CN104465688A - Micro lens structure of image sensor and manufacturing method thereof - Google Patents
Micro lens structure of image sensor and manufacturing method thereof Download PDFInfo
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- CN104465688A CN104465688A CN201410811000.XA CN201410811000A CN104465688A CN 104465688 A CN104465688 A CN 104465688A CN 201410811000 A CN201410811000 A CN 201410811000A CN 104465688 A CN104465688 A CN 104465688A
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Abstract
The invention discloses a micro lens structure of an image sensor and a manufacturing method of the micro lens structure. A micro lens is arranged above a pixel photosensitive component and made of a color filter. The surface of the micro lens is covered with a protective layer. The micro lens and the color filter are combined. Compared with an existing image sensor structure, the number of the manufacturing procedures is reduced, technical materials are saved, and therefore production cost is reduced.
Description
Technical field
The present invention relates to image sensor architecture, particularly a kind of imageing sensor microlens structure and preparation method thereof.
Background technology
Imageing sensor has been widely used in digital camera, cell phone, medicine equipment, automobile and other application scenarios.Particularly manufacture the fast development of CMOS (CMOS (Complementary Metal Oxide Semiconductor)) imageing sensor and CCD (Charged Couple type device) image sensor technologies, make the output image quality of people to imageing sensor have higher requirement.
In the prior art, imageing sensor is divided into two parts from manufacture craft structure: front end manufacture craft and rear end manufacture craft.Front end manufacture craft comprises silicon device technique and metal interconnected Wiring technology, the imageing sensor using front-end process to make is called black and white image transducer, because imageing sensor does not arrange colorful optical filter array, so the image collected only comprises the intensity information of image; Rear end manufacture craft, comprise colorful optical filter array technique and microlens array technique, Red lightscreening plate, green color filter and blue color filter three kinds of materials are comprised in color filter technology, these three kinds of filters are three kinds of elements in Bayer arrayed, image sensor pixel after black and white image transducer with the addition of colorful optical filter array can gather redness in kind, green and blue information respectively, then makes the picture signal collected be reduced to coloured image through follow-up signal process operation; Lenticule is produced on the top of colored filter, and making lenticular object is can collect more light in sensitive component, to improve the luminous sensitivity of pixel.
The vertical tangent plane structure of image sensor pixel part of the prior art, as shown in Figure 1.In Fig. 1,101 is the sensitive component of pixel, sensitive component 101 is produced in semiconductor substrate, 102 is insulating medium layer, a kind of colored filter is respectively arranged with above the sensitive component of each pixel, 103,104,105 the wherein one in Red lightscreening plate, green color filter, blue color filter is respectively, the top of colored filter 103,104,105 arranges flatness layer 106, the corresponding each colored filter in top of flatness layer 106 is respectively arranged with lenticule 107, lenticule 107 is convex lens, to collect more light in sensitive component 101.Shown in Fig. 1, the back-end process layers on insulating medium layer 102 comprises color filter technology, flatness layer 106 technique, lenticule 107 technique; The process layer quantity of making image sensor chip is more, and its cost of manufacture will be higher.
Summary of the invention
The object of this invention is to provide a kind of efficiently, the imageing sensor microlens structure reducing image sensor chip cost of manufacture and preparation method thereof.
The object of the invention is to be achieved through the following technical solutions:
The microlens structure of imageing sensor of the present invention, lenticule is arranged on above the sensitive component of pixel, and described lenticular material is colorized optical filtering sheet material, described lenticular surface coverage matcoveredn.
