CN104345674A - System and method for modular controller assembly supporting redundant configurations - Google Patents
System and method for modular controller assembly supporting redundant configurations Download PDFInfo
- Publication number
- CN104345674A CN104345674A CN201410388377.9A CN201410388377A CN104345674A CN 104345674 A CN104345674 A CN 104345674A CN 201410388377 A CN201410388377 A CN 201410388377A CN 104345674 A CN104345674 A CN 104345674A
- Authority
- CN
- China
- Prior art keywords
- support plate
- acquisition module
- connector
- pattern
- mainboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 18
- 230000009977 dual effect Effects 0.000 claims description 29
- 238000004891 communication Methods 0.000 claims description 27
- 210000000056 organ Anatomy 0.000 claims description 9
- 238000010276 construction Methods 0.000 claims description 3
- 230000000712 assembly Effects 0.000 description 12
- 238000000429 assembly Methods 0.000 description 12
- 230000008859 change Effects 0.000 description 12
- 230000008569 process Effects 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000003550 marker Substances 0.000 description 4
- 238000011017 operating method Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4188—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by CIM planning or realisation
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/25—Pc structure of the system
- G05B2219/25314—Modular structure, modules
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Safety Devices In Control Systems (AREA)
- Programmable Controllers (AREA)
Abstract
A system includes a head board 14 with a first head processor 52, a first carrier board 66, and a first junction 58. The first carrier board 66 includes a first plurality of connectors 74 configured to communicatively couple the head board 14 to one or more first acquisition modules 60 with a first attachment pattern. The first carrier board 66 is configured in a first simplex or a first redundant configuration based at least in part on the first attachment pattern. The first junction 58 is configured to removably couple the first carrier board 66 with a terminator 59 or to removably couple the first carrier board 66 with a second carrier board 68, 70.
Description
Technical field
Theme disclosed herein relates to controller, such as the industrial control unit (ICU) of turbine system, power device and gasification system.
Background technology
In the controls, various sensor surveying unit (such as, turbine system) situation and controller will be supplied to about the feedback of the situation of device (such as, turbine system).The processor of controller uses feedback to carry out control device.Control system can use the capture card with sensor special to carry out monitoring system.Feedback is supplied to processor by sensor special.Extra sensor can be added to the extra capture card of correspondence.Capture card can have conversion unit, and with future, the original feedback of sensor changes into data-signal.Application specific processor process data signal on each capture card.It's a pity, the conversion unit on capture card and the degree of accuracy of application specific processor can be degenerated along with the time.In addition, the application specific processor on capture card can increase the cost of capture card and make the utilization factor efficiency of the processor of control system low.
Summary of the invention
Be summarized in some embodiment that scope aspect is suitable with claimed invention originally below.These embodiments are not intended to limit the scope of claimed invention, but these embodiments are only intended to the brief overview providing possible form of the present invention.In fact, the present invention can comprise the various forms that can be similar to or be different from the embodiment set forth below.
In a first embodiment, a kind of system comprises mainboard (head board), the first support plate (carrier board) and first joint with the first primary processor.First support plate comprises more than first connector, and it is configured to mainboard communication be connected on one or more first acquisition module with the first attached pattern.First support plate is configured to first simple (simplex) structure or first redundantly structured at least in part based on the first attached pattern.First joint construction becomes the first support plate and terminal organ are connected removedly or the first support plate is connected removedly with the second support plate.
In a second embodiment, a kind of system comprises the mainboard with the first primary processor, and the first support plate.First support plate has first end sub-block and the second terminal block.The communication of first end sub-block is connected on mainboard, the first connector, the second connector and the 3rd connector.First connector structure becomes to connect with the first acquisition module with the first simple pattern, the first dual redundant pattern or the first triplex level redundancy pattern, second connector structure becomes to connect with the second acquisition module with the first dual redundant pattern or the first triplex level redundancy pattern, and the 3rd connector structure becomes to connect with the 3rd acquisition module with the first triplex level redundancy pattern.Second terminal block communication is connected on mainboard and the 4th connector.4th connector structure becomes to connect with the second acquisition module with the first simple pattern.
In the third embodiment, a kind of method is included in the first support plate place and receives first sensor feedback, first sensor feedback processing is become the first data-signal, and the first data-signal is transferred to one or more primary processor.Utilize one or more first acquisition modules be connected on the first support plate that first sensor feedback processing is become the first data-signal, the first support plate is configured to first mode.At least in part based on the first attached pattern of one or more first acquisition module and the first support plate, first mode comprises simple pattern or redundant mode.First sensor is fed back more than first the redundancy acquisition module be directed in one or more first acquisition module by redundant mode.
A kind of system, comprising:
Comprise the mainboard of the first primary processor;
First support plate, it comprises more than first connector, described more than first connector structure becomes to make described mainboard communication be connected on one or more first acquisition module with the first attached pattern, wherein, described first support plate is configured to the first simple structure or first redundantly structured at least in part based on described first attached pattern; And
First joint, it is configured to described first support plate is connected removedly with terminal organ or described first support plate is connected removedly with the second support plate.
In one embodiment, described first support plate and described mainboard integrate.
In one embodiment, described mainboard comprises multiple primary processor, and it is connected on described more than first connector redundantly, and wherein, each primary processor in described multiple primary processor is configured to communicate with described one or more first acquisition module connect.
In one embodiment, described first attached pattern comprises described one or more first acquisition modules be connected on described more than first connector, and described first support plate is configured to the first simple pattern, dual redundant pattern or triplex level redundancy pattern.
In one embodiment, described first support plate comprises more than second connector, it is configured to make described mainboard communication be connected on described one or more first acquisition module with described first attached pattern, wherein, the second acquisition module in described one or more first acquisition module is connected on described more than second connector, and described first support plate is configured to the described first simple pattern relative to described second acquisition module.
In one embodiment, described one or more first acquisition module is comprised.
In one embodiment, described more than first connector comprises general programmable l/O passage, and it is configured to receive thermocouple signal, resistance temperature detector (RTD) signal, voltage signal, current signal, highway addressable remote transmitter (HART) input signal, HART output signal or their any combination.
In one embodiment, comprising:
Communicate described second support plate be connected on described first joint, wherein said second support plate comprises more than second connector, it is configured to be connected on one or more second acquisition module with the second attached pattern by described mainboard communication, and wherein said one or more second acquisition module is configured to second simple or second redundantly structured at least in part based on described second attached pattern; And
Second joint, it is in order to make described second support plate connect removedly with described terminal organ or to make described second support plate connect removedly with the 3rd support plate.
In one embodiment, described first joint construction becomes transmitted power and signal of communication between described mainboard and described second support plate.
A kind of data acquisition system (DAS), comprising:
Comprise the mainboard of the first primary processor; And
First support plate, it comprises:
First end sub-block, its communication is connected on described mainboard, the first connector, the second connector and the 3rd connector, wherein said first connector structure becomes to connect with the first acquisition module with the first simple pattern, the first dual redundant pattern or the first triplex level redundancy pattern, described second connector structure becomes to connect with the second acquisition module with described first dual redundant pattern or described first triplex level redundancy pattern, and described 3rd connector structure becomes to connect with the 3rd acquisition module with described first triplex level redundancy pattern; And
Second terminal block, its communication is connected on described mainboard and the 4th connector, and wherein, described 4th connector structure becomes to connect with described second acquisition module with the described first simple pattern.
In one embodiment, described mainboard comprises multiple processor, wherein, each processor in described multiple processor is connected at least two connectors in described first connector, described second connector, described 3rd connector and described 4th connector, and wherein, each processor shares redundancy with another processor in described multiple processor and connects.
In one embodiment, described first acquisition module and described second acquisition module is comprised.
In one embodiment, described first acquisition module is configured to reception first discrete signal or the first simulating signal, and described second acquisition module is configured to reception second discrete signal or the second simulating signal.
