CN104517375A - Embedded type security device based on two channels - Google Patents

Embedded type security device based on two channels Download PDF

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Publication number
CN104517375A
CN104517375A CN201410778117.2A CN201410778117A CN104517375A CN 104517375 A CN104517375 A CN 104517375A CN 201410778117 A CN201410778117 A CN 201410778117A CN 104517375 A CN104517375 A CN 104517375A
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CN
China
Prior art keywords
heat sink
heat
laser instrument
module
dissipating plate
Prior art date
Application number
CN201410778117.2A
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Chinese (zh)
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CN104517375B (en
Inventor
陈一平
陈雪松
Original Assignee
北京航天易联科技发展有限公司
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Priority to CN201410778117.2A priority Critical patent/CN104517375B/en
Publication of CN104517375A publication Critical patent/CN104517375A/en
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Publication of CN104517375B publication Critical patent/CN104517375B/en

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Classifications

    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00Burglar, theft or intruder alarms
    • G08B13/18Actuation by interference with heat, light or radiation of shorter wavelength; Actuation by intruding sources of heat, light or radiation of shorter wavelength
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Cooling arrangements

Abstract

The invention discloses an embedded type security device based on two channels. The embedded type security device comprises a box comprising a first heat dissipating plate, a second heat dissipating plate, a heat conducting tube and a laser device. A first accommodating groove for accommodating the heat conducting tube is formed in the first surface of the first heat dissipating plate. At least one protrusion used for increasing the heat dissipation area of the first heat dissipating plate is arranged on the second surface of the first heat dissipating plate. The second heat dissipating plate is fixed on the first surface of the first dissipating plate. A through hole communicated with the second heat dissipating plate is formed in the second heat dissipating plate and is used for fixing the laser device. The heat conducting tube is positioned in the first accommodating groove of the first heat dissipating plate and is used for transmitting heat between the laser device and the first heat dissipating plate. The laser device is provided with a primary TEC (thermoelectric cooler) internally. The embedded type security device has the advantages that by the aid of increase of the heat dissipation area and the heat absorption area of the heat dissipating plates as well as improvement in heat conduction efficiency, temperature control efficiency of the TEC arranged inside the laser device is improved, so that the environment adaptiveness of the embedded type security device is improved.

Description

The embedded safety device of a kind of two passage

Technical field

The present invention relates to safety-security area, particularly relate to the embedded safety device of a kind of two passage.

Background technology

Current community optical fiber safety-protection system need two passages that embedded safety device is installed to realize front-end module integrated, the embedded safety device of two passages mainly by the monitoring to the fiber-optic vibration signal of two passages, realizes security alarm function.LED wide spectral laser instrument is the light source that sensory field of optic fibre is conventional, but the performance of LED wide spectral laser instrument is greatly influenced by ambient temperature.Because Fibre Optical Sensor is high for the spectrum intensity stability requirement of laser instrument, and embedded safety device is often in outdoor application, and environment for use is severe, therefore carries out to LED wide spectral laser instrument the necessary links that temperature adjustment is embedded safety device.

LED wide spectral laser instrument inside is provided with semiconductor chilling plate (TEC), falls mild heat to laser instrument.For a refrigeration mechanism, heat radiation and heat absorption efficiency weigh the key index of its performance, and therefore how semiconductor chilling plate (TEC) becomes a problem anxious to be resolved in the inner exchange heat of carrying out of the embedded safety device of two passages.The embedded safety device of two passage of the prior art all adopts metal shell to dispel the heat, but the radiating efficiency of metal shell is low, is difficult to maintain the temperature needed for LED wide spectral laser instrument in the presence of a harsh environment.

Summary of the invention

In view of this, the invention provides the embedded safety device of a kind of two passage, by increasing heat radiation and the endotherm area of heat sink, improving the temperature control efficiency of the TEC be built in laser instrument, the adaptive capacity to environment of the embedded safety device of two passages is improved.

The invention provides the embedded safety device of a kind of two passage, comprise A/D module, controlling calculation module, output module, power supply, spectral module and box body; Described box body comprises the first heat sink, the second heat sink, heat pipe and laser instrument;

The first surface of described first heat sink is provided with the first pockets for holding described heat pipe, the second face of described first heat sink is provided with at least one projection for increasing the area of dissipation of described first heat sink;

Described second heat sink is fixed on the first surface of described first heat sink, and extrudes described heat pipe, and described second heat sink is provided with the through hole running through described second heat sink, for fixing described laser instrument;

A part for described laser instrument is placed in described through hole, extrudes with described heat pipe;

Described heat pipe is positioned at the first pockets of described first heat sink and is positioned at the side of described second heat sink, for transmitting the heat between described laser instrument and described first heat sink;

The built-in first order semiconductor chilling plate of described laser instrument.