The manufacture method of above-mentioned imageing sensor microlens structure of the present invention, the lenticule of three kinds of colorized optical filtering sheet material is produced in the top of three pixels, three pixels are respectively the first pixel, the second pixel, the 3rd pixel, and three pixels join end to end, and comprise step:
A, prepare front-end process and make complete imageing sensor, described front-end process comprises and makes silicon device technique before colored filter and smithcraft, and metal is arranged in dielectric;
B, at dielectric upper surface, the first colorized optical filtering sheet material of spin coating, its thickness is more than or equal to 1um;
C, above the sensitive component of the first pixel, form the rectangular block of the first colorized optical filtering sheet material, its planar dimension equals the planar dimension of the first pixel, and thickness remains unchanged;
D, spin coating the second colorized optical filtering sheet material, its thickness equals the thickness of the first colorized optical filtering sheet material;
E, above the sensitive component of adjacent the second pixel of the first pixel, form the rectangular block of the second colorized optical filtering sheet material, its planar dimension equals the planar dimension of the second pixel, and thickness remains unchanged;
F, the third colorized optical filtering sheet material of spin coating, its thickness equals the thickness of the first colorized optical filtering sheet material;
G, above the sensitive component of adjacent the 3rd pixel of the second pixel, form the rectangular block of the third colorized optical filtering sheet material, its planar dimension equals the planar dimension of imageing sensor the 3rd pixel, and thickness remains unchanged;
H, spin coating photoresist, its thickness is more than or equal to 0.5um;
I, directly over the first colored filter material rectangular square, directly over the second colored filter material rectangular square, directly over the third colored filter material rectangular square, form corresponding photoresist square respectively, each photoresist square planar dimension is 60% ~ 95% of respective color filters planar dimension;
J, high-temperature baking photoresist rectangular block are to convex lens shape, and baking temperature is 50 degrees Celsius ~ 200 degrees Celsius, and baking time is more than or equal to 2 minutes, is then cooled to room temperature;
K, dry ionic etch, described photoresist keeps convex lens shape to be etched away gradually, after its thinner edge is etched away, continue etching colorized optical filtering sheet material, Other substrate materials and colored filter material monolithic keep convex lens shape, until etched by Other substrate materials complete completely, after forming the lenticule of colorized optical filtering sheet material, stop dry ionic etching operation;
L, deposit protective layer, at micro-lens surface deposit inorganic matter transparent resin material or the silica glass material of colorized optical filtering sheet material, its thickness is more than or equal to 10nm.
As seen from the above technical solution provided by the invention, imageing sensor microlens structure that the embodiment of the present invention provides and preparation method thereof, because the lenticule of imageing sensor adopts colorized optical filtering sheet material, eliminate flatness layer of the prior art and microlens material, therefore save chip production step and process materials, and then reduce image sensor chip production cost.
Accompanying drawing explanation
Fig. 1 is the vertical tangent plane structural representation of the image sensor pixel part of prior art.
Fig. 2 is the vertical tangent plane structural representation of image sensor pixel part in the embodiment of the present invention.
Fig. 3 is imageing sensor in the embodiment of the present invention, the pixel portion vertical tangent plane structural representation before backend process makes.
Fig. 4 is imageing sensor in the embodiment of the present invention, the tangent plane schematic diagram of the first colored filter material step of the spin coating in backend process making step.
Fig. 5 is imageing sensor in the embodiment of the present invention, forms the tangent plane schematic diagram of the rectangular block step of the first colorized optical filtering sheet material in backend process making step.
Fig. 6 is imageing sensor in the embodiment of the present invention, the tangent plane schematic diagram of the spin coating the second colored filter material step in backend process making step.
Fig. 7 is imageing sensor in the embodiment of the present invention, forms the tangent plane schematic diagram of the rectangular block step of the second colorized optical filtering sheet material in backend process making step.
Fig. 8 is imageing sensor in the embodiment of the present invention, the tangent plane schematic diagram of the third colored filter material step of the spin coating in backend process making step.
Fig. 9 is imageing sensor in the embodiment of the present invention, forms the tangent plane schematic diagram of the rectangular block step of the third colorized optical filtering sheet material in backend process making step.
Figure 10 is imageing sensor in the embodiment of the present invention, the tangent plane schematic diagram of the spin coating photoresist step in backend process making step.
Figure 11 is imageing sensor in the embodiment of the present invention, the tangent plane schematic diagram of the formation photoresist rectangular block step in backend process making step.
Figure 12 is imageing sensor in the embodiment of the present invention, the tangent plane schematic diagram toasted by photoresist rectangular block as convex lens shape step in backend process making step.
Figure 13 is imageing sensor in the embodiment of the present invention, the tangent plane schematic diagram of midway in the dry ionic etch step in backend process making step.
Figure 14 is imageing sensor in the embodiment of the present invention, the tangent plane schematic diagram after in the dry ionic etch step in backend process making step.
Figure 15 is imageing sensor in the embodiment of the present invention, the tangent plane schematic diagram of the deposit protective layer step in backend process making step.
