CN104331140A - Externally connected air-cooling radiator for notebook computer - Google Patents
Externally connected air-cooling radiator for notebook computer Download PDFInfo
- Publication number
- CN104331140A CN104331140A CN201410690749.3A CN201410690749A CN104331140A CN 104331140 A CN104331140 A CN 104331140A CN 201410690749 A CN201410690749 A CN 201410690749A CN 104331140 A CN104331140 A CN 104331140A
- Authority
- CN
- China
- Prior art keywords
- notebook computer
- heat
- fan
- transfer block
- contact chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 27
- 230000005855 radiation Effects 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000007664 blowing Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 description 11
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an externally connected air-cooling radiator for a notebook computer. The externally connected air-cooling radiator comprises a motor, a plurality of contact clips, a heat-transferring block, a fan and a radiating mechanism, wherein the heat-transferring block is respectively connected with one end of each of the contact clips; the other ends of the contact clips are arranged in the radiating holes of the notebook computer and are respectively in contact with a plurality of radiating fins of the notebook computer; the heat-transferring block is connected with the radiating mechanism; the fan is arranged above the radiating mechanism; the fan is driven by the motor. According to the externally connected air-cooling radiator for the notebook computer provided by the invention, the contact clips are in contact with the radiating fins in the notebook computer, the heat is transferred to the contact clips, the heat is transferred to the heat-transferring block by the contact clips and then is transferred to the radiating mechanism, the radiating mechanism is used for radiating, the fan is used for blowing air and quickening the radiation of the radiating mechanism, and the radiating efficiency is increased. The externally connected air-cooling radiator is externally connected with the notebook computer and can transfer and radiate the heat generated by the notebook computer.
Description
Technical field
The present invention relates to a kind of heating radiator, particularly relate to a kind of external air-cooled radiator for notebook computer.
Background technology
Integrated circuit is used in a large number in machine element.As everyone knows, high temperature is the formidable enemy of integrated circuit.High temperature not only can cause system cloud gray model unstable, and serviceable life shortens, and even likely makes some parts burn.The heat of high temperature is caused not to be from outside computing machine, but computer-internal, or perhaps IC interior.The effect of heating radiator is exactly by these heat absorption, then diffuses in cabinet or outside cabinet, ensures that the temperature of machine element is normal.Most heating radiator passes through and heat generating components surface contact, absorbs heat, then is delivered at a distance by heat by various method, and in the air in such as cabinet, then these hot-airs pass to outside cabinet by cabinet, complete the heat radiation of computing machine.The kind of heating radiator is very many, and CPU, video card, board chip set, hard disk, cabinet, power supply even CD-ROM drive and internal memory all can need heating radiator, and these different heating radiators can not be used with, and what wherein the most often contact is exactly the heating radiator of CPU.According to the mode taking away heat from heating radiator, heating radiator can be divided into active heat removal and passive heat radiation.The former is air-cooled radiator commonly, and the latter common be exactly heat radiator.Further finely divided hot mode, can be divided into air-cooled, heat pipe, liquid cooling, semiconductor refrigerating, compressor cooling etc.
The heat-sinking capability often comparing and rely on heating radiator itself to carry waited in use by traditional notebook computer, namely dispelled the heat by multiple heat radiator of notebook computer, and the heat radiator that these carry is all the inside being arranged on notebook computer, do not contact fully with external environment, so a good radiating effect can not be played, so need now a kind of a kind of heating radiator that can be connected on multiple heat radiator of notebook computer better to dispel the heat to notebook computer outward.
Summary of the invention
The object of the invention is to provide a kind of external air-cooled radiator for notebook computer to solve the problem.
The present invention is achieved by the following technical solutions:
A kind of external air-cooled radiator for notebook computer, comprise motor, contact chip, heat transfer block, fan and cooling mechanism, described heat transfer block is connected with one end of multiple described contact chip respectively, the other end of multiple described contact chip is placed in the louvre of notebook computer, and contact with the multiple described heat radiator of notebook computer respectively, described heat transfer block is also connected with described cooling mechanism, and described fan is arranged on the top of described cooling mechanism, and described motor drives described fan.
Contact with the multiple heat radiator in notebook computer by adopting multiple contact chip, heat is delivered to contact chip, and contact chip is by heat by being delivered to cooling mechanism after heat transfer block, and cooling mechanism dispels the heat, fan blowing accelerates the heat radiation of cooling mechanism, improves radiating efficiency.
Particularly, described cooling mechanism comprises multiple heat radiation thin slice and axis, and one end of described axis is connected with described heat transfer block, and the side of described axis is connected with multiple described heat radiation thin slice, and multiple described heat radiation thin slice is emitting shape distribution around described axis.
Contacting with air of the multiple heat radiation thin slice energy maximum area distributed around axis in emitting shape, can better dispel the heat.
Further, multiple described contact chip is copper sheet.
Further, described heat transfer block is rectangular parallelepiped copper billet.
The heat that contact chip adopts copper sheet, heat transfer block to adopt copper billet that notebook computer can be enable to produce better transmits.
Further, described axis is aluminium axle, and multiple described heat radiation thin slice is aluminium flake.
Heat radiation thin slice adopts aluminium flake that radiating efficiency can be made to maximize.
The invention has the beneficial effects as follows:
The present invention is a kind of external air-cooled radiator for notebook computer, contact with the multiple heat radiator in notebook computer by adopting multiple contact chip, heat is delivered to contact chip, contact chip by heat by being delivered to cooling mechanism after heat transfer block, cooling mechanism dispels the heat, and fan blowing accelerates the heat radiation of cooling mechanism, improves radiating efficiency, the present invention is external in notebook computer, the heat that notebook computer produces better can be transmitted and distribute.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention for the external air-cooled radiator of notebook computer.