Further, described device also comprises extruding module;

Described extruding module and described laser instrument extrude, for fixed laser;

Described extruding module comprises the first bronze medal post, the second bronze medal post and card;

Described first bronze medal post and described second bronze medal post lay respectively at the both sides of laser instrument and are fixed on the second heat sink;

Described card and laser instrument extrude mutually, the described first bronze medal post locking of first end of described card, the described second bronze medal post locking of the second end of described card.

Further, described device also comprises the 3rd heat sink, second level semiconductor chilling plate;

Described 3rd heat sink is provided with the second pockets for holding described second level semiconductor chilling plate, described laser instrument;

Described second level semiconductor chilling plate and described laser instrument are positioned at described second pockets, and described laser instrument and described second level semiconductor chilling plate extrude mutually, and are fixed by described extruding module.Further, described projection is right-angle triangle tabular structure, and wherein right-angle side of described right-angle triangle contacts with second of described first heat sink, and the hypotenuse of described right-angle triangle is away from second of described first heat sink;

Or described projection is quadrilateral platy structure, wherein limit of described quadrilateral contacts with second of described first heat sink, with described relative with second limit contacted of the first heat sink outlying from described first heat sink second;

Or described projection is hemispherical dome structure, described hemispheric summit is away from second of described first heat sink; Or described projection is polygon platy structure.

Further, described heat pipe is Cryo Heat Tube.

Further, described first heat sink is also provided with the hook for hanging described device.

The embedded safety device of a kind of two passage provided by the invention, by arranging the protruding heat radiation and the endotherm area that increase by the first heat sink on the first heat sink, improve the temperature control efficiency being built in the semiconductor chilling plate of laser instrument, make the embedded safety device of two passages to be applied to rugged surroundings.

Accompanying drawing explanation

By reading the detailed description done non-limiting example done with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious;

Fig. 1 (a) is the structural drawing of the second heat sink of the embedded safety device of a kind of two passage that the embodiment of the present invention one provides;

Fig. 1 (b) is the structural drawing of the embedded safety device of a kind of two passage that the embodiment of the present invention one provides;

Fig. 2 is the structural drawing of the embedded safety device of a kind of two passage that the embodiment of the present invention two provides.

1, the first heat sink; 2, the second heat radiation; 3, laser instrument; 4, heat pipe;

5, protruding; 6, the first bronze medal post; 7, the second bronze medal post; 8, card;

9, the first pockets.

Embodiment

Below in conjunction with drawings and Examples, the present invention is described in further detail.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, illustrate only part related to the present invention in accompanying drawing but not full content.

Embodiment one

The embodiment of the present invention one provides a kind of two passage embedded safety device.Fig. 1 a is the structural drawing of the second heat sink 2 of the embedded safety device of a kind of two passage that the embodiment of the present invention one provides.As shown in Figure 1a, described device comprises A/D module, controlling calculation module, output module, power supply, spectral module and box body; Described box body comprises the first heat sink 1, second heat sink 2, heat pipe 4 and laser instrument 3;

The first surface of described first heat sink 1 is provided with the first pockets 9 for holding described heat pipe 4, the second face of described first heat sink 1 is provided with at least one projection 5 of the area of dissipation for increasing described first heat sink 1;

Concrete, the shape of the first pockets 9 is rectangular structure, and heat pipe 4 can be stuck in the first pockets 9 just, and the second heat sink 2 and the first heat sink 1 are fixed by screw, and heat pipe 4 is clamped, heat pipe 4 can not be moved in the first pockets 9.Described protruding 5 can be N number of, the described shape of protruding 5, preferably, described protruding 5 is right-angle triangle tabular structure, wherein right-angle side of described right-angle triangle contacts with second of described first heat sink 1, and the hypotenuse of described right-angle triangle is away from second (as shown in Figure 1 b) of described first heat sink 1; Or described protruding 5 is quadrilateral platy structure, wherein limit of described quadrilateral contacts with second of described first heat sink 1, with described relative with second limit contacted of the first heat sink 1 outlying from described first heat sink 1 second; Or described protruding 5 is hemispherical dome structure, described hemispheric summit is away from second of described first heat sink 1; Or described protruding 5 is polygon platy structure.Those skilled in the art it should be explicitly made clear at this point, are only the projection of triangle platy structure in Fig. 1 b, and other protruding shapes there is no concrete restriction at this, as long as can increase the area of dissipation of the first heat sink.

