lamination and being formed repeatedly mutually.
In the first invention, described composite layer contains organic fiber or inorfil, liquid crystal oligomer, epoxy system resin and filler.
In the first invention, described first insulating barrier and the second insulating barrier contain liquid crystal oligomer, epoxy system resin and filler.
In the first invention, described liquid crystal oligomer is for shown in following chemical formula 1.
[chemical formula 1]
At this, a is the integer of 13-26, and b is the integer of 13-26, and c is the integer of 9-21, and d is the integer of 10-30, and e is the integer of 10-30.
In the first invention, relative to described composite layer 100 % by weight, described organic fiber or inorfil and filler contain 20-80 % by weight.
In the first invention, relative to the total weight of described composite layer, the content of described inorfil or organic fiber is 5-25 % by weight, and the content of described filler is 5-75 % by weight.
In the first invention, more than one for being selected from glass fibre, carbon fiber, polyparaphenylene Ben Bing bis-oxazole fiber, TLCP fiber, lyotropic liquid crystal polymers fiber, aramid fiber, polypyridobisimidazole fiber (Port リ ピ リ De PVC ス イ ミ ダ ゾ ー Le fiber), polybenzazole fibers and polyarylate fiber of described inorfil or organic fiber.
In the first invention, described glass fibre be selected from T-glass fibre, E-glass fibre, S-glass fibre, ceramic fibre and their mixture any one.
In the first invention, relative to described first insulating barrier or the second insulating barrier 100 % by weight, described filler contains 20-80 % by weight.
In the first invention, described filler be selected from the group that is made up of organic filler, inorganic filler and their combination any one.
In the first invention, described inorganic filler is silicon dioxide (SiO
2), aluminium oxide (Al
2o
3), carborundum (SiC), barium sulfate (BaSO
4), talcum, mica powder, aluminium hydroxide (Al (OH)
3), magnesium hydroxide (Mg (OH)
2), calcium carbonate (CaCO
3), magnesium carbonate (MgCO
3), magnesium oxide (MgO), boron nitride (BN), aluminium borate (AlBO
3), barium titanate (BaTiO
3), calcium zirconate (CaZrO
3) and their any one of combination.
In the first invention, described organic filler be selected from the group be made up of epoxy powder, melmac powder, urea resin powder, benzoguanamine powder (ベ Application ゾ グ ア Na ミ Application Trees cosmetics end), styrene resin and their combination any one.
In the first invention, when the residual copper rate of described first circuit layer and second circuit layer increases in the scope of 10-20%, in the scope of 1-10 % by weight, regulate the content of the filler of described first insulating barrier, the second insulating barrier and composite layer.
Preparation method's (hereinafter referred to as " the second invention ") for realizing the printed circuit board (PCB) of other object of the present invention comprising: the step providing the composite layer with one side and another side, the first circuit layer is formed respectively in the one side of described composite layer, the another side of described composite layer is formed the step of second circuit layer, and, described first circuit layer forms tertiary circuit layer, the first insulating barrier is formed between described first circuit layer and described tertiary circuit layer, described second circuit layer forms the 4th circuit layer, the step of the second insulating barrier is formed between described second circuit layer and described 4th circuit layer, the filer content of described first insulating barrier and the filer content of described second insulating barrier are formed as different, when residual copper rate height than described second insulating barrier of the residual copper rate of described first insulating barrier, the filer content of described first insulating barrier is formed as more than the filer content of described second insulating barrier.
In the second invention, when the residual copper rate of described first circuit layer and second circuit layer increases in the scope of 10-20%, in the scope of 1-10 % by weight, regulate the content of the filler of described first insulating barrier, the second insulating barrier and composite layer.
In the second invention, relative to described first insulating barrier or the second insulating barrier 100 % by weight, described filler contains 20-80 % by weight.
Preparation method's (hereinafter referred to as " the 3rd invention ") for realizing the printed circuit board (PCB) of further object of the present invention comprising: the step providing the composite layer with one side and another side, the first circuit layer is formed respectively in the one side of described composite layer, the another side of described composite layer is formed the step of second circuit layer, and, described first circuit layer forms tertiary circuit layer, the first insulating barrier is formed between described first circuit layer and described tertiary circuit layer, described second circuit layer forms the 4th circuit layer, the step of the second insulating barrier is formed between described second circuit layer and described 4th circuit layer, the filer content of described first insulating barrier and the filer content of described second insulating barrier are formed as different, when residual copper rate height than described second insulating barrier of the residual copper rate of described first insulating barrier, the filer content of described second insulating barrier is formed as fewer than the filer content of described first insulating barrier.
In the 3rd invention, when the residual copper rate of described first circuit layer and second circuit layer increases in the scope of 10-20%, in the scope of 1-10 % by weight, regulate the content of the filler of described first insulating barrier, the second insulating barrier and composite layer.
In the 3rd invention, relative to described first insulating barrier or the second insulating barrier 100 % by weight, described filler contains 20-80 % by weight.
Printed circuit board (PCB) of concrete example of the present invention and preparation method thereof, by the content of the optionally filler of the insulating barrier of regulating allocation between circuit layer, form the insulating barrier with mutually different thermal coefficient of expansion, there is the effect that can prevent the unfavorable condition such as warpage or distortion.
In addition, by relaxing the stress that thermal expansion causes, can prevent circuit and peace from forwarding the damage of the chip on circuit to.
In addition, owing to only adding the filler of necessary amount, therefore, it is possible to save material, preparation cost is reduced.