Figure 16 is imageing sensor in the embodiment of the present invention, the vertical tangent plane schematic diagram of the pixel portion after backend process making step.
Embodiment
To be described in further detail the embodiment of the present invention below.
The microlens structure of imageing sensor of the present invention, its preferably embodiment be:
Lenticule is arranged on above the sensitive component of pixel, and described lenticular material is colorized optical filtering sheet material, described lenticular surface coverage matcoveredn.
Described microlens material comprises any one or more in following three kinds of materials: red filter sheet material, green filter sheet material and blue filter sheet material.
Often organize pixel cell and comprise three end to end pixels, the microlens material of the top of the sensor devices of three pixels is respectively red filter sheet material, green filter sheet material and blue filter sheet material.
Described lenticular upper surface is more than or equal to 0.2um to the distance of lower surface.
Described protective layer adopts inorganic matter transparent resin material or silica glass material, and its thickness is more than or equal to 10nm.
The manufacture method of above-mentioned imageing sensor microlens structure of the present invention, its preferably embodiment be:
The lenticule of three kinds of colorized optical filtering sheet material is produced in the top of three pixels, three pixels are respectively the first pixel, the second pixel, the 3rd pixel, and three pixels join end to end, and comprise step:
A, prepare front-end process and make complete imageing sensor, described front-end process comprises and makes silicon device technique before colored filter and smithcraft, and metal is arranged in dielectric;
B, at dielectric upper surface, the first colorized optical filtering sheet material of spin coating, its thickness is more than or equal to 1um;
C, above the sensitive component of the first pixel, form the rectangular block of the first colorized optical filtering sheet material, its planar dimension equals the planar dimension of the first pixel, and thickness remains unchanged;
D, spin coating the second colorized optical filtering sheet material, its thickness equals the thickness of the first colorized optical filtering sheet material;
E, above the sensitive component of adjacent the second pixel of the first pixel, form the rectangular block of the second colorized optical filtering sheet material, its planar dimension equals the planar dimension of the second pixel, and thickness remains unchanged;
F, the third colorized optical filtering sheet material of spin coating, its thickness equals the thickness of the first colorized optical filtering sheet material;
G, above the sensitive component of adjacent the 3rd pixel of the second pixel, form the rectangular block of the third colorized optical filtering sheet material, its planar dimension equals the planar dimension of imageing sensor the 3rd pixel, and thickness remains unchanged;
H, spin coating photoresist, its thickness is more than or equal to 0.5um;
I, directly over the first colored filter material rectangular square, directly over the second colored filter material rectangular square, directly over the third colored filter material rectangular square, form corresponding photoresist square respectively, each photoresist square planar dimension is 60% ~ 95% of respective color filters planar dimension;
J, high-temperature baking photoresist rectangular block are to convex lens shape, and baking temperature is 50 degrees Celsius ~ 200 degrees Celsius, and baking time is more than or equal to 2 minutes, is then cooled to room temperature;
K, dry ionic etch, described photoresist keeps convex lens shape to be etched away gradually, after its thinner edge is etched away, continue etching colorized optical filtering sheet material, Other substrate materials and colored filter material monolithic keep convex lens shape, until etched by Other substrate materials complete completely, after forming the lenticule of colorized optical filtering sheet material, stop dry ionic etching operation;
L, deposit protective layer, at micro-lens surface deposit inorganic matter transparent resin material or the silica glass material of colorized optical filtering sheet material, its thickness is more than or equal to 10nm.
The first colorized optical filtering sheet material described, the second colorized optical filtering sheet material, the third colorized optical filtering sheet material are sorted arbitrarily by red filter sheet material, green filter sheet material, blue filter sheet material respectively.
In the image sensor, in order to reduce chip production cost, the present invention starts with from the back end processing steps and process materials optimizing pixel portion, in imageing sensor colored filter in the prior art and lenticule manufacturing process steps, the colored filter separated and lenticule two process layers are merged into a process layer, make by colored filter and become microlens shape, therefore save flatness layer technique of the prior art and micro lens technology step and process materials thereof, and then effectively reduce the production cost of image sensor chip.Below in conjunction with specific embodiment, elaborate feature of the present invention.
