CN104339647A - Integrated forming method of non-transparent nonmetal member and metal member - Google Patents
Integrated forming method of non-transparent nonmetal member and metal member Download PDFInfo
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- CN104339647A CN104339647A CN201410552125.5A CN201410552125A CN104339647A CN 104339647 A CN104339647 A CN 104339647A CN 201410552125 A CN201410552125 A CN 201410552125A CN 104339647 A CN104339647 A CN 104339647A
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Abstract
The invention discloses an integrated forming method of a non-transparent nonmetal member and a metal member. The integrated forming method comprises the following steps: A, placing the non-transparent nonmetal member in a mould; B, placing the metal member positioned at the peripheral edge of the nonmetal member in the mould, wherein the metal member is of a continuous structure positioned at the peripheral edge of the nonmetal member; C, heating the metal member to ensure that the metal member forms a semi-solid state metal defined in a mould cavity; D, extruding the semi-solid metal by using the mould to ensure that the semi-solid metal is seamlessly bonded on the peripheral edge of the nonmetal member; and E, rapidly cooling the semi-solid metal positioned at the peripheral edge of the nonmetal member to ensure that the semi-solid state metal forms an amorphous metal bonded on the peripheral edge of the nonmetal member. The integrated-forming method disclosed by the invention is simple and easy to operate, and high in yield; the difficulty of processing the surface of the metal member is reduced, and the processed integrally-formed member is attractive in appearance.
Description
Technical field
The present invention relates to the forming method of non-metallic member and hardware, in particular, relate to the integral formation method of a kind of opaque non-metallic member and hardware.
Background technology
At present, the frame as the electronic equipment such as mobile phone, panel computer gradually adopts alloy material to process, and the metal edge frame that alloy material is made not only has good aesthetics, can also protect frangible face or the backboard of electronic equipment simultaneously.Traditional way is embedded in the metal framework of machine-shaping by the panel of electronic product, backboard or plastic member, then metal framework and corresponding parts are assembled, certain fit-up gap is there is between metal framework after this kind of methods combining and the panel of electronic product, backboard, even if by the machining accuracy of precisely control product, this fit-up gap still can be present on electronic product.
Disclose in the patent document that publication number is CN101815594 one " for by the earth subsidence of glass insert one to the method in metal edge frame and the electronic equipment produced ", one of method mentioned in this patent document is the surface or the edge that adopt a kind of metal-molding technique metal edge frame to be placed in transparent component, particularly, transparent component is placed in the die cavity of mould, again the metal of liquid state is injected in mold cavity, after metal cooling, metal edge frame is formed on the surface of transparent component or periphery, although the method can eliminate assemblage gap, make transparent component and metal edge frame one-body molded, but it is when operating, metallic high temperature is needed to heat, casting, the operations such as quick cooling, process conditions require higher, process is complicated, the yield rate of workpiece is lower.Certainly, above-mentioned patent it is mentioned that the another kind of MIM technique that adopts makes metal dust take shape in the method for transparent component periphery, it utilizes high-sintering process that powder compacting is outside in transparent component, comparatively loose by its interior tissue of the metal edge frame after sinter molding, usually be difficult to carry out the surface treatments such as follow-up polishing, oxidation, plating, be therefore difficult to meet the requirement of people for electronic product frame aesthetics.
Therefore, prior art existing defects, needs to improve.
Summary of the invention
For the deficiencies in the prior art, object of the present invention is intended to the integral formation method providing a kind of opaque non-metallic member and hardware, its process is simple, yield rate is high, and reducing the difficulty of metal component surface process, the one-body molded component be simultaneously processed into has the advantage of good looking appearance.