In addition, owing to not needing other warpage to prevent means, not only lightweight and slim, can also improve integrated level.
Accompanying drawing explanation
[Fig. 1] is the sectional view representing the printed circuit board (PCB) of concrete example of the present invention.
[Fig. 2] is the enlarged section of the printed circuit board (PCB) of the illustrative concrete example of the present invention.
[Fig. 3] is the process chart of the preparation method of the printed circuit board (PCB) of the illustrative concrete example of diagram the present invention.
[Fig. 4] is the process chart of the preparation method of the printed circuit board (PCB) of the illustrative concrete example of diagram the present invention.
[Fig. 5] is the process chart of the preparation method of the printed circuit board (PCB) of the illustrative concrete example of diagram the present invention.
[Fig. 6] is the process chart of the preparation method of the printed circuit board (PCB) of the illustrative concrete example of diagram the present invention.
[Fig. 7] is the process chart of the preparation method of the printed circuit board (PCB) of the illustrative concrete example of diagram the present invention.
[description of reference numerals]
10 printed circuit board (PCB)s
105 composite layers
110 first insulating barriers
130 the 3rd insulating barriers
150 pentasyllabic quatrain edge layer
170 organic fiber inorfils
180 fillers
220 second insulating barriers
240 the 4th insulating barriers
260 the 6th insulating barriers
500 copper clad laminates
510 dielectric films
520 copper foil layers
1100 first circuit layers
1300 tertiary circuit layers
2200 second circuit layers
2400 the 4th circuit layers
Embodiment
Object of the present invention, specific advantage and new feature, the following detailed description related to by accompanying drawing and preferred embodiment can become clearer and more definite.In this manual, in the inscape of each accompanying drawing during additional reference marker, as long as same inscape must be noticed, even if be shown in different accompanying drawings, also additional as far as possible same mark.In addition, the term of " simultaneously ", " another side ", " first ", " second " etc., be the term in order to an inscape and other inscape are distinguished and used, inscape does not limit by described term.Below, when the present invention will be described, omit the detailed description likely making the indefinite related known technology of main idea of the present invention.
Below, with reference to accompanying drawing, the preferred embodiments of the present invention are described in detail.
First, referring to figs. 1 through Fig. 7, printed circuit board (PCB) that the illustrative concrete example of the present invention relates to and preparation method thereof is described.In the illustrative concrete example of the present invention, to possess containing liquid crystal oligomer, the printed circuit board (PCB) of the insulating barrier of the content that have adjusted filler is described, but is not limited thereto, and can use various insulating barrier.
Fig. 1 is the sectional view representing the printed circuit board (PCB) of concrete example of the present invention, and Fig. 2 is the enlarged section of the printed circuit board (PCB) of the illustrative concrete example of the present invention.
When seeing figures.1.and.2, the printed circuit board (PCB) 10 representing concrete example of the present invention comprises: the composite layer 105 with one side and the another side corresponding with it, be formed at the first insulating barrier 110 in the one side of described composite layer 105, and be formed at the second insulating barrier 220 on the another side of described composite layer 105; The thermal coefficient of expansion of described first insulating barrier 110, described second insulating barrier 220 and composite layer 105 is formed as different.
At this, between the one side and the first insulating barrier 110 of composite layer 105, there is the first circuit layer 1100, between the first insulating barrier 110 and the 3rd insulating barrier 130, there is tertiary circuit layer 1300.In addition, second circuit layer 2200 can be formed between the another side of composite layer 105 and the second insulating barrier 220, between the second insulating barrier 220 and the 4th insulating barrier 240, form the 4th circuit layer 2400.Like this, printed circuit board (PCB) 10 is formed by multiple insulating barrier and the mutual lamination of circuit layer, and now, thickness or the formation area of circuit layer can be formed as different.
In addition, insulating barrier can be formed in the outermost of the printed circuit board (PCB) 10 of multiple insulating barrier and circuit layer lamination.A part of opening of this outermost insulating barrier 150,260, can form the weld pad (パ ッ De) be connected with electronic unit.
Such circuit layer 1100,1300,2200,2400 is configured on composite layer 105 or insulating barrier 110,130,150,220,240,260, can be formed as the distribution forming figure and forming circuit.
In addition, composite layer 105 or insulating barrier 110,130,150,220,240,260 become in the thickness direction upper strata swaging of circuit layer 1100,1300,2200,2400, can play make printed circuit board (PCB) 10 interior circuit layers 1100,1300,2200,2400 between the effect of insulation.
At this, the structure of printed circuit board (PCB) is in the past for benchmark with composite layer 105, alternation of bed swaging becomes insulating barrier 110,130,150,220,240,260 in a thickness direction, has laterally zygomorphic structure, is made up of the insulating barrier formed with same filer content and composite layer.
But, in product be suitable in practice, due to circuit layer 1100,1300,2200,2400 forming circuit (signals layer and ground plane) that thermal expansion is relatively little, therefore formed the volume of the copper of the circuit layer 1100,1300,2200,2400 of upper and lower with the center of printed circuit board (PCB) 10 for benchmark or area can be formed as different.Below, the residual copper rate of circuit layer 1100,1300,2200,2400 called after of formation will be contacted respectively on composite layer 105 or insulating barrier 110,130,150,220,240,260.
