CN104342733A - Nickel plating method of stainless-steel-base glass sealing element - Google Patents
Nickel plating method of stainless-steel-base glass sealing element Download PDFInfo
- Publication number
- CN104342733A CN104342733A CN201410585557.6A CN201410585557A CN104342733A CN 104342733 A CN104342733 A CN 104342733A CN 201410585557 A CN201410585557 A CN 201410585557A CN 104342733 A CN104342733 A CN 104342733A
- Authority
- CN
- China
- Prior art keywords
- nickel plating
- grams per
- per liter
- nickel
- activation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a nickel plating method of a stainless-steel-base glass sealing element, which is characterized in that chemical nickel plating activation is used instead of the original nickel electroplating activation step, wherein the chemical nickel plating solution comprises 20-25g/L nickel sulfate, 25-30g/L sodium hypophosphite, 10-15g/L sodium acetate, 7-10g/L acetic acid, 0.002-0.003g/L thiocarbamide and 10-20g/L urea; and the pH value is controlled at 4.5-4.9, the temperature is 87-90 DEG C, and the reaction time is 5-30 minutes. By using the urea as the additive to be coordinated with the nickel ions, the autocatalysis activity of the nickel ions with sodium hypophosphite on the metal surface is enhanced, so that the potential of the plated surface quickly becomes negative, thereby promoting the occurrence of the nickel reduction reaction and ensuring the binding force of the coating. The hydrochloric acid solution is used as the solution for washing and removing scales, thereby avoiding glass corrosion.
Description
Technical field
The invention belongs to electroplating technology field, relate to a kind of stainless steel substrate glass sealing element nickel plating process.
Background technology
Conventional stainless steel electroplating technology is first electrochemical deoiling and electrochemical degreasing, after descaling, with hydrochloric acid and nickelous chloride flash nickel, stainless steel surface is activated, last re-plating nickel and other coating with the sulphuric acid soln cleaning of fluoride ion.In this technique, the sulphuric acid soln of fluoride ion has certain corrodibility to glass, can destroy glass sealed knot body airtight construction; And electronickelling can cause thickness of coating uneven because distribution of current is uneven, affect quality product.
Summary of the invention
Object of the present invention is exactly solve in common process the solution corrosion that exists and the even problem of uneven coating, provides a kind of stainless steel substrate glass sealing element nickel plating process.
the technical solution used in the present invention is as follows:
A kind of stainless steel substrate glass sealing element nickel plating process, mainly comprise electrochemical deoiling and electrochemical degreasing, pickling descale, the activation of flash nickel, electronickelling and other plating steps, it is characterized in that:
Chemical nickel plating activation is adopted to replace former electronickelling activation, wherein mainly the consisting of of chemical nickel-plating solution: single nickel salt 20 ~ 25 grams per liter, inferior sodium phosphate 25 ~ 30 grams per liter, sodium acetate 10 ~ 15 grams per liter, acetic acid 7 ~ 10 grams per liter, thiocarbamide 0.002 ~ 0.003 grams per liter, urea 10 ~ 20 grams per liter, chemical nickel plating activation control PH4.5. ~ 4.9, temperature is 87 ~ 90 DEG C, and the reaction times is 5 ~ 30 minutes.
On the basis of technique scheme, the present invention can also do following improvement:
Former fluorine-containing pickling descaling step is changed into the hydrochloric acid soln cleaning utilizing the water adding this hydrochloric acid 50% ~ 100% volume in concentration 37% hydrochloric acid to form to descale, control temperature is at 40 ~ 50 DEG C.
The invention has the advantages that: the present invention is using urea as additive and nickel ion coordination, improve the autocatalytic activity of nickel ion in metallic surface and inferior sodium phosphate, the current potential on plated surface can be made to become rapidly negative, facilitate nickel reduction reaction and occur, ensure that binding force of cladding material.Use hydrochloric acid soln as the solution of eccysis oxide skin simultaneously, avoid glass corrosion.
Embodiment
Embodiment 1
Technical process: get stainless steel substrates 10 (model 1Cr18Ni9, size 5mm × 100mm × 0.5mm) and put into 50 DEG C of alkali electroless except oil solution and soak 5min, then electrochemical degreasing (negative electrode oil removing mode, Dk1A/dm in this solution
2) 0.5min, the stainless steel substrates handled well is put into the hydrochloric acid soln that the water that adds this hydrochloric acid 1 times of volume by concentration 37% hydrochloric acid is formed, temperature keeps 45 DEG C to soak 5min, eccysis oxide skin.Then carry out chemical nickel plating, wherein mainly the consisting of of chemical nickel-plating solution: single nickel salt 25 grams per liter, inferior sodium phosphate 25 grams per liter, sodium acetate 12 grams per liter, acetic acid 10 grams per liter, thiocarbamide 0.003 grams per liter, urea 15 grams per liter.The PH adopting salt of wormwood or ammoniacal liquor regulator solution is 4.8, and the temperature keeping solution is 88 DEG C.Stainless steel test piece is dropped at every turn a slice in chemical nickel-plating solution, reaction times 0.5h, taken out by test specimen, deionized water wash, enters subsequent processing after drying up.
Embodiment 2
The processing step of the present embodiment is identical with embodiment 1, unlike, do not add urea in technical process.
Embodiment 3
The processing step of the present embodiment is identical with embodiment 1, unlike, the amount adding urea is 5 grams per liters.
Embodiment 4
The processing step of the present embodiment is identical with embodiment 1, unlike, the amount adding urea is 10 grams per liters.
Embodiment 5
The processing step of the present embodiment is identical with embodiment 1, unlike, the amount adding urea is 20 grams per liters.
Embodiment 6
The processing step of the present embodiment is identical with embodiment 1, unlike, the amount adding urea is 25 grams per liters.
Test piece good for Plating is carried out cripping test around φ 1.6mm axle.Test-results sees the following form:
Test-results table is bent after chemical nickel plating
As known from the above examples, add urea in above-mentioned chemical nickel-plating solution after, the bonding force of stainless steel substrate and coating can be improved, when urea content quality of coating within the scope of 10 ~ 20 grams per liters is best.
Claims (2)
1. a stainless steel substrate glass sealing element nickel plating process, mainly comprise electrochemical deoiling and electrochemical degreasing, pickling descale, electronickelling activation, electronickelling step, it is characterized in that:
Chemical nickel plating activation is adopted to substitute former electronickelling activation step, the solution that wherein chemical nickel plating adopts mainly consists of: single nickel salt 20 ~ 25 grams per liter, inferior sodium phosphate 25 ~ 30 grams per liter, sodium acetate 10 ~ 15 grams per liter, acetic acid 7 ~ 10 grams per liter, thiocarbamide 0.002 ~ 0.003 grams per liter, urea 10 ~ 20 grams per liter, control PH4.5. ~ 4.9, the temperature of chemical nickel plating activation is 87 ~ 90 DEG C, 5 ~ 30 minutes reaction times.
2. a kind of stainless steel substrate glass sealing element nickel plating process according to claim 1, it is characterized in that: pickling descaling step is: utilize concentration 37% hydrochloric acid to add the hydrochloric acid soln eccysis oxide skin of 50% ~ 100% water formation, control temperature is at 40 ~ 50 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410585557.6A CN104342733A (en) | 2014-10-28 | 2014-10-28 | Nickel plating method of stainless-steel-base glass sealing element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410585557.6A CN104342733A (en) | 2014-10-28 | 2014-10-28 | Nickel plating method of stainless-steel-base glass sealing element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104342733A true CN104342733A (en) | 2015-02-11 |
Family
ID=52499167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410585557.6A Pending CN104342733A (en) | 2014-10-28 | 2014-10-28 | Nickel plating method of stainless-steel-base glass sealing element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104342733A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60228678A (en) * | 1984-04-26 | 1985-11-13 | Agency Of Ind Science & Technol | Formation of metallic film on surface of high molecular material |