Specific embodiment:
The vertical tangent plane structural representation of the image sensor pixel part of the embodiment of the present invention, as shown in Figure 2.Shown in Fig. 2,201 for being placed in the sensitive component of semiconductor substrate, the sensitive component 201 in left side is labeled as the sensitive component of the first pixel (pixel 1), middle sensitive component 201 is labeled as the sensitive component of the second pixel (pixel 2), and the sensitive component 201 on right side is labeled as the sensitive component of the 3rd pixel (pixel 3), shown in Fig. 2, 202 is insulating medium layer, 203 is the lenticule of the first pixel, 204 is the lenticule of the second pixel, 205 is the lenticule for the 3rd pixel, wherein lenticule 203, lenticule 204, the material type of lenticule 205 is colorized optical filtering sheet material, and lenticule 203, lenticule 204, the material that lenticule 205 adopts is red filter sheet material, green filter sheet material, wherein one in blue filter sheet material, described lenticule 203, lenticule 204, lenticule 205 is convex lens type, described lenticule 203 is lenticular minimum point with the junction of lenticule 204 or the junction of lenticule 204 and lenticule 205, distance bottom this minimum point to lenticule 203 or bottom lenticule 204 or bottom lenticule 205 is the shortest, this beeline is more than or equal to 0.2um, shown in Fig. 2,206 for covering the protective layer of lenticule 203, lenticule 204, lenticule 205 upper surface, and its material is inorganic matter transparent resin material or silica glass material, and its thickness is more than or equal to 10nm.
Shown in Fig. 2, due to lenticule 203, lenticule 204, lenticule 205 adopt be colorized optical filtering sheet material, so eliminate processing steps more of the prior art and process materials, such as flatness layer process layer of the prior art and micro lens technology layer, as can be seen here, the present invention effectively reduces the production cost of image sensor chip, improves the market competitiveness of image sensor chip.
The imageing sensor microlens structure of embodiments of the invention, manufacturing process is described below, lenticule colorized optical filtering sheet material above the sensor devices being produced on described first pixel, the second pixel, the 3rd pixel is labeled as the first colorized optical filtering sheet material, the second colorized optical filtering sheet material, the third colorized optical filtering sheet material respectively, and it is wherein a kind of that the first colorized optical filtering sheet material described, the second colorized optical filtering sheet material, the third colorized optical filtering sheet material are respectively in red filter sheet material, green filter sheet material, blue filter sheet material.The lenticular process fabrication steps of described imageing sensor is as follows:
First, prepare front-end process and make complete imageing sensor, described front-end process comprises and makes silicon device technique before colored filter and smithcraft, and metal is arranged in dielectric.As shown in Figure 3, the first pixel, the second pixel, the 3rd pixel make and rest on insulating medium layer 202 place, and dielectric 202 upper surface is smooth.
Further, at dielectric 202 upper surface, the first colorized optical filtering sheet material of spin coating, its thickness is more than or equal to 1um.As shown in Figure 4,401 is the first colorized optical filtering sheet material.
Further, above the sensitive component 201 of the first pixel, form the rectangular block of the first colorized optical filtering sheet material, its planar dimension equals the planar dimension of the first pixel, and thickness remains unchanged.As shown in Figure 5, the rectangular block of the first colorized optical filtering sheet material is defined above the sensitive component 201 of the first pixel, its planar dimension wide and long equals the length of the first pixel planes size and wide, and rectangular block 401 is just to sensitive component 201 district of the first pixel.
Further, spin coating the second colorized optical filtering sheet material, its thickness equals the thickness of the first colorized optical filtering sheet material.As shown in Figure 6,601 is the second colorized optical filtering sheet material, the thickness of the second colorized optical filtering sheet material 601 is equal with the thickness of the first colorized optical filtering sheet material 401, and the second colorized optical filtering sheet material 601 is not produced on the top of the first colorized optical filtering sheet material 401.
Further, above the sensitive component 201 of adjacent the second pixel of the first pixel, form the rectangular block of the second colorized optical filtering sheet material, its planar dimension equals the planar dimension of the second pixel, and thickness remains unchanged.As shown in Figure 7, the rectangular block 601 of the second colorized optical filtering sheet material is formed above the sensor devices 201 of the second pixel, the rectangular block 601 of the second colorized optical filtering sheet material is just to sensor devices 201 district of the second pixel, and its planar dimension wide and long equals the length of the second pixel planes size and wide.