Accept the signal of telecommunication in order to make this circuit layer 1100,1300,2200,2400 via circuit layout and transmit, such electric energy can produce heat on copper wiring.The heat of described generation becomes mutually different heat energy because of the volume of copper wiring and area etc., gives adjacent composite layer 105 and insulating barrier 110,130,150,220,240,260 by its thermal energy transfer.And then, in operation on circuit layout mounting semiconductor chip etc. (surface installation technique: SMT), now, add preheating procedure in a pre-installation, in installation process, provide the heat of about 280 DEG C to composite layer 105 or insulating barrier 110,130,150,220,240,260.Thus, likely there is the warpage of printed circuit board (PCB) 10 thus in composite layer 105 or insulating barrier 110,130,150,220,240,260 thermal expansion.
In addition, in circuit layer 1100,1300,2200,2400, can there is more heat according to residual copper rate in the region that the area that copper wiring exposes is larger.And then insulating barrier 110,130,150,220,240,260 has viscosity and flexible characteristic, due to such viscoplasticity, the ratio of the thermal expansion that heat causes can exponentially property increase.Like this, because copper wiring and composite layer 105 and insulating barrier 110,130,150,220,240,260 have mutually different thermal coefficient of expansion, pass through transmitted heat energy and likely warpage occurs.
In addition, in order to the thermal expansion regulating the transmission of described heat energy to cause, insulating barrier 110,130,150,220,240,260 can be formed containing filler 180 in the polymer.Compared with the copper of forming circuit layer 1100,1300,2200,2400, the thermal coefficient of expansion forming the polymer of insulating barrier 110,130,150,220,240,260 is relatively high.
Therefore, regulating thermal coefficient of expansion by injecting filler 180 etc. in insulating barrier 110,130,150,220,240,260, the warping phenomenon that thermal expansion causes can be prevented.
Insulating barrier 110,130,150,220,240,260 can for being added with the built-in film (Build-Up film) of filler 180 in the polymer.Described built-in film makes distribution density increase by possessing through hole, can make printed circuit board (PCB) 10 densification and slimming.
In insulating barrier 110,130,150,220,240,260, the content of the filler 180 of mixing can be filled to 20-80 % by weight relative to the total weight of described insulating barrier 110,130,150,220,240,260.Filler 180 containing quantity not sufficient 20 % by weight time, heat transfer capacity may die down, and when the content of filler 180 is more than 80 % by weight, the problem reduced with the adhesive force of circuit layer 1100,1300,2200,2400 can occur.
In addition, as filler 180, any one of inorganic filler or organic filler and their combination can be used.At this, as inorganic filler, can use and be selected from silicon dioxide (SiO
2), aluminium oxide (Al
2o
3), barium sulfate (BaSO
4), talcum, clay, mica powder, aluminium hydroxide (Al (OH)
3), magnesium hydroxide (Mg (OH)
2), calcium carbonate (CaCO
3), magnesium carbonate (MgCO
3), magnesium oxide (MgO), boron nitride (BN), aluminium borate (AlBO
3), barium titanate (BaTiO
3) and calcium zirconate (CaZrO
3) in more than one.In addition, as organic filler, can use in the group being selected from and being made up of epoxy powder, melmac powder, urea resin powder, benzoguanamine powder, styrene resin and their combination any one.
Insulating barrier 110,130,150,220,240,260 is made up of polymer, the liquid crystal oligomer (Liquid Crystal oligomer) containing epoxy resin and following chemical formula 1.
[chemical formula 1]
At this, a is the integer of 13-26, and b is the integer of 13-26, and c is the integer of 9-21, and d is the integer of 10-30, and e is the integer of 10-30.
Described liquid crystal oligomer has the structure of the characteristic of embodiment liquid crystal (Liquid Crystal) simultaneously and dissolves in the soluble structure of solvent.In addition, described liquid crystal oligomer can introduce identical or mutually different curability group more than one end of two ends of main chain.In other words, can have in two ends existence the consolidated structures utilizing epoxy resin and curing agent.
As such curability group, photo-curable group or Thermocurable group can be introduced.In addition, as described liquid crystal oligomer, such as, can enumerate Thermocurable or photo-curable liquid crystal oligomer is described, as long as but the material that can improve mechanical properties be just not particularly limited.
Described Thermocurable group when using substrate formation composition to prepare printed circuit board (PCB) 10 grade through hot setting, these crosslinking functionalities are cross-linked with each other, form firmly netted rock-steady structure, therefore, it is possible to make the mechanical properties of printed circuit board (PCB) 10 improve.In addition, photo-curable group is when providing luminous energy by ultraviolet light, crosslinking functionality is cross-linked with each other, and can have firmly netted stable curing structure.
On the other hand, in figure, composite layer 105 is illustrated as individual layer, and the modulus in order to printed circuit board (PCB) 10 improves also can be formed as multilayer, and insulating barrier 110,130,150,220,240,260 also can be formed as multilayer as shown in the figure.
At this, composite layer 105 can be the prepreg (プ リ プ レ グ) (PPG) further containing organic fiber inorfil 170 in the polymer containing filler 180.Can use in described composite layer 105 with insulating barrier 110,130,150,220,240,260 same polymer and filler, filer content.
On the other hand, in composite layer 105, the organic fiber inorfil 170 of mixing and the content of filler 180 can be filled to 20-80 % by weight relative to the total weight of described composite layer 105, wherein, organic fiber inorfil 170 can containing 5 % by weight ~ 25 % by weight.By the addition of such organic fiber inorfil 170, filler 180 can contain 5 % by weight ~ 75 % by weight relative to the total weight of composite layer 105.Now, filler 180, in order to reduce thermal coefficient of expansion, needs at least to add more than 5 % by weight.When the addition of filler 180 is more than 75 % by weight, the dispersiveness of filler 180 reduces and filler 180 coacervation can occur, and likely increases the surface roughness of substrate.In addition, the viscosity of polymer likely increases, and makes the shaping of product become difficulty.And then in the laminar structure being formed as multilayer, ply adhesion likely reduces.
In addition, more than one for being selected from glass fibre, carbon fiber, polyparaphenylene Ben Bing bis-oxazole, TLCP fiber, lyotropic liquid crystal polymers fiber, aramid fiber, polypyridobisimidazole fiber, polybenzazole fibers and polyarylate fiber of described organic fiber inorfil 170.Wherein, as described glass fibre, T-glass fibre, E-glass fibre, S-glass fibre, ceramic fibre etc. can be used.In addition, as organic fiber inorfil 170, inorfil, organic fiber and their combination can be used.
Like this, by according to residual copper rate, regulate the amount of organic fiber inorfil and the filler added in composite layer 105 or insulating barrier 110,130,150,220,240,260, the coefficient of thermal expansion of insulating barrier and composite layer can be regulated.Thereby, it is possible to prevent the warpage occurred because of coefficient of thermal expansion differences.In addition, by relaxing the stress that causes of thermal expansion, the damage of chip that can prevent circuit and install on circuit.
On the other hand, Fig. 2 is the enlarged section of the printed circuit board (PCB) of the illustrative concrete example of the present invention, at this, in order to the printed circuit board (PCB) of the illustrative concrete example of the present invention is easily described, at random illustrates the graphics shape of circuit layer.
With reference to Fig. 2, circuit layer 1100,1300,2200,2400 is configured on insulating barrier 110,130,150,220,240,260, forms figure and forms the distribution of forming circuit.Configuration circuit layer 1100,1300,2200,2400 in the upper side of insulating barrier 110,130,150,220,240,260 and bottom surfaces.In other words, described circuit layer 1100,1300,2200,2400 is present between described insulating barrier 110,130,150,220,240,260 respectively.
At this, circuit layer 1100,1300,2200,2400, owing to being formed as figure, thus, the top and bottom of insulating barrier 110,130,150,220,240,260 can be formed as have different volumes and area.
Such as, the one side of composite layer 105 forms the first circuit layer 1100, the first circuit layer 1100 is formed the first insulating barrier 110.In addition, the first insulating barrier 110 forms tertiary circuit layer 1300.Therefore, the first insulating barrier 110 is formed as contacting with the first circuit layer 1100 and tertiary circuit layer 1300.In addition, the second insulating barrier 220 be formed on the another side of composite layer 105 is also formed as contacting with second circuit layer 2200 and the 4th circuit layer 2400.
At this, the structure of printed circuit board (PCB) 10 with composite layer 105 for benchmark, there is the first insulating barrier, the second insulating barrier 110,220 in upper and lower symmetrical structure, be applicable in the product in reality, due to circuit layer 1100,1300,2200,2400 forming circuit that thermal expansion is relatively less, with the center of printed circuit board (PCB) 10 for benchmark can form differently at the volume of the copper of upper and lower forming circuit layer or area.That is, the layers of copper, the i.e. residual copper rate that the first insulating barrier, the second insulating barrier 110,220 are formed can be formed as different each other.
Like this, because the area of circuit layer 1100,1300,2200,2400 formed on the first insulating barrier, the second insulating barrier 110,220 is different each other with volume, thus different heat energy can be distinguished contact with circuit layer 1100,1300,2200,2400 composite layer 105 that formed or the first insulating barrier, the second insulating barrier 110,220 transmit.
In addition, as shown in Figure 2, contact the second circuit layer, the 4th circuit layer 2200,2400 that are formed to be formed with lower residual copper rate with the second insulating barrier 220, contact with the first insulating barrier 110 formed the first circuit layer, tertiary circuit layer 1100,1300 to be to be formed than second circuit layer, the 4th circuit layer 2200,2400 high residual copper rates.Now, the second insulating barrier 220 that the first insulating barrier 110 that residual copper rate is high is lower than residual copper rate accepts more heat energy, is formed as having high coefficient of thermal expansion.
At this, the amount of filler of the first insulating barrier 110 or the second insulating barrier 220 can be regulated according to residual copper rate.In other words, by according to residual copper rate, regulate the amount of the filler added in a insulating layer, the coefficient of thermal expansion that transmitted heat energy causes can be regulated.Thus, the filer content of first insulating barrier 110 high by residual copper rate and low the second insulating barrier 220 of residual copper rate mixes in mutually different mode, can prevent the warpage that thermal expansion causes.
When citing is described, the percentage that the area of the circuit layer residual copper rate being defined as to calculate on the one side (100%) being formed at insulating barrier and another side (100%) obtains is summation 200%.In addition, the first and second insulating barrier 110,220 uses the filler of same polymer and same kind to be formed, and can suppose to have same filer content.Now, assuming that the first insulating barrier 110 has the residual copper rate of 80%, when the second insulating barrier 220 has the residual copper rate of 60%, printed circuit board (PCB) 10 is accepting the direction of more heat energy, is namely having on the first insulating barrier 110 direction of higher residual copper rate, forms convex and tilts.
At this, by reducing the thermal expansion of the first insulating barrier 110 at the further mixed fillers of the first insulating barrier 110 of the thermal expansion that mostly occurs, warpage can be prevented.Or, reduce by making the amount of filler of the second insulating barrier 220 and improve thermal expansion, regulate the thermal expansion ratio of the first insulating barrier 110 and the second insulating barrier 220, can warpage be prevented.
