CN104503114A - Compression splicing equipment and method - Google Patents

Compression splicing equipment and method Download PDF

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Publication number
CN104503114A
CN104503114A CN201510009685.0A CN201510009685A CN104503114A CN 104503114 A CN104503114 A CN 104503114A CN 201510009685 A CN201510009685 A CN 201510009685A CN 104503114 A CN104503114 A CN 104503114A
Authority
CN
China
Prior art keywords
circuit board
panel
unit
flexibly
pressure head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510009685.0A
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Chinese (zh)
Other versions
CN104503114B (en
Inventor
肖晗
王鹏
谷晓飞
李建超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Beijing BOE Display Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201510009685.0A priority Critical patent/CN104503114B/en
Publication of CN104503114A publication Critical patent/CN104503114A/en
Application granted granted Critical
Publication of CN104503114B publication Critical patent/CN104503114B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306Details
    • G02F1/1309Repairing; Testing
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50Protective arrangements
    • G02F2201/506Repairing, e.g. with redundant arrangement against defective part

Abstract

The invention discloses compression splicing equipment and method. The compression splicing equipment comprises a first unit and at least two second units, the first unit comprises a panel side pre-compressing mechanism, and the panel side pre-compressing mechanism comprises a compression head; each second unit comprises at least one compressing mechanism, each compressing mechanism comprises a plurality of compression heads, and the position of each compression head of each compressing mechanism can be adjusted independently. On the one hand, a plurality of flexible connecting circuit boards can be performed with compression splicing in one time through regulating each compression head to the corresponding position, and on the other hand, because the compression splicing equipment comprises the pre-compressing mechanism, the flexible connecting circuit boards can be pre-fixed on the panel before compressing the flexible connecting circuit boards. Because the pre-compressing efficiency is obviously higher than the compressing efficiency, the pre-compressing mechanism comprising one compression head rarely influences the overall compression splicing efficiency. The compression splicing equipment is simple in structure and high in compression splicing efficiency.