Further, the third colorized optical filtering sheet material of spin coating, its thickness equals the thickness of the first colorized optical filtering sheet material.As shown in Figure 8,801 is the third colorized optical filtering sheet material, its thickness is equal with the thickness of the rectangular block 401 of the first colorized optical filtering sheet material and the rectangular block 601 of the second colorized optical filtering sheet material, and the third colorized optical filtering sheet material 801 is not produced on the top of the rectangular block 401 of the first colorized optical filtering sheet material and the rectangular block 601 of the second colorized optical filtering sheet material.
Further, above the sensitive component of adjacent the 3rd pixel of the second pixel, form the rectangular block of the third colorized optical filtering sheet material, its planar dimension equals the planar dimension of imageing sensor the 3rd pixel, and thickness remains unchanged.As shown in Figure 9, the rectangular block 801 of the third colorized optical filtering sheet material is formed above the sensor devices 201 of the 3rd pixel, the rectangular block 801 of the third colorized optical filtering sheet material is just to sensor devices 201 district of the 3rd pixel, and its planar dimension wide and long equals the length of the 3rd pixel planes size and wide.
Further, spin coating photoresist, its thickness is more than or equal to 0.5um.As shown in Figure 10,1001 is the photoresist layer of spin coating, and its thickness is more than or equal to 0.5um.
Further, directly over the first colored filter material rectangular square, directly over the second colored filter material rectangular square, directly over the third colored filter material rectangular square, form corresponding photoresist square respectively, each photoresist square planar dimension is 60% ~ 95% of respective color filters planar dimension.As shown in figure 11,1101 form corresponding photoresist square for being produced on directly over the first colored filter material rectangular square 401, directly over the second colored filter material rectangular square 601, directly over the third colored filter material rectangular square 801, the center of described photoetching square 1101 is respectively just to the center of colored filter square 401,601,801, and the planar dimension of described photoresist square 1101 is 60% ~ 95% of respective color filters square 401,601,801 planar dimension.
Further, high-temperature baking photoresist rectangular block is to convex lens shape, and baking temperature is 50 degrees Celsius ~ 200 degrees Celsius, and baking time is more than or equal to 2 minutes, is then cooled to room temperature.As shown in figure 12, convex lens 1201 is respectively directly over colored filter square 401,601,801, and two adjacent convex lens 1201 interconnect.
Further, dry ionic etches, described photoresist keeps convex lens shape to be etched away gradually, after its thinner edge is etched away, continue etching colorized optical filtering sheet material, Other substrate materials and colored filter material monolithic keep convex lens shape, until etched by Other substrate materials complete completely, after forming the lenticule of colorized optical filtering sheet material, stop dry ionic etching operation.
Figure 13 shows imageing sensor of the present invention, the tangent plane schematic diagram of midway in the dry ionic etch step in backend process making step.Shown in Figure 13, shown dotted line position is the position before convex lens 1201 etches, the material at convex lens 1201 edge has been etched complete, only remain a small amount of photoresist at region near the mid-point on central axis, and the material at the periphery place of colored filter square 401,601,801 is also etched away, the residual photoresist shown in Figure 13 and a small amount of colored filter entirety partly that has been etched remain the convex lens shape before etching.
Figure 14 shows, imageing sensor of the present invention, the tangent plane schematic diagram after in the dry ionic etch step in backend process making step.Shown in Figure 14, photoresist convex lens 1201 is etched completely, an a small amount of part and the material of colored filter square center has also been etched, and 203,204,205 is the convex lens of the colorized optical filtering sheet material of end-state.
Finally, deposit protective layer, at micro-lens surface deposit inorganic matter transparent resin material or the silica glass material of colorized optical filtering sheet material, its thickness is more than or equal to 10nm.As shown in figure 15, at upper surface deposit one deck protective material of lenticule 203,204,205, object is that protection colorized optical filtering sheet material is not by air erosion.Figure 16 shows imageing sensor of the present invention, the vertical tangent plane schematic diagram of the pixel portion after backend process making step, and wherein 206 is protective layer material, and its thickness is more than or equal to 10nm.
The above; be only the present invention's preferably embodiment, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claims.
Claims (7)
1. a microlens structure for imageing sensor, lenticule is arranged on above the sensitive component of pixel, it is characterized in that, described lenticular material is colorized optical filtering sheet material, described lenticular surface coverage matcoveredn.