Namely, increase by making the content with the first insulating barrier 110 of mutually different residual copper rate and the filler of the second insulating barrier 220 or reduce, make the thermal coefficient of expansion of the first insulating barrier 110 and the second insulating barrier 220 different, can prevent from tilting to a direction.Now, when producing the residual copper rate variance of 10-20%, the content of filler can be made to increase with the scope of 1-10% or reduce.Thereby, it is possible to regulate the coefficient of thermal expansion of insulating barrier, prevent warpage.
Like this, owing to only adding the filler of necessary amount, can material be saved, reduce preparation cost, owing to not needing other warpage preventing means, therefore not be only lightweight and slim, can integrated level be improved simultaneously.
Fig. 3 to Fig. 7 is the process chart of the preparation method of the printed circuit board (PCB) of the illustrative concrete example of diagram the present invention.At this, in order to avoid repeat specification, quote Fig. 1 and Fig. 2 and be described.
The preparation method of the printed circuit board (PCB) of an embodiment of the invention, comprise: the step that the composite layer with one side and another side is provided, the first circuit layer is formed respectively in the one side of described composite layer, the another side of described composite layer is formed the step of second circuit layer, and, described first circuit layer forms tertiary circuit layer, the first insulating barrier is formed between described first circuit layer and described tertiary circuit layer, described second circuit layer forms the 4th circuit layer, the step of the second insulating barrier is formed between described second circuit layer and described 4th circuit layer.
At this, the filer content of described first insulating barrier and the filer content of described second insulating barrier are formed as different, when the residual copper rate of described first insulating barrier is than described second insulation floor height, the filer content of described first insulating barrier is formed as more than the filer content of described second insulating barrier.
In addition, other the preparation method of printed circuit board (PCB) of execution mode of the present invention, comprise: the step that the composite layer with one side and another side is provided, the first circuit layer is formed respectively in the one side of described composite layer, the another side of described composite layer is formed the step of second circuit layer, and, described first circuit layer forms tertiary circuit layer, the first insulating barrier is formed between described first circuit layer and described tertiary circuit layer, described second circuit layer forms the 4th circuit layer, the step of the second insulating barrier is formed between described second circuit layer and described 4th circuit layer.
At this, the filer content of described first insulating barrier and the filer content of described second insulating barrier are formed as different, when the residual copper rate of described first insulating barrier is than described second insulation floor height, the filer content of described second insulating barrier is formed as fewer than the filer content of described first insulating barrier.
Thus, when specifically describing, first, as shown in Figure 3, composite layer 105 is provided.Described composite layer 105 can contain liquid crystal oligomer, organic fiber inorfil 170 and filler 180, and single or multiple lift can be had to form.By this composite layer 105, the modulus of printed circuit board (PCB) 10 can be improved.For the liquid crystal oligomer of composite layer 105, organic fiber inorfil 170 and filler 180, identical with above-mentioned explanation, thus omit.
Then, as shown in Figure 4, at least one side of described composite layer 105 forms circuit layer.Now, the first circuit layer 1100 can be formed in the one side of composite layer 105, the another side of composite layer 105 is formed second circuit layer 2200.Described first circuit layer 1100 and described second circuit layer 2200 can be formed to form the mutually different mode of area.
Described first circuit layer, second circuit layer 1100,2200 can by be formed and the circuit layout forming figure is formed.Therefore, such circuit layout can be formed as the figure specified.Now, the first circuit layer, second circuit layer 1100,2200 are formed by plating mode, also form figure by development (develop) and etching (etching) operation etc.In addition, described first circuit layer, second circuit layer 1100,2200 are formed by using copper, also by using the formation such as conductive metal.
Then, as shown in Figure 5, the first circuit layer 1100 forms the first insulating barrier 110, second circuit layer 2200 is formed the second insulating barrier 220.First insulating barrier, the second insulating barrier 110,220 can cover copper laminated board 500 at the first circuit layer 110 or second circuit layer 220 upper strata and be formed.
At this, copper clad laminate 500 is made up of dielectric film 510, the copper foil layer 520 that formed on described dielectric film 510.At this, dielectric film 510 is containing polymer, the filler be mixed in polymer.Now, by carrying out plating process and graphically, can circuit layer be formed on described copper foil layer 520.In described circuit layer, by graphically, form circuit, according to the design of described circuit, the mutually different circuit layer of forming surface sum volume can be formed.Therefore, the area that described circuit layer is formed is compared, on the one side that mutually different for the filer content of dielectric film 510 copper clad laminate can be configured in composite layer respectively and another side.
Then, as shown in Figure 6, by described copper foil layer 520 being etched and graphically, tertiary circuit layer 1300 can being formed on the first insulating barrier 110.In addition, can carry out processing the through hole for by described first circuit layer and the electrical connection of tertiary circuit layer, the operation of being filled up by described through hole with copper.
In addition, copper laminated board 500 can be covered on second circuit layer 2200 upper strata, the second insulating barrier 220 forms the 4th circuit layer 2400.Like this by repeatedly lamination copper clad laminate, can be formed centered by composite layer 105 symmetrically or printed circuit board (PCB) 10 that asymmetrical insulating barrier and circuit layer are formed.