In one embodiment, be connected to described second acquisition module on described second connector with described first dual redundant pattern or be configured to substantially stop the 4th acquisition module to be connected on described 4th connector with described 3rd acquisition module that described first triplex level redundancy pattern is connected on described 3rd connector.
In one embodiment, comprising:
Second support plate, its communication is connected on described first support plate and described mainboard, and wherein said second support plate comprises:
3rd terminal block, its communication is connected on described mainboard, the 5th connector, the 6th connector and the 7th connector, wherein said 5th connector structure becomes to connect with the 4th acquisition module with the second simple pattern, the second dual redundant pattern or the second triplex level redundancy pattern, described 6th connector structure becomes to connect with the 5th acquisition module with described second dual redundant pattern or described second triplex level redundancy pattern, and described 7th connector structure becomes to connect with the 6th acquisition module with described second triplex level redundancy pattern; And
4th terminal block, its communication is connected on described mainboard and the 8th connector, and wherein, described 8th connector structure becomes to connect with described 4th acquisition module with the described second simple pattern.
A method for service data acquisition system, comprising:
First sensor feedback is received at the first support plate place;
Utilize one or more first acquisition modules be connected on described first support plate that described first sensor feedback processing is become the first data-signal, wherein, described first support plate at least in part based on described one or more first acquisition module and described first support plate the first attached pattern and be configured to first mode, described first mode comprises simple pattern or redundant mode, wherein, described first sensor is fed back more than first the redundancy acquisition module be directed in described one or more first acquisition module by described redundant mode; And
Described first data-signal is transferred to one or more primary processor.
In one embodiment, comprising: at the run duration of described data acquisition system (DAS), the acquisition module in described one or more first acquisition module is replaced with another acquisition module in described one or more first acquisition module.
In one embodiment, comprise: the described first attached pattern regulating described one or more first acquisition module and described first support plate at run duration, to change the described first mode of described first support plate, wherein, regulate described first attached pattern to comprise described first support plate is added to acquisition module, removes acquisition module from described first support plate, or rearrange described one or more first acquisition modules on described first support plate.
In one embodiment, comprising:
Second support plate is connected on described first support plate;
The second sensor feedback is received at the second support plate place;
Utilize one or more second acquisition modules be connected on described second support plate that described second sensor feedback is processed into the second data-signal, wherein, described second support plate at least in part based on described one or more second acquisition module and described second support plate the second attached pattern and be configured to the second pattern, described second pattern comprises described simple pattern or described redundant mode, wherein, described second sensor feedback is directed to more than second redundancy acquisition module in described one or more second acquisition module by described redundant mode; And
Described second data-signal is transferred to described one or more primary processor.
In one embodiment, the described first mode in described first support plate is different from described second pattern of described second support plate.
Accompanying drawing explanation
When reading following detailed description in detail with reference to accompanying drawing, these and other feature of the present invention, aspect and advantage will become better understood, and wherein, same-sign represents same parts in all figure, wherein:
Fig. 1 illustrates the block diagram with the embodiment being connected to the controller assemblies of the processor on sensor by terminal block;
Fig. 2 illustrates the block diagram of the embodiment of the controller assemblies of the Fig. 1 with one or more support plate;
Fig. 3 illustrates the block diagram of the embodiment with the controller assemblies being in the support plate of various redundant mode and Fig. 1 of acquisition module;
Fig. 4 illustrates the block diagram of the embodiment of the controller assemblies with the support plate that can be configured to simple, dual redundant and triplex level redundancy pattern;
Fig. 5 illustrates the block diagram of the embodiment of the controller assemblies with the support plate that can be configured to simple and dual redundant pattern; And
Fig. 6 illustrates for assembling the process flow diagram with the embodiment of the method for the controller assemblies of service chart 4.
List of parts
10 controller systems
12 sensors
14 mainboards
16 terminal blocks
18 processors
20 monitored devices
21 controlled devices
22 acquisition systems
24 first passages
26 second channels
28 support plates
30 power supplies
32 telecommunication circuits
34 single physical shells
36 operator interfaces
50 control panels
52 first processors
54 second processors
56 mounting structures (track)
58 joints
59 terminal organs
60 acquisition modules
61 wired connections
62 signal lines
64 concentrator markers
66 first support plates
68 second support plates
70 the 3rd support plates
74 connectors (first end sub-block)
76 connectors (first end sub-block)
78 connectors (first end sub-block)
80 connectors (the second terminal block)
100 master-support plates
102 main board
103 main connectors
104 support plate parts
106 connectors
108 power port
110 communication port
112I/O port
114 barrier structures
116 distance pieces
118 terminals
120 bunch (wire harness)
130 second support plates
132 the 3rd support plates
134 the 4th support plates
150 methods
152 connect the first acquisition module
154 determine redundancy
156 quantity determining simple sensor group
158 connect the second acquisition module (merely)
160 connect the second acquisition module (redundancy)
162 connect the 3rd acquisition module
164 quantity determining support plate
166 receiving sensor inputs
Sensor input is changed into data-signal by 168
170 transmission of data signals
172 control device
174 operating procedures
176 number of assembling steps.
Embodiment
To be described one or more specific embodiment of the present invention below.In order to be devoted to provide the simple and clear description to these embodiments, may be described all features that reality realizes in the description.Be to be understood that, when such as develop in any engineering or design item any this actual realize time, many decisions proprietary for realization must be made to realize the objectives of developer, such as meet with system about and the constraint relevant with business, the objectives of developer can change each other to some extent according to different realizations.In addition, should be appreciated that this development may be complicated and consuming time, however, concerning benefiting from those of ordinary skill of the present disclosure, this development will be design, produce and the routine mission of manufacture.
When introducing the element of various embodiments of the present invention, there is this element one or more in article " ", " one ", the expression of " being somebody's turn to do " and " described " intention.Term " comprises ", " comprising " and " having " be intended to comprising property, and represent except the element listed, and can there is other element.
Various embodiment of the present disclosure comprises controller assemblies, and it has one or more acquisition module, and acquisition module can be configured to simple or redundantly structured separately.Controller assemblies comprises mainboard and one or more support plate.Each support plate can be connected on one or more acquisition module.Acquisition module receives the raw feedback signal from the one or more sensors connected.Support plate can be configured to specific redundancy pattern relative to the physical layout (such as, attached pattern) of support plate by acquisition module automatically.In simple structure, each acquisition module receives the raw feedback signal from the corresponding sensor group connected.In redundantly structured, two or more acquisition modules of support plate receive the raw feedback signal from the one group of public sensor be connected on support plate.In certain embodiments, the acquisition module be arranged on support plate with redundant mode substantially can stop and connect extra acquisition module with simple pattern.Similarly, in certain embodiments, the multiple acquisition modules be arranged on support plate with simple pattern substantially can stop and connect extra acquisition module with redundant mode.Support plate can be modular, thus it is different redundantly structured that multiple support plates of public mainboard can be had separately.In addition, mainboard can have multiple processor, to receive the data-signal from one or more acquisition module.Acquisition module can be connected on a more than processor redundantly.The redundancy of acquisition module and/or processor can reduce measuring error and be increased in the dirigibility utilizing system in various running environment.In addition, the various redundantly structured control system that makes can be run in the control of carry out desired and monitoring, even (such as, the idle) component having one or more performance not good, this can make it possible to reduce system downtime and/or frequency of maintenance.In certain embodiments, acquisition module and/or processor can be hot-swappable (hot-swappable) component, and it carries out adding or replacing at run duration, and does not need closing controller.
