CN104465480B - 太阳能电池汇流条焊接装置用汇流条供料装置 - Google Patents

太阳能电池汇流条焊接装置用汇流条供料装置 Download PDF

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CN104465480B
CN104465480B CN201410851824.XA CN201410851824A CN104465480B CN 104465480 B CN104465480 B CN 104465480B CN 201410851824 A CN201410851824 A CN 201410851824A CN 104465480 B CN104465480 B CN 104465480B
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邱文良
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GLENN ELECTRONICS DEVICES Co Ltd
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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    • H—ELECTRICITY
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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Abstract

太阳能电池汇流条焊接装置用汇流条供料装置，包括一用于容纳汇流条的供料盘，该供料盘作用有竖向移动驱动机构；所述供料盘的上方设有沿横向滑动的取料机构，所述取料机构包括一真空吸盘滑动架，该真空吸盘滑动架上设有真空吸盘安装板，该真空吸盘安装板朝向所述供料盘设有多个真空吸盘；所述供料盘一侧设有压紧机构，该压紧机构包括一汇流条压板，该汇流条压板固定在一汇流条压板安装座上，该汇流条压板安装座作用有汇流条压板安装座横向移动驱动缸。本发明的取料机构连续取料，压紧机构将汇流条与互连条的端部固定，实现了自动化供料、压紧操作，从而可以提高生产效率低，避免人工操作的质量稳定性差的问题。