At this, when citing is described, the first circuit layer, second circuit layer 1100,2200 are covered by the first insulating barrier, the second insulating barrier 110,220.First circuit layer, second circuit layer 1100,2200 are connected and transmission of signal with electronic unit etc., produce the heat of regulation in this signal transduction process.Described thermal energy transfer is to described first insulating barrier 110 and the second insulating barrier 220.Now, the thermal coefficient of expansion of copper that uses of circuit layer and heat transfer coefficient can be formed as from the thermal coefficient of expansion of the insulating material used in described first insulating barrier, the second insulating barrier 110,220 and heat transfer coefficient different mutually.And then, described circuit layer due to volume different with area and produce mutually different heat energy, described heat energy is passed to insulating barrier.
In the past, centered by composite layer, lamination had the insulating barrier of same coefficient of thermal expansion.In addition, by having the circuit layer of mutually different formation area, mutually different heat energy can be transmitted to described insulating barrier.Now, as mentioned above, the printed circuit board (PCB) of the insulating barrier lamination formed by the insulating material with identical coefficient of thermal expansion can to either direction generation warping phenomenon.
Therefore, by using the insulating material with larger thermal coefficient of expansion in the insulating barrier accepting more heat energy, the insulating material with less thermal coefficient of expansion is used in the insulating barrier accepting less heat energy, thermal expansion can be prevented centered by described composite layer 105 in the direction set of any one party, prevent the warpage of printed circuit board (PCB).
In order to regulate such thermal expansion, by regulating the amount of filler or organic fiber inorfil according to the formation area of circuit layer, thermal coefficient of expansion can be regulated.Such as, the residual copper rate of the formation area of the first circuit layer 1100 and tertiary circuit layer 1300, i.e. the first insulating barrier 110 is formed as the residual copper rate (the formation area of second circuit layer 2200 and the 4th circuit layer 2400) hour than the second insulating barrier, the amount of filler of adjustable first insulating barrier 110, or the amount of filler regulating the second insulating barrier 220 contacted with the 4th circuit layer 2400 with second circuit layer 2200.
In other words, by regulating the amount of filler of the first insulating barrier 110 and the second insulating barrier 220, the first insulating barrier 110 and the second insulating barrier 220 can be made to have mutually different thermal coefficient of expansion.Such as, the thermal coefficient of expansion of the first insulating barrier 110 and the second insulating barrier 220, when namely amount of filler is formed as identical, when formation area ratio first circuit layer of second circuit layer 2200 and the 4th circuit layer 2400, tertiary circuit layer 1100,1300 are large, the warpage of convex can be there is to the direction of the second insulating barrier 220.Now, by increasing the amount of filler of the second insulating barrier 220, or reducing the amount of filler of the first insulating barrier 110, the warpage of printed circuit board (PCB) 10 can be reduced.On the contrary, when warpage occurs, also reduce the warpage of printed circuit board (PCB) 10 by said method.Or the circuitous pattern that can specify due to the first circuit layer 1100 and second circuit layer 2200 is formed, and correspondingly can regulate the amount of filler or organic fiber inorfil.
Now, the content of the filler of the first insulating barrier, the second insulating barrier 110,220 can be 20-80 % by weight, by regulating its content, the first insulating barrier 110 and the second insulating barrier 220 can be made to be formed as having mutually different thermal coefficient of expansion.In addition, by regulating the content of the organic fiber inorfil 170 of composite layer 105, the warpage of printed circuit board (PCB) can be reduced.
Then, as shown in Figure 7, difference lamination copper clad laminate repeatedly on the first insulating barrier 110 or the second insulating barrier 220.By such lamination copper clad laminate repeatedly, the printed circuit board (PCB) with multiple insulating barrier and circuit layer can be formed.
Therefore, insulating barrier possesses circuit layer at least one face, can accept heat energy thus.Therefore, according to the exposed surface sum volume of circuit layer, the thermal expansion degree of insulating barrier is different, and thus, insulating barrier has mutually different thermal coefficient of expansion.
As mentioned above, by regulating the content of the filler of insulating barrier, forming the insulating barrier with mutually different coefficient of thermal expansion, the warpage of printed circuit board (PCB) can be prevented.
Experimental example
In this experimental example, in order to the warpage occurrence features that the coefficient of thermal expansion observed as the composite layer of the polymeric material used in printed circuit board (PCB) causes, limit regulates the amount limit of filler to observe warping phenomenon.
First, for the formation of printed circuit board (PCB), in order to avoid repeat specification, Fig. 1 and Fig. 2 is quoted.
Composite layer 105 is formed in the middle of printed circuit board (PCB) 10.At this, composite layer 105, for improving the modulus of printed circuit board (PCB) 10, is the prepreg containing glass fibre.Such composite layer 105 can be individual layer, also can be multilayer.In addition, the two sides of composite layer 105 forms circuit layer, described circuit layer forms insulating barrier.Like this, circuit layer becomes with the sequential layer swaging replaced with insulating barrier.
Like this, printed circuit board (PCB) 10 can have mirror symmetrical structure centered by composite layer 105.
On the other hand, because circuit layer is formed with circuitous pattern respectively, thus, expose area and differently from each other formed, expose volume and also differently from each other formed.
Table 1 represents the thickness of each layer of printed circuit board (PCB) 10 and the residual copper rate of circuit layer.At this, thickness is be that percentage obtains by the thickness of each layer relative to the ratiometric conversion of the gross thickness of printed circuit board (PCB) 10, and the ratio of exposing of circuit layer is represented with percentage the residual amount of having of the copper formed in the one side of insulating barrier (residual copper rate).