Forward accompanying drawing to, Fig. 1 illustrates the embodiment of controller system 10.In certain embodiments, controller system 10 can be the power management system in power device, gasification system, turbine system or other suitable system.Controller system 10 comprises one or more sensor 12, and it is connected on mainboard 14 by one or more terminal block 16.In certain embodiments, one or more sensor 12 can detected temperatures (such as, thermopair, resistance temperature detector (RTD)), pressure, flow rate, material composition, gap, flame, some signal electrical properties (such as, electric current, voltage) or other suitable attribute, and can by the information sensed in a variety of formats in one be delivered to corresponding terminal block 16.Such as, the various embodiments of terminal block 16 can receive the information from various types of sensor 12, and sensor 12 uses various voltage, and such as 2.5 to 5V ,-10V send information to 10V, 30mV to 10V ,-100mV to 100mV or other suitable voltage.In addition or alternatively, some embodiments of terminal block 16 can receive the signal of sensor 12, sensor 12 uses various electric current, such as 4-20mA, 10mA or other suitable electric current.In addition, some embodiment of sensor 12 can use highway addressable remote transmitter (HART) agreement or other similar agreement to transmit signal from terminal block 16.In certain embodiments, one or more terminal block 16 can have the general programmable I/O terminal being configured to reception or transmitting digital (such as, discrete) signal or simulating signal.
One or more terminal block 16 provides connection between one or more sensor 12 and mainboard 14.As discussed in detail below, one or more terminal block 16 provides link between sensor 12 and one or more processor 18.In certain embodiments, one or more processor 18 can comprise microcontroller, microprocessor, programmable logic controller (PLC) (PLC), or another suitable processor.Therefore, by one or more terminal block 16, processor 18 can receive the signal of one or more sensors 12 of the various measured values in self-inductance measurement controller system 10.In addition, one or more terminal block 16 can have layout terminal in the channel, to receive the parameter sensed from one or more sensor 12.In addition, one or more passage can be used communicate with one or more sensor 12.Such as, in certain embodiments, sensor 12 (such as, RTD) by one, two, three of terminal block 16, a four or more expanding channels is on mainboard 14.In certain embodiments, a passage can comprise three terminals, but other embodiment can comprise comprise terminal block 16 one, two, three, the passage of a four or more terminal.In addition, in certain embodiments, each sensor 12 can be connected on single passage, but other embodiment can comprise and strides across two or more passages and the sensor 12 thus striding across two or more terminals.
In certain embodiments, one or more sensor 12 senses the measured value from one or more monitored device 20.One or more monitored device 20 can comprise the one or more devices in power device, chemical plant or other industrial plants.Such as, monitored device 20 can comprise the component of generator, the component (such as, compressor blade, turbo blade, bearing, burner, fuel nozzle etc.) of turbine system, the component of compressibility, the component of pump, the component of reactor, the component of gasifier, the component of gas handling system or their any combination.In various embodiments, processor 18 can use the parameter (such as, temperature, pressure, flow rate, material composition etc.) sensed from one or more sensor 12, to control one or more controlled device 21.In controller system 10, controlled device 21 can comprise any monitored device 20 or depend on the measured value sensed or other device affecting measured value.
As can be appreciated, the signal from one or more sensor 12 can not be directly delivered to processor 18.In certain embodiments, the signal with the first voltage and/or electric current from one or more sensor 12 changes into the signal with the second voltage and/or electric current, for processor 18.Therefore, Fig. 2 illustrates that controller system 10 comprises acquisition system 22.In the illustrated embodiment, controller system 10 comprises two sensors 12, but other embodiment can comprise one, three, a four or more sensor.In addition, the embodiment illustrated of controller system 10 comprises first passage 24, and mainboard 14 is connected on corresponding first sensor 12a by it.The embodiment illustrated of controller system 10 also comprises second channel 26, and mainboard 14 is connected on corresponding second sensor 12b by it.As above discuss, each sensor 12 is connected on terminal block 16 by multiple passage, and each passage can comprise multiple terminal.In certain embodiments, multiple sensor (such as, 12a and 12b) is connected on same terminal block 16 by different passages (such as, 24 and 26).
The embodiment illustrated of acquisition system 22 comprises one or more support plate 28, and the signal in its sensor in future (one or more) 12 changes into the voltage and/or electric current that are suitable for being processed by processor 18.As discussed below, each support plate 28 can comprise one or more acquisition module, with the signal of the sensor that is converted (one or more) 12.Such as, the acquisition module of support plate 28 original (such as, simulating) feedback signal of in the future sensor 12 can change into discrete data signal.As discussed in detail below, support plate 28 can receive the input from the one or more sensors 12 for various sensor type.Signal from each sensor 12 is changed into the signal being suitable for processor 18 and processing by one or more acquisition modules of support plate 28.Such as, sensor 12 can be any sensor type, such as sends the sensor 12 of 4-20 milliampere signal, thermopair, RTD, HART device or other suitable sensor type.In certain embodiments, one or more acquisition modules of support plate 28 signal of in the future self processor 18 can change into the output voltage and/or electric current that are suitable for controlling monitored device 20 and/or controlled device 21.In other words, one or more support plate 28 (and terminal block 16) can provide general purpose I/O point, make it possible to use various sensor type to be connected on mainboard 14 and one or more processor 18, and without the need to implementing dedicated terminals block 16 for each sensor type.
In certain embodiments, support plate 28 can comprise voltage and/or circuit conversion circuit, and it can use special IC (ASIC), field programmable gate array (FPGA) or other suitable circuit realiration.In addition, in certain embodiments, one or more support plate 28 can comprise the other treatment circuit that can perform extra process to the sensing signal carrying out sensor (one or more) 12.Such as, some embodiment of support plate 28 can comprise digital-to-analog converter (DAC) and/or analog to digital converter (ADC).
The various components of mainboard 14 can support one or more support plate 28.In certain embodiments, one or more processor 18 can be connected on one or more support plate 28 redundantly, makes at least two processors 18 perform substantially identical instruction for the data-signal corresponding to any sensor 12.The corresponding output of redundant processor 18 can be compared, with test sensors measured value and/or identify about the potential error of sensor 12, support plate 28, acquisition module etc. or maintenance issues.Redundant processor 18 can make mainboard 14 can continuous service, even one or more redundant processor 18 does not run due to any reason.Power supply 30 can distribute power to drive one or more processor 18 and one or more support plate 28.In certain embodiments, power supply 30 by a support plate 28 by power division to another support plate 28, and/or by power division to one or more sensor 12.Telecommunication circuit 32 make one or more processor can between other device (such as, sensor 12, controlled device 21) of mainboard 14 and controller system 10 or system transmission of signal.Telecommunication circuit 32 can make can wired and/or radio communication between other device of mainboard 14 and controller system 10 or system.In certain embodiments, telecommunication circuit 32 connects with one or more support plate 28, to be conducive to the communication between the acquisition module of support plate 28 and processor 18.
Mainboard 14 can be contained in single physical shell 34 (such as, personal computer, server, controller rack or other suitable controller assemblies) maybe can comprise multiple shell (such as, dcs).In certain embodiments, controller system 10 can comprise multiple mainboard 14 at one or more shell 34.One or more mainboard 14 can be arranged on the control panel in shell 34.One or more sensor 12, one or more monitored device 20 and/or one or more controlled device 21 can in the inside of shell 34 or outsides.Operator interface 36 can be shown from the feedback on the measured value sensed of one or more sensor 10, the order sent by acquisition system 22 and/or monitored device 20 or controlled device 21.Operator can utilize operator interface 36 to safeguard, control and/or monitor controller system 10.