Technical scheme of the present invention is as follows: the integral formation method of a kind of opaque non-metallic member and hardware, A, opaque non-metallic member is placed in mould; B, insert hardware in the periphery of non-metallic member in a mold, this hardware is a continuous structure being positioned at non-metallic member periphery; C, heating of metal component, make hardware form the metal of the semisolid be limited in mold cavity; D, utilize mould to extrude the metal of semisolid, make the periphery being incorporated into non-metallic member of the metal seamless of this semisolid; E, fast cooling are positioned at the metal of the semisolid of non-metallic member periphery, make the metal forming of semisolid be that seamless combination is in the amorphous metal of non-metallic member periphery.
Be applied to technique scheme, in described wrought magnesium alloy, in steps A, opaque non-metallic member is pottery or quartz or marble.
Be applied to each technique scheme, in described wrought magnesium alloy, the material of hardware is almag or aluminium copper or alumel or zircaloy or titanium alloy.
Be applied to each technique scheme, in described wrought magnesium alloy, the periphery of non-metallic member is provided with occlusion structure.
Be applied to each technique scheme, in described wrought magnesium alloy, occlusion structure be postpone non-metallic member edge formed groove or lug boss.
Be applied to each technique scheme, in described wrought magnesium alloy, the coefficient of thermal expansion of hardware is greater than or equal to the coefficient of thermal expansion of non-metallic member.
Be applied to each technique scheme, in described wrought magnesium alloy, before carrying out step C, also between hardware and non-metallic member, add a bolster, this bolster is the continuous structure bolster being positioned at non-metallic member periphery.
Adopt such scheme, compared to prior art, the method applied in the present invention is owing to being that to adopt hot-forming mode to make hardware be incorporated into opaque non-metallic member outside, its process is simple, yield rate is high, the hardware of compacting has higher compactness and higher intensity, and, reduce the difficulty of hardware sequent surface process.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the specific embodiment of the invention;
Fig. 2 is the structural representation of mould therefor of the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
As depicted in figs. 1 and 2, the integral formation method of non-metallic member of the present invention and hardware, the method is for processing a kind of ceramic wafer 50 and the one-body molded component of metal edge frame 60, ceramic wafer 50 is opaque non-metallic member, this one-body molded component is used as a kind of parts of electronic product, and wherein, ceramic wafer 50 is the backboard of electronic product, metal edge frame 60 is the metal frame of electronic product periphery, and the method comprises the steps:
First, steps A: die cavity ceramic wafer 50 being placed in mould as shown in Figure 2, ceramic wafer 50 is particularly placed on the core rod abaculus 40 on cover half 20 die joint, and the size of core rod abaculus 40 is suitable with ceramic wafer 50, after inserting, by the justified margin of ceramic wafer 50 with core rod abaculus 40.
Then, step B: metal edge frame 60 is placed in mould, metal edge frame 60 is made to be placed in the periphery of ceramic wafer 50, metal edge frame 60 is made to form a continuous structure at the periphery of ceramic wafer 50, after matched moulds, dynamic model 10 presses down, metal edge frame 60 is made to be surrounded on the periphery of ceramic wafer 50 and core rod abaculus 40, the matched moulds abaculus 30 of the die joint surrounding that moves moulds, the die cavity of mould is closed, metal edge frame 60 is placed in the marginal portion of mold cavity closely, now, need to guarantee that matched moulds abaculus 30 has certain freedom of lateral movement, during to avoid subsequent heat, metal edge frame 60 forms larger extruding force to ceramic wafer 50 due to thermal expansion.
Step C again: heating of metal frame 60, wherein metal edge frame 60 preferably adopts almag, utilize heater that metal edge frame 60 is heated into the metal of semisolid, now, metal edge frame 60 is due to thermal expansion, outside pressure on top surface is implemented to matched moulds abaculus 30, matched moulds abaculus 30 is moved towards the direction away from mold cavity, because the thickness of metal edge frame 60 is less, therefore the displacement of matched moulds abaculus 30 that causes of its thermal expansion is very limited, can be before heating, according to the thickness of metal edge frame 60, the parameter such as thermal coefficient of expansion and heating-up temperature roughly calculates the displacement size of matched moulds abaculus 30 movement after heating, thus be that matched moulds abaculus 30 arranges position-limit mechanism according to this displacement size.