[table 1]
| Layer | Thickness (%) | Copper Foil exposes ratio (residual copper rate %) |
| 3rd insulating barrier | 12.8 | - |
| Tertiary circuit layer | 4.2 | 43.4 |
| First insulating barrier | 12.8 | - |
| First circuit layer | 4.2 | 39.8 |
| Composite layer | 32.0 | - |
| Second circuit layer | 4.2 | 53.0 |
| Second insulating barrier | 12.8 | - |
| 4th circuit layer | 4.2 | 46.9 |
| 4th insulating barrier | 12.8 | - |
Like this, because circuit layer is formed with circuitous pattern respectively, therefore circuit layer mutually differently can expose ratio (residual copper rate) and be formed.Thus, according to the residual copper rate of circuit layer, mutually different heat energy is passed to composite layer and insulating barrier.
Comparative example
In comparative example, in the same manner as experimental example, form printed circuit board (PCB), the liquid crystal oligomer containing identical epoxy system resin, same amount in composite layer and insulating barrier, the organic fiber inorfil of mixing same amount or filler.Now, have nothing to do with the residual copper rate of insulating barrier, the amount of organic fiber inorfil and filler is added in the same manner with 40 % by weight and forms printed circuit board (PCB).In addition, mixed in composite layer and insulating barrier filler also uses one species.
Embodiment 1
In embodiment 1, different from described comparative example, according to volume and the area of residual copper rate, i.e. copper that composite layer and insulating barrier are formed, regulate the amount of the filler mixed in composite layer and insulating barrier and add.
As shown in table 1, the residual copper rate of the first circuit layer is formed as 39.8%, the residual copper rate of tertiary circuit layer is formed as 43.4%, and the residual copper rate being present in the first insulating barrier between the first circuit layer and tertiary circuit layer is formed as 83.2%.In addition, the residual copper rate that the residual copper rate of second circuit layer is formed as the 53.0%, the 4th circuit layer is formed as 46.9%, and the residual copper rate being present in the second insulating barrier between second circuit layer and the 4th circuit layer is formed as 99.9%.
At this, in the first insulating barrier that residual copper rate is lower, make the content of filler minimizing 20% and mix, in the second insulating barrier that residual copper rate is higher, make the content of filler increase by 30% and mix.Like this, in described first insulating barrier formed with mutually different residual copper rate and the second insulating barrier, add the filler of mutually different amount, observe the warpage that thermal expansion causes.
Embodiment 2
In embodiment 2, different from embodiment 1, impregnation glass fibre in the polymer of composite layer, while regulate the content limit of described glass fibre to measure the coefficient of thermal expansion of composite layer.At this, under the content remain identical, making filler and composition also maintaining identical state, regulating the content of glass fibre, and composite layer is formed as individual layer and bilayer making the composition of polymer and content.
Physical property measurement and analysis
The warpage of the printed circuit board (PCB) that the coefficient of thermal expansion of the composite layer formed in embodiment 1, embodiment 2 and comparative example and insulating barrier causes is measured.In order to measure the deformation rate of the printed circuit board (PCB) that warpage causes, use ASAME(Target Model & 2D Model) and GPA product, use the difference of the substrate position information after the substrate position information before distortion and distortion to observe warpage as deformation rate information.
Table 2 is for gathering comparative example, embodiment 1 and embodiment 2 with or without the table that warpage occurs.
[table 2]
As shown in table 2, because caloric value is different according to the volume of circuit layer and area, the heat being therefore delivered to the composite layer configured between copper foil layer is also different, produces the thermal expansion of mutually different composite layer.
Therefore, as comparative example, have nothing to do with the volume of circuit layer and area, use identical resin and identical filler, the warpage degree produced because of thermal expansion is different mutually, and the warpage of printed circuit board (PCB) occurs.
On the other hand, as embodiment 1 and embodiment 2, when regulating the amount of the amount of filler and glass fibre according to the bulk area of circuit layer, owing to discharging filler, to be delivered to the degree of the heat of composite layer different, upper and lower thermal expansion degree is formed as mutual symmetry, can prevent warpage.
On the other hand, by regulating the addition of organic fiber inorfil in composite layer to regulate coefficient of thermal expansion, forming the composite layer with mutually different thermal coefficient of expansion, can warpage be prevented.In addition, owing to there is no need for other the works preventing warpage, slimming and integrated can be realized.
Above, explain invention has been based on specific embodiment, but these are only for specifically describing the present invention, the present invention is not limited thereto, as long as have the personnel of this field general knowledge, the distortion in the technological thought invented or improvement obviously can be carried out.
Simple distortion of the present invention and even change all belong to scope of the present invention, and concrete protection range of the present invention will become clear and definite according to the scope of additional claim.
Claims (19)
1. a printed circuit board (PCB), is characterized in that, this printed circuit board (PCB) comprises:
There is the composite layer of one side and the another side corresponding with it,
Be formed at the first insulating barrier in the one side of described composite layer, and
Be formed at the second insulating barrier on the another side of described composite layer;
The thermal coefficient of expansion of described first insulating barrier, described second insulating barrier and described composite layer is formed as different.
2. printed circuit board (PCB) according to claim 1, wherein, this printed circuit board (PCB) comprises further:
Be formed at the first circuit layer between described first insulating barrier and described composite layer, and
Be formed at the second circuit layer between described second insulating barrier and described composite layer;
Described first circuit layer and described second circuit layer have mutually different formation area.
3. printed circuit board (PCB) according to claim 2, wherein, described composite layer or described first insulating barrier, the second insulating barrier and described first circuit layer, second circuit layer mutual lamination and being formed repeatedly mutually.
4. printed circuit board (PCB) according to claim 1, wherein, described composite layer contains organic fiber or inorfil, liquid crystal oligomer, epoxy system resin and filler.