Fig. 3 illustrates the embodiment of the control panel 50 of controller system 10.The mainboard 14 with first processor 52 and the second processor 54 separates with support plate 28.In certain embodiments, mainboard 14 can integrate with one or more support plate 28.As can be appreciated, one or more support plate 28 and mainboard 14 are installed on panel 50 by one or more mounting structure 56 (such as, DIN rail road).The communication of each support plate 28 is connected on mainboard 14 by joint 58.Joint 58 is electrically connected on one or more acquisition modules 60 of each support plate 28.In certain embodiments, the joint 58 of a support plate 28 can connect (such as, by wired or wireless connection) directly or indirectly on another support plate 28 or mainboard 14.Such as, multiple support plate 28 can jointly coupled in series on mainboard 14.Mainboard 14 can be configured to the connection of support and about 8,16,24 or more support plate 28.In certain embodiments, each support plate 28 has matched junction 58, to be conducive to the coupled in series of support plate 28.Matched junction 58 can directly be docking together, and/or is docked by wired connection 61.The similar layout of support plate component (such as joint 58 and terminal block 16a, 16b) can make a support plate 28 easily to exchange with another support plate 28.Each support plate 28 be can be modular and is connected removedly with other support plate 28 by joint 58.Terminal organ 59 can connect with joint 58 in the end of a series of support plate 28.As can be appreciated, terminal organ 59 can close the communications loop between mainboard 14 and a series of support plate 28, thus is conducive to being communicated via joint 58 by support plate 28.In certain embodiments, the quantity of the support plate 28 that the concentrator marker 64 in terminal organ 59 makes mainboard 14 can determine to be connected in series and/or determine the end of a series of support plate 28.
Joint 58 makes support plate 28 can communicate with mainboard 14.Data-signal is delivered to one or more processors 18 of mainboard 14 by acquisition module 60 by joint 58, and receives power from mainboard 14 and instruction by joint 58.One or more signal line 62 transmits data between Signal connector 58 and mainboard 14.In certain embodiments, signal line 62 can be exclusively used in some function, such as from the input of acquisition module 60, the output from mainboard 14, the power towards support plate 28 and/or the power leading to sensor 12.Mainboard 14 communicates with each support plate 28 in series or in parallel by signal line 62.In certain embodiments, each support plate 28 identifies by concentrator marker 64 (such as, encoded chip).Concentrator marker 64 can be utilized to coordinate with the communication of specific support plate 28.As can be appreciated, the signal line 62 that concentrator marker 64 can be conducive to along sharing in series indicates address to each support plate 28.In certain embodiments, the special signal circuit 62 for each support plate 28 is conducive to the parallel communication with mainboard 14.
The first and second processors 52,54 can be shared between one or more support plate 28.Some embodiments can comprise more than two processors 18 (such as, 3,4,5,6 or more a processor).Raw feedback signal can be changed into data-signal by acquisition module 60, and to transmit along signal line 62, and the processor 52,54 of mainboard 14 utilizes data-signal to perform instruction.In certain embodiments, acquisition module 60 can be converted the data-signal of self processor 52,54, to export control signal to control one or more controlled device 21.Common processor 52,54 can reduce the operation that module 60 performs, and this can reduce the size of acquisition module 60, cost and/or thermal value.In certain embodiments, between acquisition module 60, common processor 52,54 can increase the utilization of the processing power to controller system 10.
First and second processors 52,54 of mainboard 14 can be connected on one or more support plate 28 redundantly.That is, first processor 52 can receive data-signal and utilize data-signal to perform instruction and export to produce first processor, and the second processor 54 can receive equalized data signal and utilize data-signal to perform basic same instructions, export to produce the second processor.First processor exports and the second processor export can substantially identical (such as, the same), and difference between processor output can have fault in instruction processorunit 52,54.Redundant processor 52,54 can increase the reliability of mainboard 14, in case make mistakes.Multiple processors 18 of mainboard 14 can be connected on support plate 28 redundantly, make controller system 10 can receive and process sensor feedback from each sensor 12, even remove, change or close one or more processors 18 of mainboard 14.
Via signal line 62, each support plate 28 transfers to the data-signal of the raw feedback signal be at least partly based on from one or more sensor 12.Support plate 28 is connected on sensor 12 with various redundant mode by one or more acquisition module 60.Fig. 3 illustrates an example, wherein, first support plate 66 is configured with the triplex level redundancy pattern of three acquisition modules 60 (such as, triple modularization redundancy (TMR)), second support plate 68 is configured with the dual redundant pattern of two acquisition modules 60, and the 3rd support plate 70 is configured so that two acquisition modules 60 are in simple pattern separately.In certain embodiments, support plate 28 is configured to redundant mode based on the physical connection between acquisition module 60 and terminal block 16 at least in part.Acquisition module 60 can determine the redundant mode of the structure of support plate 28 with the physical layout (such as, attached pattern) of support plate 28.Each acquisition module 60 is connected in particular end sub-block 16 by the physical layout of acquisition module 60.The multiple acquisition modules 60 be connected on same terminal block 16 are configured to receive identical feedback signal and/or transmit identical control signal redundantly.The acquisition module 60 be connected on different terminal blocks (such as, first end sub-block 16a and the second terminal block 16b) receives different feedback signals and/or transmits different control signals, and not thus being redundancy each other.
In the triplex level redundancy pattern of the first support plate 66, three acquisition modules 60a, 60b, 60c receive the raw feedback signal from the same sensor 12a be connected on first end sub-block 16a.In certain embodiments, one in three acquisition modules 60a, 60b, 60c controlled device 21 control signal from the first terminal block 16a being delivered to connection.Acquisition module 60a, 60b, 60c are connected on first end sub-block 16a respectively by first group of connector 74,76,78.Second terminal block 16b makes the first support plate 66 can connect with another sensor 12.Second group of connector 80 of the second terminal block 16b on the first support plate 66 can be idle.In certain embodiments, the first support plate 66 can be configured to triplex level redundancy pattern by connector automatically that respectively acquisition module 60a, 60b, 60c are connected to same terminal block (such as, first end sub-block 16).In certain embodiments, the first acquisition module 60a can be appointed as main acquisition module, and second and the 3rd acquisition module 60b, 60c be appointed as from acquisition module.The regulation of MS master-slave is by main connector (such as, connector 74) or by determining the adjustment of support plate 28 (such as jumper switch).
Acquisition module 60a, 60b, 60c can be the acquisition module 60 of identical type, and it is configured to receive and comes the raw feedback signal of identical type of sensor 12 or the data-signal of the identical type from mainboard 14 with process.In other words, each acquisition module 60a, 60b, 60c can be configured to perform the operation of substantially identical (such as, the same) and the result realizing substantially identical (such as, the same) according to given one group of raw feedback signal or data-signal.Such as, if the first acquisition module 60a is configured to the temperature and pressure determined in burner, then second be also configured to according to the temperature and pressure in identical sensor feedback signal determination burner with the 3rd acquisition module 60b, 60c.As can be appreciated, aging, the wearing and tearing of material or product or flaw can make acquisition module error be introduced during it exports.The output of each acquisition module 60a, 60b, 60c can compare at joint 58, support plate 28 or mainboard 14 place.The difference exported between another output can indicate the component on the first support plate 66 (such as, acquisition module 60a, 60b, or 60c) to have fault.Such as, if the second acquisition module 60b produces the first output according to the raw feedback signal of sensor 12a or from the data-signal of mainboard 14, and first and the 3rd acquisition module 60a, 60c according to the same raw feedback signal of sensor 12a or produce second from the same data-signal of mainboard 14 and export (such as, be different from the first output), then the comparison exported will identify the detectable error of the second acquisition module 60b.Therefore, triplex level redundancy makes it possible to the error identifying an acquisition module 60 while other redundancy acquisition module 60 continuous service, thus makes controller system 10 to run a period of time, until safeguard, even there is error.