Described second heat sink 2 is fixed on the one 9 of described first heat sink 1, and described second heat sink 2 is provided with the through hole running through described second heat sink 2, for fixing described laser instrument; ; Make laser instrument 3 in the course of the work, can not shake; A part for described laser instrument 3 is placed in described through hole, extrudes with described heat pipe 4.Described laser instrument 3 extrudes with heat pipe 4, it will be appreciated by those skilled in the art that as described laser instrument 3 and described heat pipe 4 close contact.

Described heat pipe 4 is positioned at the first pockets 9 of described first heat sink 1, for transmitting the heat between described laser instrument 3 and described first heat sink 1; In the first pockets 9, increase heat pipe 4, can radiating efficiency be increased, improve the radiating efficiency of safety device.

The built-in first order semiconductor chilling plate of described laser instrument 3.Described first order semiconductor chilling plate (TEC) is by ensureing the working temperature of laser instrument 3 to laser instrument refrigeration and heating.The structure of described first heat sink 1, second heat sink 2, heat pipe 4, first pockets 9 please refer to Fig. 2.

The embedded safety device of a kind of two passage provided by the invention, by arranging heat radiation and the endotherm area that protruding 5 increase by the first heat sink 1 on the first heat sink 1, improve the temperature control efficiency being built in the first order semiconductor chilling plate of laser instrument 3, make the embedded safety device of two passages to be applied to rugged surroundings.

In such scheme, in order to allow laser instrument 3 fully contact with the first heat sink 1, extruding module is set in safety device; Described extruding module and described laser instrument 3 extrude, for fixed laser 3; Described extruding module comprises the first bronze medal post 6, second bronze medal post 7 and card 8; Described first bronze medal post 6 and described second bronze medal post 7 lay respectively at the both sides of laser instrument 3 and are fixed on the second heat sink; Described card 8 extrudes mutually with laser instrument 3, and the first end of described card 8 is locked with described first bronze medal post 6, and the second end of described card 8 is locked with described second bronze medal post 7.

By arranging extruding module, laser instrument 3 can be made fully to contact with the first heat sink 1, improving the temperature control efficiency of TEC, the adaptive capacity to environment of device is strengthened.At this, heat-proof device can be added as foam etc., for the protection of laser instrument between extruding module and laser instrument 3.

In such scheme, optionally, in order to further improve the temperature control efficiency of TEC in laser instrument 3, a TEC can be set again at two passages embedded safety device.Concrete is that the embedded safety device of two passages also comprises the 3rd heat-conducting plate and second level semiconductor chilling plate, and described 3rd heat sink is provided with the second pockets for holding described second level semiconductor chilling plate and described laser instrument 3; Described second level semiconductor chilling plate and described laser instrument 3 are positioned at described second pockets, and described laser instrument 3 extrudes mutually with described second level semiconductor chilling plate, and is fixed by described extruding module.

By arranging second level TEC in the embedded safety device of two passages, the working temperature needed for laser instrument 3 can be ensured, the adaptive capacity to environment of the embedded safety device of two passages is improved.

In such scheme, described heat pipe is Cryo Heat Tube.Described Cryo Heat Tube refers to that working temperature can cover any one heat pipe of 233k-373k.Use during Cryo Heat Tube and also at the surface smear heat-conducting silicone grease of Cryo Heat Tube, heat-conductive characteristic can be increased.

In such scheme, described first heat sink 1 is also provided with the hook for hanging described device.Be arranged in first and afterbody projection of the first heat sink 1 by hook, and the first heat sink 1 combines together, makes the embedded safety device of two passages more attractive in appearance, simultaneously also convenient operation.

Embodiment two

Fig. 2 is the structural drawing of the embedded safety device of a kind of two passage that the embodiment of the present invention two provides, and described safety device comprises: pcb board, temperature control pcb board, fibre-optical splice, AD conversion module, optical splitter, mounting hole, pilot lamp and top cover that structure base slab, RS-485 communication interface, RJ45 interface, relay output end mouth, power interface, laser instrument, main control module, relay module, power module are integrated;

Structure base slab, for installation module pcb board, fixing internal cable, installs box body.Laser instrument, for safety device provides light source.Temperature control pcb board, for controlling the TEC electric current of laser instrument, for laser instrument provides stable temperature environment.Optical splitter, the light sent by laser instrument is divided into the equal light of two-way light intensity, supplies two-way Fibre Optical Sensor respectively.Mounting hole, for the mounting hole provided installed by screw.Pilot lamp, indexed optical fiber sensor states.

Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and can not protection scope of the present invention be departed from.Therefore, although be described in further detail invention has been by above embodiment, the present invention is not limited only to above embodiment, when not departing from the present invention's design, can also comprise other Equivalent embodiments more, and scope of the present invention is determined by appended right.

Claims (6)

1. the embedded safety device of two passages, comprises A/D module, controlling calculation module, output module, power supply, spectral module and box body, it is characterized in that, described box body comprises the first heat sink, the second heat sink, heat pipe and laser instrument;
The first surface of described first heat sink is provided with the first pockets for holding described heat pipe, the second face of described first heat sink is provided with at least one projection for increasing the area of dissipation of described first heat sink;
Described second heat sink is fixed on the first surface of described first heat sink, and extrude described heat pipe, described second heat sink is provided with the through hole running through described second heat sink, for fixing described laser instrument;
A part for described laser instrument is placed in described through hole, extrudes with described heat pipe;
Described heat pipe is positioned at the first pockets of described first heat sink, for transmitting the heat between described laser instrument and described first heat sink;
The built-in first order semiconductor chilling plate of described laser instrument.
2. device according to claim 1, is characterized in that, described device also comprises extruding module;
Described extruding module and described laser instrument extrude, for fixed laser;
Described extruding module comprises the first bronze medal post, the second bronze medal post and card;
Described first bronze medal post and described second bronze medal post lay respectively at the both sides of laser instrument and are fixed on the second heat sink;
Described card and laser instrument extrude mutually, the described first bronze medal post locking of first end of described card, the described second bronze medal post locking of the second end of described card.
3. device according to claim 1, is characterized in that, described device also comprises the 3rd heat sink and second level semiconductor chilling plate;
Described 3rd heat sink is provided with the second pockets for holding described second level semiconductor chilling plate and described laser instrument;
Described second level semiconductor chilling plate and described laser instrument are positioned at described second pockets, and described laser instrument and described second level semiconductor chilling plate extrude mutually, and are fixed by described extruding module.
4. device according to claim 3, it is characterized in that, described projection is right-angle triangle tabular structure, and wherein right-angle side of described right-angle triangle contacts with second of described first heat sink, and the hypotenuse of described right-angle triangle is away from second of described first heat sink;
Or described projection is quadrilateral platy structure, wherein limit of described quadrilateral contacts with second of described first heat sink, with described relative with second limit contacted of the first heat sink outlying from described first heat sink second;
Or described projection is hemispherical dome structure, described hemispheric summit is away from second of described first heat sink; Or described projection is polygon platy structure.
5. device according to claim 4, is characterized in that, described heat pipe is Cryo Heat Tube.
6. device according to claim 5, is characterized in that, described first heat sink is also provided with the hook for hanging described device.
CN201410778117.2A 2014-12-15 2014-12-15 Embedded type security device based on two channels CN104517375B (en)

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CN202600875U (en) * 2012-05-04 2012-12-12 中国石油天然气股份有限公司 Defence-area optical fiber perimeter protection pre-warning system
CN203536718U (en) * 2013-10-21 2014-04-09 安徽中科瀚海光电技术发展有限公司 Constant temperature device for laser device
CN203787762U (en) * 2014-04-12 2014-08-20 中山新诺科技股份有限公司 Laser light source cooling device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341787A (en) * 1989-07-07 1991-02-22 Komatsu Ltd Solid-state laser
CN201293966Y (en) * 2008-11-04 2009-08-19 神讯电脑(昆山)有限公司 Radiator support structure
CN101950914A (en) * 2010-09-06 2011-01-19 中国科学院上海光学精密机械研究所 Single longitudinal mode distributed feedback optical fibre laser with tunable wavelength
CN102315585A (en) * 2011-07-26 2012-01-11 中国科学院长春光学精密机械与物理研究所 Air-cooling and heat-radiating device for high-power semiconductor laser module
CN202600875U (en) * 2012-05-04 2012-12-12 中国石油天然气股份有限公司 Defence-area optical fiber perimeter protection pre-warning system
CN203536718U (en) * 2013-10-21 2014-04-09 安徽中科瀚海光电技术发展有限公司 Constant temperature device for laser device
CN203787762U (en) * 2014-04-12 2014-08-20 中山新诺科技股份有限公司 Laser light source cooling device

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Denomination of invention: Embedded type security device based on two channels

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Granted publication date: 20170510

Pledgee: Beijing Yizhuang International Financing Guarantee Co., Ltd.

Pledgor: Beijing Aerospace Yilian Science & Technology Development Co., Ltd.

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