In figure: 1-axis, 2-dispels the heat thin slice, 3-heat transfer block, 4-contact chip, 5-motor, 6-fan.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is described in further detail:
As shown in Figure 1, the present invention is a kind of external air-cooled radiator for notebook computer, comprise motor 5, contact chip 4, heat transfer block 3, fan 6 and cooling mechanism, heat transfer block 3 is connected with one end of multiple contact chip 4 respectively, the other end of multiple contact chip 4 is placed in the louvre of notebook computer, and contacts with multiple heat radiator 4 of notebook computer respectively, and heat transfer block 3 is also connected with cooling mechanism, fan 5 is arranged on the top of cooling mechanism, motor 5 drive fan 6.
By adopting multiple contact chip 4 to contact with the multiple heat radiator in notebook computer, heat is delivered to contact chip 4, contact chip 4 is by heat by being delivered to cooling mechanism after heat transfer block 3, and cooling mechanism dispels the heat.Contacting with air in emitting shape around multiple heat radiation thin slices 2 energy maximum area of axis 1 distribution, can better dispel the heat, and fan 6 blowing accelerates the heat radiation of cooling mechanism, improves radiating efficiency.
Multiple contact chip 4 is copper sheet.Heat transfer block 3 is rectangular parallelepiped copper billet.Axis 1 is aluminium axle, and multiple heat radiation thin slice 2 is aluminium flake.The heat that contact chip 4 adopts copper sheet, heat transfer block 3 adopts copper billet that notebook computer can be enable to produce better transmits.Heat radiation thin slice 2 adopts aluminium flake that radiating efficiency can be made to maximize.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., be all included within protection scope of the present invention.
Claims (5)
1. the external air-cooled radiator for notebook computer, comprise motor, it is characterized in that: also comprise contact chip, heat transfer block, fan and cooling mechanism, described heat transfer block is connected with one end of multiple described contact chip respectively, the other end of multiple described contact chip is placed in the louvre of notebook computer, and contact with the multiple described heat radiator of notebook computer respectively, described heat transfer block is also connected with described cooling mechanism, described fan is arranged on the top of described cooling mechanism, and described motor drives described fan.
2. the external air-cooled radiator for notebook computer according to claim 1, it is characterized in that: described cooling mechanism comprises multiple heat radiation thin slice and axis, one end of described axis is connected with described heat transfer block, the side of described axis is connected with multiple described heat radiation thin slice, and multiple described heat radiation thin slice is emitting shape distribution around described axis.
3. the external air-cooled radiator for notebook computer according to claim 1, is characterized in that: multiple described contact chip is copper sheet.
4. the external air-cooled radiator for notebook computer according to claim 1, is characterized in that: described heat transfer block is rectangular parallelepiped copper billet.
5. the external air-cooled radiator for notebook computer according to claim 2, is characterized in that: described axis is copper axle, multiple described heat radiation thin slice is aluminium flake.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410690749.3A CN104331140A (en) | 2014-11-26 | 2014-11-26 | Externally connected air-cooling radiator for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410690749.3A CN104331140A (en) | 2014-11-26 | 2014-11-26 | Externally connected air-cooling radiator for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104331140A true CN104331140A (en) | 2015-02-04 |
Family
ID=52405884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410690749.3A Pending CN104331140A (en) | 2014-11-26 | 2014-11-26 | Externally connected air-cooling radiator for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104331140A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5898568A (en) * | 1997-07-25 | 1999-04-27 | Cheng; Chun-Cheng | External heat dissipator accessory for a notebook computer |
| CN1877488A (en) * | 2005-06-10 | 2006-12-13 | 鸿富锦精密工业（深圳）有限公司 | Heat sink device for electronic equipment and method therefor |
| CN200959704Y (en) * | 2006-08-31 | 2007-10-10 | 东莞市通旺达五金制品有限公司 | Radiator Structure Improvement |
| CN201156228Y (en) * | 2008-01-15 | 2008-11-26 | 东莞市天安集团有限公司 | Computer heat radiating apparatus |
| CN203849663U (en) * | 2014-01-17 | 2014-09-24 | 东华理工大学 | External cooling device for laptop |
| CN204288103U (en) * | 2014-11-26 | 2015-04-22 | 成都市思码特科技有限公司 | For the external air-cooled radiator of notebook computer |
-
2014
- 2014-11-26 CN CN201410690749.3A patent/CN104331140A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5898568A (en) * | 1997-07-25 | 1999-04-27 | Cheng; Chun-Cheng | External heat dissipator accessory for a notebook computer |
| CN1877488A (en) * | 2005-06-10 | 2006-12-13 | 鸿富锦精密工业（深圳）有限公司 | Heat sink device for electronic equipment and method therefor |
| CN200959704Y (en) * | 2006-08-31 | 2007-10-10 | 东莞市通旺达五金制品有限公司 | Radiator Structure Improvement |
| CN201156228Y (en) * | 2008-01-15 | 2008-11-26 | 东莞市天安集团有限公司 | Computer heat radiating apparatus |
| CN203849663U (en) * | 2014-01-17 | 2014-09-24 | 东华理工大学 | External cooling device for laptop |
| CN204288103U (en) * | 2014-11-26 | 2015-04-22 | 成都市思码特科技有限公司 | For the external air-cooled radiator of notebook computer |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150204 |