As can be appreciated, the support plate 28 being configured to various redundant mode can utilize multiple acquisition module 60 to improve and output to the data-signal of mainboard 14 from acquisition module or output to the reliability of control signal of controlled device 21 from acquisition module.The support plate 28 constructed redundantly has multiple acquisition module 60, to process the input of sensor 12 redundantly or to lead to the output of controlled device 21.In certain embodiments, the support plate 28 be connected on controlled device 21 is configured with multiple acquisition module 60 redundantly.At run duration, each acquisition module (such as, 60a, 60b, 60c) can produce control signal based on the data-signal from mainboard 14; But, controlled device 21a can be delivered to from the output control signal of an only acquisition module (such as, the first acquisition module 60a) simultaneously.Other acquisition module (such as, second and the 3rd acquisition module 60b, 60c) can keep online, as the standby of the acquisition module of work.If find that the first acquisition module 60a has fault, then the first support plate 66 can be forbidden the first acquisition module 60a and enable a redundancy acquisition module (such as, second or the 3rd acquisition module 60b, 60c).In a similar fashion, if find fault, triplex level redundancy first support plate 66 can forbid the second acquisition module 60b, and enables another redundancy acquisition module (such as, the 3rd acquisition module 60c).Therefore, the first support plate 66 constructed redundantly can increase precision and/or the reliability of the control signal being supplied to controlled device 21a.The support plate 28 being configured to other redundant mode (such as, dual redundant pattern) can utilize redundancy acquisition module 60 in a similar fashion.
In dual redundant pattern, two acquisition module 60d and 60e receive the raw feedback signal from the same sensor 12b be connected on the first end sub-block 16a of the second support plate 68.In certain embodiments, one in two acquisition modules 60d, 60e controlled device 21b that control signal can be delivered on the first end sub-block 16a being connected to the second support plate 68.Acquisition module 60d and 60e is connected on the first end sub-block 16a of the second support plate 68 by connector 74 and 76.The connector 78 of first end sub-block 16a and second group of connector 80 of the second terminal block 16b can be idle when the second support plate 68 is configured with dual redundant.In certain embodiments, second support plate 68 can be configured to dual redundant pattern by any two connectors (such as, 74,76,78) automatically that acquisition module 60d and 60e is connected to same terminal block (such as, first end sub-block 16a).
Each redundancy acquisition module 60d and 60e can be identical type (such as, oxygen detector) acquisition module 60, it is configured to receive and comes the identical type raw feedback signal of sensor 12b or reception and the identical type data signals of process from mainboard 14 with process.Acquisition module 60d with 60e can be the type identical from acquisition module 60a, 60b, 60c of the first support plate 66 or different types.The output of each acquisition module 60d and 60e can compare at joint 58, support plate 28 or mainboard 14 place.From acquisition module 60d and 60e output between difference the component (such as, acquisition module 60d or 60e) on the second support plate 68 can be indicated to have fault.Such as, if the 4th acquisition module 60d produces first according to raw feedback signal or data-signal and exports, and the 5th acquisition module 60e produces the second output being different from same raw feedback signal or data-signal, then due to variant, the comparison of output will identify the detectable error of in acquisition module 60d or 60e.Therefore, dual redundant makes controller system 10 to identify to break down in an acquisition module.In certain embodiments, two outputs can be used, until repair or replace suitable acquisition module.In addition or in alternatives, mainboard 14 can be determined which to use export and ignores or which is abandoned to export based on difference or from the output of other acquisition module 60.
In simple pattern, only acquisition module 60 receives the raw feedback signal from each sensor 12 be connected on the terminal block 16 of support plate 28.In other words, the acquisition module 60 being in the support plate 28 of simple pattern does not have another acquisition module 60 receiving identical raw feedback signal redundantly.3rd support plate 70 has the 6th acquisition module 60f be connected on first end sub-block 16a (such as, by connector 74,76 or 78) and the 7th acquisition module 60g be connected on the second terminal block 16b (such as, by connector 80).6th acquisition module 60f receives the raw feedback signal of sensor 12c, and the 7th acquisition module receives the feedback signal of sensor 12d.Sensor 12c and 12d can be difference, and the 6th acquisition module 60f can be the type (such as, temperature) different from the 7th acquisition module 60g (such as pressure).In certain embodiments, the 6th acquisition module 60f can receive the raw feedback signal of sensor 12c, and control signal can be delivered to controlled device 21c by the 7th acquisition module 60g.In certain embodiments, acquisition module 60 is connected on the more than terminal block 16 on support plate 28 and support plate 28 can be configured to simple pattern automatically.When acquisition module 60f and 60g is connected on the 3rd support plate 70, one or more connector (such as, connector 74,76,78) can be idle.
First, second, and third support plate 66,68,70 can have multiple terminal block 16, optionally can be configured with the simple pattern of a sensor, the simple pattern with two sensors, dual redundant pattern or triplex level redundancy pattern to make each support plate.In certain embodiments, the terminal block 16 of support plate 28 can have four, five, six or more connectors, thus increases the potential quantity of redundancy acquisition module 60, and this can increase the reliability of controller system 10.In addition, in certain embodiments, more than two acquisition modules 60 are connected on support plate 28 with simple pattern by different terminal blocks 16.In certain embodiments, acquisition module 60 is connected on support plate 28 by the second terminal block 16b with simple pattern, and other acquisition module 60 is connected on same support plate 28 with redundant mode (such as, dual redundant, triplex level redundancy) by first end sub-block 16a.
In certain embodiments, the support plate 28 be connected on the mainboard 14 of control panel 50 can have various redundant mode.And Fig. 3 illustrates the embodiment of the support plate 66,68,70 with three different redundant modes, but some embodiments can comprise two or more support plates 28 with same redundant mode (such as, simple, dual redundant, triplex level redundancy).Support plate 28 can be connected on multiple mainboard 14 redundantly.Thus, in certain embodiments, support plate 28 can have the acquisition module 60 being configured to dual or triplex level redundancy pattern redundantly, and support plate 28 can be connected on multiple mainboard 14 redundantly, and each mainboard 14 can have redundant processor 18.Therefore, the embodiment of controller system 10 is modular, to be conducive to many redundantly structured reliabilities providing aspiration level.Such as, the processor 18 of mainboard 14 can be modular and interchangeable, to be conducive to substituting the first mainboard and first group of processor with the second mainboard and second group of processor, and does not affect the performance of controller system 10.In a similar manner, support plate 28 can be modular and interchangeable, to be conducive to substituting the first support plate with the second support plate, and does not change performance or the quantity of the redundancy acquisition module 60 of the feedback signal received from the sensor 12 connected.In certain embodiments, constructable support plate 28 provides change redundant mode and support plate 28 is not changed into the dirigibility of another support plate 28 with different redundant modes.
Fig. 4 illustrates the embodiment of the control panel 50 with integrated master-support plate 100.Integrated main support plate 100 has main board 102 and support plate part 104.Main board 102 can be similar to mainboard 14 substantially, and support plate part 104 can be similar to above-described support plate 28 substantially.Integrated master-support plate 100 can reduce the quantity of the joint 58 used in controller system 10, thus reduces cost and/or the complicacy of controller system 10.One or more processor 18 is connected on master-support plate 100 by main connector 103.Main connector 103 can be and is conducive to removing and the hasp of installation process device 18 or clip.In certain embodiments, main connector 103 has with processor 18 and mainboard 14 and is electrically connected.In certain embodiments, processor 18 hot swappable, thus make processor 18 to remove at run duration and/or to replace.In certain embodiments, the component of integrated master-support plate 100 supplies 30 received powers by multiple power.Such as, each power supply 30 may correspond in corresponding processor 18.