5. printed circuit board (PCB) according to claim 1, wherein, described first insulating barrier and the second insulating barrier contain liquid crystal oligomer, epoxy system resin and filler.
6. the printed circuit board (PCB) according to claim 4 or 5, wherein, described liquid crystal oligomer for shown in following chemical formula 1,
[chemical formula 1]
At this, a is the integer of 13-26, and b is the integer of 13-26, and c is the integer of 9-21, and d is the integer of 10-30, and e is the integer of 10-30.
7. printed circuit board (PCB) according to claim 4, wherein, relative to described composite layer 100 % by weight, described organic fiber or inorfil and filler contain 20-80 % by weight.
8. printed circuit board (PCB) according to claim 4, wherein, relative to the total weight of described composite layer, the content of described inorfil or organic fiber is 5-25 % by weight, and the content of described filler is 5-75 % by weight.
9. printed circuit board (PCB) according to claim 4, wherein, described inorfil or organic fiber be selected from glass fibre, carbon fiber, polyparaphenylene Ben Bing bis-oxazole fiber, TLCP fiber, lyotropic liquid crystal polymers fiber, aramid fiber, polypyridobisimidazole fiber, polybenzazole fibers and polyarylate fiber more than one.
10. printed circuit board (PCB) according to claim 9, wherein, described glass fibre be selected from T-glass fibre, E-glass fibre, S-glass fibre, ceramic fibre and their mixture any one.
11. printed circuit board (PCB)s according to claim 5, wherein, relative to described first insulating barrier or the second insulating barrier 100 % by weight, described filler contains 20-80 % by weight.
12. printed circuit board (PCB)s according to claim 4 or 5, wherein, described filler be selected from the group that is made up of organic filler, inorganic filler and their combination any one.
13. printed circuit board (PCB)s according to claim 12, wherein, described inorganic filler is silicon dioxide (SiO
2), aluminium oxide (Al
2o
3), carborundum (SiC), barium sulfate (BaSO
4), talcum, mica powder, aluminium hydroxide (Al (OH)
3), magnesium hydroxide (Mg (OH)
2), calcium carbonate (CaCO
3), magnesium carbonate (MgCO
3), magnesium oxide (MgO), boron nitride (BN), aluminium borate (AlBO
3), barium titanate (BaTiO
3), calcium zirconate (CaZrO
3) and their any one of combination.
14. printed circuit board (PCB)s according to claim 12, wherein, described organic filler is selected from any one in the group be made up of epoxy powder, melmac powder, urea resin powder, benzoguanamine powder, styrene resin and their combination.
15. printed circuit board (PCB)s according to claim 11, wherein, when the residual copper rate of described first circuit layer and second circuit layer increases in the scope of 10-20%, in the scope of 1-10 % by weight, regulate the content of the filler of described first insulating barrier, the second insulating barrier and composite layer.
The preparation method of 16. 1 kinds of printed circuit board (PCB)s, is characterized in that, this preparation method comprises:
The step of the composite layer with one side and another side is provided,
In the one side of described composite layer, form the first circuit layer respectively, on the another side of described composite layer, form the step of second circuit layer, and
Described first circuit layer forms tertiary circuit layer, the first insulating barrier is formed between described first circuit layer and described tertiary circuit layer, described second circuit layer forms the 4th circuit layer, between described second circuit layer and described 4th circuit layer, forms the step of the second insulating barrier;
The filer content of described first insulating barrier and the filer content of described second insulating barrier are formed as different,
When residual copper rate height than described second insulating barrier of the residual copper rate of described first insulating barrier, the filer content of described first insulating barrier is formed as more than the filer content of described second insulating barrier.
The preparation method of 17. 1 kinds of printed circuit board (PCB)s, is characterized in that, this preparation method comprises:
The step of the composite layer with one side and another side is provided,
In the one side of described composite layer, form the first circuit layer respectively, on the another side of described composite layer, form the step of second circuit layer, and
Described first circuit layer forms tertiary circuit layer, the first insulating barrier is formed between described first circuit layer and described tertiary circuit layer, described second circuit layer forms the 4th circuit layer, between described second circuit layer and described 4th circuit layer, forms the step of the second insulating barrier;
The filer content of described first insulating barrier and the filer content of described second insulating barrier are formed as different,
When residual copper rate height than described second insulating barrier of the residual copper rate of described first insulating barrier, the filer content of described second insulating barrier is formed as fewer than the filer content of described first insulating barrier.
The preparation method of 18. citation circuit substrates according to claim 16 or 17, wherein, when the residual copper rate of described first circuit layer and second circuit layer increases in the scope of 10-20%, in the scope of 1-10 % by weight, regulate the content of the filler of described first insulating barrier, the second insulating barrier and composite layer.
The preparation method of 19. citation circuit substrates according to claim 16 or 17, wherein, relative to described first insulating barrier or the second insulating barrier 100 % by weight, described filler contains 20-80 % by weight.
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| KR1020130127917A KR20150047879A (en) | 2013-10-25 | 2013-10-25 | Printed curcuit board and manufacturing method of the same |
| KR10-2013-0127917 | 2013-10-25 |
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|---|---|
| CN104582252A true CN104582252A (en) | 2015-04-29 |
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| JP (1) | JP2015084394A (en) |
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2014
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- 2014-02-11 CN CN201410047979.8A patent/CN104582252A/en active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2015084394A (en) | 2015-04-30 |
| KR20150047879A (en) | 2015-05-06 |
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Application publication date: 20150429 |