Step D again: utilize hydraulic cylinder or other top-pressure mechanisms to push up press-fitting mould abaculus 30 towards the direction of mold cavity, the edge towards ceramic wafer 50 that the metal edge frame 60 of semisolid is tried one's best shrinks, guarantee the periphery being combined in ceramic wafer 50 that the metal edge frame 60 of semisolid is seamless, keep the above-mentioned top pressure external force that matched moulds abaculus 30 is applied.
Finally, step e: under the state that above-mentioned maintenance applies outside pressure on top surface to matched moulds abaculus 30, cooling device is utilized to carry refrigerant in the coolant flow channel of mould, cool the metal edge frame 60 of above-mentioned semisolid fast, the metal edge frame 60 of semisolid is in the process of cooling fast, alloy interior atoms has little time ordered arrangement crystallization, thus obtain the non-crystaline amorphous metal of solid-state disordered structure, finally make metal edge frame 60 be shaped to be positioned at the metal edge frame 60 of the non-crystaline amorphous metal of ceramic wafer 50 periphery, after the demoulding, form the one-body molded component of metal edge frame 60 and ceramic wafer 50.
In said method of the present invention, in order to avoid metal edge frame 60 is oxidized in high temperature environments, above-mentioned step C, step D and step e are carried out all under vacuum conditions, particularly, after completing steps B, outside vacuum extractor is utilized to be taken away by the air in mold cavity.
The one-body molded component that said method makes may be used for the electronic product with ceramic backboard and metal edge frame, utilize ceramic wafer 50 as the backboard of mobile phone, it is compared to existing metallic mobile phone shell, the network signal of operator can not be shielded, strengthen the wifi signal of mobile phone, can realize NFC near-field communication, the wireless charging of mobile phone, in addition, extraneous monocrystalline silicon can realize solar recharging simultaneously.
When being applicable to electronic equipment, said method after demoulding, also may need to carry out to polish, electroplate, the subsequent technique process such as oxidation, due in the above-mentioned methods, adopt the mode processing metal frame 60 of compacting semisolid metal, make the internal structure of metal edge frame 60 comparatively fine and close, there is higher intensity, thus provide good basis for process of surface treatment such as polishing, plating, oxidations.
In the present invention, the material of metal edge frame 60 also preferably adopts aluminium copper or alumel or zircaloy or titanium alloy, certainly, as long as other metal material its can be used to the metal edge frame 60 making electronic product, all within optional scope.
In order to increase bond strength, can be that occlusion structure is set at the periphery of ceramic wafer 50, particularly, can postpone ceramic wafer 50 edge formed groove, when extruding, the metal edge frame 60 of semisolid is by external compression power, and its inner surface forming section is embedded into the structure in above-mentioned groove; Certainly, occlusion structure also can be postpone ceramic wafer 50 edge formed flange, extrude time, the metal edge frame 60 of semisolid is out of shape with clamped flanges.
During the selection of material, the coefficient of thermal expansion of metal edge frame 60 can be required to be greater than or the coefficient of thermal expansion of ceramic wafer 50, so, when heating of metal frame 60, effectively can control the thermal expansion of ceramic wafer 50, the minimizing temperature of trying one's best is on the impact of ceramic wafer 50.As the parts of electronic product, above-mentioned ceramic wafer 50 can also select the exotic materials such as the quartz of tabular or marble to substitute, and boride, carbide, fluoride, silicide, phosphide, sulfide etc. also can be selected to substitute.