The modularity of the component of controller system 10 and exchange ability improve the applicability of controller system 10 to different application.Main connector 103 can make processor 18 easily can change at the run duration of mainboard 14 (such as, hot plug processor 18) and/or during maintenance shut-downs period.In certain embodiments, removable and replacement processor 18, to maintain or to improve the processing power of mainboard 14 or main portion 102.Such as, main connector 103 can make first group of processor to replace with the processor of second group of upgrading in the later stage.At interpolation corresponding sensor 12 and controlled device 21 or when removing corresponding sensor 12 and controlled device 21 from controller system 10, support plate 28 can be added or remove support plate 28 from controller system 10.Joint 58 can be conducive at the run duration of controller system 10 and/or in series adds during maintenance shut-downs period and remove support plate 28.And/or during maintenance period, acquisition module 60 can be added by connector 74,76,78,80 or remove acquisition module 60 from each support plate 28, to regulate the redundant mode of corresponding support plate 28 at the run duration of controller system 10.Some embodiments of controller system 10 are provided in the dirigibility that run duration regulates redundant mode.Such as, can be desirable is make support plate 28 at the first forecasting stage (such as, startup period, safeguard period) period has the first redundant mode (such as, triplex level redundancy), and at the second forecasting stage (such as, steady-state operation period) period has the second redundant mode (such as, simple).
The connector 106 of support plate part 104 and support plate 28 can distribute power and transmission of signal between acquisition module 60 and main portion 102.Connector 106 can machinery and/or electric in dock with acquisition module 60.Such as, connector 106 docks with acquisition module by the geometry (such as, post and socket, card and notch etc.) of coupling.The support plate part 104 of Fig. 4 and support plate 28 have four connectors 106 separately, but other embodiment can have the connector 106 (such as, 1,2,3,5,6 or more) of different quantity.Connector 106 can be arranged to close to each other.Terminal block 16 and joint 58 are connected on acquisition module 60 by connector 106.In certain embodiments, connector 106 is arranged in groups, makes first group of connector (such as, connector 74,76,78) be connected on first end sub-block 16a, and second group of connector (such as, connector 80) is connected on the second terminal block 16b.In certain embodiments, each connector 106 can have power port 108, communication port 110 and input-output (I/O) port one 12.Acquisition module 60 is connected on terminal block 16 by connecting with connector 106.Such as, acquisition module 60h and 60i is connected on the connector 74 and 80 of the integrated master-support plate 100 being in simple pattern respectively, and connector 76,78 is idle.
Support plate 28 can be configured to specific redundancy pattern relative to the physical layout of connector 106 by acquisition module 60 automatically.First group of connector 74,76,78 can be connected on first end sub-block 16a, and second group of connector 80 can be connected on the second terminal block 16b.Support plate 28 can be configured to simple pattern by connector automatically that an acquisition module 60 is connected to terminal block 16.Such as, acquisition module 60f is connected on the connector 74 of the 3rd support plate 70 with simple pattern, acquisition module 60g is connected on the connector 80 of the 3rd support plate 70 with simple pattern, acquisition module 60h is connected on the connector 74 of master-support plate 100 with simple pattern, and acquisition module 60i is connected on the connector 80 of master-support plate 100 with simple pattern.Multiple acquisition module 60 is connected on terminal block 16 and corresponding support plate 28 can be configured to dual redundant or triplex level redundancy pattern automatically.Such as, the first support plate 66 is configured with the triplex level redundancy pattern of acquisition module 60a, 60b, 60c that three connect, and the second support plate 68 is configured with the dual redundant pattern of acquisition module 60d, 60e that two connect.The quantity of the acquisition module 60 on change support plate 28 and/or physical layout can change the redundant mode of support plate 28.In certain embodiments, can remove or change hot swappable acquisition module 60 at the run duration of support plate 28.
Support plate 28 is configured to specific redundancy pattern by connection that connector 106 can be undertaken by connector 74,76,78,80 based on acquisition module 60 and terminal block 16a, 16b at least in part automatically.In certain embodiments, such as when acquisition module 60 is connected, redundant mode is transferred to signal mainboard 14 by support plate 28.Each processor 18 can be configured to communicate with each acquisition module 60 of corresponding support plate 28 with any redundant mode.The executable instruction of mainboard 14 can control each processor 18, so that be at least partly based on the redundant mode of the data-signal determination support plate 28 being received from acquisition module 60.Such as, if processor 18 receives two data-signals from support plate 28, then there is similar parameters (such as at data-signal, voltage range, range of current, sampling rate) when, mainboard 14 can determine that two acquisition modules 60 connect with dual redundant pattern, and when data-signal has different parameters, mainboard 14 can determine that two acquisition modules 60 connect with simple pattern separately.In addition or in alternatives, redundant mode signal can be supplied to mainboard 14 by support plate 28, to indicate corresponding redundant mode.
In certain embodiments, mechanical stop structure substantially can stop and added on the one or more specific connector of support plate 28 by acquisition module 60.Barrier structure can indicate the Current redundant pattern of support plate 28, and stops the interpolation of acquisition module 60, adds acquisition module 60 and can change Current redundant pattern.Such as, the first support plate 66 can be configured to triplex level redundancy pattern, and the first support plate 66 can not be supported more than three acquisition modules 60 and/or can not support different concurrent redundant modes (such as, triplex level redundancy pattern and simple pattern).3rd acquisition module 60c can have barrier structure 114 (such as, post, lid, protector, machinery intercept), and it extends in a part for connector 80, thus substantially mechanically stops the interpolation of another acquisition module 60.In certain embodiments, barrier structure 114 is on each acquisition module 60.In certain embodiments, barrier structure 114 is adjustable geometries, such as acquisition module 60 folding go out part, telescopic mast, articulated structure.Some embodiments of barrier structure 114 can make the acquisition module 60e of the second support plate 68 being in dual redundant pattern to stop to be added on connector 78 and 80 by another acquisition module 60.In certain embodiments, mechanical spacer 116 can be placed on idle connector (such as, the connector 76,78 of the 3rd support plate 70), to stop extra acquisition module 60.
I/O port one 12 communication is connected on the terminal 118 of terminal block 16 by connector 106.Terminal 118 can be arranged in groups (such as, passage), and wherein each passage has one or more terminal 118.Each terminal 118 or passage are associated with terminal block 16.In certain embodiments, terminal 118 is adjustable with the relevance of terminal block 16.In certain embodiments, each passage has three electric terminals 118, such as power terminal, plus end and negative terminal.Each sensor 12 or controlled device 21 can connect with one or more passages of terminal block 16, thus are connected on multiple terminal 118.Such as, 48 terminals 118 of first end sub-block 16a can be arranged to 16 passages, and each passage has 3 terminals 118.In certain embodiments, multiple passage that acquisition module 60 can be configured by terminal block 16 connects with multiple sensor 12 and/or controlled device 21.Such as, two or more sensors 12 on two or more passages can be connected on the redundancy acquisition module 60 on connector 74,76,78 by first end sub-block 16a.Terminal 118 can leading-terminal block 16a, 16b of support plate 100 on there is securing member, include, but is not limited to screw, as obvious.In certain embodiments, terminal block 16a, 16b connect with sensor by bunch 120 (such as, crimping pin and shell).
Fig. 5 illustrates another embodiment of integrated master-support plate 100.Be connected to carrier part 104 on master-support plate 100 and support plate 28 has less connector 106 (such as, connector 74,76,80) than the embodiment (such as, connector 74,76,78,80) of Fig. 4.Connector 74,76 is connected on first end sub-block 16a, and connector 80 is connected on the second terminal block 16b.Master-carrier part 104, second support plate 130 and the 3rd support plate 132 are configured with the simple pattern of two acquisition modules 60 separately.In simple pattern, each acquisition module 60 can receive the feedback signal from different sensors, and/or each acquisition module 60 can independent of another acquisition module 60 of same support plate.The 4th support plate 134 being in dual redundant pattern has two acquisition modules 60d, 60e.Acquisition module 60d, 60e receive the raw feedback signal from the identical one or more sensors be connected on first end sub-block 16a redundantly.