| CN1182808A (en) * | 1996-11-20 | 1998-05-27 | 山东矿业学院 | Acidic chemical plating nickel solution and plating method |
| US20050031788A1 (en) * | 2003-07-02 | 2005-02-10 | Rohm And Haas Electronic Materials, L.L.C. | Metallization of ceramics |
| CN1818141A (en) * | 2006-03-31 | 2006-08-16 | 北京航空航天大学 | Method for coating Ni-P layer in same liquid by chemically plating and electrobath |
| CN101348905A (en) * | 2008-09-04 | 2009-01-21 | 南昌航空大学 | Middle-temperature acidic electroless nickel plating-phosphor alloy formula |
| CN102953054A (en) * | 2012-11-19 | 2013-03-06 | 鲁东大学 | Chemical nickel-phosphorus alloy plating solution |
-
2014
- 2014-10-28 CN CN201410585557.6A patent/CN104342733A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60228678A (en) * | 1984-04-26 | 1985-11-13 | Agency Of Ind Science & Technol | Formation of metallic film on surface of high molecular material |
| CN1182808A (en) * | 1996-11-20 | 1998-05-27 | 山东矿业学院 | Acidic chemical plating nickel solution and plating method |
| US20050031788A1 (en) * | 2003-07-02 | 2005-02-10 | Rohm And Haas Electronic Materials, L.L.C. | Metallization of ceramics |
| CN1818141A (en) * | 2006-03-31 | 2006-08-16 | 北京航空航天大学 | Method for coating Ni-P layer in same liquid by chemically plating and electrobath |
| CN101348905A (en) * | 2008-09-04 | 2009-01-21 | 南昌航空大学 | Middle-temperature acidic electroless nickel plating-phosphor alloy formula |
| CN102953054A (en) * | 2012-11-19 | 2013-03-06 | 鲁东大学 | Chemical nickel-phosphorus alloy plating solution |
Non-Patent Citations (1)
| Title |
|---|
| 张允诚: "《电镀手册》", 31 January 2007, 国防工业出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6611380B2 (en) | COMPOSITE PLATING LAYER FORMED ON SURFACE OF Nd-Fe-B MAGNETIC MATERIAL AND METHOD FOR PRODUCING Nd-Fe-B MAGNETIC MATERIAL HAVING THE COMPOSITE PLATING LAYER | |
| CN101560662A (en) | Method for performing neutral electronickelling following magnesium alloy chemical nickeling | |
| CN103924225A (en) | High tin bronze plating solution for chemical plating of surface of tempered bead wire, and its chemical dip plating method | |
| CN102312238A (en) | Preparation of zinc nickel plating layer and trivalent chromium passivation process thereof | |
| CN101922031B (en) | Double-plating steel belt and plating process | |
| CN102108533A (en) | Multi-layer electroplating process for making coins by using cyanide-free plating copper-tin alloy layer as surface layer | |
| CN105019010A (en) | Technology for recycling precious metal palladium from electronic element and electrochemical stripping solution applied to technology | |
| CN107236977A (en) | A kind of electroplating pretreatment process optimization method | |
| CN104342733A (en) | Nickel plating method of stainless-steel-base glass sealing element | |
| CN102936721A (en) | Chemical nickel-plating process of glass-to-metal sealing wire holder | |
| CN102277600A (en) | Surface treatment method for electroplated copper door | |
| CN104294243B (en) | A kind of aluminum pipe nickel plating process | |
| CN105839109A (en) | Bath solution formula for precise alloy 3J1 chemical polishing | |
| CN104294335A (en) | Activation process for nickel plating pretreatment of aluminum alloy used for electronic devices | |
| CN102400119B (en) | Chemical nickel plating method on magnesium alloy | |
| CN104588609B (en) | Novel precious metal snowflake pattern manufacturing method | |
| CN103710692A (en) | Preparation method of corrosion-resistant SUS301 stainless steel band | |
| CN103849918A (en) | Surface decoration process of stainless steel | |
| CN102443791B (en) | Chemical nickel-tin-phosphor alloy-plating solution for magnesium alloy and treatment process of chemical nickel-tin-phosphor alloy-plating solution | |
| CN106048568A (en) | Environment-friendly chemical nickel plating method | |
| CN107513739A (en) | A kind of Nickel Pretreatment of magnesium alloy | |
| CN111763982A (en) | Process for improving secondary processing performance of pipe fitting and binding force of stamping part | |
| CN109136892A (en) | A kind of method of ceramic shell rack plating chemical nickel | |
| CN102517572A (en) | Chemical plating nickel-tungsten-phosphorus alloy solution for magnesium alloy and treatment process thereof | |
| CN109267115A (en) | A kind of copper components nickel plating process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150211 |