In the present invention, before carrying out above-mentioned step C, can also add a bolster between metal edge frame 60 and ceramic wafer 50 periphery, bolster is the continuous structure being positioned at ceramic wafer 50 periphery; Bolster can be a kind of component being beneficial to ceramic wafer 50 and being combined with metal edge frame 60; also can be that one has certain flexible component; such as; bolster can be 65Mn, after being placed in by the bolster formed by 65Mn and forming one-body molded component between metal edge frame 60 and ceramic wafer 50, because 65Mn has good elasticity; electronic product from exceed fall time; metal edge frame 60 is subject to larger impact, and bolster then can be used for slowing down impulsive force, thus effective protection ceramic wafer 50.
The combination of the opaque non-metallic member such as the hardware that method of the present invention is also applicable to other and pottery, no matter be which kind of application mode, its shaping method is roughly the same with said method step, is not here described in detail.
These are only preferred embodiment of the present invention, be not limited to the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. an integral formation method for opaque non-metallic member and hardware, is characterized in that:
A, opaque non-metallic member is placed in mould;
B, insert hardware in the periphery of non-metallic member in a mold, this hardware is a continuous structure being positioned at non-metallic member periphery;
C, heating of metal component, make hardware form the metal of the semisolid be limited in mold cavity;
D, utilize mould to extrude the metal of semisolid, make the periphery being incorporated into non-metallic member of the metal seamless of this semisolid;
E, fast cooling are positioned at the metal of the semisolid of non-metallic member periphery, make the metal forming of semisolid be that seamless combination is in the amorphous metal of non-metallic member periphery.
2. wrought magnesium alloy according to claim 1, is characterized in that, in steps A, opaque non-metallic member is pottery or quartz or marble.
3. wrought magnesium alloy according to claim 1 and 2, is characterized in that, in step B, the material of hardware is almag or aluminium copper or alumel or zircaloy or titanium alloy.
4. the wrought magnesium alloy according to claim 1 or 3, is characterized in that, the periphery of non-metallic member is provided with occlusion structure.
5. wrought magnesium alloy according to claim 4, is characterized in that, occlusion structure be postpone non-metallic member edge formed groove or lug boss.
6. wrought magnesium alloy according to claim 1, is characterized in that, the coefficient of thermal expansion of hardware is greater than or equal to the coefficient of thermal expansion of non-metallic member.
7. wrought magnesium alloy according to claim 1, is characterized in that, before carrying out step C, also between hardware and non-metallic member, adds a bolster, and this bolster is the continuous structure bolster being positioned at non-metallic member periphery.
8. wrought magnesium alloy according to claim 1, is characterized in that, step C, step D and step e are carried out all under vacuum conditions.
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| CN201410552125.5A CN104339647A (en) | 2014-10-17 | 2014-10-17 | Integrated forming method of non-transparent nonmetal member and metal member |
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| CN201410552125.5A CN104339647A (en) | 2014-10-17 | 2014-10-17 | Integrated forming method of non-transparent nonmetal member and metal member |
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| CN104339647A true CN104339647A (en) | 2015-02-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109266947A (en) * | 2018-11-27 | 2019-01-25 | 东莞颠覆产品设计有限公司 | A kind of high-entropy alloy composite component and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534433A (en) * | 2012-01-12 | 2012-07-04 | 北京理工大学 | Amorphous alloy cellular material and preparation method thereof |
| CN104190903A (en) * | 2014-08-14 | 2014-12-10 | 东莞颠覆产品设计有限公司 | Method of integrally forming non-metal part and metal part |
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- 2014-10-17 CN CN201410552125.5A patent/CN104339647A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534433A (en) * | 2012-01-12 | 2012-07-04 | 北京理工大学 | Amorphous alloy cellular material and preparation method thereof |
| CN104190903A (en) * | 2014-08-14 | 2014-12-10 | 东莞颠覆产品设计有限公司 | Method of integrally forming non-metal part and metal part |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109266947A (en) * | 2018-11-27 | 2019-01-25 | 东莞颠覆产品设计有限公司 | A kind of high-entropy alloy composite component and preparation method thereof |
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Application publication date: 20150211 |