In certain embodiments, the connector 106 with different quantity can be connected on same master-carrier 14 or master-support plate 100.Such as, the support plate 28 of Fig. 5 is connected on the support plate 28 of Fig. 4 by joint 58.The connector 106 of various quantity makes operator to be the level of redundancy of support plate 28 selection expectation, thus farthest reduces the quantity of the idle connector 106 on support plate 28.In addition, the support plate 28 with less connector 106 can be less than the support plate 28 with more connectors.In certain embodiments, with have can in the finite space (such as more than three, control rack) when be connected to the support plate 28 of the connector 106 on mainboard 14 (such as, the support plate 66,68,70 of Fig. 4) quantity compare, the support plate 28 (such as, the support plate 130,132,134 of Fig. 5) with three connectors 106 can be assembled on control panel 50 and to be connected on mainboard 14 more.
Fig. 6 illustrates for assembling the method 150 with operation controller system.First acquisition module connects (square frame 152) on the terminal block of support plate.As above discuss, the first acquisition module is connected in the first end sub-block of support plate by connector.The redundancy of the expectation of then user determines (node 154) support plate.Available redundant mode can at least in part based on the type of support plate and the quantity of connector.After node 154 place determines simple pattern, operator determines, and whether (node 156) is connected to one or more groups sensor or controlled device on independent terminal block.If connect second group of sensor or controlled device, then with simple pattern, the second acquisition module is connected (square frame 158) on the second terminal block of support plate.After node 154 place determines dual redundant, the second acquisition module is connected (square frame 160) in first end sub-block by operator, to form redundancy with the first acquisition module.After node 154 place determines triplex level redundancy, the second acquisition module is connected (square frame 160) in first end sub-block by operator, and the 3rd acquisition module is connected (square frame 162) in first end sub-block by operator.Second and the 3rd acquisition module form redundancy with triplex level redundancy pattern and the first acquisition module.As can be appreciated, operator can construct support plate with the mode like triplex level redundancy Pattern Class that is configured to is next with extra redundant mode.
For support plate with expect redundant mode connect extra acquisition module after, whether operator determines (node 164) is connected to extra support plate and sensor group on mainboard.If extra support plate will be connected (such as, passing through joint) on mainboard, then method 150 repetition from square frame 152.If do not connect extra support plate, then the acquisition module connected can receive (square frame 166) from one or more raw feedback signal being connected sensor group.Raw feedback signal is transformed (square frame 168) and becomes data-signal by acquisition module, and by data-signal transmission (square frame 170) to the one or more processors on mainboard.One or more processors of mainboard can control (square frame 172) device (such as, compressor, turbine, burner, reactor) based on data-signal at least in part.After assembling, till operating procedure 174 can repeat to controller assemblies closedown.
In certain embodiments, acquisition module, support plate and/or processor can be hot swappable, thus make it possible to carry out removing or replacing at the run duration of controller assemblies.Hot-swappable component can reduce the stop time that controller assemblies causes due to maintenance, thus reduces operating cost.In certain embodiments, acquisition module and/or the redundantly structured of processor can regulate at run duration.Thus, one or more number of assembling steps 176 can before the operating procedure 174 of method 150 or between carry out.Operating procedure 174 can be performed by the controller system assembled.Before initial launch, user performs number of assembling steps 176 to assemble controller system, and user can perform subsequent assembling step 176 to safeguard controller system.
The open the present invention of this written description use-case, comprises optimal mode, and enables any person skilled in the art put into practice the present invention, comprise and manufacture and use any device or system, and perform the method for any combination.Patentable scope of the present invention is defined by the claims, and can comprise other example that those skilled in the art expect.If other such example has the structural element of the literal language not differing from claim, if or other such example comprises and the equivalent structure element of the literal language of claim without substantial differences, then their intentions are within the scope of claim.
Claims (10)
1. a system, comprising:
Comprise the mainboard of the first primary processor;
First support plate, it comprises more than first connector, described more than first connector structure becomes to make described mainboard communication be connected on one or more first acquisition module with the first attached pattern, wherein, described first support plate is configured to the first simple structure or first redundantly structured at least in part based on described first attached pattern; And
First joint, it is configured to described first support plate is connected removedly with terminal organ or described first support plate is connected removedly with the second support plate.
2. system according to claim 1, is characterized in that, described first support plate and described mainboard integrate.
3. system according to claim 1, it is characterized in that, described mainboard comprises multiple primary processor, and it is connected on described more than first connector redundantly, wherein, each primary processor in described multiple primary processor is configured to communicate with described one or more first acquisition module connect.
4. system according to claim 1, it is characterized in that, described first attached pattern comprises described one or more first acquisition modules be connected on described more than first connector, and described first support plate is configured to the first simple pattern, dual redundant pattern or triplex level redundancy pattern.
5. system according to claim 4, it is characterized in that, described first support plate comprises more than second connector, it is configured to make described mainboard communication be connected on described one or more first acquisition module with described first attached pattern, wherein, the second acquisition module in described one or more first acquisition module is connected on described more than second connector, and described first support plate is configured to the described first simple pattern relative to described second acquisition module.
6. system according to claim 1, is characterized in that, comprises described one or more first acquisition module.
7. system according to claim 1, it is characterized in that, described more than first connector comprises general programmable l/O passage, and it is configured to receive thermocouple signal, resistance temperature detector (RTD) signal, voltage signal, current signal, highway addressable remote transmitter (HART) input signal, HART output signal or their any combination.
8. system according to claim 1, is characterized in that, comprising:
Communicate described second support plate be connected on described first joint, wherein said second support plate comprises more than second connector, it is configured to be connected on one or more second acquisition module with the second attached pattern by described mainboard communication, and wherein said one or more second acquisition module is configured to second simple or second redundantly structured at least in part based on described second attached pattern; And
Second joint, it is in order to make described second support plate connect removedly with described terminal organ or to make described second support plate connect removedly with the 3rd support plate.
9. system according to claim 8, is characterized in that, described first joint construction becomes transmitted power and signal of communication between described mainboard and described second support plate.