Description

Crimping apparatus and method
Technical field
The present invention relates to display technique field, particularly relate to a kind of crimping apparatus and method.
Background technology
In the production run of liquid crystal display, need by multiple COF (Chip On Flex, normal title covers brilliant film)/FPC (Flexible Printed Circuit, flexible circuit) panel is connected with multiple corresponding PCB (Printed Circuit Board, printed circuit board (PCB)), be generally be crimped onto on panel and PCB by the both sides correspondence of compression joint technique by COF/FPC.The defect rate of prior art compression joint technique is higher, often occurs the underproof situation of the crimping of part COF/FPC, needs to be repaired by follow-up renovation technique.When repairing, underproof COF/FPC will be crimped and peel off, and use crimping apparatus again to crimp COF/FPC afterwards.Crimping apparatus of the prior art comprises and generally comprises a pressure head, and once only can crimp the COF/FPC of a position, remediation efficiency is very low.
Summary of the invention
The object of the present invention is to provide new crimping apparatus, to improve in repair process the crimping efficiency flexibly connecting circuit board.
The invention provides a kind of crimping apparatus, circuit board will be flexibly connected be crimped onto panel and circuit board in maintenance process, it is characterized in that, comprise a first module and at least two second units, wherein, first module comprises panel side precompressed mechanism, and described panel side precompressed mechanism comprises a pressure head; Each second unit comprises at least one this press mechanism, and each this press mechanism comprises multiple pressure head, and in multiple pressure heads that each this press mechanism comprises, the position of each pressure head can independent regulation.
Preferably, multiple pressure heads of each this press mechanism comprise the pressure head being positioned at data line direction and the pressure head being positioned at grid line direction, and can regulate respectively at the pressure of the pressure head of different directions.
Preferably, first module also comprises a panel side positioning mechanism and this press mechanism of panel side; Each second unit also comprises a P.e.c. side positioning mechanism and this press mechanism of P.e.c. side; Each this laminated structure of panel side comprises multiple pressure head, and the position of each pressure head can independent regulation.
Preferably, first module also comprises a panel side positioning mechanism; Each second unit comprises this press mechanism of panel side, a P.e.c. side positioning mechanism and this press mechanism of P.e.c. side.
Preferably, first module and/or second unit comprise guide rail, motor and circuit for controlling motor, and each pressure head is arranged on guide rail, and circuit for controlling motor controls described motor by movable press head to corresponding position according to the location parameter received.
Preferably, also comprise:
For connecting the delivery unit of first module and second unit.
Utilize above-mentioned crimping apparatus to carry out the method crimped, comprising:
Using first module will flexibly connect circuit board is pre-stressed on panel, makes to flexibly connect circuit board and is attached on panel;
Each second unit is assigned to by being attached with the panel flexibly connecting circuit board;
Second unit is used carry out this pressure to flexibly connecting circuit board.
Preferably, when first module comprises this press mechanism of panel side, described use first module will flexibly connect circuit board and be pre-stressed on panel, make to flexibly connect circuit board and will be attached on panel, comprise:
Panel side positioning mechanism is used to realize flexibly connecting the contraposition of circuit board and panel;
Panel side precompressed mechanism is used to carry out precompressed to flexibly connecting circuit board;
Use this press mechanism of panel side will flexibly connect circuit board to be originally pressed onto on panel;
Described use second unit carry out this pressure to flexibly connecting circuit board, comprising:
Printed circuit board side positioning mechanism is used to realize flexibly connecting the contraposition of circuit board and printed circuit board (PCB);
Use this press mechanism of printed circuit board side will flexibly connect circuit board to be originally pressed onto on printed circuit board (PCB).
Preferably, when second unit comprises this press mechanism of panel side, described use first module will flexibly connect circuit board and be pre-stressed on panel, make to flexibly connect circuit board and will be attached on panel, comprise:
Panel side positioning mechanism is used to realize flexibly connecting the contraposition of circuit board and panel;
Panel side precompressed mechanism is used to carry out precompressed to flexibly connecting circuit board;
Described use second unit carry out this pressure to flexibly connecting circuit board, comprising:
Printed circuit board side positioning mechanism is used to realize flexibly connecting the contraposition of circuit board and printed circuit board (PCB);
Use this press mechanism of panel side will flexibly connect circuit board to be originally pressed onto on panel;
Use this press mechanism of printed circuit board side will flexibly connect circuit board to be originally pressed onto on printed circuit board (PCB).
Further, being describedly assigned to each second unit comprising being attached with the panel flexibly connecting circuit board: using delivery unit to be assigned to each second unit in turn by being attached with the panel flexibly connecting circuit board.
Crimping apparatus provided by the invention comprises a first module and at least two second units, and wherein, first module comprises panel side precompressed mechanism, and described panel side precompressed mechanism comprises a pressure head; Each second unit comprises at least one this press mechanism, and each this press mechanism comprises multiple pressure head, and in multiple pressure heads that each this press mechanism comprises, the position of each pressure head can independent regulation.Like this, once can complete multiple crimping flexibly connecting circuit board by each pressure head being adjusted to corresponding position on the one hand.On the other hand, crimping apparatus provided by the invention owing to also comprising precompressed mechanism, can once carry out multiple flexibly connect this pressure of circuit board before, circuit board will be flexibly connected and pre-fix on panel.And be significantly higher than the efficiency of this pressure due to the efficiency of precompressed, adopt the precompressed mechanism comprising a pressure head generally can not affect overall crimping efficiency, crimping apparatus provided by the invention has higher crimping efficiency while having less structure.