2. imageing sensor microlens structure according to claim 1, is characterized in that, described microlens material comprises any one or more in following three kinds of materials: red filter sheet material, green filter sheet material and blue filter sheet material.
3. imageing sensor microlens structure according to claim 2, it is characterized in that, often organize pixel cell and comprise three end to end pixels, the microlens material of the top of the sensor devices of three pixels is respectively red filter sheet material, green filter sheet material and blue filter sheet material.
4. imageing sensor microlens structure according to claim 3, is characterized in that, described lenticular upper surface is more than or equal to 0.2um to the distance of lower surface.
5. imageing sensor microlens structure according to claim 4, is characterized in that, described protective layer adopts inorganic matter transparent resin material or silica glass material, and its thickness is more than or equal to 10nm.
6. the manufacture method of the imageing sensor microlens structure described in an any one of claim 1 to 5, it is characterized in that, the lenticule of three kinds of colorized optical filtering sheet material is produced in the top of three pixels, three pixels are respectively the first pixel, the second pixel, the 3rd pixel, and three pixels join end to end, and comprise step:
A, prepare front-end process and make complete imageing sensor, described front-end process comprises and makes silicon device technique before colored filter and smithcraft, and metal is arranged in dielectric;
B, at dielectric upper surface, the first colorized optical filtering sheet material of spin coating, its thickness is more than or equal to 1um;
C, above the sensitive component of the first pixel, form the rectangular block of the first colorized optical filtering sheet material, its planar dimension equals the planar dimension of the first pixel, and thickness remains unchanged;
D, spin coating the second colorized optical filtering sheet material, its thickness equals the thickness of the first colorized optical filtering sheet material;
E, above the sensitive component of adjacent the second pixel of the first pixel, form the rectangular block of the second colorized optical filtering sheet material, its planar dimension equals the planar dimension of the second pixel, and thickness remains unchanged;
F, the third colorized optical filtering sheet material of spin coating, its thickness equals the thickness of the first colorized optical filtering sheet material;
G, above the sensitive component of adjacent the 3rd pixel of the second pixel, form the rectangular block of the third colorized optical filtering sheet material, its planar dimension equals the planar dimension of imageing sensor the 3rd pixel, and thickness remains unchanged;
H, spin coating photoresist, its thickness is more than or equal to 0.5um;
I, directly over the first colored filter material rectangular square, directly over the second colored filter material rectangular square, directly over the third colored filter material rectangular square, form corresponding photoresist square respectively, each photoresist square planar dimension is 60% ~ 95% of respective color filters planar dimension;
J, high-temperature baking photoresist rectangular block are to convex lens shape, and baking temperature is 50 degrees Celsius ~ 200 degrees Celsius, and baking time is more than or equal to 2 minutes, is then cooled to room temperature;
K, dry ionic etch, described photoresist keeps convex lens shape to be etched away gradually, after its thinner edge is etched away, continue etching colorized optical filtering sheet material, Other substrate materials and colored filter material monolithic keep convex lens shape, until etched by Other substrate materials complete completely, after forming the lenticule of colorized optical filtering sheet material, stop dry ionic etching operation;
L, deposit protective layer, at micro-lens surface deposit inorganic matter transparent resin material or the silica glass material of colorized optical filtering sheet material, its thickness is more than or equal to 10nm.
7. the manufacture method of imageing sensor microlens structure according to claim 6, it is characterized in that, the first colorized optical filtering sheet material described, the second colorized optical filtering sheet material, the third colorized optical filtering sheet material are sorted arbitrarily by red filter sheet material, green filter sheet material, blue filter sheet material respectively.
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| CN110166698A (en) * | 2019-06-28 | 2019-08-23 | Oppo广东移动通信有限公司 | Focusing method, complementary metal oxide image sensor, terminal and storage medium |
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| CN113725245B (en) * | 2021-09-06 | 2024-03-15 | 上海集成电路装备材料产业创新中心有限公司 | Pixel structure of CIS chip, microlens array, image sensor and manufacturing method |
| CN114264323A (en) * | 2021-12-14 | 2022-04-01 | 武汉华星光电半导体显示技术有限公司 | Optical sensor and display panel |
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Application publication date: 20150325 |