Description

太阳能电池汇流条焊接装置用汇流条供料装置
技术领域
本发明涉及一种太阳能电池汇流条焊接装置用汇流条供料装置，属于太阳能光伏技术领域。
背景技术
21世纪以来，全球能源消费急剧攀升，传统化石能源日益枯竭，能源问题和环境问题逐渐成为全球关注的两大重点问题。迫于可持续发展的压力，各主要国家纷纷将太阳能光伏产业列入可再生能源开发利用的重点。伴随着我国成为世界第二经济体，2013年10月，中国10月石油进口量达到每日630万桶，超过美国的每日624万桶，首次取代美国成为全球最大石油净进口国。2013年，中国石油和天然气的对外依存度分别达到58.1%和31.6%，中国已成为全球第三大天然气消费国。传统化石能源已越来越难以满足我国国民经济的旺盛需求。在过去的20年中全球大约有75%左右的人为二氧化碳排放量来源于化石燃料燃烧。因此，不管是从低碳环保的能源发展角度，还是顺应我国产业结构升级与转型压力，我国必须加快发展新能源产业。
太阳能属于清洁可再生能源。根据欧盟委员会提出的“欧洲可再生能源技术战略计划”，到2020年，太阳能将占欧盟电力需求的15％。2010年，美国能源部制定规划，计划到2030年，太阳能占总能源消费量的10％～15％。从世界范围内的太阳能和潮汐能合计净发电量看，中国为30亿千瓦时，德国为190亿干瓦时，意大利为107亿干瓦时，西班牙为91亿千瓦时，日本为38亿千瓦时。未来我国水电增长空间有限，核能存在不安全因素。化石能源受节能减排约束成本将上升，太阳能光伏发电的市场前景广阔。
为了获得所需要的电流，电压和输出功率，在目前的太阳能光伏行业中，需要将太阳能电池片串联后经过层叠、层压、封装等工艺形成太阳能电池组件后方可成为电源输出的实际应用产品。在晶体硅太阳能电池组件制造过程中，必须先用互连条将太阳能电池片焊接成为太阳能电池串，然后将多个太阳能电池串排列整齐，接下来将汇流条与多个太阳能电池串的端部伸出的互连条焊接，汇流条即可将电流汇集至接线盒中以向外界提供电力。
目前的汇流条焊接一般采用手工焊接的方式，存在虚焊、生产效率低，质量稳定性差等问题。
发明内容
本发明目的是提供一种太阳能电池汇流条焊接装置用汇流条供料装置。
为达到上述目的，本发明采用的技术方案是：一种太阳能电池汇流条焊接装置用汇流条供料装置，包括一用于容纳汇流条的供料盘，该供料盘作用有竖向移动驱动机构；所述供料盘的上方设有沿横向滑动的取料机构，所述取料机构包括一真空吸盘滑动架，该真空吸盘滑动架上设有真空吸盘安装板，该真空吸盘安装板朝向所述供料盘设有多个真空吸盘；所述供料盘一侧设有压紧机构，该压紧机构包括一汇流条压板，该汇流条压板固定在一汇流条压板安装座上，该汇流条压板安装座作用有汇流条压板安装座横向移动驱动缸。
优选的技术方案为：还包括一供料装置底板，该供料装置底板上固设一竖向的取料机构支架，该取料机构支架的上端部设有横向的取料机构移动导轨，所述取料机构滑动设于所述取料机构移动导轨上。
优选的技术方案为：所述供料装置底板上设有横向的汇流条压板安装座移动导轨，所述汇流条压板安装座滑动设于所述汇流条压板安装座移动导轨上。
由于上述技术方案运用，本发明与现有技术相比具有下列优点和效果：
本发明的取料机构连续取料，压紧机构将汇流条与互连条的端部固定，实现了自动化供料、压紧操作，从而可以提高生产效率低，避免人工操作的质量稳定性差的问题。
附图说明
附图1为汇流条示意图。
附图2供料装置示意图。
附图3为供料装置侧视示意图。
附图4为供料装置俯视示意图。
附图5为供料装置立体示意图。
以上附图中，1、供料盘；2、真空吸盘滑动架；3、真空吸盘安装板；4、真空吸盘；5、汇流条压板；6、汇流条压板安装座；7、汇流条压板安装座横向移动驱动缸；8、供料装置底板；9、取料机构支架；10、取料机构移动导轨；11、汇流条压板安装座移动导轨；12、汇流条；13、层叠的汇流条。
具体实施方式
下面结合附图及实施例对本发明作进一步描述：
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供熟悉此技术的人士了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等的用语，亦仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当亦视为本发明可实施的范畴。
实施例：太阳能电池汇流条焊接装置用汇流条供料装置
参见附图1～附图5所示，一种太阳能电池汇流条焊接装置用汇流条供料装置，包括一用于容纳汇流条的供料盘1，该供料盘1的具体结构：包括一水平放置的一个汇流条承载板，该汇流条承载板穿设有多根用来夹持层叠的汇流条13的竖向的限位柱，且限位柱与汇流条承载板之间并不固定连接，汇流条承载板可沿限位柱上下移动，而汇流条承载板则与伺服电机（也可步进电机）的动力输出部连接，这样当每取出一个汇流条12时，伺服电机作为竖向移动驱动机构驱动汇流条承载板向上移动一定的距离。
所述供料盘1的上方设有沿横向滑动的取料机构，即将汇流条12从供料盘1取出，然后移动到互连条伸出的端部上。供料装置底板8上固设一竖向的取料机构支架9，该取料机构支架9的上端部设有横向的取料机构移动导轨10，取料机构支架9和取料机构移动导轨10可以成直角设置。所述取料机构滑动设于所述取料机构移动导轨10上，具体即真空吸盘滑动架2滑动设于取料机构移动导轨10上。真空吸盘滑动架2向下设置真空吸盘安装板3，该真空吸盘安装板3朝向所述供料盘设有四个真空吸盘4，真空吸盘4用来执行抓取汇流条12的动作。真空吸盘4配设有抽真空装置。取料机构配设有驱动取料机构作横向移动的气缸。
所述供料装置底板8上设有横向的汇流条压板安装座移动导轨11，汇流条压板安装座移动导轨11与取料机构移动导轨10平行且间隔设置，即取料机构移动导轨10在上，汇流条压板安装座移动导轨11在下，且沿着供料装置底板8横向设置，汇流条压板安装座移动导轨11与取料机构移动导轨10的导向方向一致。
汇流条压板安装座移动导轨11上设有压紧机构，即压紧机构的汇流条压板安装座6滑动设于所述汇流条压板安装座移动导轨11上，而汇流条压板5固定在汇流条压板安装座6上，汇流条压板安装座6作用有汇流条压板安装座横向移动驱动缸7，该驱动缸为气缸。
操作方法：卷状的汇流条12制成附图1所示的形状，然后放在供料盘1内。真空吸盘4抓取汇流条12，每取出一根汇流条12，伺服电机动作一次以使供料盘1的汇流条承载板带动层叠的汇流条13上移一定距离。真空吸盘带动汇流条12随气缸驱动的真空吸盘滑动架2沿着取料机构移动导轨10移动，至太阳能电池串的端部伸出的互连条的位置，然后真空吸盘4放下汇流条12，使汇流条12与互连条接触。然后汇流条压板安装座横向移动驱动缸驱动汇流条压板安装座6沿着汇流条压板安装座移动导轨11移动，使汇流条压板5压紧汇流条12与互连条的接触，然后即可执行焊接操作。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (3)