Description of the invention provides in order to example with for the purpose of describing, and is not exhaustively or limit the invention to disclosed form.Many modifications and variations are obvious for the ordinary skill in the art.Selecting and describing embodiment is in order to principle of the present invention and practical application are better described, and enables those of ordinary skill in the art understand the present invention thus design the various embodiments with various amendment being suitable for special-purpose.
Accompanying drawing explanation
The structural representation of a kind of crimping apparatus that Fig. 1 provides for the embodiment of the present invention one;
The structural representation of a kind of crimping apparatus that Fig. 2 provides for the embodiment of the present invention two.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Embodiment one
The embodiment of the present invention one provides a kind of crimping apparatus, this equipment is used in maintenance process and will flexibly connects circuit board and be crimped onto on panel and circuit board, be illustrated in figure 1 the structural representation of this equipment, comprise: a first module and two, left and right second unit, and the delivery unit (delivery unit is not shown) for connecting second unit and first module, wherein, first module comprises panel side precompressed mechanism (the TCP precompressed corresponding in figure), this panel side precompressed mechanism comprises a pressure head (not shown), each second unit comprises this press mechanism, each this press mechanism comprises multiple pressure head (not shown), in the multiple pressure heads comprised in each this press mechanism, the position of each pressure head can independent regulation.
In the embodiment of the present invention, once can complete multiple crimping flexibly connecting circuit board by each pressure head being adjusted to corresponding position on the one hand.On the other hand, crimping apparatus provided by the invention owing to also comprising precompressed mechanism, can once carry out multiple flexibly connect this pressure of circuit board before, circuit board will be flexibly connected and pre-fix on panel.And be significantly higher than the efficiency of this pressure due to the efficiency of precompressed, adopt the precompressed mechanism comprising a pressure head generally can not affect overall crimping efficiency, crimping apparatus provided by the invention has higher crimping efficiency while having less structure.
The precompressed of indication of the present invention is referred to and flexible PCB and panel and printed circuit board (PCB) is bonded together by anisotropic conducting rubber, and make flexible PCB be attached on panel, this pressure refers to and uses High Temperature High Pressure to carry out press against the conduction making anisotropic conducting rubber.
In the present invention, the circuit board that flexibly connects of indication can be COF or FPC.The concrete structure of second unit and first module can with reference to design of the prior art, with crimping apparatus of the prior art unlike, in the present invention, this press mechanism has multiple pressure head, and the position of each pressure head can independently regulate.Here the position of each pressure head of indication independently can be conditioned the movement referring to a pressure head and not be limited by another pressure head and also do not affect another pressure head.In order to realize such structure, can multiple guide rail being set in second unit, multiple pressure head being separately positioned in different guide rails, when regulating respectively along the pressure head in each guide rail moving guide rail, by corresponding movable press head to corresponding position.Here delivery unit can be travelling belt etc.
In the specific implementation, can be as shown in Figure 1, first module also comprises a panel side positioning mechanism (TCP (Tape carrier package, the carrier package) contraposition corresponding in figure), this press mechanism of panel side (this pressure of TCP corresponding in figure); Each second unit comprises a P.e.c. side positioning mechanism (the PCB contraposition corresponding in figure) and this press mechanism of P.e.c. side (this pressure of PCB corresponding in figure); Here this press mechanism of panel side also comprises multiple pressure head, and the position of each pressure head can independent regulation.
In the specific implementation, the multiple pressure heads belonging to this press mechanism can comprise the pressure head being positioned at data line direction and the pressure head being positioned at grid line direction, and can regulate respectively at the pressure of the pressure head of different directions.
In actual applications, one piece of display panel can be divided into multiple pixel region by data line and data line.Data line direction is generally approximate perpendicular to data line direction, and when specifically repairing, is generally different from the flexible circuit web joint applied pressure to grid line direction to the flexible circuit web joint applied pressure in data line direction.The pressure head be positioned on data line is set respectively with the pressure of the pressure head be positioned on grid line, the pressure changing pressure head in repair process can be avoided to arrange.Save the time of reparation.
In concrete application, if need the number of the flexible connecting plate circuit of crimping more, so owing to only comprising a pressure head in first module, the consuming time of its precompressed certainly will be longer.And general, because this press mechanism of panel side does not need again to carry out contraposition when carrying out this pressure of panel side, it is consuming time comparatively fixing.If the time of precompressed exceedes the crimping speed of this press mechanism of panel side, so only need to arrange this laminated structure of panel side.For the batch products needing the number of flexible connecting plate circuit of crimping more, adopt the structure shown in Fig. 1 can to decline the making complexity of low crimping apparatus and cost ensureing the prerequisite of crimping efficiency.
In the specific implementation, first module and/or second unit comprise guide rail, motor and circuit for controlling motor, and each pressure head is arranged on guide rail, and circuit for controlling motor controls described motor by movable press head to corresponding position according to the location parameter received.Adopt the crimping apparatus with such structure, in concrete repair process, each pressure head of movement that the personnel of reparation need not be manual, improves the precision of adjustment on the one hand, also improves the efficiency of adjustment on the other hand.Here received location parameter controls to be inputted by user.
In the specific implementation, circuit for controlling motor here can be programmable logic controller (PLC).
In a particular application, the crimping apparatus that the embodiment of the present invention one provides can be integral type equipment, and first module and second unit are controlled by unified control system, or the control system of first module and second unit cooperatively interacts.Be more conducive to the monitoring of repairing quality like this.
Same with reference to Fig. 1, the schematic flow sheet utilizing the crimping apparatus in Fig. 1 to carry out the method crimped can comprise and uses first module will flexibly connect circuit board and be pre-stressed on panel, make to flexibly connect circuit board be attached to the step on panel and use second unit to carry out this pressure step to flexibly connecting circuit board, and use delivery unit to be attached with the panel flexibly connecting circuit board and to be assigned in turn the step of each second unit, wherein, comprise in the step of first module side:
Panel side contraposition: detailed process for using panel side positioning mechanism the panel needing to repair and needing to be crimped onto panel can flexibly connect circuit board.General, need the panel repaired generally can be manufactured with alignment mark in advance, CCD camera now can be used to obtain the image of panel, and carry out contraposition according to this alignment mark.This process with reference to related art, no longer can describe in detail at this.
Panel side precompressed: concrete, after contraposition completes, uses panel side precompressed mechanism will flexibly connect circuit board and is pre-stressed on panel.The object of precompressed is here attached to panel for making to flexibly connect circuit board, to such an extent as to follow-up mobile flexible circuit web joint and use multiple pressure head in the process of multiple flexible circuit web joint, avoid flexible circuit web joint come off from panel or slide at panel.
This pressure of panel side: this pressure of panel side refers to and uses this press mechanism of panel side to be compacted on panel by flexible circuit web joint.When carrying out this pressure, needing first to be adjusted to by pressure head each position corresponding to flexible circuit web joint, according to the pressure parameter of setting, flexible circuit web joint being crimped onto on panel afterwards.Flexible circuit web joint is crimped onto process on panel according to the pressure parameter of setting and flexible circuit web joint can be crimped onto process on panel with reference to using in prior art single pressure head, no longer describe in detail at this.
After completing this pressure of panel side, travelling belt is used to be assigned to each second unit in turn by being attached with the panel flexibly connecting circuit board.In the specific implementation, can be artificial panel is moved on the travelling belt of correspondence, also by suitable structure and control method, panel can be distributed on travelling belt corresponding to each second unit in turn.The present embodiment is no longer described in detail at this.
After the panel having crimped flexible circuit web joint is sent to second unit side, utilize second unit can comprise the process that flexible circuit web joint carries out this pressure:
Printed circuit board side contraposition: specifically comprise the contraposition using printed circuit board side positioning mechanism to realize flexibly connecting circuit board and printed circuit board (PCB).Detailed contraposition process with reference to the process of above-mentioned panel side contraposition, no longer can describe in detail at this.
This pressure of printed circuit board side: use this press mechanism of printed circuit board side will flexibly connect circuit board and be originally pressed onto on printed circuit board (PCB).The detailed journey that originally presses through with reference to the process of above-mentioned panel side contraposition, no longer can describe in detail at this.
Embodiment two
As shown in Figure 2, for the structural representation of a kind of crimping apparatus that the embodiment of the present invention two provides, with the crimping apparatus in Fig. 1 unlike, in the crimping apparatus that the embodiment of the present invention provides, first module comprises a panel side positioning mechanism (the TCP contraposition corresponding in figure), a panel side precompressed mechanism (the TCP precompressed corresponding in figure); Each second unit comprises this press mechanism of panel side (this pressure of TCP corresponding in figure), a P.e.c. side positioning mechanism (the PCB contraposition corresponding in figure) and this press mechanism of P.e.c. side (this pressure of PCB corresponding in figure); Here this press mechanism of panel side and the concrete structure of panel side precompressed mechanism can be a kind of with embodiment corresponding construction consistent.
In concrete application, if need the number of the flexible connecting plate circuit of crimping less, the meeting consuming time so due to first module is less.And general, because this press mechanism of panel side does not need again to carry out contraposition when carrying out this pressure of panel side, it is consuming time comparatively fixing.If the time of precompressed is less than the crimping speed of this press mechanism of panel side, this laminated structure of multiple panel sides so can be set.For the batch products needing the number of flexible connecting plate circuit of crimping less, the prerequisite adopting the structure shown in Fig. 2 can ensure to crimp efficiency declines the making complexity of low crimping apparatus and cost.
Same reference diagram 2, with in Fig. 1 shown in the method utilizing crimping apparatus to carry out keeping in repair unlike in fig. 2, after this pressure of panel side adjusts to printed circuit board side contraposition, other order remains unchanged.
It is to be noted, although in the above embodiments one and two, be 2 explanations carried out with second unit, but in actual applications, can adjust the number of second unit according to actual needs, such as in some cases, each panel possible only has 2 to flexibly connect circuit board needs crimping, the speed of such first module may, much larger than the speed of second unit, now can use the crimping apparatus with more second unit to crimp.Further, in actual applications, the structure that delivery unit neither be arranged, by mobile first module and second unit, or can realize above-mentioned method equally by the mode of a dead lift.
Panel in the present invention can be display panels, also can be oled panel etc.

Claims (10)

1. a crimping apparatus, will flexibly connect circuit board and be crimped onto panel and circuit board, it is characterized in that in maintenance process, comprise a first module and at least two second units, wherein, first module comprises panel side precompressed mechanism, and described panel side precompressed mechanism comprises a pressure head; Each second unit comprises at least one this press mechanism, and each this press mechanism comprises multiple pressure head, and in multiple pressure heads that each this press mechanism comprises, the position of each pressure head can independent regulation.
2. equipment as claimed in claim 1, is characterized in that, multiple pressure heads of each this press mechanism comprise the pressure head being positioned at data line direction and the pressure head being positioned at grid line direction, and can regulate respectively at the pressure of the pressure head of different directions.
3. equipment as claimed in claim 1, it is characterized in that, first module also comprises a panel side positioning mechanism and this press mechanism of panel side; Each second unit also comprises a P.e.c. side positioning mechanism and this press mechanism of P.e.c. side; Each this laminated structure of panel side comprises multiple pressure head, and the position of each pressure head can independent regulation.
4. equipment as claimed in claim 1, it is characterized in that, first module also comprises a panel side positioning mechanism; Each second unit comprises this press mechanism of panel side, a P.e.c. side positioning mechanism and this press mechanism of P.e.c. side.
5. equipment as claimed in claim 1, it is characterized in that, first module and/or second unit comprise guide rail, motor and circuit for controlling motor, and each pressure head is arranged on guide rail, and circuit for controlling motor controls described motor by movable press head to corresponding position according to the location parameter received.
6. the crimping apparatus as described in any one of claim 1-5, is characterized in that, also comprises:
For connecting the delivery unit of first module and second unit.
7. utilize the crimping apparatus described in any one of claim 1-6 to carry out the method crimped, it is characterized in that, comprising:
Using first module will flexibly connect circuit board is pre-stressed on panel, makes to flexibly connect circuit board and is attached on panel;
Each second unit is assigned to by being attached with the panel flexibly connecting circuit board;
Second unit is used carry out this pressure to flexibly connecting circuit board.
8. method as claimed in claim 7, it is characterized in that, when crimping apparatus is crimping apparatus as claimed in claim 3, described use first module will flexibly connect circuit board and be pre-stressed on panel, make to flexibly connect circuit board and will be attached on panel, comprise:
Panel side positioning mechanism is used to realize flexibly connecting the contraposition of circuit board and panel;
Panel side precompressed mechanism is used to carry out precompressed to flexibly connecting circuit board;
Use this press mechanism of panel side will flexibly connect circuit board to be originally pressed onto on panel;
Described use second unit carry out this pressure to flexibly connecting circuit board, comprising:
Printed circuit board side positioning mechanism is used to realize flexibly connecting the contraposition of circuit board and printed circuit board (PCB);
Use this press mechanism of printed circuit board side will flexibly connect circuit board to be originally pressed onto on printed circuit board (PCB).
9. method as claimed in claim 7, it is characterized in that, when crimping apparatus is crimping apparatus as claimed in claim 4, described use first module will flexibly connect circuit board and be pre-stressed on panel, make to flexibly connect circuit board and will be attached on panel, comprise:
Panel side positioning mechanism is used to realize flexibly connecting the contraposition of circuit board and panel;
Panel side precompressed mechanism is used to carry out precompressed to flexibly connecting circuit board;
Described use second unit carry out this pressure to flexibly connecting circuit board, comprising:
Printed circuit board side positioning mechanism is used to realize flexibly connecting the contraposition of circuit board and printed circuit board (PCB);
Use this press mechanism of panel side will flexibly connect circuit board to be originally pressed onto on panel;
Use this press mechanism of printed circuit board side will flexibly connect circuit board to be originally pressed onto on printed circuit board (PCB).
10. the method as described in any one of claim 7-9, it is characterized in that, be describedly assigned to each second unit comprise being attached with the panel flexibly connecting circuit board: using delivery unit to be assigned to each second unit in turn by being attached with the panel flexibly connecting circuit board.
CN201510009685.0A 2015-01-08 2015-01-08 Crimping apparatus and method Active CN104503114B (en)

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Application Number Priority Date Filing Date Title
CN201510009685.0A CN104503114B (en) 2015-01-08 2015-01-08 Crimping apparatus and method

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Application Number Priority Date Filing Date Title
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CN104503114B CN104503114B (en) 2017-09-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110012612A (en) * 2019-04-18 2019-07-12 创维液晶器件(深圳)有限公司 A kind of hot-pressing bonding locking equipment and method
CN110913607A (en) * 2019-11-05 2020-03-24 东莞市集银智能装备有限公司 Multi-group hot-pressing head device capable of being independently adjusted

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Publication number Priority date Publication date Assignee Title
JPH03261917A (en) * 1990-03-13 1991-11-21 Seiko Epson Corp Thermocompression bonding device
US20070044301A1 (en) * 2005-08-30 2007-03-01 Yazaki Corporation Terminal connecting apparatus
US8141237B1 (en) * 2010-10-30 2012-03-27 Cheng Uei Precision Industry Co., Ltd. Flexible printed circuit connector assembling fixture
CN102902085A (en) * 2011-07-29 2013-01-30 深圳市联得自动化机电设备有限公司 Wire connecting machine
CN103561545A (en) * 2013-10-29 2014-02-05 深圳市联得自动化装备股份有限公司 Home pressing device, home pressing control method and wiring machine
CN203766193U (en) * 2014-01-20 2014-08-13 四川世创达电子科技有限公司 Binding equipment processing system with double pressure head pressing structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03261917A (en) * 1990-03-13 1991-11-21 Seiko Epson Corp Thermocompression bonding device
US20070044301A1 (en) * 2005-08-30 2007-03-01 Yazaki Corporation Terminal connecting apparatus
US8141237B1 (en) * 2010-10-30 2012-03-27 Cheng Uei Precision Industry Co., Ltd. Flexible printed circuit connector assembling fixture
CN102902085A (en) * 2011-07-29 2013-01-30 深圳市联得自动化机电设备有限公司 Wire connecting machine
CN103561545A (en) * 2013-10-29 2014-02-05 深圳市联得自动化装备股份有限公司 Home pressing device, home pressing control method and wiring machine
CN203766193U (en) * 2014-01-20 2014-08-13 四川世创达电子科技有限公司 Binding equipment processing system with double pressure head pressing structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110012612A (en) * 2019-04-18 2019-07-12 创维液晶器件(深圳)有限公司 A kind of hot-pressing bonding locking equipment and method
CN110913607A (en) * 2019-11-05 2020-03-24 东莞市集银智能装备有限公司 Multi-group hot-pressing head device capable of being independently adjusted
CN110913607B (en) * 2019-11-05 2020-11-24 东莞市集银智能装备有限公司 Multi-group hot-pressing head device capable of being independently adjusted

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