10. a data acquisition system (DAS), comprising:
Comprise the mainboard of the first primary processor; And
First support plate, it comprises:
First end sub-block, its communication is connected on described mainboard, the first connector, the second connector and the 3rd connector, wherein said first connector structure becomes to connect with the first acquisition module with the first simple pattern, the first dual redundant pattern or the first triplex level redundancy pattern, described second connector structure becomes to connect with the second acquisition module with described first dual redundant pattern or described first triplex level redundancy pattern, and described 3rd connector structure becomes to connect with the 3rd acquisition module with described first triplex level redundancy pattern; And
Second terminal block, its communication is connected on described mainboard and the 4th connector, and wherein, described 4th connector structure becomes to connect with described second acquisition module with the described first simple pattern.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/962798 | 2013-08-08 | ||
| US13/962,798 | 2013-08-08 | ||
| US13/962,798 US20150045936A1 (en) | 2013-08-08 | 2013-08-08 | System and method for modular controller assembly supporting redundant configurations |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104345674A true CN104345674A (en) | 2015-02-11 |
| CN104345674B CN104345674B (en) | 2019-07-16 |
Family
ID=51359265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410388377.9A Active CN104345674B (en) | 2013-08-08 | 2014-08-08 | The system and method for supporting redundantly structured modularity control device assembly |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150045936A1 (en) |
| EP (1) | EP2835701B1 (en) |
| JP (1) | JP6699982B2 (en) |
| CN (1) | CN104345674B (en) |
| AU (1) | AU2014210602B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105357098A (en) * | 2015-12-03 | 2016-02-24 | 哈尔滨工业大学 | Method used for redundant wiring between sensor nodes of distributed measurement system |
| CN107783414A (en) * | 2016-08-25 | 2018-03-09 | 通用汽车环球科技运作有限责任公司 | System coordination multi-mode with dynamic fault-tolerant requirement is distributed and switched when running |
| CN108205258A (en) * | 2016-12-19 | 2018-06-26 | 西门子公司 | There are two the devices of the component of redundancy for tool |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10082541B2 (en) * | 2015-06-11 | 2018-09-25 | Altera Corporation | Mixed redundancy scheme for inter-die interconnects in a multichip package |
| US10251060B2 (en) * | 2016-09-27 | 2019-04-02 | Intel Corporation | Modifying access to a service based on configuration data |
| CN106598807A (en) * | 2016-12-14 | 2017-04-26 | 郑州云海信息技术有限公司 | Board card, mainboard and temperature monitoring system and method |
| US10985477B1 (en) * | 2019-09-26 | 2021-04-20 | Rockwell Automation Technologies, Inc. | Removable terminal block assembly that permits an I/O base to operate in simplex mode or duplex mode |
| CN113852396B (en) * | 2021-10-08 | 2023-03-24 | 珠海格力电器股份有限公司 | Data protection control method, device and system |
| CN113962176B (en) * | 2021-12-22 | 2022-03-01 | 中科亿海微电子科技（苏州）有限公司 | Method and device for verifying correctness of netlist file subjected to triple modular redundancy processing |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995008912A1 (en) * | 1993-09-23 | 1995-03-30 | Telefonaktiebolaget Lm Ericsson | An apparatus having a backplane adapted for coaction with a number of circuit boards |
| US20070168058A1 (en) * | 2006-01-13 | 2007-07-19 | Emerson Process Management Power & Water Solutions , Inc. | Method for redundant controller synchronization for bump-less failover during normal and program mismatch conditions |
| US20090198348A1 (en) * | 2008-02-01 | 2009-08-06 | Kenneth John Murphy | Method and Apparatus for Interconnecting Modules |
| EP2180389A1 (en) * | 2008-10-27 | 2010-04-28 | General Electric Company | Pluggable bases with different levels of redundancy |
| US7870299B1 (en) * | 2008-02-06 | 2011-01-11 | Westinghouse Electric Co Llc | Advanced logic system |
| US20120104295A1 (en) * | 2010-10-29 | 2012-05-03 | TapcoEnpro International | Actuator control device and method |
| CN102591266A (en) * | 2010-08-20 | 2012-07-18 | 洛克威尔自动控制技术股份有限公司 | Adaptable automation control module with integrated power bus distributor |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3588936B2 (en) * | 1996-10-16 | 2004-11-17 | 石川島播磨重工業株式会社 | Flexible high-speed multiplexed remote input / output system |
| JP3493441B2 (en) * | 1998-01-26 | 2004-02-03 | オムロン株式会社 | CPU device and I / O expansion device in programmable controller |
| JP3980768B2 (en) * | 1998-09-02 | 2007-09-26 | 株式会社日立製作所 | Distributed processing system and cooperative method thereof |
| JP3526293B2 (en) * | 2001-11-30 | 2004-05-10 | 三菱電機株式会社 | Programmable controller |
| DE102007054672A1 (en) * | 2007-11-14 | 2009-05-20 | Endress + Hauser Gmbh + Co. Kg | Field device for determining or monitoring a process variable in process automation |
| JP4981864B2 (en) * | 2009-09-25 | 2012-07-25 | パナソニック電工Ｓｕｎｘ株式会社 | Programmable controller |
-
2013
- 2013-08-08 US US13/962,798 patent/US20150045936A1/en not_active Abandoned
-
2014
- 2014-08-01 EP EP14179585.6A patent/EP2835701B1/en active Active
- 2014-08-05 JP JP2014159109A patent/JP6699982B2/en active Active
- 2014-08-07 AU AU2014210602A patent/AU2014210602B2/en active Active
- 2014-08-08 CN CN201410388377.9A patent/CN104345674B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995008912A1 (en) * | 1993-09-23 | 1995-03-30 | Telefonaktiebolaget Lm Ericsson | An apparatus having a backplane adapted for coaction with a number of circuit boards |
| US20070168058A1 (en) * | 2006-01-13 | 2007-07-19 | Emerson Process Management Power & Water Solutions , Inc. | Method for redundant controller synchronization for bump-less failover during normal and program mismatch conditions |
| US20090198348A1 (en) * | 2008-02-01 | 2009-08-06 | Kenneth John Murphy | Method and Apparatus for Interconnecting Modules |
| US7870299B1 (en) * | 2008-02-06 | 2011-01-11 | Westinghouse Electric Co Llc | Advanced logic system |
| EP2180389A1 (en) * | 2008-10-27 | 2010-04-28 | General Electric Company | Pluggable bases with different levels of redundancy |
| CN102591266A (en) * | 2010-08-20 | 2012-07-18 | 洛克威尔自动控制技术股份有限公司 | Adaptable automation control module with integrated power bus distributor |
| US20120104295A1 (en) * | 2010-10-29 | 2012-05-03 | TapcoEnpro International | Actuator control device and method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105357098A (en) * | 2015-12-03 | 2016-02-24 | 哈尔滨工业大学 | Method used for redundant wiring between sensor nodes of distributed measurement system |
| CN107783414A (en) * | 2016-08-25 | 2018-03-09 | 通用汽车环球科技运作有限责任公司 | System coordination multi-mode with dynamic fault-tolerant requirement is distributed and switched when running |
| CN108205258A (en) * | 2016-12-19 | 2018-06-26 | 西门子公司 | There are two the devices of the component of redundancy for tool |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2014210602A1 (en) | 2015-02-26 |
| JP6699982B2 (en) | 2020-05-27 |
| EP2835701B1 (en) | 2017-06-28 |
| AU2014210602B2 (en) | 2017-11-09 |
| EP2835701A3 (en) | 2015-07-01 |
| CN104345674B (en) | 2019-07-16 |
| JP2015064870A (en) | 2015-04-09 |
| EP2835701A2 (en) | 2015-02-11 |
| US20150045936A1 (en) | 2015-02-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104345674A (en) | System and method for modular controller assembly supporting redundant configurations | |
| US10095594B2 (en) | Methods and apparatus to implement communications via a remote terminal unit | |
| US9875207B2 (en) | Remote terminal unit (RTU) hardware architecture | |
| US10985477B1 (en) | Removable terminal block assembly that permits an I/O base to operate in simplex mode or duplex mode | |
| CN104169816A (en) | Method and system for controller transition | |
| CN110784854A (en) | Communication device and system | |
| CN102566436A (en) | Control system special for gasification furnace | |
| CN101960401B (en) | Apparatus and method for projecting field devices of a technical system | |
| CN203930476U (en) | A kind of engine room orders transmission peculiar to vessel and actuating unit | |
| JP3363063B2 (en) | Plant control system and process controller | |
| US8831756B2 (en) | Control system of a technical installation | |
| CN206959955U (en) | Diagnostic system of natural gas orifice plate flowmeter | |
| SG183800A1 (en) | Control and supply unit | |
| KR101690187B1 (en) | Opticasl fibre technical using input-output control card expansion device of the distributed control system | |
| US20240048626A1 (en) | Communication of a Remote Terminal Unit Based on a Module Type Package | |
| US20230244201A1 (en) | Technology for processing and exchanging field signals | |
| CN201681302U (en) | Multi-channel parameter simulation device | |
| Greene | Opening opportunities in subsea communications | |
| CN113507381A (en) | On-site device | |
| JP2003015710A (en) | Plant control system and process controller | |
| Clausen et al. | PROFIBUS in Process Controls | |
| de Sá | The evolution of the intelligent measurement | |
| Dumitru et al. | Compact local system designed for power transformer monitoring—Type MONITRA control process | |
| CN115190152A (en) | Measuring system | |
| CN103543714A (en) | Module block type control system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |