CN104425292A - 半导体装置的制造方法、半导体制造装置及树脂密封用片状树脂 - Google Patents
半导体装置的制造方法、半导体制造装置及树脂密封用片状树脂 Download PDFInfo
- Publication number
- CN104425292A CN104425292A CN201310721866.7A CN201310721866A CN104425292A CN 104425292 A CN104425292 A CN 104425292A CN 201310721866 A CN201310721866 A CN 201310721866A CN 104425292 A CN104425292 A CN 104425292A
- Authority
- CN
- China
- Prior art keywords
- resin
- recess
- mould
- semiconductor chip
- compression molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 161
- 229920005989 resin Polymers 0.000 title claims abstract description 161
- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000007789 sealing Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 238000000748 compression moulding Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims 1
- 230000007423 decrease Effects 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 230000006835 compression Effects 0.000 abstract 3
- 238000007906 compression Methods 0.000 abstract 3
- 230000004927 fusion Effects 0.000 abstract 1
- 239000011343 solid material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- -1 such as Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Engineering & Computer Science (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing & Machinery (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-188044 | 2013-09-11 | ||
JP2013188044A JP6271193B2 (ja) | 2013-09-11 | 2013-09-11 | 半導体装置の製造方法、半導体製造装置、および樹脂封止用シート状樹脂 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104425292A true CN104425292A (zh) | 2015-03-18 |
CN104425292B CN104425292B (zh) | 2018-05-15 |
Family
ID=52820680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310721866.7A Active CN104425292B (zh) | 2013-09-11 | 2013-12-24 | 半导体装置的制造方法、半导体制造装置及树脂密封用片状树脂 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6271193B2 (zh) |
CN (1) | CN104425292B (zh) |
TW (1) | TWI575615B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220161465A1 (en) * | 2020-11-25 | 2022-05-26 | Apic Yamada Corporation | Resin-sealing apparatus and resin-sealing method |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018138915A1 (ja) * | 2017-01-30 | 2018-08-02 | 信越エンジニアリング株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP7312452B2 (ja) * | 2020-01-24 | 2023-07-21 | アピックヤマダ株式会社 | 樹脂モールド装置及び樹脂モールド方法 |
JP2024107566A (ja) * | 2023-01-30 | 2024-08-09 | アピックヤマダ株式会社 | 圧縮成形装置及び圧縮成形方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09129659A (ja) * | 1995-11-02 | 1997-05-16 | Toshiba Chem Corp | 半導体封止用シート状樹脂 |
CN1503339A (zh) * | 2002-11-26 | 2004-06-09 | ������������ʽ���� | 树脂封装方法及装置、半导体器件及其制造方法及树脂材料 |
JP2006175638A (ja) * | 2004-12-21 | 2006-07-06 | Sainekkusu:Kk | 圧縮成形用のシート状樹脂及び圧縮成形方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06104311A (ja) * | 1992-09-18 | 1994-04-15 | Fujitsu Ltd | フリップチップおよびフリップチップの封止方法 |
JP3897565B2 (ja) * | 2001-10-25 | 2007-03-28 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP2006303119A (ja) * | 2005-04-19 | 2006-11-02 | Kyocera Chemical Corp | 半導体装置の製造方法及び半導体封止用樹脂シート |
JP2010221430A (ja) * | 2009-03-19 | 2010-10-07 | Elpida Memory Inc | モールド樹脂及び樹脂モールド方法 |
-
2013
- 2013-09-11 JP JP2013188044A patent/JP6271193B2/ja active Active
- 2013-12-04 TW TW102144478A patent/TWI575615B/zh active
- 2013-12-24 CN CN201310721866.7A patent/CN104425292B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09129659A (ja) * | 1995-11-02 | 1997-05-16 | Toshiba Chem Corp | 半導体封止用シート状樹脂 |
CN1503339A (zh) * | 2002-11-26 | 2004-06-09 | ������������ʽ���� | 树脂封装方法及装置、半导体器件及其制造方法及树脂材料 |
JP2006175638A (ja) * | 2004-12-21 | 2006-07-06 | Sainekkusu:Kk | 圧縮成形用のシート状樹脂及び圧縮成形方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220161465A1 (en) * | 2020-11-25 | 2022-05-26 | Apic Yamada Corporation | Resin-sealing apparatus and resin-sealing method |
Also Published As
Publication number | Publication date |
---|---|
JP2015056467A (ja) | 2015-03-23 |
TWI575615B (zh) | 2017-03-21 |
TW201511144A (zh) | 2015-03-16 |
CN104425292B (zh) | 2018-05-15 |
JP6271193B2 (ja) | 2018-01-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170803 Address after: Tokyo, Japan Applicant after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Applicant before: Toshiba Corp. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Patentee before: Japanese businessman Panjaya Co.,Ltd. Address after: Tokyo, Japan Patentee after: Kaixia Co.,Ltd. Address before: Tokyo, Japan Patentee before: TOSHIBA MEMORY Corp. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220106 Address after: Tokyo, Japan Patentee after: Japanese businessman Panjaya Co.,Ltd. Address before: Tokyo, Japan Patentee before: TOSHIBA MEMORY Corp. |
|
TR01 | Transfer of patent right |