1.一种太阳能电池汇流条焊接装置用汇流条供料装置，其特征在于：包括一用于容纳汇流条的供料盘，该供料盘作用有竖向移动驱动机构；所述供料盘的上方设有沿横向滑动的取料机构，所述取料机构包括一真空吸盘滑动架，该真空吸盘滑动架上设有真空吸盘安装板，该真空吸盘安装板朝向所述供料盘设有多个真空吸盘；所述供料盘一侧设有压紧机构，该压紧机构包括一汇流条压板，该汇流条压板固定在一汇流条压板安装座上，该汇流条压板安装座作用有汇流条压板安装座横向移动驱动缸。
2.根据权利要求1所述的太阳能电池汇流条焊接装置用汇流条供料装置，其特征在于：还包括一供料装置底板，该供料装置底板上固设一竖向的取料机构支架，该取料机构支架的上端部设有横向的取料机构移动导轨，所述取料机构滑动设于所述取料机构移动导轨上。
3.根据权利要求2所述的太阳能电池汇流条焊接装置用汇流条供料装置，其特征在于：所述供料装置底板上设有横向的汇流条压板安装座移动导轨，所述汇流条压板安装座滑动设于所述汇流条压板安装座移动导轨上。
CN201410851824.XA 2014-12-31 2014-12-31 太阳能电池汇流条焊接装置用汇流条供料装置 Active CN104465480B (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2269757B1 (de) * 2009-06-30 2013-01-16 Mikron Berlin GmbH Vorrichtung zum Löten eines Verbinders mit einer Solarzelle mit einer Reinigungseinrichtung
CN103182579A (zh) * 2011-12-29 2013-07-03 深圳市晶拓光伏自动化设备有限公司 太阳能电池晶硅片串焊机
CN203109457U (zh) * 2013-02-01 2013-08-07 河南新能光伏有限公司 薄膜太阳电池汇流交叉点自动热焊装置
CN204289419U (zh) * 2014-12-31 2015-04-22 苏州格林电子设备有限公司 太阳能电池汇流条焊接装置用汇流条供料装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070235077A1 (en) * 2006-03-27 2007-10-11 Kyocera Corporation Solar Cell Module and Manufacturing Process Thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2269757B1 (de) * 2009-06-30 2013-01-16 Mikron Berlin GmbH Vorrichtung zum Löten eines Verbinders mit einer Solarzelle mit einer Reinigungseinrichtung
CN103182579A (zh) * 2011-12-29 2013-07-03 深圳市晶拓光伏自动化设备有限公司 太阳能电池晶硅片串焊机
CN203109457U (zh) * 2013-02-01 2013-08-07 河南新能光伏有限公司 薄膜太阳电池汇流交叉点自动热焊装置
CN204289419U (zh) * 2014-12-31 2015-04-22 苏州格林电子设备有限公司 太阳能电池汇流条焊接装置用汇流条供料装置

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