CN104505348B - 一种二极管封帽方法及封帽模具 - Google Patents
一种二极管封帽方法及封帽模具 Download PDFInfo
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- CN104505348B CN104505348B CN201410833005.2A CN201410833005A CN104505348B CN 104505348 B CN104505348 B CN 104505348B CN 201410833005 A CN201410833005 A CN 201410833005A CN 104505348 B CN104505348 B CN 104505348B
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- mold
- diameter
- hole
- lower mould
- diode
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- 238000007789 sealing Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 230000006835 compression Effects 0.000 claims abstract description 4
- 238000007906 compression Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 238000004513 sizing Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410833005.2A CN104505348B (zh) | 2014-12-29 | 2014-12-29 | 一种二极管封帽方法及封帽模具 |
Applications Claiming Priority (1)
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CN201410833005.2A CN104505348B (zh) | 2014-12-29 | 2014-12-29 | 一种二极管封帽方法及封帽模具 |
Publications (2)
Publication Number | Publication Date |
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CN104505348A CN104505348A (zh) | 2015-04-08 |
CN104505348B true CN104505348B (zh) | 2017-06-27 |
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CN201410833005.2A Active CN104505348B (zh) | 2014-12-29 | 2014-12-29 | 一种二极管封帽方法及封帽模具 |
Country Status (1)
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CN (1) | CN104505348B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107553038B (zh) * | 2017-09-29 | 2019-04-02 | 北京时代民芯科技有限公司 | 一种用于双插头二极管引线焊接的工装及焊接方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003207696A (ja) * | 2002-01-17 | 2003-07-25 | Hitachi Cable Ltd | 光結合部 |
CN1933193A (zh) * | 2006-10-09 | 2007-03-21 | 郭辉 | 制作541纳米窄带通光电探测器的方法 |
CN102709276A (zh) * | 2012-06-16 | 2012-10-03 | 中国振华集团永光电子有限公司 | 低电容金属封装硅瞬态电压抑制二极管及其制造方法 |
CN204271040U (zh) * | 2014-12-29 | 2015-04-15 | 贵州雅光电子科技股份有限公司 | 一种二极管封帽模具 |
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2014
- 2014-12-29 CN CN201410833005.2A patent/CN104505348B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003207696A (ja) * | 2002-01-17 | 2003-07-25 | Hitachi Cable Ltd | 光結合部 |
CN1933193A (zh) * | 2006-10-09 | 2007-03-21 | 郭辉 | 制作541纳米窄带通光电探测器的方法 |
CN102709276A (zh) * | 2012-06-16 | 2012-10-03 | 中国振华集团永光电子有限公司 | 低电容金属封装硅瞬态电压抑制二极管及其制造方法 |
CN204271040U (zh) * | 2014-12-29 | 2015-04-15 | 贵州雅光电子科技股份有限公司 | 一种二极管封帽模具 |
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CN104505348A (zh) | 2015-04-08 |
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GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A diode sealing method and sealing mold Effective date of registration: 20230627 Granted publication date: 20170627 Pledgee: Bank of Communications Co.,Ltd. Guizhou Branch Pledgor: GUIZHOU YAGUANG ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2023520000026 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20170627 Pledgee: Bank of Communications Co.,Ltd. Guizhou Branch Pledgor: GUIZHOU YAGUANG ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2023520000026 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A diode cap sealing method and cap sealing mold Granted publication date: 20170627 Pledgee: Bank of Communications Co.,Ltd. Guizhou Branch Pledgor: GUIZHOU YAGUANG ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2024520000024 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |